WO2006031280A3 - Probe arrays and method for making - Google Patents

Probe arrays and method for making Download PDF

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Publication number
WO2006031280A3
WO2006031280A3 PCT/US2005/023706 US2005023706W WO2006031280A3 WO 2006031280 A3 WO2006031280 A3 WO 2006031280A3 US 2005023706 W US2005023706 W US 2005023706W WO 2006031280 A3 WO2006031280 A3 WO 2006031280A3
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WO
WIPO (PCT)
Prior art keywords
probes
transfer
directed
prior
temporary substrate
Prior art date
Application number
PCT/US2005/023706
Other languages
French (fr)
Other versions
WO2006031280A2 (en
Inventor
Ananda H Kumar
Ezekiel J J Kruglick
Adam L Cohen
Kieun Kim
Gang Zhang
Richard T Chen
Christopher A Bang
Vacit Arat
Michael S Lockard
Uri Frodis
Pavel B Lembrikov
Jeffrey A Thompson
Original Assignee
Microfabrica Inc
Ananda H Kumar
Ezekiel J J Kruglick
Adam L Cohen
Kieun Kim
Gang Zhang
Richard T Chen
Christopher A Bang
Vacit Arat
Michael S Lockard
Uri Frodis
Pavel B Lembrikov
Jeffrey A Thompson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/949,738 external-priority patent/US20060006888A1/en
Priority claimed from US11/028,960 external-priority patent/US7265565B2/en
Priority claimed from US11/029,217 external-priority patent/US7412767B2/en
Priority claimed from US11/028,958 external-priority patent/US20050142739A1/en
Priority claimed from US11/029,221 external-priority patent/US7531077B2/en
Priority claimed from US11/028,945 external-priority patent/US7640651B2/en
Application filed by Microfabrica Inc, Ananda H Kumar, Ezekiel J J Kruglick, Adam L Cohen, Kieun Kim, Gang Zhang, Richard T Chen, Christopher A Bang, Vacit Arat, Michael S Lockard, Uri Frodis, Pavel B Lembrikov, Jeffrey A Thompson filed Critical Microfabrica Inc
Publication of WO2006031280A2 publication Critical patent/WO2006031280A2/en
Publication of WO2006031280A3 publication Critical patent/WO2006031280A3/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • GPHYSICS
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    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • G01R1/06744Microprobes, i.e. having dimensions as IC details
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    • H01L2224/16238Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area protruding from the surface of the item
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    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector
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    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112Aligning
    • H01L2224/81136Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8114Guiding structures outside the body
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    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119Arrangement of the bump connectors prior to mounting
    • H01L2224/81191Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
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    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818Bonding techniques
    • H01L2224/81801Soldering or alloying
    • H01L2224/81815Reflow soldering
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    • H01L2924/181Encapsulation
    • H01L2924/1815Shape
    • H01L2924/1816Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18165Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip
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    • H01L2924/3011Impedance

Abstract

Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate (306), dicing individual probe arrays (300), and then transferring the arrays to space transformers or other permanent substrates (310). Some embodiments of the invention transfer probes (302) to permanent substrates (310) prior to separating the probes (302) from a temporary substrate (306) on which the probes (302) were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material (308) prior to transfer while other embodiments remove sacrificial material (308) after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.
PCT/US2005/023706 2004-09-13 2005-06-30 Probe arrays and method for making WO2006031280A2 (en)

Applications Claiming Priority (16)

Application Number Priority Date Filing Date Title
US60971904P 2004-09-13 2004-09-13
US60/609,719 2004-09-13
US61178904P 2004-09-20 2004-09-20
US60/611,789 2004-09-20
US10/949,738 US20060006888A1 (en) 2003-02-04 2004-09-24 Electrochemically fabricated microprobes
US10/949,738 2004-09-24
US11/028,960 US7265565B2 (en) 2003-02-04 2005-01-03 Cantilever microprobes for contacting electronic components and methods for making such probes
US11/029,221 2005-01-03
US11/028,945 2005-01-03
US11/029,217 US7412767B2 (en) 2003-02-04 2005-01-03 Microprobe tips and methods for making
US11/028,958 2005-01-03
US11/028,958 US20050142739A1 (en) 2002-05-07 2005-01-03 Probe arrays and method for making
US11/029,221 US7531077B2 (en) 2003-02-04 2005-01-03 Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
US11/028,960 2005-01-03
US11/029,217 2005-01-03
US11/028,945 US7640651B2 (en) 2003-12-31 2005-01-03 Fabrication process for co-fabricating multilayer probe array and a space transformer

Publications (2)

Publication Number Publication Date
WO2006031280A2 WO2006031280A2 (en) 2006-03-23
WO2006031280A3 true WO2006031280A3 (en) 2007-03-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/023706 WO2006031280A2 (en) 2004-09-13 2005-06-30 Probe arrays and method for making

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WO (1) WO2006031280A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200921109A (en) * 2007-11-09 2009-05-16 Univ Nat Chiao Tung Assembly structure of 3D probe array

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6332270B2 (en) * 1998-11-23 2001-12-25 International Business Machines Corporation Method of making high density integral test probe
US6426638B1 (en) * 2000-05-02 2002-07-30 Decision Track Llc Compliant probe apparatus
US6452406B1 (en) * 1996-09-13 2002-09-17 International Business Machines Corporation Probe structure having a plurality of discrete insulated probe tips
US6491968B1 (en) * 1998-12-02 2002-12-10 Formfactor, Inc. Methods for making spring interconnect structures

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6452406B1 (en) * 1996-09-13 2002-09-17 International Business Machines Corporation Probe structure having a plurality of discrete insulated probe tips
US6332270B2 (en) * 1998-11-23 2001-12-25 International Business Machines Corporation Method of making high density integral test probe
US6491968B1 (en) * 1998-12-02 2002-12-10 Formfactor, Inc. Methods for making spring interconnect structures
US6426638B1 (en) * 2000-05-02 2002-07-30 Decision Track Llc Compliant probe apparatus

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