WO2005091996A3 - Method and systems for batch forming spring elements in three dimensions - Google Patents

Method and systems for batch forming spring elements in three dimensions Download PDF

Info

Publication number
WO2005091996A3
WO2005091996A3 PCT/US2005/009065 US2005009065W WO2005091996A3 WO 2005091996 A3 WO2005091996 A3 WO 2005091996A3 US 2005009065 W US2005009065 W US 2005009065W WO 2005091996 A3 WO2005091996 A3 WO 2005091996A3
Authority
WO
WIPO (PCT)
Prior art keywords
dimensions
spring elements
spacer layer
top spacer
systems
Prior art date
Application number
PCT/US2005/009065
Other languages
French (fr)
Other versions
WO2005091996A2 (en
Inventor
Eric M Radza
John D Williams
Original Assignee
Neoconix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/US2004/011074 external-priority patent/WO2004093252A2/en
Application filed by Neoconix Inc filed Critical Neoconix Inc
Publication of WO2005091996A2 publication Critical patent/WO2005091996A2/en
Publication of WO2005091996A3 publication Critical patent/WO2005091996A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2492—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point multiple contact points
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

Abstract

A system for batch forming a sheet of spring elements in three dimensions includes a top spacer layer. A plurality of ball bearings is arranged in a predetermined pattern on the top spacer layer. A spring element sheet containing the spring elements defined in two dimensions is positioned on the top spacer layer and the plurality of ball bearings. A top spacer layer is positioned on the spring element sheet. The top spacer layer and the bottom support layer are adapted to have a force applied thereto to push the plurality of ball bearings against the spring element sheet, such that the spring elements extend above the plane of the spring element sheet, thereby forming the spring elements in three dimensions.
PCT/US2005/009065 2004-03-19 2005-03-18 Method and systems for batch forming spring elements in three dimensions WO2005091996A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US55481604P 2004-03-19 2004-03-19
US60/554,816 2004-03-19
PCT/US2004/011074 WO2004093252A2 (en) 2003-04-11 2004-04-09 Electrical connector and method for making
USPCT/US04/011074 2004-04-09

Publications (2)

Publication Number Publication Date
WO2005091996A2 WO2005091996A2 (en) 2005-10-06
WO2005091996A3 true WO2005091996A3 (en) 2006-08-03

Family

ID=35056724

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/009065 WO2005091996A2 (en) 2004-03-19 2005-03-18 Method and systems for batch forming spring elements in three dimensions

Country Status (1)

Country Link
WO (1) WO2005091996A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080027391A (en) * 2005-07-14 2008-03-26 나노넥서스, 인코포레이티드 Method and apparatus for producing controlled stresses and stress gradients in sputtered films
US9680273B2 (en) 2013-03-15 2017-06-13 Neoconix, Inc Electrical connector with electrical contacts protected by a layer of compressible material and method of making it

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6995577B2 (en) * 1999-03-25 2006-02-07 Micron Technology, Inc. Contact for semiconductor components

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6995577B2 (en) * 1999-03-25 2006-02-07 Micron Technology, Inc. Contact for semiconductor components

Also Published As

Publication number Publication date
WO2005091996A2 (en) 2005-10-06

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