WO2005015967A1 - Method for fixing conductor tracks onto a base plate and assembly consisting of conductor tracks and base plate - Google Patents

Method for fixing conductor tracks onto a base plate and assembly consisting of conductor tracks and base plate Download PDF

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Publication number
WO2005015967A1
WO2005015967A1 PCT/DE2004/000968 DE2004000968W WO2005015967A1 WO 2005015967 A1 WO2005015967 A1 WO 2005015967A1 DE 2004000968 W DE2004000968 W DE 2004000968W WO 2005015967 A1 WO2005015967 A1 WO 2005015967A1
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WO
WIPO (PCT)
Prior art keywords
conductor tracks
base plate
perforated film
lead frame
film
Prior art date
Application number
PCT/DE2004/000968
Other languages
German (de)
French (fr)
Inventor
Reinhold Jocham
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2005015967A1 publication Critical patent/WO2005015967A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Definitions

  • the invention relates to a method for fixing electrical conductor tracks on a base plate, in particular in connection with the production of housings for electronic control devices, and to an arrangement of electrical conductor tracks, in particular for electronic circuits, on a base plate.
  • a disadvantage is that large tolerances are transferred from injection molding to the lead frame and that a separate operation is required to separate the connecting webs. In addition, since the operation takes place on the assembly line, undesirable tinsel can appear in the housing.
  • a method for fixing electrical conductor tracks on a base plate in particular in connection with the production of housings for electronic control devices, is provided with the features of claim 1.
  • the direct fastening of the lead frame on the base plate has the advantage that the large tolerances are not transferred from the injection molding to the lead frame and that the separation of the connecting webs is not necessary as a separate operation Occurrence of tinsel in the housing, since the stressed operation can be integrated into the punching process by the lead frame.
  • bends in the lead frame are advantageously omitted because the wiring and circuit lie on one plane. It is also advantageous that, due to the precisely determinable position of the lead frame, electrical components can be fitted without an image recognition system, in particular welded or welded to the lead frame connected with a perforated film can be soldered and checked before they are attached, especially by gluing them to the base plate.
  • a thermally conductive connection of the lead frame to the base plate is furthermore favorable, the distance for the electrical insulation being ensured by the thickness of the perforated film.
  • the heat-conducting connection is carried out via a heat-conducting and electrically insulating
  • the perforated film has the advantage that the lead frame can be glued directly to the base plate with the heat-conducting adhesive through the holes in the perforated film.
  • the perforated Fohefohe only acts as a spacer in relation to the thermal conductivity
  • the first adhesive which is provided between the lead frame and the perforated film, differs from the second adhesive, which is provided for the heat transfer, by different properties and processing parameters
  • the perforated film can advantageously be applied online, reel-to-reel, in the working cycle of the punching tool, and connecting webs from the punched grid can advantageously be removed online immediately after the perforated film has been stuck on. Due to the concept according to the invention of moving the steel grid from the housing to the base plate, the production of the housing is considerably shortened and simplified. A connection or injection molding of the plug on the base plate can also advantageously contribute to this.
  • a plastic film, an electrically insulating film or an electrically insulating film structure is preferably provided as the perforated film.
  • FIG. 1 shows a representation of a spaced assignment of a plastic film and a lead frame before a so-called reel-to-reel assembly
  • Figure 2 shows an arrangement of conductor tracks that are glued to a plastic sheet.
  • FIG. 1 a lead frame 11, unwound on a roll 10, is shown, in which conductor tracks 12 and edge-side fastening sections 13 are punched out.
  • the plastic sheet 16 has perforated strips 17 and 18 with mounting holes 19 and 20 on the edge, which are aligned and mutually aligned with the associated holes 21 and 22 of the lead frame 1 1.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

The aim of the invention is to simplify the production of housings for hybrid control devices. To achieve this, the invention provides a method for fixing electric conductor tracks onto a base plate, according to which the conductor tracks (12), in the form of a pressed screen, are fixed to one side of a perforated film (16) and lateral connection webs of the pressed screen are then severed together with the attached perforated film. The invention also relates to an assembly of electric conductor tracks (12), in particular for an electronic circuit, which is fixed to a base plate by means of a double-sided adhesive plastic film (16).

Description

Vei fahren zur Fixierung von elektrischen Leiterbahnen auf einer Grundplatte sowie Anordnung aus Leiterbahnen und GrundplatteVei drive to fix electrical conductor tracks on a base plate and arrangement of conductor tracks and base plate
Die Erfindung betrifft ein Verfahren zur Fixierung von elektrischen Leiterbahnen auf einer Grundplatte, insbesondere im Zusammenhang mit der Herstellung von Gehäusen für elektronische Steuergeräte, sowie eine Anordnung von elektrischen Leiterbahnen, insbesondere für elektronische Schaltungen, auf einer Grundplatte.The invention relates to a method for fixing electrical conductor tracks on a base plate, in particular in connection with the production of housings for electronic control devices, and to an arrangement of electrical conductor tracks, in particular for electronic circuits, on a base plate.
STAND DER TECHNIKSTATE OF THE ART
Bisher ist es üblich, bei der Herstellung von Gehäusen für Hybnd-Steuergeräte Stanzgittcr, die elektrische Leiterbahnen bilden, in Kunststoffgehäuse einzuspritzen Dieses Einspritzen in Kunststoffgehäuse dient dazu, eine Verbindung für elektronische Bauteile, wie beispielsweise Elektrolyt-Kondensatoren, mit dem Hybπd-Steuergerät bzw. Leiterplatten verwirklichen zu können Anschließend werden die für das Handlmg erforderlichen Verbindungsstege mittels Stanzwerkzeug aus dem Stanzgilter ausgetrennt.So far, it has been customary in the manufacture of housings for hybrid control devices to inject stamped metal, which form electrical interconnects, into plastic housings. This injection into plastic housings serves to connect electronic components, such as electrolytic capacitors, to the Hybπd control device or To be able to realize printed circuit boards Then the connecting webs required for handling are cut out of the lead frame using a punching tool.
Als nachteilig ist dabei anzusehen, daß große Toleranzen vom Spritzgießen auf das Stanzgitter übertragen werden und daß für das Trennen der Verbindungsstege ein separater Arbeitsgang erforderlich ist. Außerdem kann es, da der Arbeitsgang auf der Montagehnie erfolgt, zum Auftreten von unerwünschtem Flitter im Gehäuse kommen.A disadvantage is that large tolerances are transferred from injection molding to the lead frame and that a separate operation is required to separate the connecting webs. In addition, since the operation takes place on the assembly line, undesirable tinsel can appear in the housing.
Mit der Erfindung sollen die vorgenannten Nachteile beseitigt werden. Erfindungsgemäß ist ein Verfahren zur Fixierung von elektrischen Leiterbahnen auf einer Grundplatte, insbesondere im Zusammenhang mit der Herstellung von Gehäusen für elektronische Steuergeräte, mit den Merkmalen des Anspruchs 1 vorgesehen.With the invention, the aforementioned disadvantages are to be eliminated. According to the invention, a method for fixing electrical conductor tracks on a base plate, in particular in connection with the production of housings for electronic control devices, is provided with the features of claim 1.
Vorteilhafte weitere Ausgestaltungen des Verfahrens sind in den nachgeordneten Patentansprüchen 2 bis 6 angegeben. Eine erfindungsgemaße Anordnung von elektrischen Leiterbahnen, insbesondere für eine elektronische Schaltung auf einer Grundplatte, ist gemäß der Erfindung im Anspruch 8 beanspruchtAdvantageous further developments of the method are specified in the subordinate claims 2 to 6. An arrangement of electrical conductor tracks according to the invention, in particular for an electronic circuit on a base plate, is claimed according to the invention in claim 8
Vorteilhafte Weiterbildungen dieser Anordnung enthalten die Ansprüche 9 bis 1 1 .Advantageous further developments of this arrangement are contained in claims 9 to 11.
VORTEILE DER ERFINDUNGADVANTAGES OF THE INVENTION
Aufgrund der erfindungsgemäßen Ausgestaltung des Verfahrens und der Anordnung hat das direkte Befestigen des Stanzgitters auf der Grundplatte den Vorteil, daß die großen Toleranzen vom Spritzgießen nicht auf das Stanzgitter übertragen werden und daß das Trennen der Verbindungsstege als separater Arbeitsgang entfallt Es besteht weiterhin nicht die Gefahr eines Auftretens von Flitter im Gehäuse, da der beanspruchte Arbeitsgang in den Stanzprozeß vom Stanzgitter integriert werden kann.Due to the inventive design of the method and the arrangement, the direct fastening of the lead frame on the base plate has the advantage that the large tolerances are not transferred from the injection molding to the lead frame and that the separation of the connecting webs is not necessary as a separate operation Occurrence of tinsel in the housing, since the stressed operation can be integrated into the punching process by the lead frame.
Vorteilhaft entfallen weiterhin Biegungen im Stanzgitter, weil die Verdi ahtung und Schaltung auf einer Ebene liegen- Von Vorteil ist femer, daß aufgrund der genau bestimmbaren Position des Stanzgitters elektrische Bauteile ohne Bildeikennungssystem bestückt werden können, insbesondere auf das mit einer gelochten Folie verbundene Stanzgitter geschweißt oder gelötet und geprüft werden können, ehe eine Befestigung, insbesondere durch Aufkleben auf der Grundplatte, erfolgt-Furthermore, bends in the lead frame are advantageously omitted because the wiring and circuit lie on one plane. It is also advantageous that, due to the precisely determinable position of the lead frame, electrical components can be fitted without an image recognition system, in particular welded or welded to the lead frame connected with a perforated film can be soldered and checked before they are attached, especially by gluing them to the base plate.
In vorteilhafter Weise entfallen weiterhin Freiräume für das Austrennen von Verbindungsstegen, was der Reduzierung der Baugrόße vom Gehäuse zugute kommtAdvantageously, there is also no space for the separation of connecting webs, which is beneficial in reducing the size of the housing
Günstig ist weiterhin eine wärmeleitende Anbmdung des Stanzgitters an die Grundplatte, wobei der Abstand für die elektrische Isolierung durch die Dicke der gelochten Folie sichergestellt wird Die wäiTneleitende Anbmdung erfolgt über einen wärmeleitenden und elektrisch IsolierendendenA thermally conductive connection of the lead frame to the base plate is furthermore favorable, the distance for the electrical insulation being ensured by the thickness of the perforated film. The heat-conducting connection is carried out via a heat-conducting and electrically insulating
Kleber. Die gelochte Folie bietet den Vorteil, dass mit dem wärmeleitende Kleber durch die Löcher der gelochten Folie das Stanzgitter direkt auf die Grundplatte geklebt werden kann Die gelochte Fohefohe wirkt, bezogen auf die Wärmeleitfähigkeit, nur als AbstandshalterGlue. The perforated film has the advantage that the lead frame can be glued directly to the base plate with the heat-conducting adhesive through the holes in the perforated film. The perforated Fohefohe only acts as a spacer in relation to the thermal conductivity
Der erste Kleber, der zwischen Stanzgitter und gelochter Folie vorgesehen ist, unterscheidet sich von dem zweiten Kleber, der für die Wärmeübertragung vorgesehen ist, durch unterschiedliche Eigenschaften und VerarbeitungsparameterThe first adhesive, which is provided between the lead frame and the perforated film, differs from the second adhesive, which is provided for the heat transfer, by different properties and processing parameters
Die gelochte Folie kann vorteilhaft online, reel to reel, im Arbeitstakt des Stanzwerkzeugs aufgebracht werden, und Verbindungsstege vom Stanzgitter können in günstiger Weise online unmittelbar nach dem Aufkleben der gelochten Folie ausgetrennt werden. Aufgrund der erfindungsgemäßen Konzeption, das Staπzgitter vom Gehäuse auf die Grundplatte zu verlagern, verkürzt und vereinfacht sich die Herstellung des Gehäuses erheblich. Hierzu kann auch vorteilhaft eine Verbindung bzw. Anspritzung des Steckers an der Grundplatte beitragen.The perforated film can advantageously be applied online, reel-to-reel, in the working cycle of the punching tool, and connecting webs from the punched grid can advantageously be removed online immediately after the perforated film has been stuck on. Due to the concept according to the invention of moving the steel grid from the housing to the base plate, the production of the housing is considerably shortened and simplified. A connection or injection molding of the plug on the base plate can also advantageously contribute to this.
Als gelochte Folie ist vorzugsweise eine Kunststofffolie, eine elektrisch isolierende Folie oder ein elektrisch isolierender Folienaufbau vorgesehen.A plastic film, an electrically insulating film or an electrically insulating film structure is preferably provided as the perforated film.
ZEICHNUNGENDRAWINGS
Nachfolgend wird ein Ausführungsbeispiel der Erfindung unter Bezugnahme auf die beigefügten Zeichnungen näher erläutert. Es zeigen-An exemplary embodiment of the invention is explained in more detail below with reference to the accompanying drawings. Show it-
Figur 1 eine Darstellung einer beabstandeten Zuordnung von einer Kunststofffolie und einem Stanzgitter vor einer sogenannten reel-to-reel-Montage; und1 shows a representation of a spaced assignment of a plastic film and a lead frame before a so-called reel-to-reel assembly; and
Figur 2 eine Anordnung aus Leiterbahnen, die auf einer Kunststofffohe aufgeklebt sind.Figure 2 shows an arrangement of conductor tracks that are glued to a plastic sheet.
BESCHREIBUNG DES AUSFÜHRUNGSBEISPIELSDESCRIPTION OF THE EMBODIMENT
In Figur 1 ist ein auf einer Rolle 10 abgewickeltes Stanzgitter 1 1 dargestellt, m dem Leiterbahnen 12 und randseitige Befestigungsabschnitte 13 ausgestanzt sind.In FIG. 1, a lead frame 11, unwound on a roll 10, is shown, in which conductor tracks 12 and edge-side fastening sections 13 are punched out.
Unterhalb der Rolle 10 ist achsparallel zu dieser eine Rolle 15 angeordnet, von der eine gelochte Kunststofffohe 16 abgewickelt ist. Die Kunststofffohe 16 besitzt randseitige nicht perforierte Streifen 17 und 18 mit Montage löchern 19 und 20, die in Anordnung und wechselseitiger Ausrichtung mit den zugeordneten Löchern 21 und 22 des Stanzgitters 1 1 fluchten Zwischen den Seitenstreifen 17 und 18 befindet sich als Lochung eine gleichmäßige Netzstruktur, in der verschiedene Ausnehmungen, wie beispielsweise 23, 24 und 25, vorgesehen sind, die als große Löcher zu Montagezwecken dienen.A roller 15, from which a perforated plastic sheet 16 is unwound, is arranged below the roller 10, parallel to the axis. The plastic sheet 16 has perforated strips 17 and 18 with mounting holes 19 and 20 on the edge, which are aligned and mutually aligned with the associated holes 21 and 22 of the lead frame 1 1. Between the side strips 17 and 18 there is a uniform mesh structure as perforations, in which various recesses, such as 23, 24 and 25, are provided, which serve as large holes for assembly purposes.
Die Befestigung der Leiteibahnen 12 auf der Kunststofffohe 16 erfolgt reel to reel, d.h. die in Figur 1 dargestellten Rollen 10 und 15 werden so weit zusammengeführt, daß sie aneinander abrollen. Nach der Befestigung der Leiterbahnen 1 1 auf der Kunststofffohe 16 werden die Randstreifen mit den Lochern 19, 20 bzw. 21 und 22 nebst den zu ihnen führenden Verbindungsstegen, beispielsweise 26 und 27, abgetrennt, und es hegt dann die in Figur 2 dargestellte Anordnung aus Leitci bahnen 1 1 und Kunststofffohe 16 vor, die dann in einem weiteren Verfahrensschritt auf einer passenden Grundplatte durch Verkleben der Kunststofffohe 16 befestigt wird Es kann hierzu ein Kleber mit guten Warmeleiteigenschaften verwendet werden The mounting of the conductive tracks 12 on the plastic sheet 16 takes place reel-to-reel, ie the rolls 10 and 15 shown in FIG. 1 are brought together so far that they roll against one another. After the conductor tracks 11 have been fastened to the plastic sheet 16, the edge strips with the holes 19, 20 or 21 and 22, together with the connecting webs leading to them, for example 26 and 27, separated, and then there is the arrangement shown in Figure 2 from Leitci webs 1 1 and plastic sheet 16, which is then attached in a further process step to a suitable base plate by gluing the plastic sheet 16 be used
Verfahren zur Fixierung von elektrischen Leiterbahnen auf einer Grundplatte sowie Anordnung aus Leiterbahnen und Grundplatte BEZUGSZEICHENLISTE:Process for fixing electrical conductor tracks on a base plate and arrangement of conductor tracks and base plate REFERENCE SIGN LIST:
Figure imgf000007_0001
Figure imgf000007_0001

Claims

Verfahren zur Fixierung von elektrischen Leiterbahnen auf einer Grundplatte sowie Anordnung aus Leiterbahnen und GamdplattePATENTANSPRÜCHE Process for fixing electrical conductor tracks on a base plate and arrangement of conductor tracks and gamd plate
1 Verfahren zur Fixierung von elektrischen Leiterbahnen (12) auf einer Grundplatte, insbesondere im Zusammenhang mit der Herstellung von Gehäusen für elektronische Steuerger te, dadurch gekennzeichnet, daß die Leiterbahnen (12) in Form eines Stanzgitters mittels eines ersten Klebers an einer Seite einer gelochten Folie (16) befestigt werden, daß seitliche Verbindungsstege (26, 27) von dem Stanzgitter ( 1 1 ) mit der anhaftenden gelochten Folie (16) abgetrennt werden, und daß die andere Seite der gelochten Folie (16) mittels eines zweiten Klebers auf der Grundplatte befestigt wird1 Method for fixing electrical conductor tracks (12) on a base plate, in particular in connection with the manufacture of housings for electronic control units, characterized in that the conductor tracks (12) in the form of a lead frame by means of a first adhesive on one side of a perforated film (16) are attached so that lateral connecting webs (26, 27) are separated from the lead frame (1 1) with the adhered perforated film (16), and that the other side of the perforated film (16) by means of a second adhesive on the base plate is attached
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Befestigung der Leiterbahnen auf der Grundplatte über einen wärmeleitenden und elektrisch isolierenden Kleber vorgenommen wird.2. The method according to claim 1, characterized in that the fastening of the conductor tracks on the base plate is carried out via a heat-conducting and electrically insulating adhesive.
3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die Befestigung des Stanzgitters (1 1 ) im Arbeitstakt eines Stanzwerkzeugs vorgenommen wird, der durch die Löcher der Folie Grundplatte und Leiterbahnen direkt veibiπdet.3. The method according to claim 1 or 2, characterized in that the attachment of the lead frame (1 1) is carried out in the working cycle of a punching tool which directly veibiπdet through the holes in the film base plate and conductor tracks.
4. Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, daß die Befestigung des Stanzgitters ( 1 1) an der gelochten Folie (16) online (reel to reel) vorgenommen wird.4. The method according to any one of the preceding claims, characterized in that the attachment of the lead frame (1 1) on the perforated film (16) is carried out online (reel to reel).
5. Vei fahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, daß die Verbindungsstege (26, 27) vom Stanzgitter (1 1 ) online unmittelbar nach dem Aufkleben der gelochten Folie ( 16) abgetrennt werden. 5. Vei drive according to one of the preceding claims, characterized in that the connecting webs (26, 27) from the lead frame (1 1) are separated online immediately after the perforated film (16) has been stuck on.
6. Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, daß vor dem Befestigen der mit dem Stanzgitter ( 1 1 ) versehenen gelochten Folie (16) an der Grundplatte elektronische Bauteile an das Stanzgittcr (1 1 ) geschweißt bzw. gelötet und anschließend geprüft werden.6. The method according to any one of the preceding claims, characterized in that before attaching the punched grid (1 1) provided perforated film (16) on the base plate electronic components to the Stanzgittcr (1 1) are welded or soldered and then checked ,
7. Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, daß die gelochte Folie (16) vor der Befestigung mit Ausnehmungen (23, 24, 25) zu Montagezwecken versehen wird.7. The method according to any one of the preceding claims, characterized in that the perforated film (16) is provided with recesses (23, 24, 25) prior to attachment for assembly purposes.
8. Anordnung von elektrischen Leiterbahnen (12), insbesondere in Form eines Stanzgitters, über eine gelochte Folie (16) auf einer Grundplatte, wobei die Leiterbahnen (12) mittels eines ersten Klebers mit der gelochten Folie ( 16) verbunden sind, und wobei die Leiterbahnen ( 12) mittels eines zweiten Klebers auf der Grundplatte wärmeleitend und elektrisch isoliert befestigt sind.8. Arrangement of electrical conductor tracks (12), in particular in the form of a lead frame, via a perforated film (16) on a base plate, the conductor tracks (12) being connected to the perforated film (16) by means of a first adhesive, and wherein the Conductor tracks (12) are attached to the base plate in a heat-conducting and electrically insulated manner by means of a second adhesive.
9 Anordnung nach Anspruch 8, dadurch gekennzeichnet, daß die beiden Kleber unterschiedliche Eigenschaften und Verarbeitungsparameter aufweisen.9 Arrangement according to claim 8, characterized in that the two adhesives have different properties and processing parameters.
10 Anordnung nach Anspruch 8 oder 9, dadurch gekennzeichnet, daß der zweite Kleber wärmeleitend und elektrisch isolierend ist10 Arrangement according to claim 8 or 9, characterized in that the second adhesive is thermally conductive and electrically insulating
1 1 Anordnung nach einem der Ansprüche 8 bis 10, dadurch gekennzeichnet, dass die gelochte Folie aus einer Kunststofffohe, einer elektrisch isolierenden Folie oder einem elektrisch isolierenden Folienaufbau besteht. 1 1 arrangement according to one of claims 8 to 10, characterized in that the perforated film consists of a plastic film, an electrically insulating film or an electrically insulating film structure.
PCT/DE2004/000968 2003-07-31 2004-05-10 Method for fixing conductor tracks onto a base plate and assembly consisting of conductor tracks and base plate WO2005015967A1 (en)

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