WO2005044451A9 - Electrical connection of components - Google Patents
Electrical connection of componentsInfo
- Publication number
- WO2005044451A9 WO2005044451A9 PCT/GB2004/004595 GB2004004595W WO2005044451A9 WO 2005044451 A9 WO2005044451 A9 WO 2005044451A9 GB 2004004595 W GB2004004595 W GB 2004004595W WO 2005044451 A9 WO2005044451 A9 WO 2005044451A9
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- contacts
- substrate
- contact
- circuit
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- H05K1/00—Printed circuits
- H05K1/02—Details
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- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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- H05K2203/1157—Using means for chemical reduction
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
- H05K2203/1469—Circuit made after mounting or encapsulation of the components
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
Definitions
- This invention relates to electrical connection of components, e.g. connection of a microchip or other electronic component to electrical circuitry on a substrate in the form of a printed circuit board, and concerns a method of electrically connecting an electrical contact of a component to an electrical contact of an electrical circuit, apparatus for this purpose, and the resulting circuit.
- Wire bonding is the oldest traditional approach.
- the component is accurately placed in position (to within +/- 30microns) on the substrate, with contacts on the upper surface of the component (remote from the substrate) adjacent to respective associated contacts on the upper surface of the substrate.
- the contacts on the component are in the form of leads, 200microns in length extending upwardly from the component.
- the component is secured in position on the substrate by die bonding with an adhesive.
- a wire bonding machine places a length of wire, typically 25microns diameter gold or aluminium wire, to extend between a pair of associated contacts (one on the component and one on the substrate) and bonds the ends of the wire to the contacts, e.g. by ultrasonic or thermal welding.
- the wire bonds at this stage are fragile, exposed loops of metal that protrude upwardly from the substrate surface, and usually the wires are not insulated.
- the wire bonds are therefore typically encapsulated, e.g. in silicone material, to protect them from damage and insulate them, preventing contact between wire bonds and possible short circuiting. Because the wire bonds protrude from the surface, this method is not ideal for flat products such as smart cards or RFIDs (radio frequency identification devices).
- This process can be fully automated, it is expensive and can cost in the region of 10 cents (US) per chip for a processor with many connections.
- the output rate is slower than desired, with a typical automated machine outputting around 10,000 components per hour. Also, the output rate is linked to the complexity of the component or number of bonds to be made; therefore more complex components are produced more slowly.
- the substrate is provided with a hole slightly larger than the footprint of the component, with contacts appropriately located on the upper surface of the substrate adjacent the hole.
- the component has contacts in the form of outwardly extending, horizontally oriented wires or legs.
- the component is placed part way into the hole, with the protruding legs in contact with the associated contacts on the substrate.
- the pairs of associated contacts are then welded or crimped together to complete the circuit as required.
- This approach requires the substrate to be custom designed and made, with appropriate holes and contacts, and so is expensive and hence mainly only used for higher cost applications.
- the component is placed on the substrate in inverted condition, i.e. with the contacts on the lower surface of the component, adjacent the substrate. Contacts on the component or on the substrate are raised or 'bumped' to provide a protruding electrical connection between the component and substrate circuit.
- Several different procedures are known for forming the bumps, including palladium (Pd) bumping, nickel gold (NiAu) bumping, polymer bumping, solder bumping, possibly with under bump metallisation (UBM).
- components are accurately pre-mounted on a supporting sheet or tape, known as an interposer, that has appropriately located contacts for electrical connection to the components.
- the interposer with mounted components is then placed on the substrate and electrically connected thereto via contact pads on the interposer and substrate.
- the contact pads are relatively large, typically several square millimetres in area, so placement of the interposer on the substrate need not be carried out with great accuracy.
- the contacts are usually pressed or crimped together to complete the electrical connection between the interposer, and hence components, and the substrate.
- the present invention provides a method of electrically connecting a contact of a component to an associated contact in or for an electrical circuit, comprising depositing material between the contacts, the material forming or being processed to form an electrical connection between the contacts.
- connection from the contact of the component may be to an associated contact of an electrical circuit, an associated contact of another component or another contact of the original component.
- the electrical connection may itself constitute in part another component or part thereof.
- a component typically requires more than one connection to a circuit, so the method is repeated as required until all required connections between contacts have been formed.
- the component may be selected from a wide range of possibilities, including a microchip (analogue or digital), including a passivated chip having a layer of non-conductive material over exposed circuitry to prevent unwanted electrical contact, microprocessor, memory chip, timing chip, capacitor, transistor, resistor, inductor, diode, switch, relay, solenoid, microphone, speaker, amplifier, piezoelectric device or crystal, ariel or antenna, battery, fuel cell, photovoltaic cell, solar cell, light emitting diode (LED), light emitting polymer (LEP), liquid crystal display (LCD), charge coupled device (CCD), semiconductor imaging device, or a holder, connector, terminal or socket for any of the above.
- the electrical circuit is typically formed on a substrate.
- the material is typically deposited on the substrate to adhere thereto, in a way that is not possible with soldering.
- the substrate may be of a wide range of materials, including plastics materials, paper, ceramics etc..
- the substrate is typically in the form of rigid or flexible sheet material, e.g. of plastics materials etc.
- the substrate typically has conductive tracks, including contacts, formed thereon, e.g. by photolithography.
- the substrate is commonly in the form of a printed circuit board.
- the electrical connection is typically in the form of a track, particularly an elongate track (with length greater than width).
- Track width and length may be selected (and varied) as appropriate to suit requirements in a way that is not possible with existing techniques.
- Multiple connections need not be identical and can have individually determined dimensions.
- the track width and/or length may be deliberately oversized to produce tracks of increased conductivity and/or to allow for reduced accuracy of deposition.
- the electrical connection is generally selectively provided between the contacts.
- the electrical connection can be selectively formed to have a desired confined extent (typically a track of desired length and width).
- a layer of electrically conductive material of greater extent than necessary can be formed, and the material then selectively removed or treated, e.g. by using a mask, to leave an electrical connection in the desired region only.
- the method typically includes placing the component in position with respect to the circuit for connection thereto.
- the component may be placed in position with respect to the circuit by a range of techniques, including human placement and mechanical placement Mechanical placement is preferred for reasons of speed and accuracy, and is preferably computer-controlled, with suitable placement devices being known to those skilled in the art, including robot means such as a pick and place robot. Pick and place robots are well suited to this use being very fast, typically being able to handle up to 60,000 units per hour, and being versatile through use of appropriate software.
- a plurality of components may be placed simultaneous or consecutively, by one or more devices.
- the method preferably includes the step of using a detection device to detect (in automated manner, not involving human input) the position of the contact of the component with respect to the associated contact of the circuit, and depositing material between the detected positions of the contacts.
- the position of the contact of the component may be detected directly, by determining the position of the contact, or indirectly by determining the position of the component and deducing from this the position of the contact based on knowledge of the position of the contact on the component.
- the position of the contact of the component with respect to the associated contact of the circuit may be determined (directly or indirectly) by a variety of ways, as is known to those skilled in the art. It is preferred to use a digital imaging device such as a CCD. Alternative possibilities include use of a photodiode sensor (with position determination based, e.g. , on the colour of the contact) or a proximity sensor (with determination based on sensing metal of the contact).
- the position determining means may include a data processing device, such as an image processing device to process data measured by an imaging device and determine the position of one or more contacts.
- Material is preferably deposited by a printing process.
- the printing process is preferably a non-contact process and is preferably a digital process, as this permits ready regulation and control of the precise location of deposited material by use of appropriate software, without requiring physical movement of printing means for positioning purposes.
- use of digital printing enables the method to be used for forming connections to multiple components which need not be accurately positioned with respect to the associated circuit as appropriate compensation may be readily made.
- Inkjet printing is particularly well suited to this purpose.
- a typical industrial inkjet printhead has nozzles spaced by about 140microns, so by selecting the appropriate nozzle or nozzles, thus material can be deposited with great accuracy without requiring mechanical repositioning of the printhead with respect to the component and circuit.
- nozzle pitch can be reduced, e.g. to 35 microns with 4 interleaved print heads.
- Other possible digital printing techniques include laser printing, using powder toner.
- Other possible analogue printing techniques include pad printing, screen printing, lithographic printing, gravure printing, etc.
- any necessary adjustment to compensate for mispositioning of components can be made by adjusting the location and/or shape of deposited material, rather then adjusting the location of the component and/or electrical circuit.
- multiple components may be processed and multiple connections made in a single pass through a digital printer.
- the material to be deposited is typically in the form of a liquid, possibly with suspended or dispersed solids, for ease of application.
- the invention provides a solderless (and free of lead) approach to formation of an electrical connection. Soldering requires more accurate positioning of a component, as only a point or spot connection is formed. Moreover, soldering is not a suitable method for bridging gaps between contacts.
- the material to be deposited may be selected from a wide range of materials that constitute, form or can be processed to form, an electrically conductive connection between the contacts.
- the deposited material may comprise metal nano- particles (deposited in a suitable liquid vehicle).
- suitable treatment such as thermal treatment, chemical treatment, exposure to ultra violet etc, the particles fuse together or anneal and form a connection with good conductive properties.
- a conductive polymer such as PEDOT (poly-3,4-ethylenedioxythiophene) may be used or produced by reaction in situ of one or more reagents.
- Conductive pigment inks or pastes e.g. containing graphite or silver, may alternatively be deposited and form a conductive connection.
- the deposited material may alternatively comprise a metal precursor.
- the conductive connection may be formed by an in situ metallisation reaction, as disclosed in our PCT/GB2004/000358 (WO 2004/068389).
- This specification discloses a method of forming a conductive metal region on a substrate, comprising depositing, (e.g. by inkjet printing, spraying, immersion etc., with inkjet printing being preferred) on the substrate a solution of a metal ion, and depositing, (e.g.
- the method of the invention conveniently involves an initial step of depositing of an activator such as a catalyst or catalyst precursor on the substrate, to activate a conductive material-forming reaction.
- the deposition is preferably by a digital printing process such as inkjet printing.
- the conductive material-forming reaction may be reaction between a metal ion and reducing agent, e.g. as disclosed in WO 2004/068389, as discussed above.
- electroless plating techniques as are well known to those skilled in the art, may be employed.
- passivated chips having a layer of non-conductive material placed over exposed circuitry to prevent electrical contact
- these are suited to immersion, e.g. in an electroless metallisation bath.
- the catalyst is preferably used in sparing amounts.
- the activator should provide a continuous connection between the contacts to be joined but need not, and indeed preferably does not, entirely cover the contacts (at least when the contacts are formed of a metal that will support (catalyse) the conductive material-forming reaction); this is unnecessary and so is a waste of material and moreover is likely to reduce the electrical conductivity of the final connection.
- the activator may be deposited, e.g. in the form of a thin strip extending between the contacts. The subsequent conductive material-forming reaction, being activated by the metal contact and deposited activator, results in the conductive material growing to cover and connect both the metal contact and deposited activator regions.
- the activator may be deposited over an area of greater extent than the desired electrical connection, and then selectively removed or treated to render it inactive prior to the conductive material-forming reaction. In the latter case the untreated activator must be non-conducting.
- Electroless or electrolytic plating techniques may optionally be used in combination with the above techniques to form a metal layer on top of the conductive material and so improve conductivity.
- Suitable adhesives are well known to those skilled in the art, including UN curable adhesives and epoxy based adhesive, as are suitable application techniques, including inkjet printing.
- the adhesive is optionally thermally conductive.
- the adhesive is preferably non-conducting (i.e. an electrical insulator).
- the ink should also be selected having regard to intended subsequent processing, e.g. being resistant to catalyst ink and metallisation in order to prevent debonding of the component from the substrate on subsequent processing.
- a wetting control agent is advantageously applied to surfaces of the component, substrate and/or adhesive (if present) prior to deposition of material between the contacts.
- the wetting control agent functions to control wetting by modifying surface energy and also functions to keep a subsequently applied liquid film stably spread, e.g. prior to curing, preventing de-wetting or reticulation.
- Suitable wetting control agents include polymers such as polyvinylpyrrolidone (PVP), polyacrylic acid, polyvinyl acetate, polyethylene imine, polyethylene oxide, polyethylene glycol, gelatin and polymers thereof.
- the wetting control agent may be applied in any convenient manner, e.g. by inkjet printing.
- the wetting control agent is suitably applied in the form of a thin film, typically less than 1 micron thick, e.g. about lOOnm thick.
- the wetting control agent functions to create more uniform surface energy on different surfaces, e.g. substrate, adhesive, component surface, leading to deposited material forming tracks of more uniform width and thickness than would otherwise be the case.
- Track width of deposited material is also affected by the surface on which it is deposited, any surface coatings thereon, e.g. adhesive, the volume of material deposited and the composition of the deposited material.
- any surface coatings thereon e.g. adhesive, the volume of material deposited and the composition of the deposited material.
- One skilled in the art can readily find suitable combinations of variables to give a track of deposited material of desired width.
- component e.g. chip
- the component e.g. chip
- component e.g. chip
- a contact that extends right up to the top edge (or as close as possible thereto), that extends across the top edge and down on to the side of the component, or that is formed on the side of the component.
- liquids e.g. inks
- the liquids typically used generally wet well across the surface of a contact but wet less well on the surface of a component, particularly in the case of passivated chips.
- the ramp may have a positive (convex) or negative (concave) meniscus.
- One preferred ramp is one that removes the 90° angle from the corner of the component, i.e. with the transition from the component to adhesive being flat and then curving gently down to the substrate.
- the adhesive ramp additionally to cover areas of the component between the top edge and contact. This will increase the distance between the conductive track and the component and so reduce any capacitive coupling which may occur.
- the adhesive can be applied before or after component placement.
- adhesive can be placed on the substrate in appropriate position (so as not completely to cover contacts, e.g. by careful placement of adhesive or by use of non- wetting adhesive that does not cover metal contacts), and the component then placed in position, on the adhesive.
- the adhesive will be displaced, and will tend to form ramps leading from the substrate surface up the sides of the component, with a positive meniscus.
- the component can be placed in position directly on the substrate and adhesive then applied to form ramps leading from the substrate surface up the sides of the component, in this case more likely with a negative meniscus. In both cases, material is then deposited between the contacts to be connected, passing up and over the adhesive ramp.
- the material that forms the ramp up the side of the component contacts (wets) the side surface of the component and does not result in a gap being left between the ramp and the component.
- the component may be pre-treated with wetting control agent, (e.g. PVP) as discussed above, to control wetting by modifying surface energy and to keep the liquid film stably spread e.g. prior to curing (preventing de-wetting or reticulation).
- wetting control agent e.g. PVP
- the adhesive forms a good sealing bond to the side surface of the component to prevent conductive material from seeping down between the component and the adhesive ramp.
- the method may include the step of depositing one or more layers of material on the substrate where the electronic component is to be placed, prior to placement of the component on the substrate.
- a conductive metal layer may be deposited where the electronic component is to be placed. This may function as a heat sink. This is particularly convenient when an electronic component which requires a heat-sink, for example, a microchip, is placed with the one or more contacts located away from the substrate.
- microchips which require heat sinks have contact pins extending in one direction, and a face, in the opposite direction, which is to be thermally connected to a heat sink.
- the microchip or other electronic component can be conveniently thermally connected to a heat sink on a surface facing the substrate, and electrically connected to a circuitry on one or more other faces, such as via contact pads on the side facing away from the substrate.
- a thermally conductive material may be deposited on top of a conductive metal layer to improve thermal conductivity between the electronic component and the heat sink.
- the method may also involve printing a protective over-coating, (e.g. potting or encapsulation layer) over the entire assembly of substrate and one or more components.
- a protective over-coating e.g. potting or encapsulation layer
- the method may be carried out as a batch process, but is preferably operated on a continuous basis, e.g. on a production line/conveyor.
- the steps of placement, position detection and deposition can be performed simultaneously at different locations on different components at different stages of processing, so enhancing throughput.
- the invention finds particular application in the production of RFID tags.
- the method of the invention may be used to connect an RFID chip to a RFID antenna.
- the method may alternatively be used to print an RFID antenna directly to contacts on an RFID chip, with the deposition of material to form the antenna and connections to the chip occurring in a single step, without forming the connection between the chip and the antenna in a separate step.
- the connection in part constitutes the antenna.
- the method of the invention differs from prior art techniques by detecting the position of a component contact with respect to the associated contact of the circuit after placement of the component in position (at least approximately accurately) with respect to the circuit for connection thereto.
- An electrical connection is then formed between the detected positions of the contacts by depositing material therebetween, generally linking the contacts, with the material forming or being processed to form the connection.
- the component does not need to be positioned with respect to the circuit with total accuracy, as mispositioning can be accommodated by depositing the connection-forming material in the correct location, as subsequently detected.
- the requirement for component placement accuracy in the method of the invention can be significantly reduced when compared to known techniques.
- detecting the actual position of the contacts to be connected and forming the connection therebetween can be achieved more accurately than current component placement techniques: using digital imaging techniques positions can be detected to an accuracy of +/- 1 micron or better, whereas the best current component placement accuracy is typically of the order of +/- 30 microns.
- benefits of the invention include the ability to use a component in standard form without the need for special processing, such as 'bumping' , mounting on an interposer etc; a reduced number of steps or processes in the production of a finished item, e.g. no need to encapsulate fragile wire bonds, no need to form 'bumps'; simplicity compared with the difficulty and high cost of wire bonding; no need to use speciality adhesives.
- deposition is by a digital process, this allows development prototypes, one-offs and customised products to be produced cost effectively, as modifications can be produced by use of appropriate software control.
- deposition is by a non-contact process, e.g. inkjet printing, this allows connections to be made over surfaces that are not necessarily flat, e.g. over three dimensional objects.
- the invention also includes within its scope apparatus for electrically connecting a contact of a component to an associated contact of an electrical circuit, comprising placement means for placing a component in position with respect to the circuit for connection thereto; and deposition means for depositing material between the contacts, the material being capable of forming or being processed to form an electrical connection between the contacts.
- the apparatus preferably also includes a detection device for detecting the position of a contact of the component with respect to the associated contact of the circuit.
- the deposition means is for depositing material between the detected positions of the contacts.
- the placement means conveniently comprises a computer-controlled mechanical device such as a pick and place robot.
- a single placement means may place a plurality of components simultaneously or consecutively.
- the detection device preferably comprises a digital imaging device such as a CCD camera.
- the detection means may include a data processing device, such as an image processing device, to process data measured by an imaging device and determine the position of one or more contacts.
- the deposition means preferably comprise digital printing means such as one or more inkjet printers.
- digital printing means such as one or more inkjet printers.
- the various components of the apparatus are all conveniently controlled for synchronised operation by computer-control means.
- the invention also covers the resulting connected component and circuit, i.e. an electrical circuit including a component connected by the method of the invention or using the apparatus of the invention.
- Typical applications of the invention include in the production of RFIDs (connecting an RFID chip to an antenna on a substrate and possibly also forming the antenna), smart cards, credit cards, electronic security devices and many others, as will be apparent to those skilled in the art.
- the invention includes within its scope an electronic product including a circuit with a component connected by the method or apparatus of the invention.
- Figure 1 is a schematic sectional view of a component connected to contacts on a substrate using a method and apparatus in accordance with the invention
- Figure 2 is a schematic plan view of the component and substrate shown in Figure 1
- Figure 3 is a schematic representation of one embodiment of apparatus in accordance with the invention.
- Figure 1 and 2 show a portion of a substrate 10 of plastics sheet material carrying metal tracks 12 and 14 forming part of electrical circuitry.
- the tracks 12 and 14 terminate in contacts for an electrical component 16, having metal contacts 18 and 20 on the upper surface thereof.
- a metal heat sink 22 having a footprint corresponding to that of chip 16 is formed on the substrate, conveniently using the in situ metallisation method of PCT/GB2004/000358 (WO 2004/068389).
- Component 16 is placed on substrate 10, on top of heat sink 22 in at least the approximately precise location, using a pick and place robot 24 (shown schematically in Figure 3) under control of computer means 26 (shown schematically in Figure 3).
- the substrate and chip are then imaged using a CCD camera 28 (shown schematically in Figure 3) to detect (directly or indirectly) the actual position of the contacts at the end of tracks 12 and 14 and the contacts 18 and 20 of the components.
- CCD camera 28 conveys information on position to computer means 26.
- An adhesive is then deposited using inkjet printer 30 (shown schematically in Figure 3) in the gap between track end 12 and contact 18 and the gap between track end 14 and contact 20, forming respective ramped regions of adhesive 32 and 34 approximately linking the two pairs of contacts to be connected.
- the adhesive is accurately delivered to between the detected positions of the contacts, as determined by CCD camera 28, under control of computer means 26.
- inkjet printer 36 shown schematically in Figure 3
- material is deposited to extend between track end 12 and contact 18, over adhesive ramp 32 and between track end 14 and contact 20 over adhesive ramp 34, the material being accurately placed on the basis of the detected positions of the contacts as determined by CCD camera 28.
- the deposited material forms or is processed to form respective electrical connections 40 and 42, e.g. using the in situ metallisation method of WO 2004/068389.
- the two connections may be formed sequentially or simultaneously.
- the component 16 is thus connected into the electrical circuitry carried by the substrate 10.
- a flexible Melinex (Melinex is a Trade Mark) polyester sheet, printed with a circuit has 4 connections to be connected to an EM4100 read only contact-less identification chip, supplied by EM Microelectronic.
- the chip is 1016 x 1041 microns in plan and 440 microns thick, with 4 contacts arrayed on the underside of the chip. Two of the contacts are 76 x 76 microns and the other two are 95 x 95 microns.
- a Fuji CP7 (Fuji is a Trade Mark) series high speed chip 'pick and place' robot is used to place the chip onto the substrate, with the contacts visible on the top surface of the chip.
- This robot is capable of placing 52,941 components per hour at an accuracy of +/- 66 microns.
- a National Instruments 'NI Vision System 1400' (National Instruments is a Trade Mark) machine vision system is then used to detect accurately the position of the chip, relative to the contacts of the printed circuit.
- This system uses a RS-170 camera connected to a NI PCI- 1409 image capture board in conjunction with the LabView (LabView is a Trade Mark) software accurately to image the position of the chip on the substrate and accordingly modify the conductive connection image to be printed.
- LabView is a Trade Mark
- the modified image is sent to the print head controller, a Xennia XPC-XJ500 (Xennia is a Trade Mark); this system drives a XaarJet 500/360 (XaarJet is a Trade Mark) print head, which has 500 nozzles arranged at 180dpi spacing and prints 40pL droplets.
- the print head is scanned across the substrate in 70mm wide swathes and prints a fluid that forms 75 microns wide and 5mm long connections between the contacts on the PCB and the contacts on the chip.
- the fluid printed maybe an activator ink containing palladium ions, such as the formulation specified in Table 1 below.
- the amounts of the ingredients are expressed as %w/w. Table 1. UV curable activator ink formulation.
- Irgacure 1700, Irgacure 819 and Actilane 505 are Trade Marks.
- PVP K30 is K30 grade polyvinylpyrrolidone from International Speciality Products, which has a molecular weight between 60,000 and 70,000.
- Actilane 505 is a reactive tetrafunctional polyester acrylate oligomer supplied by AKZO Nobel UV Resins, Manchester, UK.
- DPHA dipentaerythritol hexaacrylate
- Irgacure 819 and Irgacure 1700 are UV photo-initiators supplied by Ciba Specialty Chemicals, Macclesfield, UK.
- DPGDA is dipropylene glycol diacrylate supplied by UCB, Dragenbos, Belgium.
- the activator ink is cured to a solid film using a Fusion (Fusion is a Trade Mark) UV 500W lamp fitted with an H-bulb.
- the activator film is then treated with a reductant (dimethylamineborane) to reduce the palladium ions to palladium metal and generate a catalyst for the metal deposition reaction.
- a reductant dimethylamineborane
- the catalyst is then treated with a copper layer forming solution (consisting of Enplate 872A (30% w/w), Enplate 872B (30% w/w), Enplate 872C (10% w/w), t-butanol (5% w/w), ethylene glycol (20% w/w) and polyethylene glycol 1500 (5% w/w).
- Enplate 872A, 872B and 872C are copper plating solutions supplied by Enthone Ltd of Woking, UK. Enplate is a Trade Mark).
- This treatment maybe applied by a second inkjet printing stage, similar to the application of the activator, or by immersion, in a bath process.
- the solution is applied for about 2 minutes to form a layer of copper about 1 micron thick, which forms conducting connections between the contacts of the printed circuit and the contacts of the chip.
- Example 2 (addition of adhesive ramp)
- Example 1 The procedure of Example 1 is repeated, with the following addition. After placement of the chip and before imaging, a Fuji GL-541E high speed glue dispenser is used to dispense drops of epoxy adhesive at a rate of 11 drops per second on either side of the chip, next to the contacts, to generate a small ramp of adhesive for the conductive connection to be printed up and over.
- a Fuji GL-541E high speed glue dispenser is used to dispense drops of epoxy adhesive at a rate of 11 drops per second on either side of the chip, next to the contacts, to generate a small ramp of adhesive for the conductive connection to be printed up and over.
- a flexible Melinex (Melinex is a Trade Mark) polyester sheet, printed with a circuit has 4 connections to be connected to an EM4100 read only contact-less identification chip, supplied by EM Microelectronic.
- the chip is 1016 x 1041 microns in plan and 440 microns thick, with 4 contacts arrayed on the underside of the chip. Two of the contacts are 76 x 76 microns and the other two are 95 x 95 microns.
- a Fuji GL-541E (Fuji is a Trade Mark) high speed glue dispenser is used to dispense drops of epoxy adhesive at a rate of 11 drops per second in the position where the chip is to be located, next to the contacts. Excess adhesive is applied so that on placement of the chip a meniscus ramp of adhesive is generated at the sides of the chip for the conductive connection to be printed up and over.
- a Fuji CP7 series high speed chip 'pick and place' robot is used to place the chip onto the substrate, with the contacts visible on the top surface of the chip.
- This robot is capable of placing 52,941 components per hour at an accuracy of +/- 66 microns.
- a National Instruments 'NI Vision System 1400' machine vision system is then used to detect accurately the position of the chip, relative to the contacts of the printed circuit.
- This system uses a RS-170 camera connected to a NI PCI-1409 image capture board in conjunction with the LabView software accurately to image the position of the chip on the substrate and accordingly modify the conductive connection image to be printed.
- the modified image is sent to the print head controller, a Xennia XPC-XJ500; this system drives a XaarJet 500/360 print head, which has 500 nozzles arranged at 180dpi spacing and prints 40pL droplets.
- the print head is scanned across the substrate in 70mm wide swathes and prints a fluid that forms 75 microns wide and 5mm long connections between the contacts on the PCB and the contacts on the chip.
- the fluid printed is an activator ink containing palladium ions, having the formulation specified in Table 2 below. In Table 2, the amounts of the ingredients are expressed as %w/w. Table 2. UV curable activator ink formulation.
- Irgacure 1700, Irgacure 819 and Actilane 505 are Trade Marks.
- PVP K30 is K30 grade polyvinylpyrrolidone from International Speciality Products, which has a molecular weight between 60,000 and 70,000.
- Actilane 505 is a reactive tetrafunctional polyester acrylate oligomer supplied by AKZO Nobel UV Resins, Manchester, UK.
- DPHA dipentaerythritol hexaacrylate
- Irgacure 819 and Irgacure 1700 are UV photo-initiators supplied by Ciba Specialty Chemicals, Macclesfield, UK.
- DPGDA is dipropylene glycol diacrylate supplied by UCB, Dragenbos, Belgium.
- the activator ink is cured to a solid film using a Fusion UV 500W lamp fitted with an H-bulb.
- the activator film is then treated with a reductant by immersion in a bath comprising 1.6% dimethylamineborane (DMAB), to reduce the palladium ions to palladium metal and generate a catalyst for the metal deposition reaction.
- DMAB dimethylamineborane
- the catalyst is then treated with a copper layer forming solution (consisting of Enplate 872A (10.71 % w/w), Enplate 872B (10.71 % w/w), Enplate 872C (3.57% w/w), water (75% w/w).
- Enplate 872A, 872B and 872C are copper plating solutions supplied by Enthone Ltd of Woking, UK. Enplate is a Trade Mark).
- This treatment is applied by immersion, in a bath process.
- the solution is applied for about 2 minutes to form a layer of copper about 0.5 micron thick, which forms conducting connections between the contacts of the printed circuit and the contacts of the chip.
- the resistivity of the connections was around 3-4 Ohms/mm.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006537433A JP2007510301A (en) | 2003-10-29 | 2004-10-29 | Electrical connection of parts |
EP04818166A EP1678761A1 (en) | 2003-10-29 | 2004-10-29 | Electrical connection of components |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0325247A GB0325247D0 (en) | 2003-10-29 | 2003-10-29 | Method of forming a conductive metal region on a substrate |
GB0325247.5 | 2003-10-29 | ||
PCT/GB2004/000358 WO2004068389A2 (en) | 2003-01-28 | 2004-01-28 | Method of forming a conductive metal region on a substrate |
GBPCT/GB2004/000358 | 2004-01-28 | ||
GB0407303A GB0407303D0 (en) | 2003-10-29 | 2004-03-31 | Electrical connection of components |
GB0407303.7 | 2004-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005044451A1 WO2005044451A1 (en) | 2005-05-19 |
WO2005044451A9 true WO2005044451A9 (en) | 2005-06-30 |
Family
ID=34577375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB2004/004595 WO2005044451A1 (en) | 2003-10-29 | 2004-10-29 | Electrical connection of components |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1678761A1 (en) |
KR (1) | KR20060126481A (en) |
WO (1) | WO2005044451A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8383014B2 (en) | 2010-06-15 | 2013-02-26 | Cabot Corporation | Metal nanoparticle compositions |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200642785A (en) | 2005-01-14 | 2006-12-16 | Cabot Corp | Metal nanoparticle compositions |
US7824466B2 (en) | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
WO2006076609A2 (en) | 2005-01-14 | 2006-07-20 | Cabot Corporation | Printable electronic features on non-uniform substrate and processes for making same |
WO2006076604A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Processes for planarizing substrates and encapsulating printable electronic features |
WO2006076606A2 (en) | 2005-01-14 | 2006-07-20 | Cabot Corporation | Optimized multi-layer printing of electronics and displays |
EP1818860B1 (en) | 2006-02-08 | 2011-03-30 | Semiconductor Energy Laboratory Co., Ltd. | RFID device |
JP2007241999A (en) * | 2006-02-08 | 2007-09-20 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
GB0705287D0 (en) | 2007-03-20 | 2007-04-25 | Conductive Inkjet Tech Ltd | Electrical connection of components |
US8097497B2 (en) | 2007-03-30 | 2012-01-17 | Xerox Corporation | Inkjet printed wirebonds, encapsulant and shielding |
TWM466649U (en) * | 2012-08-28 | 2013-12-01 | Chen Yu Han | A sensing pad of physiological electrical signal and a sensing mattress of using the same |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3082327A (en) * | 1960-12-08 | 1963-03-19 | Ibm | Interconnected printed circuit boards |
US5917707A (en) * | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US5556810A (en) * | 1990-06-01 | 1996-09-17 | Kabushiki Kaisha Toshiba | Method for manufacturing a semiconductor device wherein a semiconductor chip is connected to a lead frame by metal plating |
DE4235019C1 (en) * | 1992-10-16 | 1994-04-21 | Ame Gmbh | Printed circuit board manufacture as well as assembly and contacting processes for components by electroless metal deposition |
JPH0864938A (en) * | 1994-08-25 | 1996-03-08 | Sharp Corp | Connection method of chip electronic component |
WO1999018255A1 (en) * | 1997-10-03 | 1999-04-15 | Massachusetts Institute Of Technology | Selective substrate metallization |
US6468891B2 (en) * | 2000-02-24 | 2002-10-22 | Micron Technology, Inc. | Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
-
2004
- 2004-10-29 KR KR1020067010084A patent/KR20060126481A/en not_active Application Discontinuation
- 2004-10-29 WO PCT/GB2004/004595 patent/WO2005044451A1/en active Application Filing
- 2004-10-29 EP EP04818166A patent/EP1678761A1/en not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8668848B2 (en) | 2005-01-14 | 2014-03-11 | Cabot Corporation | Metal nanoparticle compositions for reflective features |
US8383014B2 (en) | 2010-06-15 | 2013-02-26 | Cabot Corporation | Metal nanoparticle compositions |
Also Published As
Publication number | Publication date |
---|---|
KR20060126481A (en) | 2006-12-07 |
WO2005044451A1 (en) | 2005-05-19 |
EP1678761A1 (en) | 2006-07-12 |
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