WO2006049358A1 - Mixing type circuit board - Google Patents

Mixing type circuit board Download PDF

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Publication number
WO2006049358A1
WO2006049358A1 PCT/KR2004/002833 KR2004002833W WO2006049358A1 WO 2006049358 A1 WO2006049358 A1 WO 2006049358A1 KR 2004002833 W KR2004002833 W KR 2004002833W WO 2006049358 A1 WO2006049358 A1 WO 2006049358A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
board unit
copper membrane
printed circuit
carbon
Prior art date
Application number
PCT/KR2004/002833
Other languages
French (fr)
Inventor
Hong-Beom Shin
Original Assignee
Remote Solution Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Remote Solution Co., Ltd. filed Critical Remote Solution Co., Ltd.
Priority to PCT/KR2004/002833 priority Critical patent/WO2006049358A1/en
Publication of WO2006049358A1 publication Critical patent/WO2006049358A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0391—Using different types of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors

Definitions

  • the present invention relates to a circuit board on which various parts such as resistor, condenser, diode, transistor, and so on are loaded in electric or electron instruments, and in particular to a mixing type circuit board capable of combining a carbon printed circuit board unit and a copper membrane circuit board unit each are individually manufactured, so that the circuit board may be not assembled more faster and easier but also adopted for green environments and a mass product.
  • a general circuit board 103 used in electric or electron instruments as shown in Fig. 1 , coppers are covered over a surface of a substrate to form a copper membrane.
  • the copper membrane is etched by a predetermined pattern so that a copper covered portion having a desirable electric characteristic may be remained on the surface of the substrate.
  • an insulation layer is formed on the copper covered portion and successively an exposure of particular portions at which contact portions 4 are formed is carried out, so as to be covered on the particular portions with a carbon.
  • a plural of elements 2' at a predetermined position are loaded on the patterned substrate and the loaded elements 2' are fixed to the patterned substrate by a solder.
  • the present invention is designed in consideration of the above problems, and therefore it is an object of the invention to provide a mixing type circuit board which may separate a carbon printed circuit board unit from a copper membrane circuit board unit, each is individually manufactured, resulting in forming one circuit board after the individually manufactured carbon printed circuit board unit and the individually manufactured copper membrane circuit board unit are coupled to each other, so that the coupled circuit board may be not assembled more faster and easier but also adopted for green environments and a mass product.
  • the present invention provides a mixing type circuit board, which comprises a carbon printed circuit board unit having predetermined patterns to realize a carbon printed circuit on a substrate; a copper membrane circuit board unit having predetermined patterns which are formed on a substrate by a copper membrane; and a coupling terminal for making these circuit board units to be coupled to each other to realize one circuit board.
  • the mixing type circuit board may be to not only improve a better quality, resulting from the formation of predetermined patterns at much of a substrate in the method of a carbon printing, which is its original use, but also largely reduce a number of complex manufacturing processes which include a copper membrane coverage, an etching, an insulation coverage, a removal, and a carbon coverage of limited regions, and a draining amount of a wastewater containing chemical supplies, resulting in improving a green environment and a high productivity.
  • FIG. 1 is an exemplary view showing the formation of predetermined patterns in a conventional circuit board
  • FIG. 2 is a front view showing one preferred embodiment of a mix type circuit board according to the present invention.
  • FIG. 3 is a front view showing a divided state of a mix type circuit board into a carbon printed circuit board unit and a copper membrane circuit board unit;
  • FIG. 4 is a side view showing a coupled state of a carbon printed circuit board unit and a copper membrane circuit board unit to each other. [Best Mode]
  • FIG. 2 which shows one preferred embodiment of a mix type circuit board
  • the mix type circuit board 103 comprises a carbon printed circuit board unit 1 having predetermined patterns which are formed on a surface of a substrate by a carbon printing, and a copper membrane circuit board unit 2 having a copper membrane which is formed to solder various parts on a surface of a substrate.
  • FIG. 3 shows a divided state of a mix type circuit board 103 according to the present invention
  • FIG. 4 is a side view showing a coupled state of a carbon printed circuit board unit 1 and a copper membrane circuit board unit 2 to each other.
  • a carbon printed circuit board unit 1 and a copper membrane circuit board unit 2 are independently manufactured and also have at least one respective coupling terminals 101 and 201 at a corresponding contact regions 10 and 20 in the carbon printed circuit board unit 1 and the copper membrane circuit board unit 2.
  • a conductivity formed between them 1 and 2 keeps to be maintained by the at least one respective coupling terminals 101 and 201.
  • a conductive coupling member 3 is fixedly loaded on a surface of a connection member in the respective coupling terminals 101 and 201 by a solder so that the carbon printed circuit board unit 1 and the copper membrane circuit board unit 2 may keep maintaining a conductive state, resulting in forming one circuit board 103 from combing the carbon printed circuit board unit 1 and the copper membrane circuit board unit 2.
  • one circuit board 103 required to electric or electron instruments may distinguish the copper membrane circuit board unit 2 having predetermined patterns which are formed by the copper membrane with the carbon printed circuit board unit 1 having predetermined patterns which are formed by a carbon printing, resulting in forming one circuit board 103 from coupling the carbon printed circuit board unit 1 to the copper membrane circuit board unit 2 by the respective coupling terminals 101 and 201 and the conductive coupling member 3.
  • the present invention is basically directed to providing a mix type circuit board, in which much portions of surface of a substrate are consisted of a carbon printed circuit board unit 1 having a high conductivity, capable of considerably improving its quality and being embodied only with a printing process, so it may be easy to carry out a mass product. Further, portions occupied by the copper membrane circuit board unit 2 is comparably reduced and thereby a using amount about chemical drugs employed at the formation process of a carbon membrane successively becomes less, resulting in functioning as a basis on an environment protection.
  • the conductive coupling member 3 fixedly soldered to the coupling terminals 101 and 201 of the carbon printed circuit board unit 1 and the copper membrane circuit board unit 2 may be used as a conductive body of the respective coupling terminals 101 and 201 for keeping maintaining a conductive state at the separated carbon printed circuit board unit 1 and copper membrane circuit board unit 2 divided from each other.
  • the conductive coupling member 3 is functioned as making a conductive film material to be heat-melt on the respective coupling terminals 101 and 201 , or functioned as making a conductive rubber material to which a predetermined push pressure is applied from the upper, to be soldered on the respective coupling terminals 101 and 201.
  • various conductive materials are functioned as making a conductive socket to be coupled. Therefore, the present invention configured as above may be within a scope of a technical thinking.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

Disclosed is a mix type circuit board capable of forming one circuit board after individually manufactured carbon printed circuit board unit and copper membrane circuit board unit are coupled to each other, so that the formed one circuit board may be not assembled faster and easier but also adopted for green environments and a mass product. The mix type circuit board comprises the carbon printed circuit board unit having predetermined patterns to realize a carbon printed circuit on the substrate; and the copper membrane circuit board unit having predetermined patterns which are formed on the substrate by a copper membrane; and a coupling terminal for making these circuit board units to be coupled to each other to realize one circuit board.

Description

MIXING TYPE CIRCUIT BOARD
[Technical Field]
The present invention relates to a circuit board on which various parts such as resistor, condenser, diode, transistor, and so on are loaded in electric or electron instruments, and in particular to a mixing type circuit board capable of combining a carbon printed circuit board unit and a copper membrane circuit board unit each are individually manufactured, so that the circuit board may be not assembled more faster and easier but also adopted for green environments and a mass product.
[Background Art]
In a general circuit board 103 used in electric or electron instruments as shown in Fig. 1 , coppers are covered over a surface of a substrate to form a copper membrane. The copper membrane is etched by a predetermined pattern so that a copper covered portion having a desirable electric characteristic may be remained on the surface of the substrate. And, an insulation layer is formed on the copper covered portion and successively an exposure of particular portions at which contact portions 4 are formed is carried out, so as to be covered on the particular portions with a carbon. After a completion of the first and secondary patterned formations of the copper covered portion and the particular carbon portions, a plural of elements 2' at a predetermined position are loaded on the patterned substrate and the loaded elements 2' are fixed to the patterned substrate by a solder.
In such conventional circuit board manufacturing method using a copper membrane, it is to degrade productivity because the particular patterned formation can be achieved after a completion of carrying out many processes and also it is not to be suitable for a mass product. Further, errors are often occurred in manufacturing procedure and many persons and a high manufacturing cost are required too, resulting in having its high cost price. Moreover, diverse chemical supplies are employed and mixed in the coverage process and the etching process of the copper membrane, thereby bringing about a serious environment pollution resulting from draining a wastewater containing the chemical supplies.
In a meanwhile, it has been suggested that high conductive carbon circuit patterns are formed on a substrate. The formation of the carbon printed patterns on the substrate is easier at working in manufacturing a circuit board, but it is impossible to load various parts such as resistor, condenser, diode, transistor on the printed circuit board. Also, only limited regions like switching contact portions 4 in the substrate where a considerably high conductivity is required are used as the printed circuit. Practically, only a contact surface on the bottom of a push button to be contacted is covered with a carbon and is printed to fast sense a contact signal because switching contact portions 4 are downward moved to and contacted with limited regions in the case that the printed circuit installed in electric or electron instruments having the push button like a remote control or a mobile phone is actually active operated by the push button. [Disclosure] [Technical Problem]
The present invention is designed in consideration of the above problems, and therefore it is an object of the invention to provide a mixing type circuit board which may separate a carbon printed circuit board unit from a copper membrane circuit board unit, each is individually manufactured, resulting in forming one circuit board after the individually manufactured carbon printed circuit board unit and the individually manufactured copper membrane circuit board unit are coupled to each other, so that the coupled circuit board may be not assembled more faster and easier but also adopted for green environments and a mass product. [Technical Solution]
In order to accomplish the above object, the present invention provides a mixing type circuit board, which comprises a carbon printed circuit board unit having predetermined patterns to realize a carbon printed circuit on a substrate; a copper membrane circuit board unit having predetermined patterns which are formed on a substrate by a copper membrane; and a coupling terminal for making these circuit board units to be coupled to each other to realize one circuit board. [Advantageous Effects]
By using the mixing type circuit board according to the present invention, it may be to not only improve a better quality, resulting from the formation of predetermined patterns at much of a substrate in the method of a carbon printing, which is its original use, but also largely reduce a number of complex manufacturing processes which include a copper membrane coverage, an etching, an insulation coverage, a removal, and a carbon coverage of limited regions, and a draining amount of a wastewater containing chemical supplies, resulting in improving a green environment and a high productivity.
In addition to obtaining the simplification of the manufacturing procedure, the rapidity of the making-up, and a working facility, it may be to easily have the construction of a mass product system, so it may be minimized to use chemical drugs to be led to bring to environment pollution, which is employed at a copper membrane etching, resulting in functioning as a basis on environments protection. [Description of Drawings]
FIG. 1 is an exemplary view showing the formation of predetermined patterns in a conventional circuit board;
FIG. 2 is a front view showing one preferred embodiment of a mix type circuit board according to the present invention;
FIG. 3 is a front view showing a divided state of a mix type circuit board into a carbon printed circuit board unit and a copper membrane circuit board unit; and
FIG. 4 is a side view showing a coupled state of a carbon printed circuit board unit and a copper membrane circuit board unit to each other. [Best Mode]
Hereinafter, a mix type circuit board according to the present invention will be described in detail referring to the accompanying drawings.
In FIG. 2 which shows one preferred embodiment of a mix type circuit board
103 according to the present invention, the mix type circuit board 103 comprises a carbon printed circuit board unit 1 having predetermined patterns which are formed on a surface of a substrate by a carbon printing, and a copper membrane circuit board unit 2 having a copper membrane which is formed to solder various parts on a surface of a substrate.
FIG. 3 shows a divided state of a mix type circuit board 103 according to the present invention, and FIG. 4 is a side view showing a coupled state of a carbon printed circuit board unit 1 and a copper membrane circuit board unit 2 to each other. Referring to FIGs. 3 and 4, a carbon printed circuit board unit 1 and a copper membrane circuit board unit 2 are independently manufactured and also have at least one respective coupling terminals 101 and 201 at a corresponding contact regions 10 and 20 in the carbon printed circuit board unit 1 and the copper membrane circuit board unit 2. A conductivity formed between them 1 and 2 keeps to be maintained by the at least one respective coupling terminals 101 and 201. The corresponding contact regions 10 and 20 in the carbon printed circuit board unit 1 and the copper membrane circuit board unit 2 are opposed against each other and coupled to each other to form an incorporative one body. A conductive coupling member 3 is fixedly loaded on a surface of a connection member in the respective coupling terminals 101 and 201 by a solder so that the carbon printed circuit board unit 1 and the copper membrane circuit board unit 2 may keep maintaining a conductive state, resulting in forming one circuit board 103 from combing the carbon printed circuit board unit 1 and the copper membrane circuit board unit 2.
In other words, one circuit board 103 required to electric or electron instruments may distinguish the copper membrane circuit board unit 2 having predetermined patterns which are formed by the copper membrane with the carbon printed circuit board unit 1 having predetermined patterns which are formed by a carbon printing, resulting in forming one circuit board 103 from coupling the carbon printed circuit board unit 1 to the copper membrane circuit board unit 2 by the respective coupling terminals 101 and 201 and the conductive coupling member 3.
As described above, it would be understood that the present invention is basically directed to providing a mix type circuit board, in which much portions of surface of a substrate are consisted of a carbon printed circuit board unit 1 having a high conductivity, capable of considerably improving its quality and being embodied only with a printing process, so it may be easy to carry out a mass product. Further, portions occupied by the copper membrane circuit board unit 2 is comparably reduced and thereby a using amount about chemical drugs employed at the formation process of a carbon membrane successively becomes less, resulting in functioning as a basis on an environment protection.
In addition, many applications and modifications may be used by those skilled in the art within the scope of basic technical spirit of the present invention. [Industrial Applicability] By using the mix type circuit board according to the present invention configured as above, the conductive coupling member 3 fixedly soldered to the coupling terminals 101 and 201 of the carbon printed circuit board unit 1 and the copper membrane circuit board unit 2 may be used as a conductive body of the respective coupling terminals 101 and 201 for keeping maintaining a conductive state at the separated carbon printed circuit board unit 1 and copper membrane circuit board unit 2 divided from each other. Also, the conductive coupling member 3 is functioned as making a conductive film material to be heat-melt on the respective coupling terminals 101 and 201 , or functioned as making a conductive rubber material to which a predetermined push pressure is applied from the upper, to be soldered on the respective coupling terminals 101 and 201. Moreover, it may be suggested that various conductive materials are functioned as making a conductive socket to be coupled. Therefore, the present invention configured as above may be within a scope of a technical thinking.

Claims

[CLAIMS] [Claim 1 ]
In a circuit board 103 in electric or electron instruments, which is divided into a carbon printed circuit board unit 1 and a copper membrane circuit board unit 2 wherein said carbon printed circuit board unit 1 has predetermined patterns which are formed on a surface of a substrate and said copper membrane circuit board unit 2 has a copper membrane which is formed to solder on the surface of the substrate various parts 2' such as diode, condenser, and so on, a mix type circuit board comprises: a plural of contact regions 10 and 20 for being formed in said carbon printed circuit board unit 1 and said copper membrane circuit board unit 2; at least one or more coupling terminals 101 and 201 for being formed on said respective contact regions 10 and 20 so as to keep maintaining a conductive state; and a conductive coupling member 3 for being soldered to said respective coupling terminals 101 and 201 at a state that said corresponding contact regions 10 and 20 in said carbon printed circuit board unit 1 and said copper membrane circuit board unit 2 are opposed against and coupled to each other, wherein one circuit board 103 are combined and integrated with said carbon printed circuit board unit 1 and said copper membrane circuit board unit 2 which are individually manufactured, for the purpose of forming one body.
PCT/KR2004/002833 2004-11-04 2004-11-04 Mixing type circuit board WO2006049358A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/KR2004/002833 WO2006049358A1 (en) 2004-11-04 2004-11-04 Mixing type circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2004/002833 WO2006049358A1 (en) 2004-11-04 2004-11-04 Mixing type circuit board

Publications (1)

Publication Number Publication Date
WO2006049358A1 true WO2006049358A1 (en) 2006-05-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1937042A2 (en) 2006-12-21 2008-06-25 Siemens Home and Office Communication Devices GmbH & Co. KG Connection system for a display module
CN103177331A (en) * 2013-02-06 2013-06-26 重庆航凌电路板有限公司 Two-dimension mixing production data monitoring method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415988A (en) * 1990-05-09 1992-01-21 Mitsubishi Electric Corp Manufacture of print wiring board
JPH08148768A (en) * 1994-11-25 1996-06-07 Fujitsu Ten Ltd Flexible printed circuit board
JPH09232698A (en) * 1996-02-26 1997-09-05 Hitachi Telecom Technol Ltd Printed wiring board structure
KR200321081Y1 (en) * 2003-04-09 2003-07-22 리모트솔루션주식회사 separation a model printed circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415988A (en) * 1990-05-09 1992-01-21 Mitsubishi Electric Corp Manufacture of print wiring board
JPH08148768A (en) * 1994-11-25 1996-06-07 Fujitsu Ten Ltd Flexible printed circuit board
JPH09232698A (en) * 1996-02-26 1997-09-05 Hitachi Telecom Technol Ltd Printed wiring board structure
KR200321081Y1 (en) * 2003-04-09 2003-07-22 리모트솔루션주식회사 separation a model printed circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1937042A2 (en) 2006-12-21 2008-06-25 Siemens Home and Office Communication Devices GmbH & Co. KG Connection system for a display module
DE102006060756A1 (en) * 2006-12-21 2008-07-03 Siemens Home And Office Communication Devices Gmbh & Co. Kg Connection system for a display module
CN103177331A (en) * 2013-02-06 2013-06-26 重庆航凌电路板有限公司 Two-dimension mixing production data monitoring method

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