WO2006036080A1 - Circuit integre sans contacts - Google Patents
Circuit integre sans contacts Download PDFInfo
- Publication number
- WO2006036080A1 WO2006036080A1 PCT/RU2004/000339 RU2004000339W WO2006036080A1 WO 2006036080 A1 WO2006036080 A1 WO 2006036080A1 RU 2004000339 W RU2004000339 W RU 2004000339W WO 2006036080 A1 WO2006036080 A1 WO 2006036080A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- information
- photovoltaic
- light
- semiconductor
- optically active
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 27
- 230000002093 peripheral effect Effects 0.000 claims abstract description 22
- 239000004065 semiconductor Substances 0.000 claims abstract description 21
- 238000001514 detection method Methods 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 15
- 230000005855 radiation Effects 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 239000010703 silicon Substances 0.000 claims description 11
- 229910052594 sapphire Inorganic materials 0.000 claims description 5
- 239000010980 sapphire Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 4
- 230000005670 electromagnetic radiation Effects 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- -1 for example Substances 0.000 claims description 2
- 238000012986 modification Methods 0.000 abstract description 2
- 230000004048 modification Effects 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 238000013461 design Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000003550 marker Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 230000001427 coherent effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000004986 Cholesteric liquid crystals (ChLC) Substances 0.000 description 1
- 239000004988 Nematic liquid crystal Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003446 memory effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000001208 nuclear magnetic resonance pulse sequence Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S99/00—Subject matter not provided for in other groups of this subclass
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
- G06K19/0707—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement being capable of collecting energy from external energy sources, e.g. thermocouples, vibration, electromagnetic radiation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/06009—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking
- G06K19/06046—Constructional details
- G06K19/06112—Constructional details the marking being simulated using a light source, e.g. a barcode shown on a display or a laser beam with time-varying intensity profile
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
- G06K7/10158—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves methods and means used by the interrogation device for reliably powering the wireless record carriers using an electromagnetic interrogation field
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the invention relates to electronic technical means of informatization and is a functional analogue of contactless radio frequency identifiers used in the hardware of electronic document management and information protection.
- Non-contact type identifiers favorably distinguishes from devices of a similar purpose with electrical contacts (for example, Touch Methor type) the possibility of remote activation, which, combined with their lightness and small thickness, makes it most efficient, according to reports, to solve such an extremely relevant and socially significant problem, as a prevention of unauthorized access and "copying" copying information recorded on replicated optical media (CD and DVD).
- Contactless identifiers are widely used and are commercially available by a number of companies (see, for example, [I]). They contain a central part for storing and processing input information according to a given program, made on a substrate of semiconductor material, and a peripheral part for communicating through the electromagnetic radiation of the central part with an external device supplying it, inputting and outputting information according to a given protocol .
- the central part therefore, is a semiconductor (monolithic) integrated circuit.
- the peripheral part made for communication at radio frequencies in the form of a flat coil, whose characteristic dimensions are three to four orders of magnitude higher than the characteristic dimensions of planar structures of the central part, not allowing it to form on a common substrate with
- the central part can only be a film (or foil) microcircuit.
- a film (or foil) microcircuit is a hybrid contactless integrated microcircuit (BIMS), which in principle does not allow, in the radio frequency version, a much more technically and cost-effective monolithic design.
- BIMS hybrid contactless integrated microcircuit
- radio frequencies provide obvious advantages for the main areas of application of contactless identifiers (smart cards, electronic travel documents, etc.), the main one being the possibility of activation at an arbitrary position of the identifier with respect to an external device within the zone with sizes of the order of 100 mm or more.
- the key point is the monophysical nature of the access channels (both for recording and reading) to encoded content that is located on the working field of the disk and therefore available, as well as attributive (identifying and necessary for decoding) information, access to which
- the problem is solved in that in the BIMS containing a central part, designed to store and process input information according to a given program, made on a substrate of semiconductor material, and a peripheral part, designed for contactless communication through electromagnetic radiation of the central part with an external device carrying out its power, input and output of information according to a given protocol, the peripheral part contains at least one photovoltaic structure, etc. forming incident on it the electromagnetic radiation of optical range (light) into electric energy, connected to the central portion by the input of energy and information, and at least two are connected by the voltage controlled display information optically active structures modulating light radiation reflected by them.
- the information exchange protocol corresponds to at least a single scan by a focused external device generated and modulated, in accordance with the inputted information, by a light beam of photovoltaic and optically active structures located along its path with
- An external device refers to a playback device for recording optical media in CD-DVD (CD-R, CD-RW / DVD-R, DVD-RW) formats, the optical head of which contains a semiconductor laser whose radiation is modulated in recording, and a photodetector that detects reflected radiation in the playback mode. Scanning is performed when the disk is rotated with a “SIMS” implanted into it a SIMS drive of the drive relative to its optical head.
- SIMS SIMS
- All elements of the central and peripheral parts of such a BIMS can be located on a common substrate of a semiconductor material, for example, silicon.
- a semiconductor material for example, silicon.
- This option corresponds to the simplest and most economical monolithic design, which is recommended for use as “implanted” in the identifier optical discs.
- the disk material itself is used, under which it is located (along with the recording medium).
- the SIMS is located on a common substrate made of a combined material, which includes layers of a semiconductor and an optically transparent dielectric, for example, a silicon-on-sapphire epitaxial structure.
- the SIMS is accessed from the side opposite to the planar structures of the central part, through a solid and absolutely impermeable to moisture transparent dielectric substrate, on which the photovoltaic and optically active elements are formed using thin-film technology on the surface areas freed from the semiconductor.
- the other side of the substrate, on which the central part of the BIMS is located may have blind protection and be turned into the carrier of an opaque, for example, metal frame.
- At least one element of the peripheral part of the SIMS can be located on a coating substrate of an optically transparent dielectric that coincides in size with the semiconductor substrate, hermetically connected to the first so that together they form a hybrid sandwich structure, all of whose functional elements are concentrated in the internal layers.
- the advantage of hybrid SIMS is the ability to perform their optically active structures and other bulk elements.
- FIG. 1 schematically depicts a typical example of the topology of the main (monolithic) variant of BIMS, intended for use as a contactless identifier in the composition of optical information carriers.
- Zone 2 is located under an optically opaque protective layer 4, eliminating the parasitic photoelectric effect, which can unpredictably affect the logical states of in-circuit elements of the SIMS and erase the information recorded in the registers of its non-volatile memory.
- Zone 3 is a strip stretched along the scan line AB (circular arc, concentric recording tracks), on which the functional as well as auxiliary elements of the peripheral part are concentrated.
- initial marker strokes 5 include (in the order of exposure by the laser beam during scanning): initial marker strokes 5, first photovoltaic structure 6, intermediate marker strokes (in particular, one stroke) 7, optically active structures 8 (in the amount corresponding to the number of binary digits with a checksum displayed in one scan cycle), the second photovoltaic structure 9 and the final marker strokes 10.
- All marker strokes which are light reflecting local sections of conductor (in particular, aluminum) metallization are auxiliary elements of the peripheral part, ensuring synchronization of the central part of the BIMS with the electrical circuit of an external device (electronic part of the drive).
- the first (main) photovoltaic structure 6 is a photovoltaic converter, similar in structure to a solar cell and electrically equivalent to a photodiode, or their battery, operating in photovoltaic mode. It is located along the AB scan line and is isotropic for the time corresponding to its exposure by the optical head of the drive, sufficient to input and process a binary number with the number
- the optically active structures 8 are located across this line, each of which is a dashed familiarity that changes (within two discrete states, corresponding to the logical levels “0” and “1”) parameters of the light reflected by it, depending on the level of applied voltage.
- the type of modulation provided in this way can consist not only in a direct change in the brightness of the reflected light (amplitude modulation, absorption / reflection), but also in rotation by a predetermined angle of the plane of its polarization.
- the choice of the optimal type of modulation is determined by many factors related both to the design features of the optical drive head and to the issues of the most appropriate implementation of the optically active structures themselves 8.
- the latter contain at least two elements: as a rule, a reflective control electrode (“mirror”), corresponding to the configuration of the dashed familiarity, and the optically active transparent dielectric medium (it can be common to all structures) located in the electric field of the control electric Yes, and significantly changing its optical parameters depending on the electric field strength in it.
- a reflective control electrode (“mirror”)
- the optically active transparent dielectric medium it can be common to all structures located in the electric field of the control electric Yes, and significantly changing its optical parameters depending on the electric field strength in it.
- At least one electrode with zero potential, usually optically transparent must also be present in the whole or set of optically active structures, either explicitly or implicitly.
- optically active structures are their implementation in the form of a microminiature analogue of a conventional liquid crystal display, the electrodes of which are located directly on the silicon substrate.
- An optically active medium - a nematic or cholesteric liquid crystal (LC) material - is located on top of the electrodes in the form of a layer of a given thickness and can cover the entire front surface of the SIMS, since it does not interfere with the operation of photovoltaic structures and is chemically neutral with respect to semiconductor devices.
- LC cholesteric liquid crystal
- An optically transparent common electrode is deposited in the form of a film on the bottom of the recess in the material, under which the SIMS is located, the thickness of the LCD material layer being determined by the height of the support pads inside the recess (its excess is extruded to the surface when the SIMS is installed), and contacts with the common electrode are made through these are the supporting platforms.
- the design characterized by these features has the features of a hybrid, since one element of the peripheral part - a common optically transparent electrode - is placed on a separate dielectric substrate, and the SIMS as a whole is a sandwich structure, all of whose functional elements are located in the inner layers.
- Replacement sheet The cavities are filled with FFA and an optically transparent common indium-tin oxide electrode is deposited on top of it.
- This option obviously, eliminates the need for the formation of bulk optically active structures with a transparent electrode placed on a separate substrate, and removes all the problems associated with its attachment to the SIMS, the creation of seals and providing the specified thickness of the LCD material.
- auxiliary photovoltaic structure 9 of a dashed configuration, which serves to send a service pulse to the central part of the SIMS, indicating the end of the scanning procedure for optically active structures. Since the latter are equivalent to electric capacitances capable of remembering the levels of voltages applied to them during the “active period”, of the voltages generated by the central part during the passage of the main photovoltaic structure 6, the completion of each current scan cycle must be accompanied by a command for their forced reset, as well as preparation of the central parts to the conclusion of the next group of binary digits provided by the protocol for the exchange of information for the next scan cycle. It is the “memory effect" inherent in
- Replacement sheet voltage-controlled optically active structures makes it possible to work in which the supply voltage is cut off before information is output, which happens in this embodiment.
- photovoltaic structures in particular, can be made in the form of highly efficient multi-junction elements on V-grooves [3], and
- Replacement sheet optically active structures have transparent electrodes, for example, of indium tin oxide, deposited on the bottom of the cavities made in silicon to the sapphire surface, and optically active medium in these cavities to the outer silicon surface, which is the plane of arrangement of the control electrodes.
- the structure can have a multilayer protection, ensuring its complete tightness.
- Hybrid design also provides interesting possibilities, in which the dimensions of the semiconductor and coating dielectric substrates coincide. As the latter, it is advisable to use a sapphire wafer (similar to that used for KHC) of the same diameter as silicon.
- the groups of elements of the peripheral part made on it are arranged with a step similar to the step of arranging the central parts of the SIMS on a silicon wafer. This allows them to be grouped together into sandwich structures immediately for all SIMSs on wafers (tens and hundreds). Finished devices can be obtained by cutting such a hybrid plate, for example, diamond discs.
- BIMS placed in the material of the optical disk so that its zone 2 is located in the central technological field of the disk, and zone 3 - at the level of the first tracks available for recording / playback, moves, during the rotation of the disk, relative to the optical head of the drive along the path described by the line AB.
- the photodetector of the head perceives the first code sequence of pulses programmed by the widths of these strokes and the distances between them so that it
- Replacement sheet transfers the electronic circuit of the drive to the beginning of the dialogue mode with the identifier.
- the “field of view” of the optical head appears at the beginning of the first photovoltaic structure 6, the exposure of which by modulated laser radiation leads to the supply to the central part of the SIMS both the supply voltage and the pulse sequence generated by the drive corresponding to the information entered when requesting the identifier.
- the selection of information pulses against the background of the constant component of the brightness of the radiation, which provides a SIMS supply voltage, can be carried out in the simplest way using the Zener diode structure (zener diode) available in the central part of the SIMS, if the information pulses are peak brightness values with respect to its initial value.
- the transit time of the first photovoltaic structure by the optical head should be sufficient to complete the entire cycle of input and processing of information for a given program.
- the drive circuit If the identifier is programmed, which consists in changing the contents of the registers of its non-volatile memory, the drive circuit generates a special code that puts the SIMS into standby mode, in which the code sequences that came through the photovoltaic structure 6 in the next scan cycles are used as programming ones. Then, after a predetermined number of disk revolutions, sufficient to complete programming, after a period, the BIMS is automatically or by a special command transferred to the operation mode described below.
- the identifier response is given in the form displayed by the state of its optically active structures 8, which is formed during the active period corresponding to the presence of the supply voltage during
- the electronic circuit of the drive must first be prepared for reading this information, for which intermediate marker strokes 7 are used. Since the photovoltaic structure 6 almost completely absorbs the laser radiation incident on it, for this, in principle, one stroke is sufficient, during which the optical head passes it the photodetector registers a distinct impulse.
- the pulses coming further from the optically active structures 8 in the reflective state are perceived by the electronic circuitry of the drive as informational, which are written into its special registers and analyzed for compliance with their code sequence with the checksum displayed by the state of the last group (usually four) of structures 8 If the analysis is positive, the scan cycle is considered completed, otherwise it repeats.
- the reset of the optically active structures 8 is carried out, as described above, by a pulse formed by the second photovoltaic structure 9, after which the peripheral part of the SIMS is prepared for the next scan cycle.
- the readiness of the drive electronic circuit is ensured by the second code sequence of pulses resulting from the reflection of light from the group of final marker strokes 10.
- the total number of scan cycles performed with a positive result during one request corresponds to the information exchange protocol between the identifier and the drive.
- Replacement sheet skipping a few revolutions between the supply of control voltages to them and reading the information displayed by their state, as well as between their reset and the start of the next scan cycle.
- the difference between the levels of the mirror layer of the optical disk deposited on its surface and the SIMS structures immersed in the volume of its material can be compensated by lens (facet) structures molded on the outer side of the disk opposite to SIMS.
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/RU2004/000339 WO2006036080A1 (fr) | 2004-09-02 | 2004-09-02 | Circuit integre sans contacts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/RU2004/000339 WO2006036080A1 (fr) | 2004-09-02 | 2004-09-02 | Circuit integre sans contacts |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006036080A1 true WO2006036080A1 (fr) | 2006-04-06 |
Family
ID=36119165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/RU2004/000339 WO2006036080A1 (fr) | 2004-09-02 | 2004-09-02 | Circuit integre sans contacts |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2006036080A1 (fr) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU652829A1 (ru) * | 1976-08-03 | 1980-03-15 | Ордена Ленина Физико-Технический Институт Им. А.Ф.Иоффе | Полупроводниковый преобразователь |
RU2095851C1 (ru) * | 1994-06-14 | 1997-11-10 | Михаил Анатольевич ЧЕХОНИН | Способ ввода информации в устройство с памятью и обработки вводимой информации |
US5875450A (en) * | 1996-02-05 | 1999-02-23 | Siemens Aktiengesellschaft | Device for processing and storing data received from either a contactless interface or an interface having contacts |
DE19855596A1 (de) * | 1998-12-02 | 2000-06-29 | Orga Consult Gmbh | Tragbarer mikroprozessorgestützter Datenträger, der sowohl kontaktbehaftet als auch kontaktlos betreibbar ist |
-
2004
- 2004-09-02 WO PCT/RU2004/000339 patent/WO2006036080A1/fr active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU652829A1 (ru) * | 1976-08-03 | 1980-03-15 | Ордена Ленина Физико-Технический Институт Им. А.Ф.Иоффе | Полупроводниковый преобразователь |
RU2095851C1 (ru) * | 1994-06-14 | 1997-11-10 | Михаил Анатольевич ЧЕХОНИН | Способ ввода информации в устройство с памятью и обработки вводимой информации |
US5875450A (en) * | 1996-02-05 | 1999-02-23 | Siemens Aktiengesellschaft | Device for processing and storing data received from either a contactless interface or an interface having contacts |
DE19855596A1 (de) * | 1998-12-02 | 2000-06-29 | Orga Consult Gmbh | Tragbarer mikroprozessorgestützter Datenträger, der sowohl kontaktbehaftet als auch kontaktlos betreibbar ist |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU597318B2 (en) | Device for the transfer of data between a card and a data processing unit | |
EP3087562B1 (fr) | Dispositif optique | |
US5163039A (en) | Three-dimensional optical memory system | |
US5751471A (en) | Switchable lens and method of making | |
US7929191B2 (en) | Spatial light modulator and light sensing device provided on the same substrate | |
US20050157613A1 (en) | Recording medium and recording and reproducing method and recording and reproducing device | |
RU2245591C1 (ru) | Бесконтактная интегральная микросхема | |
WO2006036080A1 (fr) | Circuit integre sans contacts | |
US8018815B2 (en) | Micro-Fresnel zone plate optical devices using densely accumulated ray points | |
EP1665244B1 (fr) | Systeme pour decaler au moins un point lumineux | |
US8477588B2 (en) | High power optical disc drives | |
EP1599875B1 (fr) | Support d'informations a plusieurs empilements comprenant des materiaux electrochromes | |
EP0235748A2 (fr) | Mémoire à disque à cristaux liquides | |
CN1290102C (zh) | 光学器件、光拾取器与光盘装置 | |
FR2474204A1 (fr) | Dispositif electronique portatif, notamment pour l'identification de son porteur | |
EP1665242A1 (fr) | Systeme pour lire des donnees stockees sur un support d'information | |
KR20050012282A (ko) | 광 기록매체의 정보층에 데이터를 표시하는 마크들을기록하는 방법 및 장치 | |
JPS634221A (ja) | 光学的情報記録担体 | |
EP0371580B1 (fr) | Système tridimesionnel d'emmagasinage optique | |
JP2002259932A (ja) | Icカード | |
CN100461269C (zh) | 使用于包含更有效光束衍射的改进光栅的光盘装置中的光拾取系统 | |
WO2003007230A2 (fr) | Systeme a memoire optique pour rechercher des informations sur une carte optique fluorescente multicouche de type rom | |
TWI239517B (en) | Optical recording medium and the manufacturing method thereof | |
US20030031110A1 (en) | Optical disk having multiple write layers, optical disk manufacturing method, optical disk device and optical disk write/read method | |
JP2952610B2 (ja) | 光書き込み型液晶ライトバルブ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |