WO2005003859A3 - Resist composition - Google Patents

Resist composition Download PDF

Info

Publication number
WO2005003859A3
WO2005003859A3 PCT/JP2004/009980 JP2004009980W WO2005003859A3 WO 2005003859 A3 WO2005003859 A3 WO 2005003859A3 JP 2004009980 W JP2004009980 W JP 2004009980W WO 2005003859 A3 WO2005003859 A3 WO 2005003859A3
Authority
WO
WIPO (PCT)
Prior art keywords
organic solvent
resist composition
ester
diol compound
group
Prior art date
Application number
PCT/JP2004/009980
Other languages
French (fr)
Other versions
WO2005003859A2 (en
Inventor
Satoru Ishigaki
Kunio Matsuki
Original Assignee
Showa Denko Kk
Satoru Ishigaki
Kunio Matsuki
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk, Satoru Ishigaki, Kunio Matsuki filed Critical Showa Denko Kk
Priority to US10/563,485 priority Critical patent/US20060154173A1/en
Priority to EP04747446A priority patent/EP1644777A2/en
Publication of WO2005003859A2 publication Critical patent/WO2005003859A2/en
Publication of WO2005003859A3 publication Critical patent/WO2005003859A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

There is provided a resist composition used for the production of printed boards, which comprises (A) a resin component, (B) a photopolymerization initiator, (C) water and (D) an organic solvent, wherein the organic solvent (D) contains: (D-1) at least one organic solvent selected from the group consisting of an (-hydroxycarboxylate ester, a (-alkoxycarboxylate ester, a 1,3-diol compound and a 1,3-diol compound derivative, and (D-2) an organic solvent having a hydroxyl group other than (D-1).
PCT/JP2004/009980 2003-07-08 2004-07-06 Resist composition WO2005003859A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/563,485 US20060154173A1 (en) 2003-07-08 2004-07-06 Resist composition
EP04747446A EP1644777A2 (en) 2003-07-08 2004-07-06 Resist composition

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003193831 2003-07-08
JP2003-193831 2003-07-08
US48949303P 2003-07-24 2003-07-24
US60/489,493 2003-07-24

Publications (2)

Publication Number Publication Date
WO2005003859A2 WO2005003859A2 (en) 2005-01-13
WO2005003859A3 true WO2005003859A3 (en) 2005-04-14

Family

ID=33566778

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/009980 WO2005003859A2 (en) 2003-07-08 2004-07-06 Resist composition

Country Status (2)

Country Link
EP (1) EP1644777A2 (en)
WO (1) WO2005003859A2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5567568A (en) * 1993-12-14 1996-10-22 Fuji Photo Film Co., Ltd. Photosensitive composition and photosensitive lithographic printing plate
WO2003048860A1 (en) * 2001-12-03 2003-06-12 Showa Denko K. K. Photosensitive composition and production processes for photosensitive film and printed wiring board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5567568A (en) * 1993-12-14 1996-10-22 Fuji Photo Film Co., Ltd. Photosensitive composition and photosensitive lithographic printing plate
WO2003048860A1 (en) * 2001-12-03 2003-06-12 Showa Denko K. K. Photosensitive composition and production processes for photosensitive film and printed wiring board

Also Published As

Publication number Publication date
WO2005003859A2 (en) 2005-01-13
EP1644777A2 (en) 2006-04-12

Similar Documents

Publication Publication Date Title
EP1568723A4 (en) Photo- and thermo-setting resin composition and printed wiring boards made by using the same
SG160355A1 (en) Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board
MY148552A (en) Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board
TW200606580A (en) A chemically amplified positive resist composition, (meth)acrylate derivative and a process for producing the same
TW200625008A (en) Photoresist compositions and processes of use
EP1850178A3 (en) Dye-containing negative curable composition, color filter and method for producing the same
EP3537217A3 (en) Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition
EP1630215A3 (en) Photocurable resin composition and resin composition for plastics comprising the same
WO2008140017A1 (en) Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board
EP1698937A3 (en) Positive resist composition and pattern-forming method using the same
WO2007121110A3 (en) Flooring substrate having a coating of a curable composition
WO2004081663A3 (en) Novel photosensitive resin compositions
EP1914279A3 (en) Photo curable ink composition set, and recording method and recordings employing ink compositon set
TW200606590A (en) Waveguide compositions and waveguides formed therefrom
MY152732A (en) Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board
TW200722911A (en) Photosensitive resin composition
EP1970367A3 (en) Method for producing hydroxyphenyl acrylate monomers and polymers
WO2006132672A3 (en) A method of nanopatterning, a cured resist film use therein, and an article including the resist film
WO2002024766A8 (en) Imidate-containing fluoropolymer compositions
EP1906246A3 (en) Photosensitive resin composition, production method of cured relief pattern using the same and semiconductor device
NZ598184A (en) Composition for aqueous coating material and process for its production, and two-component curable aqueous coating material kit
TW200622496A (en) Method for forming anti-reflective coating
TW201129600A (en) Solder resist composition and printed circuit board
EP1128213A3 (en) Photoresist compositions comprising novel copolymers
EP1519228A3 (en) Positive resist composition and pattern formation method using the same

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2004747446

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020057023823

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 20048184118

Country of ref document: CN

ENP Entry into the national phase

Ref document number: 2006154173

Country of ref document: US

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 10563485

Country of ref document: US

WWP Wipo information: published in national office

Ref document number: 1020057023823

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 2004747446

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 10563485

Country of ref document: US