WO2005043965A3 - Verfahren zur herstellung eines transponders - Google Patents

Verfahren zur herstellung eines transponders Download PDF

Info

Publication number
WO2005043965A3
WO2005043965A3 PCT/EP2004/012315 EP2004012315W WO2005043965A3 WO 2005043965 A3 WO2005043965 A3 WO 2005043965A3 EP 2004012315 W EP2004012315 W EP 2004012315W WO 2005043965 A3 WO2005043965 A3 WO 2005043965A3
Authority
WO
WIPO (PCT)
Prior art keywords
transponder
antenna
substrate
production
zone
Prior art date
Application number
PCT/EP2004/012315
Other languages
English (en)
French (fr)
Other versions
WO2005043965A2 (de
Inventor
Rolf Treude
Original Assignee
Steiner Gmbh & Co Kg
Rolf Treude
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steiner Gmbh & Co Kg, Rolf Treude filed Critical Steiner Gmbh & Co Kg
Publication of WO2005043965A2 publication Critical patent/WO2005043965A2/de
Publication of WO2005043965A3 publication Critical patent/WO2005043965A3/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Radar Systems Or Details Thereof (AREA)

Abstract

Bei einem Verfahren zur Herstellung eines Transponders mit zumindest einer Antenne und zumindest einer auslesbaren Datenspeicherstruktur wird die vorgesehene Umrissgestalt der Antenne in einer Vakuumanlage mittels einer Walze auf ein Substrat durch Benetzung des umliegenden Bereichs aufgezeichnet und nachfolgend das Substrat einem Materialstrom ausgesetzt, wobei sich dieses Material auf dem unbenetzten Bereich niederschlägt.
PCT/EP2004/012315 2003-10-29 2004-10-29 Verfahren zur herstellung eines transponders WO2005043965A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10350648.9 2003-10-29
DE2003150648 DE10350648A1 (de) 2003-10-29 2003-10-29 Transponder

Publications (2)

Publication Number Publication Date
WO2005043965A2 WO2005043965A2 (de) 2005-05-12
WO2005043965A3 true WO2005043965A3 (de) 2005-06-30

Family

ID=34529909

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/012315 WO2005043965A2 (de) 2003-10-29 2004-10-29 Verfahren zur herstellung eines transponders

Country Status (2)

Country Link
DE (1) DE10350648A1 (de)
WO (1) WO2005043965A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005018984A1 (de) * 2005-04-22 2006-11-02 Steiner Gmbh & Co. Kg Verfahren und Vorrichtung zum Herstellen von elektronischen Bauteilen

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4643912A (en) * 1982-10-29 1987-02-17 Marui Industry Co., Ltd. Method for forming a metal layer with pattern on a substrate
US4832983A (en) * 1987-03-05 1989-05-23 Shizuki Electric Co., Inc. Process for producing metallized plastic film
EP0395411A2 (de) * 1989-04-26 1990-10-31 Flex Products, Inc. Verfahren zur Herstellung einer strukturierten Dünnschicht
WO2002031214A1 (de) * 2000-10-09 2002-04-18 Hueck Folien Metallisierte folie und verfahren zu deren herstellung sowie deren anwendung
EP1291463A1 (de) * 2001-09-05 2003-03-12 Hueck Folien Gesellschaft m.b.H. Verfahren zur Herstellung einer selektiv metallisierten Folie, und dessen Produkte

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3601040A1 (de) * 1985-04-26 1986-10-30 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Verfahren zum aufbringen von polarisationsselektiven strukturen auf einen reflektor einer richtantenne
GB8728399D0 (en) * 1987-12-04 1988-01-13 Secretary Trade Ind Brit Deposition of materials to substrates

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4643912A (en) * 1982-10-29 1987-02-17 Marui Industry Co., Ltd. Method for forming a metal layer with pattern on a substrate
US4832983A (en) * 1987-03-05 1989-05-23 Shizuki Electric Co., Inc. Process for producing metallized plastic film
EP0395411A2 (de) * 1989-04-26 1990-10-31 Flex Products, Inc. Verfahren zur Herstellung einer strukturierten Dünnschicht
WO2002031214A1 (de) * 2000-10-09 2002-04-18 Hueck Folien Metallisierte folie und verfahren zu deren herstellung sowie deren anwendung
EP1291463A1 (de) * 2001-09-05 2003-03-12 Hueck Folien Gesellschaft m.b.H. Verfahren zur Herstellung einer selektiv metallisierten Folie, und dessen Produkte

Also Published As

Publication number Publication date
DE10350648A1 (de) 2005-06-16
WO2005043965A2 (de) 2005-05-12

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