WO2005101489A3 - Gehäuse für led-chip und lichtquelle - Google Patents

Gehäuse für led-chip und lichtquelle Download PDF

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Publication number
WO2005101489A3
WO2005101489A3 PCT/CH2005/000210 CH2005000210W WO2005101489A3 WO 2005101489 A3 WO2005101489 A3 WO 2005101489A3 CH 2005000210 W CH2005000210 W CH 2005000210W WO 2005101489 A3 WO2005101489 A3 WO 2005101489A3
Authority
WO
WIPO (PCT)
Prior art keywords
led chip
light source
housing
conducting path
optical element
Prior art date
Application number
PCT/CH2005/000210
Other languages
English (en)
French (fr)
Other versions
WO2005101489A2 (de
Inventor
Gerhard Staufert
Original Assignee
Lucea Ag
Gerhard Staufert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucea Ag, Gerhard Staufert filed Critical Lucea Ag
Priority to EP05729367A priority Critical patent/EP1735845A2/de
Publication of WO2005101489A2 publication Critical patent/WO2005101489A2/de
Publication of WO2005101489A3 publication Critical patent/WO2005101489A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Abstract

Die Lichtquelle ist gesamthaft ein zerschneidbares Array von auf einem Trägerelement aufgebrachten LED-Chip. Pro LED-Chip bzw. Einheit von nebeneinander angeordneten, bspw. unterschiedlichen Spektralbereichen emittierenden LED-Chips ist ein hohlspiegelartiges oder blendenartiges optisches Element vorhanden. Von einer Befestigungsfläche des bzw. der LED-Chips zu gegen aussen offenen Flächen des optischen Elementes besteht ein durchgängiger Wärmeleitpfad, in dem Sinne, dass jedes der diesen Wärmeleitpfad konstituierenden Elemente entweder voll metallisch ist oder mit Metall gefüllter Kunststoff ist und die genannten Elemente in Summe einen durchgängigen Kühlkörper für den LED-Chip bilden.
PCT/CH2005/000210 2004-04-16 2005-04-15 Gehäuse für led-chip und lichtquelle WO2005101489A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP05729367A EP1735845A2 (de) 2004-04-16 2005-04-15 Gehäuse für led-chip und lichtquelle

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH663/04 2004-04-16
CH6632004 2004-04-16
CH14252004 2004-08-31
CH1425/04 2004-10-31

Publications (2)

Publication Number Publication Date
WO2005101489A2 WO2005101489A2 (de) 2005-10-27
WO2005101489A3 true WO2005101489A3 (de) 2006-07-27

Family

ID=34964082

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CH2005/000210 WO2005101489A2 (de) 2004-04-16 2005-04-15 Gehäuse für led-chip und lichtquelle

Country Status (2)

Country Link
EP (1) EP1735845A2 (de)
WO (1) WO2005101489A2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101573558B1 (ko) 2008-09-03 2015-12-01 오스람 옵토 세미컨덕터스 게엠베하 광전 소자

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007147278A2 (de) * 2006-06-21 2007-12-27 Gerhard Staufert Led-lichtquelle und verfahren
DE102009055765A1 (de) * 2009-09-30 2011-03-31 Osram Opto Semiconductors Gmbh Optisches oder optoelektronisches Bauelement und Verfahren zu dessen Herstellung
CZ22371U1 (cs) 2011-05-13 2011-06-13 Ledwell S.R.O. Svítidlo, zejména reflektorové, s usmerneným tokem svetla
TWI767246B (zh) 2014-12-30 2022-06-11 荷蘭商露明控股公司 具有用於氣體或液體冷卻之集成特徵之發光二極體封裝

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59207674A (ja) * 1983-05-10 1984-11-24 Matsushita Electric Ind Co Ltd 送光装置
WO2002005356A1 (de) * 2000-07-12 2002-01-17 Hella Fahrzeugteile Austria Gmbh & Co Kg Leuchte mit einer led-lichtquelle
EP1187226A1 (de) * 2000-09-01 2002-03-13 Citizen Electronics Co., Ltd. Oberflächenmontierbares LED und Herstellungsverfahren
WO2003023857A2 (de) * 2001-09-13 2003-03-20 Lucea Ag Led-leuchtpaneel und trägerplatte
US20030102481A1 (en) * 2001-11-26 2003-06-05 Citizen Electronics Co., Ltd. Light emitting diode device
WO2003069685A2 (en) * 2002-02-14 2003-08-21 Enfis Limited A light system
US20030189829A1 (en) * 2001-08-09 2003-10-09 Matsushita Electric Industrial Co., Ltd. LED illumination apparatus and card-type LED illumination source
US20030189830A1 (en) * 2001-04-12 2003-10-09 Masaru Sugimoto Light source device using led, and method of producing same
WO2004051705A2 (en) * 2002-12-02 2004-06-17 3M Innovative Properties Company Illumination system using a plurality of light sources

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59207674A (ja) * 1983-05-10 1984-11-24 Matsushita Electric Ind Co Ltd 送光装置
WO2002005356A1 (de) * 2000-07-12 2002-01-17 Hella Fahrzeugteile Austria Gmbh & Co Kg Leuchte mit einer led-lichtquelle
EP1187226A1 (de) * 2000-09-01 2002-03-13 Citizen Electronics Co., Ltd. Oberflächenmontierbares LED und Herstellungsverfahren
US20030189830A1 (en) * 2001-04-12 2003-10-09 Masaru Sugimoto Light source device using led, and method of producing same
US20030189829A1 (en) * 2001-08-09 2003-10-09 Matsushita Electric Industrial Co., Ltd. LED illumination apparatus and card-type LED illumination source
WO2003023857A2 (de) * 2001-09-13 2003-03-20 Lucea Ag Led-leuchtpaneel und trägerplatte
US20030102481A1 (en) * 2001-11-26 2003-06-05 Citizen Electronics Co., Ltd. Light emitting diode device
WO2003069685A2 (en) * 2002-02-14 2003-08-21 Enfis Limited A light system
WO2004051705A2 (en) * 2002-12-02 2004-06-17 3M Innovative Properties Company Illumination system using a plurality of light sources

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 0090, no. 69 (E - 305) 29 March 1985 (1985-03-29) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101573558B1 (ko) 2008-09-03 2015-12-01 오스람 옵토 세미컨덕터스 게엠베하 광전 소자

Also Published As

Publication number Publication date
WO2005101489A2 (de) 2005-10-27
EP1735845A2 (de) 2006-12-27

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