WO2005005889A1

WO2005005889A1 - Floor-heating device

Info

Publication number: WO2005005889A1
Application number: PCT/JP2004/009970
Authority: WO
Inventors: Takashi Sumiya; Takuya Kishida
Original assignee: Tokyo Gas Co., Ltd.
Priority date: 2003-07-14
Filing date: 2004-07-13
Publication date: 2005-01-20
Also published as: JP2005061638A

Abstract

A floor-heating device advantageous in production costs and having a feature where installation mistakes can be reduced. A floor-heating device (1) has a heat-equalizing plate (3) bent in a recessed shape. Warm water pipes (7) are fixed on a bottom wall (3a) of the heat-equalizing plate (3) by aluminum tapes (9). The inner surface of the bottom wall (3a) is painted black and serves as a heat-radiating surface having a high radiation coefficient. Heat radiated from the warm water pipes (7) is radiated from the bottom wall (3a) to the lower face of a floor member (70) and can uniformly heat the floor member (70). Further, when a nail (81) is mistakenly driven into outside a floor joist (60), the nail (81) sticks out into a space (S), and as a result such a situation where the nail sticks in a warm water pipe can be avoided.

Description

Technical field

The present invention relates to a floor heating device that warms a room from the floor of a building. In particular, the present invention relates to a floor heating device which is advantageous in terms of manufacturing cost or has a feature of reducing construction errors.

Background art

FIG. 5 is a sectional perspective view showing an example of the structure of a floor heating device.

Light

[0003] The floor heating device 110 includes a mat base material 111, a hot water pipe 113, a heat transfer sheet 115, and the like.

Has been established. The mat substrate 111 is made of a lightweight and heat-insulating material such as expanded polystyrene. The length and width of the mat substrate 111 are standardized to various dimensions. In this example, the width of the mat substrate 111 is equal to the interval between the joists 60. On the upper surface of the mat base material 111, a groove 111a for accommodating the hot water pipe 113 is formed so as to meander. A hot water pipe 113 is routed through the groove 111a.

[0004] A heat transfer sheet 115 such as an aluminum foil is affixed to the upper surface of the mat base material 111 and the hot water pipe 113 routed in the groove of the base material. The heat transfer sheet 115 uniformly transfers the heat radiated from the hot water pipe 113 to the upper surface of the mat base material 111.

As shown in FIG. 5, the floor heating device 110 is inserted between the adjacent joists 60 so that the upper surface is at the same height as the upper surface of the joists 60, and is temporarily placed on the large scale 100. . Then, a holding plate (not shown) is pressed against the back surface of the floor heating device 110 so as to be orthogonal to the joist 60 and fixed to the joist 60, and the floor heating device 110 is fixed to the joist 60.

[0006] On the floor heating device 110, a base plywood 70 is pasted, and a finishing material 80 is pasted thereon. The finishing material 80 is fixed to the base plywood 70 and the joist 60 with the nail 81 at the portion of the joist 60. At this time, in order not to nail the floor heating device 110, the position of the joist 60 is marked S on the upper surface of the base plywood.

Disclosure of the invention

Problems to be solved by the invention

[0007] As described above, when the floor material is nailed onto the floor heating device 110, the position of the joist 60 is previously determined. To prevent nailing to the floor heating device 110, particularly to the hot water pipe 113, by mistake. However, if the nail is disengaged from the joist 60 due to a wrong hand, the nail may be hit into the hot water pipe 113 (cord heater in the case of the electric heating device).

[0008] The present invention has been made in view of the above problems, and has an object to provide a floor heating device that is advantageous in terms of manufacturing cost and has a feature of reducing construction errors. And Means for solving the problem

[0009] In order to solve the above problems, a first floor heating device of the present invention includes a heating element disposed under a floor material of a building, and heat generated by heat transfer from the heating element. And a heat equalizing plate having a heat radiation surface with a high emissivity facing the lower surface (back surface) of the material at a certain interval.

[0010] The second floor heating device of the present invention is characterized in that it has a planar heating element having a radiation surface with a high emissivity facing a lower surface (back surface) of a floor material of a building at a certain interval. And

[0011] With such a configuration, a space is formed between the lower surface of the floor material and the heat radiation surface of the floor heating device. Since the heat radiation surface has a high emissivity, the heat radiated from the heat radiation surface is directly transmitted to the lower surface of the flooring. Thereby, the floor material on the upper surface of the floor heating device can be uniformly heated.

[0012] Furthermore, in the case where the nail is erroneously placed on the joist of the floor heating device, the nail protrudes into the space, so that a situation in which the nail is pierced into the hot water pipe can be avoided. Further, the mat base material 111 required for the conventional floor heating device shown in FIG. 5 is not required. For this reason, the material cost and the molding cost of the mat base material are reduced, and the cost can be reduced.

[0013] As the heat radiating surface, a heat equalizing plate provided with a heating element or a planar heating element can be used.

[0014] In the present invention, the emissivity of the heat radiation surface is preferably 0.9 or more. As a method of increasing the emissivity, for example, there is a method of painting the heat radiation surface black, or a method of manufacturing the heat radiation surface with a material having a high emissivity (for example, paper or copper (rough surface)).

[0015] In the present invention, the heat equalizing plate or the planar heating element is disposed between joists of the building floor supporting structure, and an end of the heat equalizing plate or the planar heating element extends to the upper surface of the joist. At the same end, it is preferable that the heat equalizing plate or the planar heating element is in contact with the lower surface of the floor material.

[0016] In the conventional floor heating apparatus 110 shown in FIG. Since the heating surface (heat transfer sheet 115) of No. 10 is not in contact with the floor material 70, the temperature of the floor material may not increase in a portion where the joist is wide. For this reason, temperature unevenness occurred on the floor material surface.

[0017] Therefore, as in the present invention, the end of the heat equalizing plate or the sheet heating element extends to the upper surface of the joist, and the heat equalizing plate or the sheet heating element contacts the lower surface of the floor material at the same end. In this case, the floor material on the joist is directly transferred from the heat equalizing plate or the heating element via the end. For this reason, even if the width of the joist is wide, the floor material on the joist can be heated, and temperature unevenness on the floor surface can be eliminated. Therefore, there is no floor portion that makes a noise when contact is made, and comfort is improved.

Further, when laying the floor heating device, it is possible to lay the floor heating device simply by pulling the end of the heat equalizing plate or the planar heating element on the joist.

[0019] The third floor heating device of the present invention is arranged at a certain pitch, and is laid so as to connect a plurality of small joists on which building floor materials are placed and adjacent small joists, and a lower surface of the floor material. A heat equalizing plate having a heat radiation surface with a high emissivity facing the (back surface) at a certain interval, and a heating element disposed on the upper surface of the heat equalizing plate.

[0020] The fourth floor heating device of the present invention is arranged at a certain pitch, and is laid so as to connect a plurality of small joists on which building floor materials are placed and adjacent small joists, and a lower surface of the floor material. (Back surface) and a planar heating element having a heat radiation surface with a high emissivity facing at a certain distance.

[0021] These floor heating devices are manufactured at a factory in a panel shape of a certain size (for example, 1.8m x 3.6m), and are attached so as to be laid on the floor of a building.

[0022] Also in these floor heating devices, the end of the heat equalizing plate or the planar heating element is pressed to the upper surface of the small joist, and the heat equalizing plate or the planar heating element is at the same end. It is preferable to contact the lower surface.

[0023] The fifth floor heating device of the present invention includes a plurality of small joists on which a building floor material can be arranged at an arbitrary pitch, and a lower surface (back surface) of the floor material on which the small joist is placed. It is characterized by comprising a heat equalizing plate having a heat radiation surface with a high emissivity facing at a certain interval, and a heat generator disposed on the upper surface of the heat equalizing plate. [0024] The sixth floor heating device of the present invention includes a plurality of small joists on which a building floor material can be arranged at an arbitrary pitch, and a lower surface (back surface) of the floor material on which the small joist is placed. And a planar heating element having a heat radiation surface with high emissivity facing at a certain interval.

[0025] These floor heating devices are also installed on a base plywood laid in advance, but the soaking plate and the small joists are separate products. Therefore, the soaking plate is first placed on the base plywood, and then the small joists are placed on the soaking plate according to the width of the finishing material.

[0026] In the first and second floor heating devices of the present invention, it is preferable that a distance between a lower surface (back surface) of the floor material and the upper surface of the heat generator is 27 mm or more.

[0027] If the interval is too small, there is a possibility that the nail protruding into the space may pierce the heating element (hot water pipe or cord heater) when the nailing position is incorrect. On the other hand, if the interval is too high, the distance from the heat radiating surface to the end of the heat equalizing plate becomes longer, and it becomes difficult for the joist to transfer heat to the floor.

The invention's effect

[0028] As is apparent from the above description, according to the present invention, this floor heating device can be constructed without worrying about damaging the hot water pipe even if nails are accidentally dislodged from the joists when nailing the floor material. A floor heating device with improved performance can be provided. In addition, since a base mat is not required, cost can be reduced. Further, the temperature of the floor surface including the portion above the joist can be substantially uniformly heated, and the temperature unevenness can be reduced.

Brief Description of Drawings

FIG. 1 is a diagram showing a structure of a floor heating device according to a first embodiment of the present invention, wherein FIG. 1 (A) is a plan view, and FIG. is there.

FIG. 2 is a cross-sectional view showing a state where the floor heating device of FIG. 1 is laid.

FIG. 3 is a diagram showing a floor heating device according to a second embodiment of the present invention. FIG. 3 (A) is a cross-sectional view of the floor heating device, and FIG. It is sectional drawing which shows a state.

FIG. 4 is a cross-sectional view showing a state where a floor heating device according to a third embodiment of the present invention is laid.

FIG. 5 is a sectional perspective view showing the structure of a general floor heating device. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, description will be made with reference to the drawings.

FIG. 1 is a diagram showing a structure of a floor heating device according to a first embodiment of the present invention.

(A) is a plan view, and FIG. 1 (B) is a cross-sectional view along II.

As shown in FIG. 1 (B), the floor heating device 1 includes a heat equalizing plate 3 that is bent in a concave shape. The heat equalizing plate 3 is made of, for example, an aluminum plate having a thickness of 0.5 mm. The heat equalizing plate 3 includes a rectangular bottom wall 3a and two side walls 3b rising from each long side of the bottom wall 3a. A horizontal portion (end) 3c extending outward is provided at the upper edge of each side wall 3b.

[0034] Such a heat equalizing plate 3 may be manufactured by bending a flat plate, or may be bonded and connected to the flat plate and the band plate with an aluminum foil tape or the like.

[0035] The inner surface of the bottom wall 3a is coated with black paint (for example, paint). By painting in black in this way, the emissivity of the bottom wall 3a is about 0.9. As an example, the length of the bottom wall 3a is 1800 mm, the width is 303 mm which is a general interval between the joists, the width is 263 mm less the joist width (40 mm), and the height of each side wall 3b is 40 mm. The width of the horizontal portion 3c is 20 mm, which is half the width of a general joist.

[0036] On the upper surface of the bottom wall 3a of the heat equalizing plate 3, a hot water pipe (heating element) 7 is arranged so as to meander. The hot water pipe 7 is pulled out from the through hole 5 formed in the bottom wall 3a onto the bottom wall 3a, and meanders around the outer periphery and the center of the bottom wall 3a so as to extend in the length direction of the bottom wall 3a. The straight section of the hot water pipe 7 is fixed to the bottom wall 3a with aluminum tape 9, and the pipe 7 is in contact with the bottom wall 3a. After meandering on the bottom wall 3a in this way, the hot water pipe 7 is pulled out from another through hole 5 below the bottom wall 3a. The hot water pipe 7 is made of a metal or resin such as copper having high heat conductivity, and has an outer diameter of 9.5 mm as an example.

A state in which the floor heating device 1 is laid will be described with reference to FIG.

[0038] In the floor heating device 1, each horizontal portion 3c of the heat equalizing plate 3 is hooked on an adjacent joist 60, and is inserted between the joists. Then, the floor heating devices 1 are arranged and inserted in the length direction of the joists 60. Then, the upper surface of one joist 60 is covered with the horizontal portions 3c and 3 of the two floor heating devices 1 and 合う adjacent in the width direction of the joist 60. [0039] After the floor heating devices 1 are spread on the joists 60 in this manner, first, the base plywood 70 is placed on the joists 60 (on the horizontal portion 3c of the soaking plate), and the base plywood 70 is spread.

After that, the finishing material 80 is spread on the base plywood 70, and the finishing material 80 is fixed to the base plywood 70 and the joist 60 with the nail 81 at the part of the joist 60. The base plywood 70 and the finishing material 80 can each be of a general thickness of 12 mm.

Thereafter, the hot water pipes 7 of the adjacent floor heating devices 1 are connected.

When the floor heating device 1 is laid in this way, a space S is opened between the bottom wall 3a of the soaking plate and the back surface of the base plywood 70, as shown in FIG. The height of the space S is 40 mm, the same as the height of the side wall 3b of the heat equalizing plate.

When hot water (for example, 60 ° C. or 80 ° C.) is supplied to the hot water pipe 7, the hot water pipe 7 generates heat. Since the bottom wall 3a of the heat equalizing plate is painted black as described above and serves as a heat radiation surface with a high emissivity, the heat generated from the hot water pipe 7 spreads over the entire bottom wall 3a and the bottom wall 3a Radiated into the force space S. The radiated heat is transmitted to the lower surface of the floor member 70 above the space S. Therefore, the entire lower surface of the floor material above the space S can be uniformly heated.

[0044] Further, heat is also transmitted to the horizontal portion 3c of the heat equalizing plate from the bottom wall 3a heated by the hot water pipe 7 along each side wall 3b. The horizontal portion 3c is in contact with the lower surface of the floor material 70 on the upper surface of the joist 60 as shown in FIG. In the joist 60, heat is directly transmitted from the horizontal portion 3c to the lower surfaces of the floor members 70 and 80.

As described above, the entire surface of the floor (the portion above the floor heating device 1 and the portion above the joists 60) can be heated, and the temperature unevenness on the floor surface is reduced.

Further, the heat insulating material 11 may be disposed on the back surface of the bottom wall 3a of the heat equalizing plate. The heat insulating material 11 is made of, for example, expanded polystyrene. The dimensions of the heat insulating material 11 are equal to the dimensions of the bottom wall 3a. The thickness of the heat insulating material 11 is, for example, 50 mm. By arranging the heat insulating material 11, heat generated from the hot water pipe 7 is mainly directed to the upper space S, so that heat efficiency is improved.

[0047] The heat insulating material 11 may be previously attached to the lower surface of the bottom wall 3a of the heat equalizing plate.

[0048] In addition, when the floor heating device 1 nails the finishing material 80 to the joist, even if the nail 81 'comes off the joist 60 by mistake as shown by the broken line in FIG. It will protrude into S. Therefore, there is an advantage that the hot water pipe 7 is not damaged by the nail 81. [0049] Furthermore, there is an advantage that the work of laying the floor heating device 1 can be a simple work that only requires the horizontal portions 3c of the heat equalizing plate to be hooked on the joists 60. Further, the conventional floor heating device 110 shown in FIG. 5 requires a holding plate for fixing the same to the joist, but such a holding plate is unnecessary in the device of the present invention.

Further, unlike the heating device in FIG. 5, a mat base material (reference numeral 111 in FIG. 5) for supporting the hot water pipe is not required, so that material costs and molding costs are reduced, and costs can be reduced.

[0051] The height of the space S (the height of the side wall 3b) is preferably 37 mm (the outer diameter of the pipe 7 is 10 mm + the distance between the upper surface of the pipe and the lower surface of the floor material is 27 mm) or more. . If the height is too low, the nail 81 projecting into the space S may pierce the hot water pipe 7 if the nailing position is incorrect. On the other hand, if the height of the side wall 3b is too high, the distance from the heat radiating surface (the bottom wall 3a of the heat equalizing plate) to the horizontal portion 3c increases, and it becomes difficult for heat to be transmitted from the bottom wall 3a to the horizontal portion 3c. Then, it becomes difficult for heat to be transferred to the floor at the joist 60.

In this example, in order to increase the emissivity of the heat equalizing plate 3 by increasing the emissivity by painting the heat equalizing plate 3 black, other materials having a high emissivity (for example, There is a method of manufacturing a heat equalizing plate using paper or copper (rough surface), or a method of forming the surface of the heat equalizing plate into a shape having a high emissivity (for example, a wavy shape or an uneven shape).

In this example, a power code heater using a hot water pipe 7 as a heating element may be used. Further, a planar heating element can be used instead of the heat equalizing plate. Examples of the planar heating element include a planar heater and a carbon planar heating element.

FIG. 3 is a diagram showing a floor heating device according to a second embodiment of the present invention. FIG. 3 (A) is a cross-sectional view of the floor heating device, and FIG. It is sectional drawing which shows the state which laid.

[0055] The floor heating device 21 of this example is of a type laid on the base plywood 70. As shown in FIG. 3 (B), the base plywood 70 is spread over the joists 60. Further, a heat insulating material 90 is inserted under the base plywood 70 and between the joists.

The floor heating device 21 has a force having the soaking plate 23 and the hot water pipe 27 as well as a small joist 31 for supporting the finishing material 70, similarly to the floor heating device of FIG.

As shown in FIG. 3 (A), the heat equalizing plate 23 of the floor heating device 21 is also bent in a concave shape, and has a rectangular bottom wall 23a and a long side of the bottom wall 23a. Provide two side walls 23b that stand up I can. A hot water pipe 27 is provided on the bottom wall 23a, and is fixed to the bottom wall 23a with an aluminum tape 29. A horizontal portion (end) 23c extending outward is provided on the upper edge of one of the side walls 23b. A small joist 31 is fixed to the corner between the side wall 23b and the horizontal portion 23c. The inner surface of the bottom wall 23a is painted black. The width of the horizontal portion 23c is equal to the width of the small joist 31 and is 45 mm. In addition, the height of the side wall 23b and the height of the small joist 31 are equal and are 12 mm, for example.

When laying this floor heating device 21, first, as shown in FIG. 3 (B), the floor heating devices 21 and 21 ′ are laid on the base plywood 70. Here, the floor heating devices 21, 21 'and the like may be integrated in advance to a certain size. Then, the floor heating device 21 is fixed to the base plywood 70 with a nail 71 or the like at the small joist 31. Next, the finishing material 80 is spread on the floor heating device 21. Then, the finishing material 80 is fixed to the small joist 31 of the floor heating device 21 with the nail 81.

[0059] Also in this floor heating device 21, heat from the hot water pipe 27 is radiated on the radiation surface of the soaking plate 23 to heat the lower surface of the finishing material 80, and in the portion of the small joist 31, the horizontal portion 23c is formed. Heat is transferred from the hot water pipe 27 and heated. This makes it possible to heat the floor uniformly

[0061] The floor heating device 41 of this example is also of the type laid on the base plywood 70.

[0062] The floor heating device 41 also includes a soaking plate 43 and a hot water pipe 47, and further includes a small joist 51 that supports a finishing material 80. The heat equalizing plate 43 and the small joist 51 are different.

As shown in FIG. 4, the heat equalizing plate 43 of the floor heating device 41 is a rectangular flat plate. The upper surface of the soaking plate 43 is painted black. The dimensions of the heat equalizing plate 43 are, for example, 1800 mm in length and 3000 mm in width. A hot water pipe 47 is provided on the upper surface of the soaking plate 43 so as to meander, and is fixed to the soaking plate 43 with an aluminum tape 49 or the like. The portions of the hot water pipes 47 extending in the length direction of the soaking plate 43 are arranged at equal intervals P.

[0064] As the small joist 51, for example, a wooden body whose surface is wound with aluminum foil or the like having high heat conductivity can be used. The height of the small joist 51 is, for example, 12 mm. When the floor heating device 41 is laid, first, the soaking plate 43 is laid on the base plywood 70 as shown in the figure. Then, the small joists 51 are arranged between the hot water pipes 47 of the floor heating device 41 according to the width of the finishing material 80. For example, as shown in FIG. 4 (A), when the width W1 of the finishing material 80 is large, the small joists 51 are arranged with three hot water pipes 47 therebetween. Then, at the portion of the small joist 51, the small joist 51 and the floor heating device 41 are fixed on the base plywood 70 with nails or the like. After that, the finishing material 80 is connected in the width direction above the small joist 51, and the finishing material 80 is fixed to the small joist 51 with a nail there.

On the other hand, as shown in FIG. 4 (C), when the width W2 of the finishing material 80 is narrow, the small joists 51 are arranged with the two hot water pipes 47 interposed therebetween. Then, similarly, the small joist 51 and the floor heating device 41 are fixed on the base plywood 70. Thereafter, similarly, the finishing material 80 is connected and fixed to the small joist 51.

When laying the floor heating device 41 of this example, appropriate numbers of heat equalizing plates 43 and small joists 51 are prepared in advance. Then, after the heat equalizing plate 43 is laid down according to the dimensions of the site, the small joists 51 are laid according to the width of the finishing material 80. Since the surface of the small joist 51 is wound with aluminum foil and has a high surface made of heat transfer, heat can be transferred from the soaking plate 43 to the small joist 51. For this reason, heat is transmitted from the heat equalizing plate 43 to the surface of the small joist 51 and to the floor material 80 above the small joist 51, and the portion above the small joist can be heated, and the temperature unevenness on the floor surface is small. It will be cheap.

Claims

The scope of the claims

[1] a heating element located under the flooring of the building,

A heat equalizing plate heated by heat transfer from the heating element and having a radiation surface with a high emissivity facing a lower surface (back surface) of the floor material at a certain interval;

A floor heating device comprising:

[2] A floor heating device comprising a planar heating element having a heat radiation surface with a high emissivity facing a lower surface (back surface) of a floor material of a building at a certain interval.

3. The floor according to claim 1, wherein an emissivity of the heat radiation surface is 0.9 or more.

[4] The heat equalizing plate or the planar heating element is disposed between joists of the building floor support structure, and the end of the heat equalizing plate or the planar heating element is pressed to the upper surface of the joist. The floor heating device according to claim 1, wherein the heat equalizing plate or the planar heating element is in contact with a lower surface of the floor material.

[5] A plurality of small joists arranged at a certain pitch and on which building flooring is placed,

A soaking plate having a high emissivity heat-dissipating surface facing the lower surface (back surface) of the floor material at a certain interval, laid so as to connect adjacent small joists;

A heating element disposed on the upper surface of the heat equalizing plate,

A floor heating device comprising:

[6] A plurality of small joists arranged at a certain pitch and on which building flooring is placed,

A sheet-like heating element having a high emissivity heat-dissipating surface facing the lower surface (back surface) of the floor material at a certain interval, laid so as to connect adjacent small joists;

A floor heating device comprising:

[7] The end of the heat equalizing plate or the planar heating element is applied to the upper surface of the joist, and at the same end, the heat equalizing plate or the planar heating element is in contact with the lower surface of the floor material. The floor heating device according to claim 5 or 6, wherein

[8] multiple small joists on which building flooring is placed, which can be arranged at any pitch,

A heat equalizing plate having a high emissivity and a heat radiating surface facing the lower surface (back surface) of the floor material at a certain interval on which the small joists are placed; A heating element disposed on the upper surface of the heat equalizing plate,

A floor heating device comprising:

[9] a plurality of small joists on which building flooring can be placed, which can be arranged at any pitch;

A planar heating element having a high emissivity and a heat radiating surface facing the lower surface (back surface) of the floor material at a certain interval on which the small joists are placed;

A floor heating device comprising:

[10] The floor heating device according to any one of claims 14 to 14, wherein a distance between a lower surface (back surface) of the floor material and the upper surface of the heating element is 27 mm or more.