WO2006062210A1 - Surface modified corundum and resin composition - Google Patents
Surface modified corundum and resin composition Download PDFInfo
- Publication number
- WO2006062210A1 WO2006062210A1 PCT/JP2005/022703 JP2005022703W WO2006062210A1 WO 2006062210 A1 WO2006062210 A1 WO 2006062210A1 JP 2005022703 W JP2005022703 W JP 2005022703W WO 2006062210 A1 WO2006062210 A1 WO 2006062210A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin
- corundum
- resin composition
- silicone
- group
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/40—Compounds of aluminium
- C09C1/407—Aluminium oxides or hydroxides
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/12—Treatment with organosilicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
- Y10T428/257—Iron oxide or aluminum oxide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/259—Silicic material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2998—Coated including synthetic resin or polymer
Definitions
- the present invention relates to a highly thermal conductive corundum, which is mainly used by filling in plastics, rubbers, greases or the like, and a resin composition using the corundum.
- corundum has been widely used as a filler in rubbers or plastics.
- the corundum is used as a heat-radiating filler in a silicone resin, a silicone rubber or an epoxy resin.
- JP-A-H05-132576 and JP-A-2001-348488 disclose a resin composition using alumina particles and having excellent heat conductivity.
- JP-A-H11-209618 discloses a thermal conductive silicone gel composition containing alumina particles treated with a silane coupling agent.
- the heat-radiating performance is more enhanced by filling a larger amount of corundum in the resin, but an untreated corundum has poor affinity with the resin.
- the composition has, therefore, a high viscosity and may cause a molding failure when used for molding or an inhibition of curing when dispersed in a curable resin.
- An object of the present invention is to obtain good affinity between a resin and corundum by surface-treating the corundum with a silicone compound and yield a kneaded product assured of a low viscosity, a uniform dispersibility and when a curable resin is used as the matrix resin, a high curing rate, so that the handling and moldability of the resin composition can be enhanced.
- the present invention includes the followings.
- the silicone resin comprises at least one of a modified silicone where at least a part of methyl groups in polydimethylsiloxane is replaced by another substituent X (X is an alkoxy group, an epoxy group, an amino group, a carboxyl group or an organic group having an ether bond or the like) , and a modified silicone represented by formula (1) :
- Y is an alkyl group represented by C n H 2n+ i (n is an integer from 1 to 8), and m is an integer of 1 or more.
- corundum as described in any one of (1) to (5) above, wherein the corundum has an average secondary particle diameter of 0.1 to 200 ⁇ m and a BET specific surface area of 0.01 to 100 m 2 /g.
- a semiconductor element which transmits heat through the resin composition described in any one of (8) to (12) above.
- Fig. 1 shows an example of a device comprising a corundum-containing resin composition of the present invention inserted between a heat generating part and a heat releasing component.
- the corundum of the present invention is characterized in that the surface thereof is coated with a silicone compound containing a silicone resin.
- the silicone resin as used in the present invention means a resin having a skeleton comprising bonds formed by alternately bonding oxygen to silicon having an organic group, and examples thereof include a modified silicone where a part of methyl groups in polydimethylsiloxane is replaced by another substituent X (X is an alkoxy group, an epoxy group, an amino group, a carboxyl group or an organic group having an ether bond or the like) , and a modified silicone represented by formula (1) .
- such a silicone resin is coated on corundum particles.
- Y is an alkyl group represented by C n H 2n+! (n is an integer from 1 to 8), and m is an integer of 1 or more.
- the viscosity of the kneaded product is relatively not elevated and the flexibility of the composition is scarcely lost, as a result, the mechanical resistance and the like of the composition are enhanced.
- curing may not or insufficiently proceed or even if cured, curing takes a very long time, but even in such a case, when the corundum of the present invention is used, curing may be completed in a short time.
- the silicone compound containing a silicone resin a silicone resin-containing silicone compound having a kinetic viscosity of 500 cSt or less is preferably used. If the kinetic viscosity exceeds 500 cSt, the affinity to the surface of a corundum particle is worsened and it becomes difficult to uniformly effect the surface treatment.
- the silicone resin which can be used is not particularly limited and a known compound may be used. Examples thereof include the above-described modified silicones and among these, more preferred is an alkoxy- modified silicone such as methylmethoxysiloxane and polyethoxy-dimethylsiloxane.
- the corundum for use in the present invention preferably has an average secondary particle diameter of 0.1 to 200 ⁇ m, more preferably from 0.3 to 100 ⁇ m. With an average particle diameter in this range, an excellent surface smoothness is obtained when a resin composition containing this corundum is used as a sheet material of a heat-radiating sheet or as a substrate material of an MC (metal core) substrate or a printed wiring board. Furthermore, excellent dispersibility in a resin composition is ensured and therefore, the resin composition can have good mechanical strength.
- the corundum particles may be difficult to handle or a cohesive force among particles may be increased to lower the dispersibility in a resin composition.
- the average particle diameter exceeds 200 ⁇ m, the surface smoothness decreases when a resin composition containing this corundum is used as a sheet material of a heat-radiating sheet or as a substrate material of an MC substrate or a printed wiring board.
- the corundum of the present invention preferably has a specific surface area of 0.01 to 100 m 2 /g, more preferably from 0.05 to 10 m 2 /g, as measured by the BET method.
- a resin composition using a corundum having a specific surface area in this range is assured of smooth surface, excellent mechanical strength and good dispersibility of corundum in the resin composition.
- the method of coating a silicone compound on the corundum is not particularly limited and a known method may be used. Examples thereof include a dry processing method and a wet processing method.
- the coverage of a silicone compound or the like on the corundum is preferably from 0.01 to 5 mass%, more preferably from 0.05 to 1 mass%, based on the corundum. If the coverage is less than 0.01 mass%, the covering effect is hardly obtained, whereas if it exceeds 5 mass%, the content of an unreacted silicone compound or the like is increased and this may give rise to a problem that, for example, the unreacted silicone compound remains as an impurity.
- the corundum of the present invention is preferably filled in an oil or a polymer compound such as rubber or plastic (in the specification, these are also referred to as "a resin"), and can be suitably used as a highly thermal conductive grease composition, a highly thermal conductive rubber composition or a highly thermal conductive plastic composition.
- the corundum content is preferably 80 mass% or more.
- the resin as above examples include a hydrocarbon-based resin (e.g., polyethylene, ethylene- vinyl acetate copolymer, ethylene-acrylate copolymer, ethylene-propylene copolymer, poly(ethylene-propylene) , polypropylene, polyisoprene, poly(isoprene-butylene) , polybutadiene, poly(styrene-butadiene) , poly(butadiene- acrylonitrile) , polychloroprene, chlorinated polypropylene, polybutene, polyisobutylene, olefin resin, petroleum resin, styrol resin, ABS resin, coumarone• indene resin, terpene resin, rosin resin, diene resin); a (meth) acrylic resin (for example, a resin obtained by homopolymerizing a monomer such as methyl (meth) acrylate, ethyl (meth) acrylate, 2-e
- One of these may be used alone or a plurality of these may be used in combination.
- these resins more preferred are an unsaturated polyester resin, an acrylic resin, a methacrylic resin, a vinyl ester resin, an epoxy resin and a silicone resin.
- Such a resin may have a low molecular weight or a high molecular weight and may be in a rubbery or glassy state or may be a cured product. These conditions may be freely selected depending on the usage or environment on use.
- the resin is preferably an oily substance.
- the grease obtained by mixing the corundum of the present invention with an oil advantageously follows the unevenness of a heating element and a heat-radiating element and at the same time, allows for a small distance therebetween, so that the heat-radiating effect can be more enhanced.
- the oil which can be used for the above and other purposes is not particularly limited and a known oil may be used. Examples thereof include a silicone oil, a petroleum-based oil, a synthetic oil and a fluorine-based oil.
- the corundum coated with a silicone compound of the present invention has a high affinity with a general resin and can be filled in a general resin in a higher amount in comparison with corundum without a coating, but a silicone compound, for example, a curable silicone oil such as two components room temperature curable potting gel (TSE 3070 soled by GE Toshiba Silicone) is of course particularly preferred as the silicone compound generally has a higher affinity with the silicone resin.
- a silicone compound for example, a curable silicone oil such as two components room temperature curable potting gel (TSE 3070 soled by GE Toshiba Silicone) is of course particularly preferred as the silicone compound generally has a higher affinity with the silicone resin.
- the composition of the present invention may have a solid form such as a sheet or a grease form.
- the sheet or grease is interposed between a heat-generating portion of, for example, an electronic part or a semiconductor element and a heat-radiating component or plate, whereby heat generated can be efficiently transmitted and radiated through the composition of the present invention.
- Examples of such a part, element or device include a computer and CPU (central processing unit) thereof, PDP (plasma display panel), a battery (e.g., lead storage battery, secondary battery, capacitor) and a peripheral device thereof (a device used for a hybrid electric car or the like by providing a thermal conductive composition between a secondary battery and a heat-radiating element to control the temperature and stabilize the battery properties) , a radiator of electric motor, a Peltier element, an inverter, a (high) power transistor, and a high-brightness LED.
- a computer and CPU central processing unit
- PDP plasma display panel
- a battery e.g., lead storage battery, secondary battery, capacitor
- a peripheral device thereof a device used for a hybrid electric car or the like by providing a thermal conductive composition between a secondary battery and a heat-radiating element to control the temperature and stabilize the battery properties
- a radiator of electric motor e.g., a Peltier element, an inverter, a (high) power
- Fig. 1 shows an example of a device comprising a heat releasing sheet 1 of a corundum-containing resin composition of the present invention inserted between a package 2 including a heat generating part such as an electronic component or a semiconductor element (CPU, etc.) and a heat releasing component or a heat radiator 3, by which generated heat is effectively conducted and released through the resin composition of the present invention.
- Reference 4 denotes a substrate.
- the obtained resin composition was held in air at 100°C for 1 hour, thereby effecting a curing test. As a result of the curing test, good cured state was obtained in all samples. Also, 300 g of the surface-treated corundum was filled in 100 g of a silicone oil (TSE3070 Solution A (10 g) + Solution B (10 g) , produced by GE Toshiba Silicones, Co., Ltd.), and the viscosity was measured at 25°C by a BS-type viscometer (manufactured by Tokyo Reiki Co., Ltd.) .
- TSE3070 Solution A (10 g) + Solution B (10 g) produced by GE Toshiba Silicones, Co., Ltd.
- a surface treatment and a curing test were performed under the same conditions as in Examples.
- the amount of the silicone compound at the surface treatment was 35 g in Reference Examples 1 to 4, 0.035 g in Reference
- Example 5 or 420 g in Reference Example 6.
- Comparative Example 1 the curing test was performed by using surface-untreated corundum. In the case where the surface was not coated with a silicone compound (Comparative Example 1),, the resin composition was not cured.
- the corundum of the present invention can be filled in a resin in a higher amount, with a reduced viscosity and a uniform dispersion, and when a resin composition in which the corundum is filled is disposed, for example, between a heat generating part of an electronic component or a semiconductor element and a heat releasing component or a heat radiator, heat conduction and heat release can be improved.
- a resin composition in which the corundum is filled is disposed, for example, between a heat generating part of an electronic component or a semiconductor element and a heat releasing component or a heat radiator, heat conduction and heat release can be improved.
- the corundum and resin composition of the present invention are useful in industries.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/791,849 US7566500B2 (en) | 2004-12-06 | 2005-12-05 | Surface modified corundum and resin composition |
DE602005016155T DE602005016155D1 (en) | 2004-12-06 | 2005-12-05 | SURFACE MODIFIED CORUND AND RESIN COMPOSITION |
AT05814337T ATE440125T1 (en) | 2004-12-06 | 2005-12-05 | SURFACE MODIFIED CORUNDUM AND RESIN COMPOSITION |
EP05814337A EP1833924B1 (en) | 2004-12-06 | 2005-12-05 | Surface modified corundum and resin composition |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-353199 | 2004-12-06 | ||
JP2004353199 | 2004-12-06 | ||
US63560204P | 2004-12-14 | 2004-12-14 | |
US60/635,602 | 2004-12-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006062210A1 true WO2006062210A1 (en) | 2006-06-15 |
Family
ID=38353171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/022703 WO2006062210A1 (en) | 2004-12-06 | 2005-12-05 | Surface modified corundum and resin composition |
Country Status (7)
Country | Link |
---|---|
US (1) | US7566500B2 (en) |
EP (1) | EP1833924B1 (en) |
JP (1) | JP5105740B2 (en) |
KR (1) | KR100855228B1 (en) |
AT (1) | ATE440125T1 (en) |
DE (1) | DE602005016155D1 (en) |
WO (1) | WO2006062210A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101547343B1 (en) * | 2007-02-20 | 2015-08-28 | 다우 코닝 코포레이션 | Filler treating agents based on hydrogen bonding polyorganosiloxanes |
MX2011008279A (en) * | 2009-02-17 | 2011-11-04 | Dow Corning | Silicone gel seal and method for its preparation and use. |
US9856400B2 (en) | 2012-04-27 | 2018-01-02 | Burning Bush Group, Llc | High performance silicon based coating compositions |
WO2013170124A1 (en) | 2012-05-10 | 2013-11-14 | Burning Bush Group | High performance silicon based thermal coating compositions |
EP2869977B1 (en) | 2012-07-03 | 2020-04-22 | Burning Bush Group, LLC | High performance silicon based coating compositions |
US9006355B1 (en) | 2013-10-04 | 2015-04-14 | Burning Bush Group, Llc | High performance silicon-based compositions |
WO2015060125A1 (en) | 2013-10-24 | 2015-04-30 | Dic株式会社 | Resin composition, heat-dissipating material, and heat-dissipating member |
CA2935794C (en) * | 2014-01-22 | 2023-01-24 | Basf Se | Silicon comprising polymer coated particles |
US20180163111A1 (en) * | 2016-12-14 | 2018-06-14 | National Chung-Shan Institute Of Science And Technology | Thermal conductive plastic material and method of manufacturing the same |
CN109942747B (en) * | 2019-04-01 | 2021-05-18 | 福州大学 | Flexible conductive hydrogel and preparation method thereof |
ES2970729T3 (en) | 2019-09-18 | 2024-05-30 | Premo Sl | Power transformer assembly and thermally conductive compound to seal a power transformer assembly |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0799791A1 (en) * | 1995-10-02 | 1997-10-08 | Mitsubishi Materials Corporation | Hydrophobic metal oxide powder and use thereof |
JPH11209618A (en) * | 1998-01-27 | 1999-08-03 | Matsushita Electric Works Ltd | Heat-conductive silicone rubber composition |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59137305A (en) | 1983-01-27 | 1984-08-07 | Nippon Aerojiru Kk | Surface-modified fine metallic oxide powder |
TW197458B (en) | 1991-02-14 | 1993-01-01 | Ciba Geigy Ag | |
JP3146679B2 (en) * | 1992-08-31 | 2001-03-19 | 三菱マテリアル株式会社 | Hydrophobic metal oxide powder |
EP0934773B1 (en) * | 1998-02-06 | 2004-02-04 | Seiwa Kasei Co., Ltd. | Microcapsule having a specific wall and method for producing the same |
JP2001348488A (en) | 2000-06-06 | 2001-12-18 | Matsushita Electric Works Ltd | Heat-conductive resin composition, prepreg, radiating circuit board and radiating heating part |
EP1249470A3 (en) * | 2001-03-30 | 2005-12-28 | Degussa AG | Highly filled pasty siliconorganic nano and/or microhybridcapsules containing composition for scratch and/or abrasion resistant coatings |
JP2003201116A (en) * | 2001-10-10 | 2003-07-15 | Showa Denko Kk | Granular alumina, manufacturing method of granular alumina and composition containing granular alumina |
-
2005
- 2005-12-05 EP EP05814337A patent/EP1833924B1/en active Active
- 2005-12-05 WO PCT/JP2005/022703 patent/WO2006062210A1/en active Application Filing
- 2005-12-05 AT AT05814337T patent/ATE440125T1/en not_active IP Right Cessation
- 2005-12-05 DE DE602005016155T patent/DE602005016155D1/en active Active
- 2005-12-05 JP JP2005351251A patent/JP5105740B2/en active Active
- 2005-12-05 US US11/791,849 patent/US7566500B2/en active Active
- 2005-12-05 KR KR1020077012668A patent/KR100855228B1/en active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0799791A1 (en) * | 1995-10-02 | 1997-10-08 | Mitsubishi Materials Corporation | Hydrophobic metal oxide powder and use thereof |
JPH11209618A (en) * | 1998-01-27 | 1999-08-03 | Matsushita Electric Works Ltd | Heat-conductive silicone rubber composition |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 13 30 November 1999 (1999-11-30) * |
Also Published As
Publication number | Publication date |
---|---|
US20070264493A1 (en) | 2007-11-15 |
DE602005016155D1 (en) | 2009-10-01 |
ATE440125T1 (en) | 2009-09-15 |
JP5105740B2 (en) | 2012-12-26 |
JP2006188670A (en) | 2006-07-20 |
KR100855228B1 (en) | 2008-08-29 |
US7566500B2 (en) | 2009-07-28 |
EP1833924B1 (en) | 2009-08-19 |
KR20070073967A (en) | 2007-07-10 |
EP1833924A1 (en) | 2007-09-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1833924B1 (en) | Surface modified corundum and resin composition | |
JP5854363B2 (en) | Thermal storage composition | |
TWI327322B (en) | ||
JP4144998B2 (en) | Material for heat dissipation | |
JP2024023255A (en) | Heat dissipation composition, heat dissipation member, and filler aggregate for heat dissipation member | |
JP5103364B2 (en) | Manufacturing method of heat conductive sheet | |
TW200911924A (en) | Thermally conductive compound and process for producing the same | |
JP2017039802A (en) | Material for protecting semiconductor element and semiconductor device | |
JP2006036931A (en) | Heat-conductive composition | |
JP2018188350A (en) | Boron nitride particle aggregate and thermosetting material | |
WO2022049902A1 (en) | Thermally conductive silicone heat dissipation material | |
JP6988023B1 (en) | Thermally conductive silicone heat dissipation material | |
KR101960528B1 (en) | Heat-dissipation sheet with improved insulating property | |
JP4526064B2 (en) | Corundum for resin filling and resin composition | |
EP1629035B1 (en) | Corundum for filling in resin and resin composition | |
JP2008031405A (en) | Method of manufacturing thermoconductive resin composition | |
CN113661215B (en) | Heat-resistant silicone resin composition and heat-resistant silicone resin composite material | |
WO2020075663A1 (en) | Resin composition, resin cured product, and composite molded body | |
JP2020063438A (en) | Resin composition, resin cured product and composite molding | |
US20220389229A1 (en) | Method For Producing Surface-Coated Hexagonal Boron Nitride Particle And Surface-Coated Hexagonal Boron Nitride Particle | |
WO2023189030A1 (en) | Thermosetting resin composition, resin cured product and composite molded body | |
WO2022210686A1 (en) | Resin composition, cured product sheet, composite molded body and semiconductor device | |
KR20060025545A (en) | Corundum for filling in resin and resin composition | |
JP2023102284A (en) | Heat-conductive resin composition, heat-conductive resin sheet, heat dissipation laminate, heat dissipation circuit board, semiconductor device, and power module | |
WO2023074449A1 (en) | Heat-conductive sheet |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KM KN KP KR KZ LC LK LR LS LT LU LV LY MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU LV MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 11791849 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2005814337 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020077012668 Country of ref document: KR |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWP | Wipo information: published in national office |
Ref document number: 2005814337 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 11791849 Country of ref document: US |