WO2005074463A3 - Dispositifs thermoelectriques a film mince destines a la conversion de puissance et au refroidissement - Google Patents

Dispositifs thermoelectriques a film mince destines a la conversion de puissance et au refroidissement Download PDF

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Publication number
WO2005074463A3
WO2005074463A3 PCT/US2004/041431 US2004041431W WO2005074463A3 WO 2005074463 A3 WO2005074463 A3 WO 2005074463A3 US 2004041431 W US2004041431 W US 2004041431W WO 2005074463 A3 WO2005074463 A3 WO 2005074463A3
Authority
WO
WIPO (PCT)
Prior art keywords
header
cooling
thin film
power conversion
thermoelectric devices
Prior art date
Application number
PCT/US2004/041431
Other languages
English (en)
Other versions
WO2005074463A2 (fr
Inventor
Rama Venkatasubramanian
Brooks O'quinn
Edward Siivola
Kip Coonley
Pratima Addepalli
Randy Alley
John Posthill
Thomas Colpitts
Anil Reddy
Chris Caylor
Peter Thomas
Original Assignee
Nextreme Thermal Solutions
Rama Venkatasubramanian
Brooks O'quinn
Edward Siivola
Kip Coonley
Pratima Addepalli
Randy Alley
John Posthill
Thomas Colpitts
Anil Reddy
Chris Caylor
Peter Thomas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nextreme Thermal Solutions, Rama Venkatasubramanian, Brooks O'quinn, Edward Siivola, Kip Coonley, Pratima Addepalli, Randy Alley, John Posthill, Thomas Colpitts, Anil Reddy, Chris Caylor, Peter Thomas filed Critical Nextreme Thermal Solutions
Priority to JP2006544022A priority Critical patent/JP2007535803A/ja
Priority to EP04821305A priority patent/EP1756881A4/fr
Publication of WO2005074463A2 publication Critical patent/WO2005074463A2/fr
Priority to US11/406,100 priority patent/US7638705B2/en
Priority to US11/641,563 priority patent/US20100257871A1/en
Publication of WO2005074463A3 publication Critical patent/WO2005074463A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H10N19/101—Multiple thermocouples connected in a cascade arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Hybrid Cells (AREA)

Abstract

L'invention concerne un dispositif thermoélectrique comprenant au moins une unité thermoélectrique présentant au moins une paire thermoélectrique de thermoélements de type n et de type p, une première embase couplée à un côté de la paire thermoélectrique et une seconde embase couplée à un second côté de la paire thermoélectrique. Celle-ci comprend une zone de canal de conduction thermique inférieure à celle de la première ou seconde embase, de manière que la zone de conduction thermique soit une fraction de la zone de la première ou seconde embase.
PCT/US2004/041431 2003-12-11 2004-12-13 Dispositifs thermoelectriques a film mince destines a la conversion de puissance et au refroidissement WO2005074463A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006544022A JP2007535803A (ja) 2003-12-11 2004-12-13 電力変換及び冷却用の薄膜熱電装置
EP04821305A EP1756881A4 (fr) 2003-12-11 2004-12-13 Dispositifs thermoelectriques a film mince destines a la conversion de puissance et au refroidissement
US11/406,100 US7638705B2 (en) 2003-12-11 2006-04-18 Thermoelectric generators for solar conversion and related systems and methods
US11/641,563 US20100257871A1 (en) 2003-12-11 2006-12-18 Thin film thermoelectric devices for power conversion and cooling

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52847903P 2003-12-11 2003-12-11
US60/528,479 2003-12-11

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/406,100 Continuation-In-Part US7638705B2 (en) 2003-12-11 2006-04-18 Thermoelectric generators for solar conversion and related systems and methods

Publications (2)

Publication Number Publication Date
WO2005074463A2 WO2005074463A2 (fr) 2005-08-18
WO2005074463A3 true WO2005074463A3 (fr) 2009-04-02

Family

ID=34837339

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/041431 WO2005074463A2 (fr) 2003-12-11 2004-12-13 Dispositifs thermoelectriques a film mince destines a la conversion de puissance et au refroidissement

Country Status (3)

Country Link
EP (1) EP1756881A4 (fr)
JP (1) JP2007535803A (fr)
WO (1) WO2005074463A2 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006507690A (ja) 2002-11-25 2006-03-02 ネクストリーム・サーマル・ソリューションズ トランス熱電装置
US8455751B2 (en) 2003-12-02 2013-06-04 Battelle Memorial Institute Thermoelectric devices and applications for the same
KR101157216B1 (ko) 2003-12-02 2012-07-03 바텔리 메모리얼 인스티튜트 열전 디바이스 및 그 응용 장치
US7851691B2 (en) * 2003-12-02 2010-12-14 Battelle Memorial Institute Thermoelectric devices and applications for the same
US7834263B2 (en) 2003-12-02 2010-11-16 Battelle Memorial Institute Thermoelectric power source utilizing ambient energy harvesting for remote sensing and transmitting
US7638705B2 (en) * 2003-12-11 2009-12-29 Nextreme Thermal Solutions, Inc. Thermoelectric generators for solar conversion and related systems and methods
US7523617B2 (en) 2004-10-22 2009-04-28 Nextreme Thermal Solutions, Inc. Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
US8039727B2 (en) * 2006-04-26 2011-10-18 Cardiac Pacemakers, Inc. Method and apparatus for shunt for in vivo thermoelectric power system
US8538529B2 (en) 2006-04-26 2013-09-17 Cardiac Pacemakers, Inc. Power converter for use with implantable thermoelectric generator
US8003879B2 (en) 2006-04-26 2011-08-23 Cardiac Pacemakers, Inc. Method and apparatus for in vivo thermoelectric power system
CN101669221B (zh) * 2006-11-13 2012-05-23 麻省理工学院 太阳能发电机
CN100427631C (zh) * 2006-11-24 2008-10-22 清华大学 纳米SiC颗粒复合CoSb3基热电材料及其制备方法
US8267984B2 (en) 2007-08-03 2012-09-18 Scion Neurostim, Llc. Neurophysiological activation by vestibular or cranial nerve stimulation
US8696724B2 (en) 2007-01-11 2014-04-15 Scion Neurostim, Llc. Devices for vestibular or cranial nerve stimulation
US8267983B2 (en) 2007-01-11 2012-09-18 Scion Neurostim, Llc. Medical devices incorporating thermoelectric transducer and controller
US8525016B2 (en) 2009-04-02 2013-09-03 Nextreme Thermal Solutions, Inc. Thermoelectric devices including thermoelectric elements having off-set metal pads and related structures, methods, and systems
WO2011075573A1 (fr) 2009-12-18 2011-06-23 Scion Neurostim, Llc Dispositifs et méthodes pour la stimulation des nerfs vestibulaires et/ou crâniens
WO2012083151A1 (fr) 2010-12-16 2012-06-21 Scion Neurostim, Llc Systèmes, procédés et appareil pour appliquer une stimulation nerveuse à un patient sous la surveillance d'un médecin
DE102010004200A1 (de) 2010-01-08 2011-07-14 Emitec Gesellschaft für Emissionstechnologie mbH, 53797 Vorrichtung zur Erzeugung elektrischer Energie aus einem wärmeleitenden Material
US9601677B2 (en) 2010-03-15 2017-03-21 Laird Durham, Inc. Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces
US9744074B2 (en) 2010-12-16 2017-08-29 Scion Neurostim, Llc Combination treatments
US10537467B2 (en) 2010-12-16 2020-01-21 Scion Neurostim, Llc Systems, devices and methods for bilateral caloric vestibular stimulation
US10512564B2 (en) 2010-12-16 2019-12-24 Scion Neurostim, Llc Combination treatments
CN104576913A (zh) * 2014-12-29 2015-04-29 华中科技大学 一种半导体温差发电片
JP7438685B2 (ja) 2019-07-30 2024-02-27 株式会社Kelk 熱電モジュール及び熱電モジュールの製造方法
US20240243545A1 (en) * 2023-01-17 2024-07-18 Lawrence Livermore National Security, Llc Systems and methods for cooling high power devices

Citations (3)

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US20020017102A1 (en) * 1998-05-12 2002-02-14 Bell Lon E. Thermoelectric heat exchanger
US6557354B1 (en) * 2002-04-04 2003-05-06 International Business Machines Corporation Thermoelectric-enhanced heat exchanger
US20030099279A1 (en) * 2001-10-05 2003-05-29 Research Triangle Insitute Phonon-blocking, electron-transmitting low-dimensional structures

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US4640977A (en) * 1984-04-23 1987-02-03 Omnimax Energy Corporation Thermoelectric generator using variable geometry with support pedestals of dissimilar materials than the basic thermoelectric semi-conductor elements
US4687879A (en) * 1985-04-25 1987-08-18 Varo, Inc. Tiered thermoelectric unit and method of fabricating same
US5237821A (en) * 1987-08-20 1993-08-24 Kabushiki Kaisha Komatsu Seisakusho Multistep electronic cooler
JPH08316532A (ja) * 1995-05-19 1996-11-29 Hitachi Chem Co Ltd 冷却ユニット構造
US6388185B1 (en) * 1998-08-07 2002-05-14 California Institute Of Technology Microfabricated thermoelectric power-generation devices
US6474074B2 (en) * 2000-11-30 2002-11-05 International Business Machines Corporation Apparatus for dense chip packaging using heat pipes and thermoelectric coolers

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
US20020017102A1 (en) * 1998-05-12 2002-02-14 Bell Lon E. Thermoelectric heat exchanger
US20030099279A1 (en) * 2001-10-05 2003-05-29 Research Triangle Insitute Phonon-blocking, electron-transmitting low-dimensional structures
US6557354B1 (en) * 2002-04-04 2003-05-06 International Business Machines Corporation Thermoelectric-enhanced heat exchanger

Also Published As

Publication number Publication date
JP2007535803A (ja) 2007-12-06
EP1756881A4 (fr) 2011-03-09
WO2005074463A2 (fr) 2005-08-18
EP1756881A2 (fr) 2007-02-28

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