WO2006063134A3 - Low-melting pre-alloy compositions - Google Patents

Low-melting pre-alloy compositions Download PDF

Info

Publication number
WO2006063134A3
WO2006063134A3 PCT/US2005/044424 US2005044424W WO2006063134A3 WO 2006063134 A3 WO2006063134 A3 WO 2006063134A3 US 2005044424 W US2005044424 W US 2005044424W WO 2006063134 A3 WO2006063134 A3 WO 2006063134A3
Authority
WO
WIPO (PCT)
Prior art keywords
low
alloy compositions
alloy
melting pre
components
Prior art date
Application number
PCT/US2005/044424
Other languages
French (fr)
Other versions
WO2006063134A2 (en
Inventor
Alan Rae
Eric Groat
Original Assignee
Nanodynamics Inc
Alan Rae
Eric Groat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanodynamics Inc, Alan Rae, Eric Groat filed Critical Nanodynamics Inc
Publication of WO2006063134A2 publication Critical patent/WO2006063134A2/en
Publication of WO2006063134A3 publication Critical patent/WO2006063134A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Powder Metallurgy (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The present invention provides pre-alloy compositions that include a major component of an alloy system and at least one minor component, where at least one of the components is in a particulate form, and the particles are of a sufficiently small size that they have a melting temperature that is less than that of any alloy of the major and minor components.
PCT/US2005/044424 2004-12-07 2005-12-06 Low-melting pre-alloy compositions WO2006063134A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63374604P 2004-12-07 2004-12-07
US60/633,746 2004-12-07

Publications (2)

Publication Number Publication Date
WO2006063134A2 WO2006063134A2 (en) 2006-06-15
WO2006063134A3 true WO2006063134A3 (en) 2008-12-11

Family

ID=36578569

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/044424 WO2006063134A2 (en) 2004-12-07 2005-12-06 Low-melting pre-alloy compositions

Country Status (1)

Country Link
WO (1) WO2006063134A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101026970B1 (en) * 2005-05-25 2011-04-11 센주긴조쿠고교 가부시키가이샤 Lead-free solder paste
US8486305B2 (en) 2009-11-30 2013-07-16 Lockheed Martin Corporation Nanoparticle composition and methods of making the same
US9072185B2 (en) 2009-07-30 2015-06-30 Lockheed Martin Corporation Copper nanoparticle application processes for low temperature printable, flexible/conformal electronics and antennas
US9011570B2 (en) 2009-07-30 2015-04-21 Lockheed Martin Corporation Articles containing copper nanoparticles and methods for production and use thereof
US10544483B2 (en) 2010-03-04 2020-01-28 Lockheed Martin Corporation Scalable processes for forming tin nanoparticles, compositions containing tin nanoparticles, and applications utilizing same
WO2011109660A2 (en) * 2010-03-04 2011-09-09 Lockheed Martin Corporation Compositions containing tin nanoparticles and methods for use thereof
US20130206225A1 (en) 2012-02-10 2013-08-15 Lockheed Martin Corporation Photovoltaic cells having electrical contacts formed from metal nanoparticles and methods for production thereof
WO2013120110A1 (en) 2012-02-10 2013-08-15 Lockheed Martin Corporation Nanoparticle paste formulations and methods for production and use thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030168130A1 (en) * 1999-02-23 2003-09-11 International Business Machines Corporation Lead-free solder powder material, lead-free solder paste and a method for preparing same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030168130A1 (en) * 1999-02-23 2003-09-11 International Business Machines Corporation Lead-free solder powder material, lead-free solder paste and a method for preparing same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
LIN D.C. ET AL.: "An Investigation of nanoparticles addition on solidification kinetics and microstructure development of tin-lead solder", MATERIAL SCIENCE AND ENGINEERING, vol. A360, 2003, pages 285 - 292 *

Also Published As

Publication number Publication date
WO2006063134A2 (en) 2006-06-15

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