WO2005114421A1 - Détection d'une défaillance de thermocouple en utilisant une résistance de ligne - Google Patents

Détection d'une défaillance de thermocouple en utilisant une résistance de ligne Download PDF

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Publication number
WO2005114421A1
WO2005114421A1 PCT/US2004/013992 US2004013992W WO2005114421A1 WO 2005114421 A1 WO2005114421 A1 WO 2005114421A1 US 2004013992 W US2004013992 W US 2004013992W WO 2005114421 A1 WO2005114421 A1 WO 2005114421A1
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WIPO (PCT)
Prior art keywords
thermocouple
temperature
resistance
loop resistance
failure
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PCT/US2004/013992
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English (en)
Inventor
William C. Schuh
Original Assignee
Watlow Electric Manufacruring Company
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Application filed by Watlow Electric Manufacruring Company filed Critical Watlow Electric Manufacruring Company
Priority to PCT/US2004/013992 priority Critical patent/WO2005114421A1/fr
Publication of WO2005114421A1 publication Critical patent/WO2005114421A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
    • G01K7/026—Arrangements for signalling failure or disconnection of thermocouples
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K15/00—Testing or calibrating of thermometers
    • G01K15/007—Testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
    • G01K7/021—Particular circuit arrangements

Definitions

  • the present invention relates generally to thermocouples and more particularly to methods and systems for detecting the degradation of a thermocouple monitoring circuit prior to failure using the loop resistance of the circuit.
  • thermocouple transducers that output an EMF in response to a temperature gradient across two dissimilar materials, typically metals. It is well known, however, that thermocouples degrade over time due to chemical and metallurgical changes in the composition of the materials.
  • Common thermocouples used in temperature measurement comprise two dissimilar thermoelements connected at one end in a hot junction with the other ends connected to the positive and negative leads of a voltmeter at a known reference temperature. The temperature measured at the hot end is a function of the EMF measured and the reference temperature.
  • thermocouple circuit is typically constructed from conductive metal wires, and the associated loop resistance of the thermocouple monitoring circuit is a measure of the electrical resistance due to the various connections, the resistivity of the wires, and the junction of the materials at the hot junction.
  • the thermocouple circuit includes chemical, metallurgical, and mechanical changes in the materials and devices of the circuit.
  • Chemical changes include oxidation of elements in the alloys of the individual thermoelements that, in effect, modify the alloy composition of the base material.
  • the change in chemical composition is usually accompanied by a shift in the resistivity of the thermoelement. Diffusion of the elements may also cause changes in the chemical makeup of the thermoelements and be a source of further resistivity change.
  • thermoelements The junction of the two thermoelements is particularly susceptible to chemical changes.
  • the junction is most often the hottest portion of the circuit and is therefore exposed to the harshest conditions.
  • the junction is also exposed to processes that may increase the likelihood of changes in the electrical properties.
  • Welding, soldering, twisting, or crimping commonly forms the junction of a thermocouple.
  • These joining methods apply a large amount of heat in the case of welding, introduce new materials in the case of soldering, or mechanically strain the materials in the case of twisting or crimping. In these examples the degradation of the junction may be evidenced by an accompanying shift (change) in the loop resistance of the measurement circuit.
  • Metallurgical changes such as grain growth may also contribute to resistivity changes in the thermoelements.
  • Grain growth, re-crystallization, or annealing is usually accompanied by a change in the resistivity of the material.
  • severe mechanical damage such as sharp bends, kinks, or indentations can cause a change in the geometry of the thermoelements and the temperature measurement.
  • Mechanical damage and thermal cycling may also change the contact resistance in screw terminals, connectors, or plugs. In these instances the base resistivity of the material is unchanged but the overall loop resistance of the circuit is impacted. In all of these cases a measurement of the loop resistance of the circuit may help identify degradation of the measuring circuit.
  • the use of impedance measurements on thermocouple circuits have been employed in the past to detect problems in the circuit.
  • thermocouple circuit In one case, a complex oscillating signal circuit is used to derive the impedance measurement from the thermocouple circuit. While the prior art has employed the value of loop resistance in determining thermocouple health, accommodations for specific aspects of most practical thermocouple circuits have not been made. For example, in most applications the circuit comprises a portion of the sensor that is exposed to temperature variations along with some leadwire circuitry that is maintained near room temperature. Typically the heat affected region of the circuit is short compared to the total loop length, thus the resistance of the loop is a combination of a large contribution from the leadwire and a smaller contribution from the actual measuring section. Also, since most of the common thermoelement materials have a significant temperature coefficient of resistance, any change in measured temperature will affect the total loop resistance.
  • thermoelements Without a method to isolate the changes in loop resistance due to degradation from the effects of temperature change, however, the true health of the thermoelements is difficult to determine with any significant accuracy. Accordingly, there is a need for more accurately detecting the degradation of the thermoelement materials of a temperature monitoring system prior to failure, and for determining the health of the thermocouple and the temperature monitoring system.
  • the present invention is directed to a system and method for detecting the degradation of a thermocouple (TC) circuit prior to failure. Changes in loop resistance due to degradation from the effects of temperature change are isolated by identifying the heat affected loop resistance change portion from the total change in loop resistance.
  • TC thermocouple
  • a detection system of the present invention monitors the loop resistance of the measurement circuit and isolates the heat affected loop resistance changes from the degraded circuit changes.
  • the loop resistance of the measurement circuit is isolated by dividing the monitoring circuit into a sheathed portion (e.g., the thermocouple, the portion purchased from the manufacturer), which is generally exposed to the temperature measurements (the heat affected portion), and an unsheathed portion (e.g., connector, lead wires, monitor) that is generally at ambient temperature.
  • the present invention further provides an algorithm for instrumentation systems to predict certain types of impending failure in thermocouple temperature measurement circuits.
  • the algorithm compensates the loop resistance measurements by removing or isolating out the heat affected sheathed portion loop resistance changes, thus identifying changes due to degradations in the unsheathed portion of the circuit.
  • the algorithm utilizes one or more values supplied by the manufacturer of the thermocouple and an initial loop resistance of the monitoring circuit to isolate the heat affected sheathed portion changes.
  • R mo is the initial resistance of the sheathed portion of the thermocouple
  • ⁇ is the temperature coefficient of resistance (TCR) of the thermocouple
  • LR is the measured loop resistance of the thermocouple monitoring circuit measured at the initial indicated temperature T m0 with the unsheathed portion of the circuit at an ambient temperature T a .
  • the manufacturer of the thermocouple may supply R mo and ⁇ based on the manufacturer's part number.
  • thermocouple confidence level %CL ⁇ R mo * (1+ ⁇ /2*(T m - T a )) - (LR-R C ) ⁇ / (LR-R C )
  • Rmo is the initial resistance of the sheathed portion of the thermocouple
  • ⁇ is the temperature coefficient of resistance of the thermocouple
  • LR is the measured loop resistance of the thermocouple monitoring circuit measured at the current indicated temperature T m with the unsheathed portion of the circuit at an ambient temperature T a .
  • the TC degradation detection system of the present invention comprises a temperature measuring component, a storage component, and an analyzer comprising an algorithm for predicting certain types of impending failure in thermocouple temperature measurement circuits.
  • the analyzer of the detection system is operable to receive thermocouple parametric input values available from the thermocouple manufacture, monitor one or more sensor (e.g., thermocouple) inputs, monitor the loop resistance of the monitoring circuit, and calculate and store the initial calculation of the non- sheathed resistance of the monitoring circuit to the storage component.
  • the analyzer may then provide one or more of a confidence level, a degradation detection, a failure prediction, and an alarm output, based on an analysis of the thermocouple sheathed portion degradation results from the algorithm.
  • the detection system may, according to one aspect of the invention, monitor the loop resistance of a thermocouple circuit for changes that are analyzed and determined to be due to a level of thermocouple degradation greater than a predetermined acceptable level. Although only the overall resistance need be monitored, an accurate determination may be made using the algorithm and several parameters of the thermocouple from the manufacturer.
  • Another aspect of the present invention provides a method for the detection of degradation of thermal elements in the detection system of the invention.
  • the method comprises inputting and storing parametric inputs as provided by the thermocouple manufacturer for the thermocouple that is to be used, then calculating and storing an initial unsheathed portion resistance Rc using the algorithm of the present invention and an initial loop resistance measurement.
  • the method further comprises continuing to monitor the loop resistance, calculating a thermocouple confidence level %CL using the algorithm, the parametric inputs, and the unsheathed portion resistance Rc.
  • the thermocouple confidence level %CL may then be used to determine whether an alarm to maintenance should be initiated if the %CL exceeds a predetermined level.
  • thermocouple confidence level %CL a prediction of an imminent failure, or a prediction of a next expected value may be provided by the detection system.
  • Fig. 1 is a prior art diagram illustrating a conventional thermocouple device as provided by a thermocouple manufacturer such as may be used in a temperature monitoring system
  • Fig. 2 is an accompanying schematic symbol of the prior art thermocouple of Fig. 1 , and the polarity of an EMF provided by the device
  • Fig. 3 is a simplified schematic diagram of an equivalent circuit of the prior art thermocouple of Fig. 1
  • Fig. 4A is a diagram illustrating an exemplary wiring diagram of a temperature monitoring system used in accordance with an aspect of the present invention, and demonstrating several potential circuit degradation areas
  • Fig. 4B is a schematic diagram of an equivalent circuit of the temperature monitoring system of Fig.
  • FIG. 5A is a simplified schematic diagram of an equivalent circuit of an exemplary TC degradation detection system of the present invention similar to the temperature monitoring system of Fig. 4A in accordance with an aspect of the present invention
  • Fig. 5B is a schematic diagram of another equivalent circuit of the exemplary TC degradation detection system of Fig. 5A, illustrating the system divided into sheathed and unsheathed portions in association with an aspect of the present invention, and equations relating to the degradation detection algorithm of the present invention
  • Fig. 6 is a simplified block diagram of an exemplary TC degradation detection system for detecting TC circuit degradations and predicting failures in accordance with an aspect of the present invention
  • Fig. 6 is a simplified block diagram of an exemplary TC degradation detection system for detecting TC circuit degradations and predicting failures in accordance with an aspect of the present invention
  • Fig. 5A is a simplified schematic diagram of an equivalent circuit of an exemplary TC degradation detection system of the present invention similar to the temperature monitoring system of Fig. 4A in accord
  • FIG. 7 is a functional diagram of an exemplary TC degradation detection system and illustrating a method for monitoring, analyzing, and detecting TC circuit degradations, and predicting failures in accordance with an aspect of the present invention
  • Fig. 8 is a flow chart diagram illustrating a method of detecting TC circuit degradations, and predicting failures in a TC degradation detection system in accordance with an aspect of the present invention
  • Fig. 9 is another flow chart diagram illustrating a method of detecting TC circuit degradations, and predicting failures in a TC degradation detection system in accordance with an aspect of the present invention
  • Fig. 10 is a simplified output plot of an exemplary TC degradation detection system similar to the systems of Figs.
  • Fig. 11 is a plot of the changes in several TCs illustrating a drift (DR#1- 4) over time and temperature, and an associated change in figure of merit (Z1-4) as detected by the exemplary TC degradation detection system similar to the systems of Figs. 6 and 7, and as computed by the algorithm of the present invention.
  • the invention relates to a method of detecting thermocouple degradation in a temperature monitoring system, and a degradation detection system in which an algorithm is employed utilizing several parameters specific to the thermocouples of the monitoring system.
  • the parameters may be supplied by the manufacturer of the specific thermocouples or ascertained in another manner, and are useful for increasing the accuracy of the identification of thermocouple degradation and other elements of the temperature monitoring system.
  • Fig. 1 illustrates a conventional thermocouple device 100, such as may be provided by a thermocouple manufacturer and used in a temperature monitoring system
  • Fig. 2 illustrates an accompanying schematic symbol 200 of the thermocouple of Fig. 1.
  • Most common thermocouples are temperature measuring devices or sensors comprising two dissimilar metals connected together at one end, called the hot junction. The two metals have a polarity with respect to each other and one of these is referred to as the positive leg and the other as the negative leg.
  • the conventional thermocouple typically has a stainless steel sheath 110 for protection over the hot junction that may be potted therein (e.g., a ceramic, or epoxy potting material), together with a (e.g., stainless steel) transition 120 to protect the transition to a length of high temperature insulated leadwire 130.
  • the leadwire 130 may also have a length of heatshrink protection and a label 140 before it terminates in a mini- plug connector 145.
  • Fig. 3 illustrates a simplified schematic diagram 300 of an equivalent circuit of the thermocouple of Fig. 1.
  • the EMF produced by the thermocouple may be represented by a battery 310 with a temperature dependency, while the total series resistance of the thermocouple device may be represented by R m (T) 320.
  • Resistance R m (T) 320 comprises the junction resistance, the lead wire resistance, the leadwire to mini-plug connector resistance, and the resistance of the connector conductors themselves.
  • the manufacturer of the thermocouple in many cases is in possession of some or all the parameters comprising a specific thermocouple device.
  • a complete circuit (loop) is formed when the two free ends of a thermocouple are connected to a voltage measuring device providing a temperature measurement of the thermocouple hot end.
  • the electrical loop resistance (LR) of the temperature measurement circuit in some cases is an indicator of some forms of impending failure.
  • thermocouples can be classified into at least two distinct categories: catastrophic failure and inaccuracy.
  • Catastrophic failures are indicated by a lack of signal from the sensor and can include wire breaks and mechanical damage. Inaccuracies in some cases are more sinister and can result from chemical or metallurgical changes in the thermocouple metals. Inaccuracies can also result from secondary junctions in regions of low electrical insulation isolation between the positive and negative legs away from the hot end. Either of these modes of failure can lead to poor thermal processing in applications, thus it is desirable to avoid unplanned thermocouple failure.
  • One method of minimizing the number of unplanned failures is through a program of preventive maintenance where sensors are replaced at a predetermined interval.
  • the present invention provides one such method and system for predicting impending failure automatically and without disrupting service.
  • the failure prediction algorithm of the present invention utilizes a shift
  • thermocouple change in the electrical loop resistance of the thermocouple measurement circuit to predict impending thermocouple failure.
  • modes of failure In a typical thermocouple installation there are several modes of failure but four modes are somewhat common. These common failure modes are: 1 ) degradation of the weld joining the two metals at the hot end, 2) degradation of either metal leg due to chemical or metallurgical changes occurring at high temperatures, 3) degradation of the electrical connection between the instrumentation to the thermocouple, and 4) secondary junctions caused by degradation of the electrical insulation between the two thermoelements away from the hot end. Figs.
  • FIGS. 4A and 4B illustrate a wiring diagram and a schematic diagram of an equivalent circuit of an exemplary temperature monitoring system 400 used in accordance with an aspect of the present invention, and for detecting degradation or failure of a thermocouple.
  • Figs. 4A and 4B of the temperature monitoring system 400 further demonstrate the four potential circuit degradation areas or failure mechanisms identified above.
  • 410 illustrates the type 1 common failure modes as listed above at the hot end thermoelement junction and any degradations due to the welding/joining process, metallurgical changes, or mechanical damage.
  • Many of the degradation areas herein discussed in the thermoelectric materials will generally demonstrate the effect of a new thermoelement junction comprising a temperature dependant battery and an internal series resistance.
  • junction degradation area 410 comprises a temperature dependant battery or voltage source 410a and an internal series resistance 410b.
  • the junction of the thermoelements provides the temperature dependant EMF represented by the temperature dependant battery 410a, while the internal resistance of the junction and the materials is represented by internal series resistance 410b.
  • the other failure mode or degradation areas are also represented by another temperature dependent voltage source and an internal series resistance.
  • the EMF provided by each of these temperature dependant batteries may be quite small, and the internal series resistance may be low, yet at a macroscopic level these characteristics will generally exist.
  • 420 illustrates the type 2 failure mode due to the degradation of either metal leg due to chemical or metallurgical changes occurring at high temperatures, or mechanical damage such as dents or pinching of the protective sheath.
  • Region 430 illustrates the type 3 failure mode due to the degradation of the electrical connection between the instrumentation and the thermocouple. This failure mode could be in the termination between the leadwires and the mini- plug, between the mini-plug prongs and the mating instrumentation socket, or between the mating instrumentation socket and the leadwires to the instrumentation. Loose connections in this area can cause large loop resistance changes.
  • the type 4 failure mode is due to secondary junctions caused by degradation of the electrical insulation between the two thermoelements away from the hot end, and is illustrated at 440 and 450.
  • Secondary junction 440 may be caused, for example, by frayed leadwire insulation allowing leadwire conductors to touch a common object such as the electrical conduit for the instrumentation leadwires, or allowing the conductors to touch each other directly at 450.
  • a common object such as the electrical conduit for the instrumentation leadwires
  • several series and parallel voltages and resistances may be formed within the temperature monitoring circuit due to the above failure modes. All four of the modes of failure are accompanied by a shift in the electrical loop resistance, LR, of the measurement circuit, as illustrated by a temperature measuring system 500 of Figs. 5A and 5B in accordance with an aspect of the present invention.
  • Fig. 5A illustrates the temperature dependant voltage source 502 supplying an EMF through loop resistance LR 504 to the instrumentation voltmeter VM 506 for monitoring the temperature at the thermocouple.
  • LR may be employed as an indicator of the relative health of the thermocouple. Since most commercially available thermocouple measurement instruments also have provisions for making resistance measurements, it is a simple matter to implement a LR monitoring scheme to provide indications of the sensor's health. LR monitoring provides a means of predicting some modes of impending failure, but it may not detect all modes of failure or detect all instances of the listed four modes. It will however improve the likelihood of detecting a failing thermocouple sensor and thus increase the reliability of the thermal system. A simple scheme of recording the LR history of the sensor will be of some value, but a slightly more sophisticated scheme will give a more robust failure prediction system. As further illustrated by the temperature monitoring system 500 of Fig.
  • the loop resistance LR 504 comprising the series and parallel voltages and resistances are formed within either the sheathed portion 508 of the thermocouple device or within the unsheathed portion 509 of the temperature monitoring system 500.
  • failure modes 1 & 2 and some of the mode 3 failures occur within the sheathed portion 508, while the remainder of failure mode 3 and 4 occur within the unsheathed portion 509.
  • 4A and 4B, or 5A and 5B) consisting of a metal sheathed sensor transitioning to a sheathed portion leadwire and then connected to the instrumentation through an unsheathed portion leadwire circuit.
  • the sensor and its sheathed portion leadwire are supplied from the factory.
  • the unsheathed portion leadwire circuit is provided typically by the customer at the application.
  • the sheathed portion of the sensor is usually exposed to the largest temperature gradient while the unsheathed portion leadwire is exposed typically to temperatures slightly above ambient. Since the resistance of a metal wire increases with temperature one can expect that the loop resistance will have a component that is affected by the installation temperature, but that the unsheathed portion leadwire will, for the most part, remain at a somewhat constant temperature.
  • Both the sheathed portion leadwire and the sheathed sensor combine to form the measurement circuit and so both must be considered. Because the unsheathed portion leadwire is not in a substantially temperature affected zone, its contribution (to an approximation) to the LR 504 is a constant resistance R c 515.
  • the sheathed portion resistance can likewise be denoted Rm(T) 525, where the T indicates this is in a temperature affected zone and so will shift in resistance with changing temperature.
  • first level implementation of loop resistance failure prediction includes monitoring the LR of the circuit and logging the values.
  • a second level implementation further includes a process temperature shift compensation to the algorithm. This would require that some of the values associated with the sensor are pre-registered at the factory and then an initial base point reading be accomplished upon installation.
  • the values registered at the factory include the temperature coefficient of resistance, ⁇ , of the thermocouple wire that is determined from the thermocouple type and the loop resistance R m o, of the sheathed portion of the sensor. Both of these values typically are readily available based upon the sensor part number.
  • R m o is the initial resistance of the sheathed portion of the thermocouple (e.g., provided by the manufacturer)
  • ⁇ is the temperature coefficient of resistance of the thermocouple (e.g., provided by the manufacturer)
  • LR is the measured loop resistance of the thermocouple monitoring circuit measured at the current indicated temperature T m with the unsheathed portion of the circuit at an ambient temperature T a .
  • the unsheathed constant resistance R c is calculated from the initial LR measurement (according to equation (4a) above), the factory values, and the indicated temperature, T m .
  • thermocouple failure detection system 600 is illustrated in Fig. 6 in accordance with an aspect of the present invention.
  • the detection system 600 comprises a temperature measuring component 610, a storage component 620, and an analyzer 630 having an algorithm 635 used by the analyzer 630 for detecting TC circuit degradations and to make TC failure predictions.
  • the temperature measuring component 610 is operable to monitor one or more thermocouples and the loop resistance of the thermocouple monitoring circuit, and forward the results to the analyzer 630.
  • the analyzer 630 is operable to receive one or more TC parametric inputs 640 (e.g., provided by the manufacturer), and the results of the temperature measuring component 610.
  • the analyzer 630 of Fig. 6 is further operable to analyze the results of the temperature monitor component 610, and use the algorithm 635 together with the TC parametric inputs 640 to compute and store the unsheathed constant resistance R c to the storage component 620.
  • the analyzer 630 of the detection system 600 is further operable to direct the measurement component to make additional loop resistance measurements of each TC and to analyze and determine using the failure detection algorithm 635, the confidence level 650 of the TC, make a failure prediction 660 of the TC, and issue an alarm condition 670 if a predetermined limit has been achieved.
  • Fig. 7 illustrates one example of a TC degradation detection system 700 for monitoring, analyzing, and detecting TC circuit degradations, and predicting failures in accordance with an aspect of the present invention.
  • the detection system 700 comprises a temperature measuring component 710, a storage component 720, and an analyzer 730 having an algorithm 735 used by the analyzer 730 for detecting TC circuit degradations and to make TC failure predictions.
  • the temperature measuring component 710 is operable to monitor one or more thermocouples 738 and the loop resistance of the thermocouple monitoring circuit, and forward the results to the analyzer 730.
  • the analyzer 730 is operable to receive one or more TC parametric inputs 740 (e.g., provided by the manufacturer), and the results of the temperature measuring component 710.
  • the analyzer 730 of Fig. 7 is further operable to analyze the results of the temperature monitor component 710, and use the algorithm 735 together with the TC parametric inputs 740 to compute and store the unsheathed constant resistance R c to the storage component 720.
  • the analyzer 730 of the detection system 700 is further operable to direct the measurement component to make additional loop resistance measurements of each TC and to analyze and determine using the failure detection algorithm 735, the confidence level 735d of the TC, make a failure prediction 735d of the TC, and issue an alarm condition 750 if a predetermined limit has been achieved or exceeded. For example, when a predetermined failure level is reached, maintenance may be alerted to check or replace the thermocouple, or alternatively to check for loose terminal connections or broken leadwires.
  • an event timing macro 760 is further added to control how often the loop resistance measurement is made via a loop resistance monitoring macro 735b.
  • timings ranging from continuous loop resistance measurements to once per day, or once per thermal process cycle may be enabled with the event timing macro 760.
  • Another aspect of the invention provides a methodology for monitoring, analyzing, and detecting TC circuit degradations, and predicting failures in a thermocouple monitoring system as illustrated and described herein, as well as other types of temperature monitoring systems.
  • the method relies on a shift in the loop resistance of the measurement circuit as an indicator of sensor health. Increasing or decreasing resistance is an indicator of, for example, weld degradation, metal wire degradation, electrical contact degradation, or formation of secondary junctions.
  • the method compensates for expected resistance variation due to measured temperature variation.
  • the method of the present invention utilizes an algorithm to detect the degradations and to enable failure predictions as described in the algorithm and equation development above.
  • an exemplary method 800 is illustrated for detecting TC circuit degradations, and predicting failures, for example, in a TC degradation detection system similar to the systems of Figs. 6 and 7 in accordance with an aspect of the present invention. While the method 800 and other methods herein are illustrated and described below as a series of acts or events, it will be appreciated that the present invention is not limited by the illustrated ordering of such acts or events. For example, some acts may occur in different orders and/or concurrently with other acts or events apart from those illustrated and/or described herein, in accordance with the invention. In addition, not all illustrated steps may be required to implement a methodology in accordance with the present invention.
  • the method 800 may be implemented in association with the detection systems, elements, and devices illustrated and described herein as well as in association with other systems, elements, and devices not illustrated.
  • the method 800 comprises initially (upon installation) inputting and storing sensor (e.g., thermocouple) specific parameters (e.g., available from the manufacturer by sensor part number) of the initial sensor resistance R m0 , and the TCR, ⁇ .
  • sensor e.g., thermocouple
  • specific parameters e.g., available from the manufacturer by sensor part number
  • a loop resistance LR is also measured at the indicated initial temperature T m o.
  • An initial unsheathed (constant) circuit resistance R c is then computed according to equation (4a) of the failure detection algorithm, from the measured LR, the sensor specific parameters R m o and ⁇ , at the indicated initial temperature T m o with the unsheathed portion of the detecting system at an ambient temperature T a .
  • R c is then stored in memory for future reference.
  • a currently measured loop resistance LR is taken at a current indicated temperature T m .
  • a confidence level (CL), for example a percentage confidence level (%CL) is computed from the currently measured LR, at T m , thereby comparing the predicted loop resistance values to the currently measured values according to equation (5) of the failure detection algorithm.
  • Method 800 also includes determining whether the CL has exceeded a predetermined limit. If the limit has not been exceeded, the detection continues to take additional loop resistance LR measurements and compute CL values. When the CL limit has been exceeded a sensor alarm is issued to signal that a failure is imminent, and the method ends.
  • the exemplary failure detection and prediction method 800 of Fig. 8 begins at 805. Upon installation, initial thermocouple resistance R m o. and the
  • TCR, ⁇ parameters specific to the thermocouple (e.g., based on the manufacturers part number) are input and stored at 810 in the detection system.
  • a loop resistance LR is also measured at an indicated initial temperature T m o.
  • An initial unsheathed (constant) circuit resistance R c is then computed at 820 according to equation (4a) of the failure detection algorithm, from the measured LR, the sensor specific parameters R m0 and ⁇ at the indicated initial temperature T m o with the unsheathed portion of the detecting system at an ambient temperature T a .
  • Rc LR-R m *(1 + ⁇ /2*(T m - T a )).
  • a current loop resistance LR measurement is taken at a current indicated temperature T m .
  • a confidence level for example a percentage confidence level (%CL) is computed from the current LR measurement at T m , thereby comparing the predicted loop resistance values to the currently measured values according to equation (5) of the failure detection algorithm.
  • %CL ⁇ R m0 *(1 + ⁇ /2*(T m - T a )) - (LR-R C ) ⁇ / (LR- R c ).
  • Method 800 also includes determining whether the CL has exceeded a predetermined limit at 870.
  • the detection continues to 850 to take additional loop resistance LR measurements and compute CL values. If, however, the CL limit has been exceeded at 870, a sensor alarm is issued at 880 to signal that a failure is imminent. Thereafter, the failure detection and prediction method of the present invention ends at 890.
  • the method detects TC circuit degradations, and predicts failures in a thermocouple monitoring system as well as other types of temperature monitoring systems, wherein a shift in the loop resistance of the measurement circuit is an indicator of sensor health.
  • the present invention provides compensation for expected resistance variation due to measured temperature variation, utilizing a failure detection algorithm to detect thermocouple degradations and to enable failure predictions. Referring now to Fig.
  • Method 900 of Fig. 9 is similar in most regards to that of method 800 of Fig. 8, and as such need not be described again for the sake of brevity.
  • Method 900 of Fig. 9, in accordance with the TC degradation detection systems of Figs. 6, 7 and 8, begins at 905, and continues similar to that of method 800 up thru 820 that is similar to the R c computation at 920 and R c storage in memory at 925.
  • a time delay loop is added at 930, waiting for a next periodic loop resistance LR measurement, when a predetermined time has expired at 940.
  • a current loop resistance LR measurement is read at 950 at a current indicated temperature T m , similar to that of 850 of Fig. 8.
  • method 900 of Fig. 9 continues similar to that of method 800 of Fig. 8, until the failure detection and prediction method of the present invention ends at 990, for detecting TC circuit degradations, and predicting failures in a thermocouple monitoring system.
  • Fig. 10 illustrates a simplified output plot 1000 of an exemplary TC degradation detection system similar to the systems of Figs. 6 and 7 and in accordance with the methods of Figs. 8 and 9.
  • Plot 1000 shows a curve 1010 of a typical change in the percentage of confidence level as a thermocouple circuit degrades over time up toward a predetermined confidence limit 1020 indicating a failure or alarm level in accordance with an aspect of the present invention.
  • Uniform or fixed periods of time may be utilized for making the loop resistance measurements (e.g., 1030, 1040, 1050, and 1060) used in the algorithm discussed above to create a time-series history model of the thermocouple confidence levels for predicting variables relating to confidence level and an impending thermocouple failure at a next loop resistance measurement.
  • a curve could be modeled based on historical %CL data points 1030-1050 at periods 7-9, to predict that a next data point 1060 at period 10 will exceed a failure mode limit for the TC measured.
  • Fig. 11 illustrates a plot 1100 of the changes in several TCs with a drift (DR#1-4) over time at a temperature, and a corresponding change in figure of merit (Z1-4) as detected by the exemplary TC degradation detection system similar to the systems of Figs. 6 and 7 and in accordance with the methods of Figs. 8 and 9, and a variation of the algorithm of the present invention.
  • DR#1-4 drift
  • Z1-4 change in figure of merit
  • the Z figure of merit curves are generated using, for example, an inverted form of the %CL algorithm of the present invention (e.g., 1/(%CL)).
  • Plot 1100 further demonstrates that the Z figure of merit variable provides enhanced resolution and more accuracy in identifying TC and TC circuit degradation than simply a macroscopic loop resistance measurement.
  • drift curves DR#1 and DR#2 to those of the Z figure of merit curves Z1 and Z2, respectively, illustrates that the Z figure of merit also appears to beneficially respond sooner in the time domain than that of the thermocouple drift.
  • the Z figure of merit may also be assigned a predetermined limit corresponding to a failure or alarm level in accordance with another aspect of the invention.

Abstract

Un système et un procédé sont présentés pour détecter la dégradation d'un circuit thermocouple précédent une défaillance et la prédiction de certaines défaillances imminentes du thermocouple. Le système de détection surveille la résistance de ligne du circuit de mesure et isole les changements de résistance de ligne affectée de chaleur à partir des changements du circuit dégradé. Le circuit de surveillance est divisé en une partie gainée, généralement exposée à la mesure de température, et d'une partie sans gaine du système de surveillance généralement à température ambiante. Un algorithme est fourni pour que des systèmes d'instrumentation standard puissent prédire certains types de défaillances imminentes dans des circuits de mesure de température de thermocouple. L'algorithme compense essentiellement les mesures de résistance de ligne en ôtant les changements de résistance de ligne de partie gainée affectée par la chaleur calculés à partir de la résistance de la partie non gainée initiale basée sur les paramètres du fabriquant spécifiques à un thermocouple et à une mesure de résistance de ligne initiale, laissant seulement les changements dus aux dégradations dans la partie non gainée du circuit.
PCT/US2004/013992 2004-05-03 2004-05-03 Détection d'une défaillance de thermocouple en utilisant une résistance de ligne WO2005114421A1 (fr)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6377052B1 (en) * 1999-11-03 2002-04-23 Eaton Corporation Monitoring fluid condition through an aperture
US20030216879A1 (en) * 2002-05-14 2003-11-20 Analysis & Measurement Services Corporation Integrated system for verifying the performance and health of instruments and processes

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6377052B1 (en) * 1999-11-03 2002-04-23 Eaton Corporation Monitoring fluid condition through an aperture
US20030216879A1 (en) * 2002-05-14 2003-11-20 Analysis & Measurement Services Corporation Integrated system for verifying the performance and health of instruments and processes

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