WO2006006849A3 - Carrier for electronic components and method for separating segments from such a carrier - Google Patents

Carrier for electronic components and method for separating segments from such a carrier Download PDF

Info

Publication number
WO2006006849A3
WO2006006849A3 PCT/NL2005/000488 NL2005000488W WO2006006849A3 WO 2006006849 A3 WO2006006849 A3 WO 2006006849A3 NL 2005000488 W NL2005000488 W NL 2005000488W WO 2006006849 A3 WO2006006849 A3 WO 2006006849A3
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
electronic components
segments
separating segments
separating
Prior art date
Application number
PCT/NL2005/000488
Other languages
French (fr)
Other versions
WO2006006849A2 (en
Inventor
Joannes Leonardus Jurrian Zijl
Willem Antonie Hennekes
Original Assignee
Fico Bv
Joannes Leonardus Jurrian Zijl
Willem Antonie Hennekes
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv, Joannes Leonardus Jurrian Zijl, Willem Antonie Hennekes filed Critical Fico Bv
Publication of WO2006006849A2 publication Critical patent/WO2006006849A2/en
Publication of WO2006006849A3 publication Critical patent/WO2006006849A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

The present invention relates to a carrier for electronic components, comprising a panel which is substantially flat and at least partially subdivided into segments, which segments are partially bounded by recesses in the panel. The invention also relates to a method for separating segments from a carrier for electronic components.
PCT/NL2005/000488 2004-07-13 2005-07-07 Carrier for electronic components and method for separating segments from such a carrier WO2006006849A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1026645A NL1026645C2 (en) 2004-07-13 2004-07-13 Carrier for electronic components and method for separating segments from such a carrier.
NL1026645 2004-07-13

Publications (2)

Publication Number Publication Date
WO2006006849A2 WO2006006849A2 (en) 2006-01-19
WO2006006849A3 true WO2006006849A3 (en) 2006-03-02

Family

ID=34972039

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2005/000488 WO2006006849A2 (en) 2004-07-13 2005-07-07 Carrier for electronic components and method for separating segments from such a carrier

Country Status (2)

Country Link
NL (1) NL1026645C2 (en)
WO (1) WO2006006849A2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0923120A1 (en) * 1997-04-03 1999-06-16 Shinko Electric Industries Co. Ltd. Method for manufacturing semiconductor device
JP2001196396A (en) * 2000-01-11 2001-07-19 Toyota Motor Corp Semiconductor device, manufacturing method therefor and substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0923120A1 (en) * 1997-04-03 1999-06-16 Shinko Electric Industries Co. Ltd. Method for manufacturing semiconductor device
JP2001196396A (en) * 2000-01-11 2001-07-19 Toyota Motor Corp Semiconductor device, manufacturing method therefor and substrate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 24 11 May 2001 (2001-05-11) *

Also Published As

Publication number Publication date
NL1026645C2 (en) 2006-01-16
WO2006006849A2 (en) 2006-01-19

Similar Documents

Publication Publication Date Title
WO2006066014A3 (en) Backplane design for display panels and processes for their manufacture
WO2005094440A3 (en) Nanofiber surface based capacitors
WO2006048427A8 (en) Method for producing chiral 8-(3-amino-piperidin-1-yl)-xanthines
WO2006060814A3 (en) Process for making a fibrous structure comprising an additive
WO2008130372A9 (en) Production of sterols in oleaginous yeast and fungi
AU2006246541A8 (en) Method for producing blasting fermentation-treated bagasse
WO2004110411A3 (en) Orally-dispersible multilayer tablet
WO2007112279A3 (en) Resonators
MY152922A (en) Value document
WO2006113580A3 (en) Linear correspondence assessment
WO2008148654A3 (en) Electrical contact for a micromechanical component
AU2003291111A1 (en) Method for recovering trace elements from coal
WO2008055561A3 (en) Gutter
WO2007055965A3 (en) Air separation plant design method
WO2005074645A3 (en) Methods and compositions for modulating angiogenesis
WO2009003464A3 (en) Surface-covering structure and method for producing a surface-covering structure
WO2003031965A3 (en) Microfluidic extraction method
MX2007004137A (en) Lightweight structural panel and method for making same.
AUPS167402A0 (en) Method for extracting pgms
WO2006050458A3 (en) Tadalafil crystal forms and processes for preparing them
WO2004075021A3 (en) Molecular modeling methods
WO2007081605A3 (en) Method for converting electrical components
WO2008022033A3 (en) Methods for preventing or treating cardiovascular disease
WO2006056324A3 (en) Carrier material and method for producing a valuable document
WO2006006849A3 (en) Carrier for electronic components and method for separating segments from such a carrier

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU LV MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

NENP Non-entry into the national phase

Ref country code: DE

WWW Wipo information: withdrawn in national office

Country of ref document: DE

122 Ep: pct application non-entry in european phase