WO2006015568A1 - Method for providing a metal coating on plastic capacitor films and device for carrying out said method - Google Patents

Method for providing a metal coating on plastic capacitor films and device for carrying out said method Download PDF

Info

Publication number
WO2006015568A1
WO2006015568A1 PCT/DE2005/001207 DE2005001207W WO2006015568A1 WO 2006015568 A1 WO2006015568 A1 WO 2006015568A1 DE 2005001207 W DE2005001207 W DE 2005001207W WO 2006015568 A1 WO2006015568 A1 WO 2006015568A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal layer
plastic
plastic film
defects
carrying
Prior art date
Application number
PCT/DE2005/001207
Other languages
German (de)
French (fr)
Inventor
Gert Peter Fischer
Original Assignee
Fischer & Tausche Holding Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fischer & Tausche Holding Gmbh & Co. Kg filed Critical Fischer & Tausche Holding Gmbh & Co. Kg
Priority to EP05766944A priority Critical patent/EP1776492A1/en
Publication of WO2006015568A1 publication Critical patent/WO2006015568A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/015—Special provisions for self-healing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose

Definitions

  • the invention relates to a process for the metallization of capacitor foils made of plastic and a device for carrying out this process.
  • Metal-plastic capacitors are made of a thin plastic film on which a metal layer is vapor-deposited.
  • the metal layer is regularly about 0.05 ⁇ m thick. After the film has been processed into cylindrical coils or flat coils, a voltage is applied to the coils. In case of any defects of the plastic film thereby evaporate the thin assignments around the defect, the capacitor remains usable (so-called self-healing). However, this is only possible if the metal layer is very thin.
  • the metal layer is made thicker.
  • the obvious solution to make the vapor-deposited metal layer thicker fails because it would also form in the region of the defects and self-healing can no longer take place.
  • DE 760 157 C discloses an arrangement for burning out defects in the condenser foils.
  • the invention is therefore based on the object to provide a method for producing a Me ⁇ tall plastic film, wherein the metal layer can be applied relatively thick.
  • this object is achieved by burning out the vapor deposited first metal layer in the region of the defects of the plastic film and then alsgal ⁇ vanishing a second metal layer on the first metal layer.
  • the invention is therefore based on the fact that in a galvanizing a second metal layer - unlike a vapor deposition - the second metal layer will settle only in the region of the first metal layer in which the first metal layer is not burned out, so that in the Defects of the plastic film also the second metal layer will not form.
  • the second metal layer may consist of the same metal as the first metal layer, but the method proposed here also allows the second metal layer to consist of a different metal layer than the first (vapor-deposited) metal layer.
  • the burning out (vaporization) of the first metal layer in the region of the defects of the film can take place by guiding the films between a first roller whose surface has a first electrical voltage and a second roller whose surface has a second electrical voltage.
  • the film vaporized with a metal layer bears against the surface of the first roller with the metal layer and against the second roller with the insulating plastic film.
  • the metal layer leads the tension of the first roller into the area of the second roller, in the area of imperfections there is a flow of current which leads to an evaporation of the metal layer in the area of these defects ("burnout").

Abstract

The invention relates to a method for coating a plastic film that is used in the production of a combined metal and plastic capacitor. According to said method, a thin first metal layer is vapour deposited on the plastic film. The vapour-deposited first metal layer is burnt off in the defective areas of the plastic film and a second metal layer is subsequently applied to the first metal layer by electrodeposition.

Description

Verfahren zur Metallisierung von Kondensatorfolien aus Kunststoff und Vorrichtung zur Durchführung dieses Verfahrens Process for the metallization of plastic capacitor films and apparatus for carrying out this process
Die Erfindung betrifft ein Verfahren zur Metallisierung von Kondensatorfolien aus Kunst¬ stoff und eine Vorrichtung zur Durchführung dieses Verfahrens.The invention relates to a process for the metallization of capacitor foils made of plastic and a device for carrying out this process.
Metall-Kunststoff-Kondensatoren (MK-K) werden aus einer dünnen Kunststofffolie, auf die eine Metallschicht aufgedampft wird, hergestellt. Die Metallschicht ist dabei regelmä¬ ßig etwa 0,05 μm dick. Nach der Bearbeitung der Folie zu zylindrischen Wickeln oder Flachwickeln wird an den Wickeln eine Spannung angelegt. Bei etwaigen Fehlstellen der Kunststofffolie verdampfen dabei die dünnen Belegungen rings um die Fehlstelle, der Kondensator bleibt weiter verwendbar (sogenannte Selbstheilung). Dies ist jedoch nur dann möglich, wenn die Metallschicht sehr dünn ist.Metal-plastic capacitors (MK-K) are made of a thin plastic film on which a metal layer is vapor-deposited. The metal layer is regularly about 0.05 μm thick. After the film has been processed into cylindrical coils or flat coils, a voltage is applied to the coils. In case of any defects of the plastic film thereby evaporate the thin assignments around the defect, the capacitor remains usable (so-called self-healing). However, this is only possible if the metal layer is very thin.
Für bestimmte Aufgabenstellungen, etwa bei einer hohen Pulsbelastung des Kondensators oder aus thermischen Aspekten, ist es jedoch erwünscht, dass die Metallschicht dicker ausgebildet ist. Die naheliegende Lösung, die aufgedampfte Metallschicht dicker auszu¬ bilden, scheitert daran, dass sich diese auch im Bereich der Fehlstellen ausbilden würde und eine Selbstheilung nicht mehr erfolgen kann.For certain tasks, such as a high pulse load of the capacitor or thermal aspects, it is desirable that the metal layer is made thicker. The obvious solution to make the vapor-deposited metal layer thicker fails because it would also form in the region of the defects and self-healing can no longer take place.
Aus der DE 1 938 319, der DE 691 03 434 T3, der DE 26 03 642 Al, und der DE 196 41 249 C2 sind Belege aus Kondensatorfolien aus Kunststoff bekannt, bei denen der Versuch unternommen wird, einen Kompromiss zwischen der Selbstheilung, die dünne Belege er¬ fordert, und der Impulsbelastbarkeit sowie des Verlustfaktors, die dicke niederohmige Be¬ läge erfordern, anzugeben.From DE 1 938 319, DE 691 03 434 T3, DE 26 03 642 Al, and DE 196 41 249 C2 documents are known from capacitor films made of plastic, in which the attempt is made, a compromise between self-healing, the thin slips er¬ demands, and the pulse load capacity and the loss factor, the thick low-Be¬ required to specify.
Aus der GB 1 542 796, der DE 23 59 432 B2 und der JP 2004-200 590 A ist es prinzipiell bekannt, Beläge von Kondensatorfolien zu verdicken.From GB 1 542 796, DE 23 59 432 B2 and JP 2004-200590 A it is known in principle to thicken coatings of capacitor films.
Die DE 760 157 C gibt eine Anordnung zum Ausbrennen von Fehlstellen in den Konden¬ satorfolien an. Der Erfindung liegt daher die Aufgabe zugrunde, ein Verfahren zum Herstellen einer Me¬ tall-Kunststofffolie zu schaffen, bei dem die Metallschicht relativ dick aufgebracht werden kann.DE 760 157 C discloses an arrangement for burning out defects in the condenser foils. The invention is therefore based on the object to provide a method for producing a Me¬ tall plastic film, wherein the metal layer can be applied relatively thick.
Erfindungsgemäß wird diese Aufgabe gelöst durch Ausbrennen der aufgedampften ersten Metallschicht im Bereich der Fehlstellen der Kunststofffolie und anschließendes Aufgal¬ vanisieren einer zweiten Metallschicht auf die erste Metallschicht.According to the invention, this object is achieved by burning out the vapor deposited first metal layer in the region of the defects of the plastic film and then aufgal¬ vanishing a second metal layer on the first metal layer.
Der Erfindung liegt also der Umstand zugrunde, dass bei einem Aufgalvanisieren einer zweiten Metallschicht - anders als bei einem Aufdampfen - sich die zweite Metallschicht nur in dem Bereich der ersten Metallschicht absetzen wird, in dem die erste Metallschicht nicht ausgebrannt ist, so dass im Bereich der Fehlstellen der Kunststofffolie sich auch die zweite Metallschicht nicht ausbilden wird.The invention is therefore based on the fact that in a galvanizing a second metal layer - unlike a vapor deposition - the second metal layer will settle only in the region of the first metal layer in which the first metal layer is not burned out, so that in the Defects of the plastic film also the second metal layer will not form.
Die zweite Metallschicht kann aus demselben Metall wie die erste Metallschicht bestehen, das hier vorgeschlagene Verfahren erlaubt es aber auch, dass die zweite Metallschicht aus einer anderen Metallschicht als die erste (aufgedampfte) Metallschicht besteht.The second metal layer may consist of the same metal as the first metal layer, but the method proposed here also allows the second metal layer to consist of a different metal layer than the first (vapor-deposited) metal layer.
Das Ausbrennen (Verdampfen) der ersten Metallschicht im Bereich der Fehlstellen der Folie kann durch Führen der Folien zwischen einer ersten Walze, deren Oberfläche eine erste elektrische Spannung und einer zweiten Walze, deren Oberfläche eine zweite elektri¬ sche Spannung hat, erfolgen. Dabei liegt die mit einer Metallschicht verdampfte Folie mit der Metallschicht an der Oberfläche der ersten Walze und mit der isolierenden Kunststoff¬ folie an der zweiten Walze an.The burning out (vaporization) of the first metal layer in the region of the defects of the film can take place by guiding the films between a first roller whose surface has a first electrical voltage and a second roller whose surface has a second electrical voltage. In this case, the film vaporized with a metal layer bears against the surface of the first roller with the metal layer and against the second roller with the insulating plastic film.
Die Metallschicht führt die Spannung der ersten Walze bis in den Bereich der zweiten Walze, im Bereich von Fehlstellen erfolgt ein Stromfluss, der zu einem Verdampfen der Metallschicht im Bereich dieser Fehlstellen führt („Ausbrennen").The metal layer leads the tension of the first roller into the area of the second roller, in the area of imperfections there is a flow of current which leads to an evaporation of the metal layer in the area of these defects ("burnout").
Nach dem Ausbrennen der Metallschicht im Bereich der Fehlstellen der Kunststofffolie kann ein Aufgalvanisieren nicht erfolgen, da das Aufgalvanisieren einer zweiten Metall schicht das Vorhandensein der ersten Metall Schicht erfordert, sie also nicht im Bereich der Fehlstellen der Kunststofffolie erfolgt. After burnout of the metal layer in the region of the defects of the plastic film, a galvanization can not take place because the galvanizing of a second metal layer requires the presence of the first metal layer, so it does not take place in the area of the defects of the plastic film.

Claims

- A-Ansprüche - A claims
1. Verfahren zur Metallisierung von Kondensatorfolien aus Kunststoff, bei dem auf die Kunststofffolie eine dünne erste Metallschicht aufgedampft wird, gekenn¬ zeichnet durch Wegbrennen der aufgedampften ersten Metallschicht im Bereich der Fehlstellen der Kunststofffolie und anschließendes Aufgalvanisieren einer zweiten Metallschicht auf die erste Metallschicht.1. A process for the metallization of capacitor films made of plastic, in which a thin first metal layer is deposited on the plastic film gekenn¬ characterized by burning away the vapor-deposited first metal layer in the region of the defects of the plastic film and then electroplating a second metal layer on the first metal layer.
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass die zweite Metall¬ schicht aus einem anderen Metall als die erste Metallschicht besteht.2. The method according to claim 1, characterized in that the second metal layer consists of a different metal than the first metal layer.
3. Vorrichtung zum Ausbrennen der Fehlstellen einer nach dem Verfahrens nach Anspruch 1 oder 2 hergestellten Kondensatorfolie, gekennzeichnet durch eine erste Walze, deren Oberfläche eine erste elektrische Spannung und eine zweite Walze, de¬ ren Oberfläche eine zweite Spannung hat. 3. A device for burning out the defects of a capacitor film produced by the method according to claim 1 or 2, characterized by a first roller whose surface has a first electrical voltage and a second roller, de¬ ren surface has a second voltage.
PCT/DE2005/001207 2004-08-13 2005-07-07 Method for providing a metal coating on plastic capacitor films and device for carrying out said method WO2006015568A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP05766944A EP1776492A1 (en) 2004-08-13 2005-07-07 Method for providing a metal coating on plastic capacitor films and device for carrying out said method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004039290.0 2004-08-13
DE102004039290A DE102004039290B3 (en) 2004-08-13 2004-08-13 Process for the metallization of plastic capacitor films

Publications (1)

Publication Number Publication Date
WO2006015568A1 true WO2006015568A1 (en) 2006-02-16

Family

ID=35006582

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2005/001207 WO2006015568A1 (en) 2004-08-13 2005-07-07 Method for providing a metal coating on plastic capacitor films and device for carrying out said method

Country Status (3)

Country Link
EP (1) EP1776492A1 (en)
DE (1) DE102004039290B3 (en)
WO (1) WO2006015568A1 (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE760157C (en) * 1941-07-18 1951-08-27 Bosch Gmbh Robert Arrangement for pre-burning out areas that are prone to punctures in metallized insulating strips
US3179862A (en) * 1960-09-09 1965-04-20 Cornell Dubilier Electric Dual-film metallized condensers
DE1938319A1 (en) * 1969-07-28 1971-02-11 Siemens Ag Regenerative electrical condenser
DE2411813A1 (en) * 1974-03-12 1975-09-25 Siemens Ag Heat treatment of faulty spots in capacitor prodn. - uses annealing of metal foil parts on insulating foils
US4482931A (en) * 1981-08-24 1984-11-13 General Electric Company Metallized capacitor with improved bilayer electrodes
JPH0379017A (en) * 1989-08-22 1991-04-04 Matsushita Electric Ind Co Ltd Manufacture of metallized film capacitor
US5453906A (en) * 1993-10-21 1995-09-26 Philips Electronics North America Corporation Metallized film series section capacitor with improved oxidation resistance
DE19641249A1 (en) * 1995-10-06 1997-04-10 Matsushita Electric Ind Co Ltd Capacitor for charging and discharging energy, e.g. in flash lamp
US5933947A (en) * 1995-03-20 1999-08-10 Kakogawa Plastics Co., Ltd. Metallized film process for production thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2359432C3 (en) * 1973-11-29 1984-08-09 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Process for the production of aluminum-coated foils for capacitors and device for carrying out the process
JPS5188583A (en) * 1975-02-03 1976-08-03 Kinzokuhichakufuirumu
DE2700013C2 (en) * 1977-01-03 1983-05-05 Siemens AG, 1000 Berlin und 8000 München Regenerative electrical condenser
FR2657455B1 (en) * 1990-01-19 1992-04-10 Europ Composants Electron HIGH VOLUME CAPACITOR, SELF-HEALING.
JP2004200590A (en) * 2002-12-20 2004-07-15 Matsushita Electric Ind Co Ltd Process for producing metallized film capacitor

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE760157C (en) * 1941-07-18 1951-08-27 Bosch Gmbh Robert Arrangement for pre-burning out areas that are prone to punctures in metallized insulating strips
US3179862A (en) * 1960-09-09 1965-04-20 Cornell Dubilier Electric Dual-film metallized condensers
DE1938319A1 (en) * 1969-07-28 1971-02-11 Siemens Ag Regenerative electrical condenser
DE2411813A1 (en) * 1974-03-12 1975-09-25 Siemens Ag Heat treatment of faulty spots in capacitor prodn. - uses annealing of metal foil parts on insulating foils
US4482931A (en) * 1981-08-24 1984-11-13 General Electric Company Metallized capacitor with improved bilayer electrodes
JPH0379017A (en) * 1989-08-22 1991-04-04 Matsushita Electric Ind Co Ltd Manufacture of metallized film capacitor
US5453906A (en) * 1993-10-21 1995-09-26 Philips Electronics North America Corporation Metallized film series section capacitor with improved oxidation resistance
US5933947A (en) * 1995-03-20 1999-08-10 Kakogawa Plastics Co., Ltd. Metallized film process for production thereof
DE19641249A1 (en) * 1995-10-06 1997-04-10 Matsushita Electric Ind Co Ltd Capacitor for charging and discharging energy, e.g. in flash lamp

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 015, no. 250 (E - 1082) 26 June 1991 (1991-06-26) *

Also Published As

Publication number Publication date
EP1776492A1 (en) 2007-04-25
DE102004039290B3 (en) 2006-01-05

Similar Documents

Publication Publication Date Title
DE2444484A1 (en) METHOD FOR MANUFACTURING LIQUID CRYSTAL COMPONENTS
DE872065C (en) Process for the production of sheets provided with deformable foils, for television sets and the like. like
DE1464870A1 (en) Process for the production of electrical capacitors
WO2006015568A1 (en) Method for providing a metal coating on plastic capacitor films and device for carrying out said method
WO1998018977A1 (en) Coating for components and process for producing the same
DE102006019000A1 (en) Device and method for plasma-assisted deposition of hard material layers
EP3133184B1 (en) Method of forming a layer having high light transmission and/or low light reflection
EP2376369A2 (en) Arrangement of two substrates having a slid bond and method for producing such an arrangement
DE1621347A1 (en) Multi-layer arrangement, in particular consisting of vapor-deposited layers
DE102015225662A1 (en) Process for preparatory treatment and hot working of a steel component
WO2015169485A1 (en) Method for producing a multilayered electret component
DE102012203229B4 (en) Method for mixing evaporation materials when deposited on a substrate in a vacuum
DE881430C (en) Procedure for sampling metal layers that are already on documents
EP3954801A1 (en) Multi-walled tube and method for producing multi-walled tubes
DE102015210827B4 (en) Process for the formation of structures on the surfaces of a component
WO2022058528A1 (en) Capacitor and method for the production thereof
DE102015006078A1 (en) Catalyst-coated membrane for a fuel cell, process for its preparation and apparatus for carrying out the process
AT215517B (en) Process for the production of printed circuits by high vacuum vapor deposition for electrical devices
DE2337386C3 (en) Method for producing an electrophotographic recording material
DD132090B1 (en) METHOD FOR THE PRODUCTION OF ELECTRODES IN CERAMIC CAPACITORS
DE2017930C3 (en) Method of manufacturing an electrical capacitor
DE2937098A1 (en) High quality photosensitive plate for photocopier - has coated conducting sub-layer to eliminate surface spots
DE708225C (en) Process for the production of high quality capacitors
DE2408154C (en) Process for the production of a wound capacitor
DE1615010C (en) Underlay coated in several layers with thin films

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2005766944

Country of ref document: EP

AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU LV MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWP Wipo information: published in national office

Ref document number: 2005766944

Country of ref document: EP