WO2005116515A1 - Cooling apparatus comprising a thermal interface and method for recondensing a cryogen gas - Google Patents

Cooling apparatus comprising a thermal interface and method for recondensing a cryogen gas Download PDF

Info

Publication number
WO2005116515A1
WO2005116515A1 PCT/EP2005/005154 EP2005005154W WO2005116515A1 WO 2005116515 A1 WO2005116515 A1 WO 2005116515A1 EP 2005005154 W EP2005005154 W EP 2005005154W WO 2005116515 A1 WO2005116515 A1 WO 2005116515A1
Authority
WO
WIPO (PCT)
Prior art keywords
refrigerator
recondensing
cryogen
gas
cooling
Prior art date
Application number
PCT/EP2005/005154
Other languages
French (fr)
Inventor
Timothy John Hughes
Keith White
Original Assignee
Siemens Magnet Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB0411607.5A external-priority patent/GB0411607D0/en
Application filed by Siemens Magnet Technology Ltd filed Critical Siemens Magnet Technology Ltd
Priority to CN2005800166491A priority Critical patent/CN1997851B/en
Priority to US10/594,618 priority patent/US9732907B2/en
Publication of WO2005116515A1 publication Critical patent/WO2005116515A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/006—Thermal coupling structure or interface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/20—Arrangements or instruments for measuring magnetic variables involving magnetic resonance
    • G01R33/28—Details of apparatus provided for in groups G01R33/44 - G01R33/64
    • G01R33/38—Systems for generation, homogenisation or stabilisation of the main or gradient magnetic field
    • G01R33/3804—Additional hardware for cooling or heating of the magnet assembly, for housing a cooled or heated part of the magnet assembly or for temperature control of the magnet assembly
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/17—Re-condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F6/00—Superconducting magnets; Superconducting coils
    • H01F6/04—Cooling

Definitions

  • MRI magnetic resonance imaging
  • a requirement of an MRI magnet is that it provides a stable, homogeneous, magnetic field.
  • a superconducting magnet system which operates at very low temperature, the temperature being maintained by cooling the superconductor, typically by immersion in a low temperature cryogenic fluid, such as liquid helium, liquid neon, liquid hydrogen or liquid nitrogen.
  • cryogenic fluids are expensive, and it is desirable that the magnet system should be designed and operated in a manner to reduce to a minimum the amount of cryogenic fluid used.
  • the superconducting magnet system typically comprises a set of superconductor windings for producing a magnetic field, contained within a cryostat.
  • the cryostat typically comprises a cryogenic fluid vessel which contains the superconductor windings, one or more thermal shields completely surrounding the cryogenic fluid vessel, and a vacuum jacket completely enclosing the one or more thermal shields. It is common practice to use a refrigerator to cool the thermal shields to a low temperature in order to reduce the heat load onto the cryogen vessel. It is also known to use a refrigerator to directly refrigerate the cryogen vessel, thereby reducing or eliminating the cryogen fluid consumption.
  • the refrigerator is subject to wear, and must be periodically serviced and then replaced after a certain time in order to maintain adequate system performance.
  • the refrigerator is therefore placed in a means of removably interfacing it to the magnet system.
  • thermal contact at low temperature is difficult, and whilst adequate thermal contact can be achieved using pressed contacts at the thermal shield temperatures, these pressed contacts are difficult to re-make once the refrigerator has been removed and replaced, for example as required for servicing.
  • the thermal contact provided needs to allow such removal and replacement without significant degradation in the thermal transfer efficiency of the thermal contact, otherwise it becomes more difficult to achieve the desired refrigeration at very low temperature.
  • a cryogenic refrigerator is provided, removably mounted within a sleeve.
  • the sleeve terminates in a heat sink which is thermally linked in some way to a recondensing surface exposed to a cryogen vessel.
  • the recondensing surface 32 is directly exposed to the interior of the cryogen vessel.
  • a separate recondensing chamber is provided, adjacent to the heat sink. Gas supply and liquid return pipes are provided to link the recondensing chamber with the cryogen vessel.
  • this is provided by a compressible indium washer.
  • the corresponding thermal interface relies upon effective cleaning of mechanically touching parts.
  • Indium washers suffer from creep - that is, the indium washer providing the thermal contact between the refrigerator and the heat exchanger changes shape over time, resulting in degradation of the thermal interface.
  • the refrigerator is removed for servicing, it is difficult to remove all traces of the old indium washer before fitting a new one. Any residue of the earlier washer will cause non-uniform compression of the later washer, resulting in a sub-standard thermal interface.
  • the present invention accordingly aims to provide an effective thermal interface for conducting heat between a removable refrigerator and a heat exchanger, such that the thermal interface is simple to make, and does not degrade with time, or with repeated removal of the refrigerator.
  • the invention aims to provide adequate thermal contact between a cryogenic gas to be cooled and a refrigerator used for cooling whilst maintaining ease of removal of the refrigerator for servicing and eliminating the possibility of air entering the cryogen vessel due to the removal of the refrigerator.
  • Fig. 1 shows a schematic cross section of an MRI system
  • Fig. 2 shows a refrigerator mounted in a refrigerator sleeve, including a thermal interface according to an embodiment of the present invention.
  • a refrigerator intended to cool a cryogen may efficiently be interfaced to the gas to be cooled by situating a cooling part of the refrigerator within the cryogen gas. Condensation takes place on the cooling part of the refrigerator, and the recondensed cryogen falls back into the cryogen vessel.
  • FIG. 1 shows a schematic of a known MRI magnet system fitted with a refrigerator 4.
  • a cryostat comprises a liquid cryogen vessel 1, containing a superconductor magnet (not shown) and liquefied cryogen 16, and is surrounded by one or more thermal shields 2, which are in turn completely surrounded by a vacuum jacket 3.
  • Removably fitted to the magnet system is refrigerator 4 thermally interfaced to a cryogen recondensing chamber 11 by interface sleeve 5 so as to cool the thermal shields and recondense cryogen gas and deliver it back to the cryogen vessel 1 by tube 6.
  • the MRI system discussed with reference to Fig. 1 is typical of MRI systems employing superconductors requiring liquid helium temperatures. In alternative systems, so-called high temperature superconductors may be used. In such systems, the cryogen may be liquid nitrogen. No thermal shields 2 would be required, but multilayer insulation would typically be provided instead. A single stage refrigerator 4 would be sufficient.
  • the present invention provides an improved thermal interface, particularly suitable for use between a removable refrigerator and an article to be cooled, for example in an MRI system at interface sleeve 5 in Fig. 1.
  • the thermal interface of the present invention preferably consists of a recondensing chamber filled with a gas, the recondensing chamber being in thermal contact with a cooling surface of the refrigerator and the article to be cooled.
  • the condensation process is employed twice in adjoining chambers so that the refrigerator can be isolated from the gas and liquid cryogen used to cool the superconductor magnet, while providing an effective thermal interface which does not degrade with time or with repeated removal and replacement of the refrigerator.
  • FIG. 2 shows a thermal interface according to an embodiment of the present invention.
  • the bottom of the interface sleeve 5 is terminated in a leak tight manner with thermally conducting base 10 which seals the sleeve and isolates it from the cryogen fluid and gas in cryogen vessel 1.
  • Base 10 accordingly forms part of the wall of the cryogen vessel 1 as well as forming part of the wall of sleeve 5.
  • Base 10 is also connected, preferably in a leak tight manner, as part of the wall of the recondensing chamber 11.
  • Recondensing chamber 11 encloses a recondenser 11a in thermal contact with base 10, and is in communication with cryogen vessel 1 through gas cryogen inlet / liquid cryogen outlet tube 6.
  • a two-stage refrigerator 4 is placed within refrigerator interface sleeve 5.
  • the first stage heat exchanger 12a of the refrigerator 4 is in thermal contact with shield 2. This contact may be either direct as shown or by known intermediaries such as flexible copper braid.
  • the second stage 7 of the refrigerator 4 is situated in the lower part 8 of refrigerator interface sleeve 5. Second stage 7 terminates in cooling stage 9 which is cooled by the refrigerator to a low temperature, for example about 4K.
  • the features described in this paragraph are conventional, and correspond to the arrangement shown in United States patent 5,918,470.
  • the sleeve 5 is filled with a cryogen gas.
  • Cooling stage 9 preferably does not make mechanical contact with base 10. Cooling stage 9 operates to cool the cryogen gas to its liquefaction temperature. Cooling stage 9 is preferably finned so as to improve recondensation heat transfer.
  • the interior of sleeve 5 is arranged as a secondary recondensing chamber.
  • Cooling stage 9 liquefies the gas within the sleeve 5.
  • the resultant liquid cryogen 12 accordingly partly fills the bottom of sleeve 5 and provides a heat transfer medium for transferring heat from gaseous cryogen from cryogen vessel 1 in recondensing chamber 11, via recondenser 11a and base 10 to secondary recondenser 9, by boiling at base 10 and recondensation at cooling stage 9.
  • Base 10 is preferably made from highly thermally conducting material, typically copper, and provides good thermal conduction from its upper surface 10a in contact with liquid 12 to its lower surface and on to recondenser 11a.
  • the upper surface of cryogen liquid 12 should preferably not touch the secondary recondenser 9 since this would reduce the area available for recondensation, and therefore would also reduce the rate of heat transfer.
  • Liquid cryogen 12 and its gaseous counterpart provide a non-contact ('recondenser') thermal interface between cooling stage 9 and base 10.
  • Upper surface 10a of base 10 may be finned or otherwise machined or prepared so as to increase the area for heat transfer by boiling, but the preparation of the surface should be such as to allow free flow of liquid 12 across the upper surface 10a of base 10.
  • First stage heat exchanger 12a between the refrigerator and the sleeve is provided with at least one gas path 13 so that gas can pass between the upper and lower parts of the interface sleeve 5 for evacuation of the sleeve, refilling with cryogen gas, and release of cryogen gas, as and when appropriate.
  • cryogen gas may be slowly admitted through port 14 into the interface sleeve.
  • the gas is admitted slowly so that the refrigerator can cool and liquefy it as appropriate.
  • the quantity of gas admitted is measured so that the appropriate quantity of liquid 12 is condensed in the bottom of the sleeve.
  • the liquid cryogen 12 When the refrigerator is turned off for servicing, or if the refrigerator should be turned off. or stopped unintentionally, the liquid cryogen 12 will boil and evaporate. A pressure relief valve 15 is fitted to the interface sleeve 5 to prevent excessive pressure developing in the sleeve under these circumstances. Alternatively, since the quantity of liquid cryogen 12 is small, it could be allowed to boil off into a reservoir and then recondensed when the refrigerator restarted. A volume of about 2 litres pressurized to about 2 bar (2xl0 5 Pa) would be sufficient to provide adequate gas for recondensing into a heat transfer liquid 12.
  • the interface of the present invention may be used to interface refrigerator 4 to a recondenser 11a. While any suitable gas 12 may be used in the secondary recondenser 9,5, the boiling point of the gas 12 of the secondary recondenser should be no greater than the boiling point of the gas in the recondensation chamber 11 and the cryogen vessel 1. The same gas may be used in both recondensers. If gases with differing boiling points are used, a thermal resistance may be placed in the thermal path 10 to improve the efficiency of the recondenser 11a.
  • the thermal interface between cooling stage 9 and the object 10 to be cooled is provided by a closed recondensation chamber.
  • the secondary recondensation chamber 8 is opened. However, no interference is caused to the recondensation chamber 11.
  • the cooled object 10 itself forms part of a recondensation chamber.
  • the invention is not limited to providing a thermal interface to recondensation chambers.
  • the present invention usefully finds application in any situation where a refrigerator may need to be periodically removed and replaced without difficulty and without deterioration in the thermal interface between the refrigerator and the object to be cooled.
  • the invention may also usefully be employed in situations where the refrigerator does not need to be repeatedly removed, since the thermal interface of the present invention is predictable and simple to set up. It does not have such demanding requirements of mechanical perfection as in the case of thermal interfaces which reply on accurate mechanical contact, or the interposition of indium washers.

Abstract

A thermal interface between a removable cryogenic refrigerator (4) and an article (10) to be cooled by the cryogenic refrigerator. The thermal interface consists of a recondensing chamber filled with a gas (12), the recondensing chamber being in thermal contact with a cooling surface (9) of the refrigerator and the article (10) to be cooled.

Description

COOLINGAPPARATUS COMPRISINGATHERMAL INTERFACE AND METHODFORRECONDENSINGA CRYOGEN GAS
MRI (magnetic resonance imaging) systems are used for medical diagnosis. A requirement of an MRI magnet is that it provides a stable, homogeneous, magnetic field. In order to achieve stability it is common to use a superconducting magnet system which operates at very low temperature, the temperature being maintained by cooling the superconductor, typically by immersion in a low temperature cryogenic fluid, such as liquid helium, liquid neon, liquid hydrogen or liquid nitrogen. Cryogenic fluids are expensive, and it is desirable that the magnet system should be designed and operated in a manner to reduce to a minimum the amount of cryogenic fluid used.
The superconducting magnet system typically comprises a set of superconductor windings for producing a magnetic field, contained within a cryostat. The cryostat typically comprises a cryogenic fluid vessel which contains the superconductor windings, one or more thermal shields completely surrounding the cryogenic fluid vessel, and a vacuum jacket completely enclosing the one or more thermal shields. It is common practice to use a refrigerator to cool the thermal shields to a low temperature in order to reduce the heat load onto the cryogen vessel. It is also known to use a refrigerator to directly refrigerate the cryogen vessel, thereby reducing or eliminating the cryogen fluid consumption.
MRI magnet systems use refrigerators to reduce the heat load onto the cryogen vessel in order to reduce or eliminate the consumption of cryogenic fluid. The refrigerator must make good thermal contact to the objects to be cooled whilst being easy to remove and replace for servicing.
The refrigerator is subject to wear, and must be periodically serviced and then replaced after a certain time in order to maintain adequate system performance. The refrigerator is therefore placed in a means of removably interfacing it to the magnet system.
Achieving good thermal contact at low temperature is difficult, and whilst adequate thermal contact can be achieved using pressed contacts at the thermal shield temperatures, these pressed contacts are difficult to re-make once the refrigerator has been removed and replaced, for example as required for servicing. The thermal contact provided needs to allow such removal and replacement without significant degradation in the thermal transfer efficiency of the thermal contact, otherwise it becomes more difficult to achieve the desired refrigeration at very low temperature.
Known solutions are discussed, for example, in United States Patents 5,782,095, 5,613,367, 5,918,470; and in European Patent Application EP 0 720 024 Al.
In each of these described solutions, a cryogenic refrigerator is provided, removably mounted within a sleeve. In each case, the sleeve terminates in a heat sink which is thermally linked in some way to a recondensing surface exposed to a cryogen vessel. In United States 5,613,367, the recondensing surface 32 is directly exposed to the interior of the cryogen vessel. In each of the remaining solutions mentioned above, a separate recondensing chamber is provided, adjacent to the heat sink. Gas supply and liquid return pipes are provided to link the recondensing chamber with the cryogen vessel. In each of these solutions, there exists a requirement to provide an effective thermal interface between the refrigerator and the heat sink. In United States 5,918,470 and EP 0 720 024, this is provided by a compressible indium washer. In United States 5,613,367, the corresponding thermal interface relies upon effective cleaning of mechanically touching parts.
Problems are encountered when removing and replacing the refrigerator, in that the thermal coupling between the refrigerator and the heat sink may degrade, or at least is difficult to maintain. When the refrigerator is removed from its sleeve, the interior of the sleeve is exposed to the atmosphere. The heat exchangers will be at very low temperatures, and it is difficult to prevent atmospheric gases from condensing or freezing on the inside of the sleeve. Such condensate may be removed by bringing the temperature of the sleeve to ambient, but this will result in a more lengthy process for removal and replacement of the refrigerator, and may lead to unwanted cryogen loss. Furthermore, the use of indium washers requires that a new indium washer be used every time that the refrigerator is removed and replaced. Indium washers suffer from creep - that is, the indium washer providing the thermal contact between the refrigerator and the heat exchanger changes shape over time, resulting in degradation of the thermal interface. In addition, when the refrigerator is removed for servicing, it is difficult to remove all traces of the old indium washer before fitting a new one. Any residue of the earlier washer will cause non-uniform compression of the later washer, resulting in a sub-standard thermal interface.
The present invention accordingly aims to provide an effective thermal interface for conducting heat between a removable refrigerator and a heat exchanger, such that the thermal interface is simple to make, and does not degrade with time, or with repeated removal of the refrigerator.
In a certain application, the invention aims to provide adequate thermal contact between a cryogenic gas to be cooled and a refrigerator used for cooling whilst maintaining ease of removal of the refrigerator for servicing and eliminating the possibility of air entering the cryogen vessel due to the removal of the refrigerator.
The present invention accordingly provides methods and apparatus as defined in the appended claims.
These, and further, objects, advantages and characteristics of the present invention will be apparent from consideration of the following description of certain embodiments thereof, in conjunction with the accompanying drawings, wherein: Fig. 1 shows a schematic cross section of an MRI system; and Fig. 2 shows a refrigerator mounted in a refrigerator sleeve, including a thermal interface according to an embodiment of the present invention.
As discussed above, it is known in itself to provide recondensation by action of a refrigerator on a cryogenic gas. For example, a refrigerator intended to cool a cryogen may efficiently be interfaced to the gas to be cooled by situating a cooling part of the refrigerator within the cryogen gas. Condensation takes place on the cooling part of the refrigerator, and the recondensed cryogen falls back into the cryogen vessel.
Figure 1 shows a schematic of a known MRI magnet system fitted with a refrigerator 4. A cryostat comprises a liquid cryogen vessel 1, containing a superconductor magnet (not shown) and liquefied cryogen 16, and is surrounded by one or more thermal shields 2, which are in turn completely surrounded by a vacuum jacket 3. Removably fitted to the magnet system is refrigerator 4 thermally interfaced to a cryogen recondensing chamber 11 by interface sleeve 5 so as to cool the thermal shields and recondense cryogen gas and deliver it back to the cryogen vessel 1 by tube 6.
The MRI system discussed with reference to Fig. 1 is typical of MRI systems employing superconductors requiring liquid helium temperatures. In alternative systems, so-called high temperature superconductors may be used. In such systems, the cryogen may be liquid nitrogen. No thermal shields 2 would be required, but multilayer insulation would typically be provided instead. A single stage refrigerator 4 would be sufficient.
The present invention provides an improved thermal interface, particularly suitable for use between a removable refrigerator and an article to be cooled, for example in an MRI system at interface sleeve 5 in Fig. 1. The thermal interface of the present invention preferably consists of a recondensing chamber filled with a gas, the recondensing chamber being in thermal contact with a cooling surface of the refrigerator and the article to be cooled.
According to an embodiment of the present invention, to provide recondensation of cryogen gas in the cryogen vessel 1, the condensation process is employed twice in adjoining chambers so that the refrigerator can be isolated from the gas and liquid cryogen used to cool the superconductor magnet, while providing an effective thermal interface which does not degrade with time or with repeated removal and replacement of the refrigerator.
Figure 2 shows a thermal interface according to an embodiment of the present invention. The bottom of the interface sleeve 5 is terminated in a leak tight manner with thermally conducting base 10 which seals the sleeve and isolates it from the cryogen fluid and gas in cryogen vessel 1. Base 10 accordingly forms part of the wall of the cryogen vessel 1 as well as forming part of the wall of sleeve 5. Base 10 is also connected, preferably in a leak tight manner, as part of the wall of the recondensing chamber 11. Recondensing chamber 11. encloses a recondenser 11a in thermal contact with base 10, and is in communication with cryogen vessel 1 through gas cryogen inlet / liquid cryogen outlet tube 6. A two-stage refrigerator 4 is placed within refrigerator interface sleeve 5. The first stage heat exchanger 12a of the refrigerator 4 is in thermal contact with shield 2. This contact may be either direct as shown or by known intermediaries such as flexible copper braid. The second stage 7 of the refrigerator 4 is situated in the lower part 8 of refrigerator interface sleeve 5. Second stage 7 terminates in cooling stage 9 which is cooled by the refrigerator to a low temperature, for example about 4K. The features described in this paragraph are conventional, and correspond to the arrangement shown in United States patent 5,918,470.
According to an aspect of the present invention, the sleeve 5 is filled with a cryogen gas. Cooling stage 9 preferably does not make mechanical contact with base 10. Cooling stage 9 operates to cool the cryogen gas to its liquefaction temperature. Cooling stage 9 is preferably finned so as to improve recondensation heat transfer. As will be understood by those skilled in the art, and according to an aspect of the present invention, the interior of sleeve 5 is arranged as a secondary recondensing chamber.
Cooling stage 9 liquefies the gas within the sleeve 5. The resultant liquid cryogen 12 accordingly partly fills the bottom of sleeve 5 and provides a heat transfer medium for transferring heat from gaseous cryogen from cryogen vessel 1 in recondensing chamber 11, via recondenser 11a and base 10 to secondary recondenser 9, by boiling at base 10 and recondensation at cooling stage 9.
Base 10 is preferably made from highly thermally conducting material, typically copper, and provides good thermal conduction from its upper surface 10a in contact with liquid 12 to its lower surface and on to recondenser 11a. The upper surface of cryogen liquid 12 should preferably not touch the secondary recondenser 9 since this would reduce the area available for recondensation, and therefore would also reduce the rate of heat transfer. Liquid cryogen 12 and its gaseous counterpart provide a non-contact ('recondenser') thermal interface between cooling stage 9 and base 10.
Upper surface 10a of base 10 may be finned or otherwise machined or prepared so as to increase the area for heat transfer by boiling, but the preparation of the surface should be such as to allow free flow of liquid 12 across the upper surface 10a of base 10.
Operation of the thermal interface of the present invention will now be described. First stage heat exchanger 12a between the refrigerator and the sleeve is provided with at least one gas path 13 so that gas can pass between the upper and lower parts of the interface sleeve 5 for evacuation of the sleeve, refilling with cryogen gas, and release of cryogen gas, as and when appropriate.
On first putting the refrigerator into the interface sleeve 5, with both the refrigerator and the magnet system hot, air is evacuated from the interface sleeve 5 through port 14 and the interface sleeve is then filled with clean cryogen gas, again through port 14. This process may be repeated a number of times to ensure purity of the cryogen gas remaining in the interface sleeve.
During cooling of the magnet system and the refrigerator to operating temperature, or when the magnet system and refrigerator have been cooled to operating temperature, further cryogen gas may be slowly admitted through port 14 into the interface sleeve. The gas is admitted slowly so that the refrigerator can cool and liquefy it as appropriate. The quantity of gas admitted is measured so that the appropriate quantity of liquid 12 is condensed in the bottom of the sleeve.
After subsequent cycles of removing, servicing and replacing the refrigerator, when the magnet system is cold, but the refrigerator is still hot (relative to the temperature in the cryogenic vessel 1), air is evacuated from the interface sleeve 5 through port 14 and the sleeve is then filled with a clean cryogen gas. This may be repeated a number of times to ensure purity of the gas remaining in the interface sleeve 5. The refrigerator 4 is then started and allowed to cool to its operating temperature. When the refrigerator is fully cold, or during the cooling, a quantity of cryogen gas is slowly admitted through port 14 into the sleeve. The gas is admitted slowly so that the refrigerator can cool and liquefy it as appropriate. The quantity of gas admitted is measured so that the appropriate quantity of liquid 12 is condensed in the bottom of the sleeve.
When the refrigerator is turned off for servicing, or if the refrigerator should be turned off. or stopped unintentionally, the liquid cryogen 12 will boil and evaporate. A pressure relief valve 15 is fitted to the interface sleeve 5 to prevent excessive pressure developing in the sleeve under these circumstances. Alternatively, since the quantity of liquid cryogen 12 is small, it could be allowed to boil off into a reservoir and then recondensed when the refrigerator restarted. A volume of about 2 litres pressurized to about 2 bar (2xl05Pa) would be sufficient to provide adequate gas for recondensing into a heat transfer liquid 12.
The interface of the present invention may be used to interface refrigerator 4 to a recondenser 11a. While any suitable gas 12 may be used in the secondary recondenser 9,5, the boiling point of the gas 12 of the secondary recondenser should be no greater than the boiling point of the gas in the recondensation chamber 11 and the cryogen vessel 1. The same gas may be used in both recondensers. If gases with differing boiling points are used, a thermal resistance may be placed in the thermal path 10 to improve the efficiency of the recondenser 11a.
According to an aspect of the present invention, the thermal interface between cooling stage 9 and the object 10 to be cooled is provided by a closed recondensation chamber. When the refrigerator is removed for servicing, the secondary recondensation chamber 8 is opened. However, no interference is caused to the recondensation chamber 11.
While the present invention has been described with reference to a limited number of specific embodiments, numerous modifications and adaptations may be made within the scope of the present invention, as will be apparent to those skilled in the art.
For example, in the particularly described embodiment, the cooled object 10 itself forms part of a recondensation chamber. However, the invention is not limited to providing a thermal interface to recondensation chambers. Indeed, the present invention usefully finds application in any situation where a refrigerator may need to be periodically removed and replaced without difficulty and without deterioration in the thermal interface between the refrigerator and the object to be cooled. The invention may also usefully be employed in situations where the refrigerator does not need to be repeatedly removed, since the thermal interface of the present invention is predictable and simple to set up. It does not have such demanding requirements of mechanical perfection as in the case of thermal interfaces which reply on accurate mechanical contact, or the interposition of indium washers.

Claims

1. Cooling apparatus comprising a removable cryogenic refrigerator (4) and a thermal interface between the removable cryogenic refrigerator (4) and an article (10) to be cooled by the cryogenic refrigerator, wherein the thermal interface consists of a gas held within a recondensing chamber (12), the recondensing chamber being in thermal contact with a cooling surface (9) of the refrigerator and the article (10) to be cooled.
2. Cooling apparatus according to claim 1 wherein the cryogenic refrigerator is mounted within a sleeVe (5), and the volume within the sleeve surrounding the refrigerator forms the recondensing chamber.
3. Cooling apparatus according to any preceding claim, wherein the article (10) to be cooled is placed at a lower extremity of the recondensing chamber, such that gas condenses to a liquid (12) on the cooling surface (9) and falls under gravity into contact with the article (10) to be cooled.
4. Cooling apparatus according to any preceding claim wherein the article (10) to be cooled is in thermal contact with a further recondensing chamber (11), arranged for the recondensation of a cryogen gas itself isolated from the recondensing chamber of the interface.
5. Cooling apparatus according to any preceding claim wherein the cooling surface (9) is provided with fins.
6. A cryostat containing a liquefied cryogen (16), comprising a recondenser (11a) exposed to the interior of a cryogen vessel (1) containing the liquefied cryogen, the recondenser being connected for cooling by cooling apparatus according to any of claims 1- 5.
7. An MRI system comprising superconducting windings contained within a cryostat as claimed in claim 6.
8. A thermal contact, comprising a sealed chamber (5) around a recondensing refrigerator (4) and in contact with a component (10) to be cooled, the sealed chamber being filled with a gas which is recondensed into a liquid (12) by the recondensing refrigerator whereby thermal contact between the recondensing refrigerator and the component (10) is provided by recondensation of the gas.
9. A method for recondensing a cryogen gas within a cryostat comprising the steps of : - providing a recondensing surface (11a) exposed to the cryogen gas within the cryostat and in thermal contact with a component as recited in claim 8; and - cooling the recondensing surface by cooling the component through a thermal contact according to claim 8.
10. Apparatus substantially as described, and/or as illustrated in Fig. 2 of the accompanying drawing.
PCT/EP2005/005154 2004-05-25 2005-05-12 Cooling apparatus comprising a thermal interface and method for recondensing a cryogen gas WO2005116515A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2005800166491A CN1997851B (en) 2004-05-25 2005-05-12 Cooling apparatus comprising a thermal interface and method for recondensing a cryogen gas
US10/594,618 US9732907B2 (en) 2004-05-25 2005-05-12 Cooling apparatus comprising a thermal interface and method for recondensing a cryogen gas

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB0411607.5 2004-05-25
GBGB0411607.5A GB0411607D0 (en) 2004-05-25 2004-05-25 Recondenser interface
GB0423895A GB2414538B (en) 2004-05-25 2004-10-28 Cooling apparatus comprising a thermal interface and method for recondensing a cryogen gas
GB0423895.2 2004-10-28

Publications (1)

Publication Number Publication Date
WO2005116515A1 true WO2005116515A1 (en) 2005-12-08

Family

ID=34969195

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/005154 WO2005116515A1 (en) 2004-05-25 2005-05-12 Cooling apparatus comprising a thermal interface and method for recondensing a cryogen gas

Country Status (1)

Country Link
WO (1) WO2005116515A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008105845A3 (en) * 2006-10-10 2008-11-13 Massachusetts Inst Technology Cryogenic vacuum break thermal coupler
US20100005814A1 (en) * 2008-07-03 2010-01-14 Bruker Biospin Gmbh Method for cooling a cryostat configuration during transport and cryostat configuration with transport cooler unit
US8291717B2 (en) 2008-05-02 2012-10-23 Massachusetts Institute Of Technology Cryogenic vacuum break thermal coupler with cross-axial actuation

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0720024A1 (en) * 1994-12-29 1996-07-03 General Electric Company Helium recondensing superconducting magnet
US5586437A (en) * 1995-09-06 1996-12-24 Intermagnetics General Corporation MRI cryostat cooled by open and closed cycle refrigeration systems
US5701744A (en) * 1996-10-31 1997-12-30 General Electric Company Magnetic resonance imager with helium recondensing
US5782095A (en) * 1997-09-18 1998-07-21 General Electric Company Cryogen recondensing superconducting magnet
US5918470A (en) * 1998-07-22 1999-07-06 General Electric Company Thermal conductance gasket for zero boiloff superconducting magnet
US6246308B1 (en) * 1999-11-09 2001-06-12 General Electric Company Superconductive magnet including a cryocooler coldhead
EP1418388A2 (en) * 2002-11-07 2004-05-12 Oxford Magnet Technology Limited A pulse tube refrigerator

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0720024A1 (en) * 1994-12-29 1996-07-03 General Electric Company Helium recondensing superconducting magnet
US5586437A (en) * 1995-09-06 1996-12-24 Intermagnetics General Corporation MRI cryostat cooled by open and closed cycle refrigeration systems
US5701744A (en) * 1996-10-31 1997-12-30 General Electric Company Magnetic resonance imager with helium recondensing
US5782095A (en) * 1997-09-18 1998-07-21 General Electric Company Cryogen recondensing superconducting magnet
US5918470A (en) * 1998-07-22 1999-07-06 General Electric Company Thermal conductance gasket for zero boiloff superconducting magnet
US6246308B1 (en) * 1999-11-09 2001-06-12 General Electric Company Superconductive magnet including a cryocooler coldhead
EP1418388A2 (en) * 2002-11-07 2004-05-12 Oxford Magnet Technology Limited A pulse tube refrigerator

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008105845A3 (en) * 2006-10-10 2008-11-13 Massachusetts Inst Technology Cryogenic vacuum break thermal coupler
JP2010506134A (en) * 2006-10-10 2010-02-25 マサチューセッツ インスティテュート オブ テクノロジー Cryogenic vacuum cutoff thermal coupler
US8069675B2 (en) 2006-10-10 2011-12-06 Massachusetts Institute Of Technology Cryogenic vacuum break thermal coupler
US8291717B2 (en) 2008-05-02 2012-10-23 Massachusetts Institute Of Technology Cryogenic vacuum break thermal coupler with cross-axial actuation
US20100005814A1 (en) * 2008-07-03 2010-01-14 Bruker Biospin Gmbh Method for cooling a cryostat configuration during transport and cryostat configuration with transport cooler unit
US8448455B2 (en) 2008-07-03 2013-05-28 Bruker Biospin Gmbh Method for cooling a cryostat configuration during transport and cryostat configuration with transport cooler unit

Similar Documents

Publication Publication Date Title
US9732907B2 (en) Cooling apparatus comprising a thermal interface and method for recondensing a cryogen gas
US8327650B2 (en) Method and apparatus for controlling the cooling power of a cryogenic refrigerator delivered to a cryogen vessel
JP4494027B2 (en) Cryogenic equipment
JP4336359B2 (en) NMR apparatus having a probe head and a cryogenic vessel cooled in common, and an operation method thereof
JP3824283B2 (en) Superconducting magnet assembly
US20080115510A1 (en) Cryostats including current leads for electronically powered equipment
JP3996935B2 (en) Cryostat structure
US9494344B2 (en) Method for reconfiguring a cryostat configuration for recirculation cooling
US20070051116A1 (en) Device for loss-free cryogen cooling of a cryostat configuration
KR102506491B1 (en) Fault-tolerant cryogenic cooling system
US10203068B2 (en) Method and device for precooling a cryostat
JPH02502665A (en) Cryogenic recondenser with remote cryogenic box
JPH11243007A (en) Superconducting magnet for magnetic resonance imaging
KR101530916B1 (en) Cooling system and superconducting magnet apparatus employing the same
EP0720024B1 (en) Helium recondensing superconducting magnet
CA2528175A1 (en) Method and apparatus of cryogenic cooling for high temperature superconductor devices
WO2005116515A1 (en) Cooling apparatus comprising a thermal interface and method for recondensing a cryogen gas
US7263841B1 (en) Superconducting magnet system with supplementary heat pipe refrigeration
US5979176A (en) Refrigerator
USRE33878E (en) Cryogenic recondenser with remote cold box
US20220236349A1 (en) Accelerated cooldown of low-cryogen magnetic resonance imaging (mri) magnets
JP2007078310A (en) Cryogenic cooling device
US11749435B2 (en) Pre-cooling and removing ice build-up from cryogenic cooling arrangements
GB2463659A (en) Method and Apparatus for Improved Cooling of a Cryostat Thermal Shield
JP3310872B2 (en) Magnetic refrigerator

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DPEN Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed from 20040101)
WWE Wipo information: entry into national phase

Ref document number: 200580016649.1

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE

WWW Wipo information: withdrawn in national office

Country of ref document: DE

122 Ep: pct application non-entry in european phase
WWE Wipo information: entry into national phase

Ref document number: 10594618

Country of ref document: US