WO2004100220A2 - Source lumineuse a diodes electroluminescentes - Google Patents

Source lumineuse a diodes electroluminescentes Download PDF

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Publication number
WO2004100220A2
WO2004100220A2 PCT/US2004/012991 US2004012991W WO2004100220A2 WO 2004100220 A2 WO2004100220 A2 WO 2004100220A2 US 2004012991 W US2004012991 W US 2004012991W WO 2004100220 A2 WO2004100220 A2 WO 2004100220A2
Authority
WO
WIPO (PCT)
Prior art keywords
light source
accordance
thermally conductive
light emitting
conductive member
Prior art date
Application number
PCT/US2004/012991
Other languages
English (en)
Other versions
WO2004100220A3 (fr
Inventor
Joel M. Dry
Original Assignee
Optolum, Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/430,698 external-priority patent/US6815724B2/en
Application filed by Optolum, Inc filed Critical Optolum, Inc
Publication of WO2004100220A2 publication Critical patent/WO2004100220A2/fr
Publication of WO2004100220A3 publication Critical patent/WO2004100220A3/fr

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/54Cooling arrangements using thermoelectric means, e.g. Peltier elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40Cooling of lighting devices
    • F21S45/42Forced cooling
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00Illumination
    • Y10S362/80Light emitting diode

Definitions

  • This invention pertains to lighting sources, in general, and to a lighting source that utilizes Light Emitting Diodes (LEDs), in particular.
  • LEDs Light Emitting Diodes
  • LEDs have many advantages as light sources. However, in the past LEDs have found application only as specialized light sources such as for vehicle brake lights, and other vehicle related lighting, and recently as flashlights. In these prior applications, the LEDs are typically mounted in a planar fashion in a single plane that is disposed so as to be perpendicular to the viewing area. Typically the LED planar array is not used to provide illumination, but to provide signaling.
  • LEDs typically generate significant amounts of heat. The heat is such that unless the heat is dissipated, the LED internal temperature will rise causing degradation or destruction of the LED.
  • an improved light source includes an elongate thermally conductive member having an outer surface.
  • a plurality of light emitting diodes is carried on the elongate member outer surface. At least some of the light emitting diodes are disposed in a first plane and others of said light emitting diodes are disposed in a second plane not coextensive with the first plane.
  • Electrical conductors are carried by the elongate thermally conductive member and are connected to the plurality of light emitting diodes to supply electrical power thereto.
  • the elongate thermally conductive member conducts heat away from the light emitting diodes to a thermally conductive fluid medium.
  • a cooling device is utilized to remove heat from the light emitting diodes.
  • the cooling device comprises a fluid moving device utilized to cause the fluid medium to flow to cause cooling of the elongate thermally conductive member and therefore to dissipate heat from the light emitting diodes.
  • the cooling device may be an electronic or solid state device such as a Piezoelectric device or a device that uses the Peltier effect, known as a Peltier device.
  • a temperature sensor is provided to determine the temperature of the light emitting diodes.
  • the temperature sensor is coupled to a controller that monitors the temperature and controls the cooling device to vary the degree of cooling in accordance with the monitored temperature.
  • the controller can be used to control the power provided to the light emitting diodes in response to the monitored temperature.
  • the controller may be operated to control the light output provided by the light emitting diodes.
  • the fluid medium is air and the fluid moving device is an air moving device.
  • an illustrative embodiment of the invention utilizes light emitting diodes that emit white light.
  • other embodiments of the invention may utilize light emitting diodes that are of different colors to produce monochromatic light or the colors may be chosen to produce white light or other colors.
  • the elongate thermally conductive member transfers heat from the light emitting diodes to a medium within said elongate thermally conductive member.
  • the medium is air.
  • the elongate thermally conductive member has one or more projections or fins to enhance heat transfer to the medium.
  • the projections or fins may be disposed on the outer surface or inner surface of the elongate thermally conductive member or may be disposed on both the outer and inner surfaces.
  • the elongate thermally conductive member comprises a tube.
  • the tube has a cross-section in the shape of a polygon.
  • the tube has a cross- section having flat portions.
  • the elongate thermally conductive member comprises a channel.
  • the elongate thermally conductive member may comprise an extrusion, and the extrusion can be highly thermally conductive material such as aluminum.
  • the elongate thermally conductive member is a tubular member.
  • the tubular member has a polygon cross-section.
  • other embodiments my have a tubular member of triangular cross-section.
  • a flexible circuit is carried on a surface of said elongate thermally conductive member; the flexible circuit includes the electrical conductors.
  • the flexible circuit comprises a plurality of apertures for receiving said plurality of light emitting diodes. Each of the light emitting diodes is disposed in a corresponding one of the apertures and affixed in thermally conductive contact with said elongate thermally conductive member.
  • the elongate thermally conductive member includes a thermal transfer media disposed therein in a flow channel.
  • At least one clip for mounting the elongate thermally conductive member in a fixture may be included.
  • a flexible circuit is carried on a surface of said elongate thermally conductive member; the flexible circuit includes the electrical conductors.
  • the flexible circuit comprises a plurality of apertures for receiving said plurality of light emitting diodes.
  • Each of the light emitting diodes is disposed in a corresponding one of the apertures and affixed in thermally conductive contact with said elongate thermally conductive member.
  • the elongate thermally conductive member includes a thermal transfer media disposed therein in a flow channel.
  • At least one clip for mounting the elongate thermally conductive member in a fixture may be included.
  • FIG.1 is a planar side view of a light source in accordance with the principles of the invention.
  • FIG. 2 is a top planar view of the light source of FIG. 1;
  • FIG. 3 is a perspective view of the light source of FIG. 1 with mounting clips;
  • FIG. 4 is a planar side view of the light source of FIG. 3 showing mounting clips separated from the light source;
  • FIG. 5 is a top view of the light source and mounting clips of FIG. 4;
  • FIG. 6 is a partial cross-section of the light source of FIG. 1;
  • FIG. 7 is a top view of an alternate elongate thermally conductive member
  • FIG. 8 is a side view of the member of FIG. 7;
  • FIG. 9 is a block diagram of a control arrangement for the light source of the invention.
  • a light source in accordance with the principles of the invention may be used as a decorative lighting element or may be utilized as a general illumination device.
  • a light source 100 in accordance with the invention includes an elongate thermally conductive member or heat sink 101.
  • Elongate heat sink 101 is formed of a material that provides excellent thermal conductivity.
  • Elongate heat sink 101 in the illustrative embodiment of the invention is a tubular aluminum extrusion.
  • elongate heat sink 101 is configured to provide convective heat dissipation and cooling. As more clearly seen in FIG.
  • tubular heat sink 101 is hollow and has an interior cavity 103 that includes one or more surface discontinuities or heat dissipating protrusions 105.
  • the surface discontinuities or heat dissipating protrusions 105 are triangular shaped fins, but may take on other shapes.
  • the surface discontinuities may include apertures or blind bores either alone or in combinations with heat dissipation protrusions.
  • Protrusions 105 are integrally formed on the interior of elongate heat sink 101.
  • movement of a medium 102 through elongate heat sink 101 provides cooling.
  • Medium 102 utilized in the illustrative embodiment is air, but may in some applications be a fluid other than air to provide for greater heat dissipation and cooling.
  • Cooling device 199 is coupled to elongate thermally conductive member 101 to enhance cooling of the LEDs.
  • Cooling device in one embodiment of the invention is a medium moving device in fluid coupling with elongate thermally conductive member 101 to enhance the movement of medium 102.
  • Medium moving device 199 is utilized to enhance fluid medium 102 to flow to cause cooling of the elongate thermally conductive member and therefore to dissipate heat from the light emitting diodes.
  • Medium moving device 199 in a first illustrative embodiment is a fan and may be an electromechanical fan, electronic fan, or solid-state device such as a piezoelectric fan.
  • cooling device 199 may comprise one or more solid state cooling devices utilizing the Peltier effect, otherwise known as Peltier devices.
  • cooling device 199 is shown at one end of the light source 100, it will be appreciated by those skilled in the art that where solid state devices are utilized, a plurality of solid state devices may be positioned at locations other than on an end of the light source 100. It will also be appreciated by those skilled in the art that solid state cooling devices such as Piezoelectric and Peltier devices are known.
  • a controller 300 is provided in accordance with the principles of the invention. Controller 300 is coupled to a temperature sensor 301 that is disposed on light source 100 so as to monitor the temperature of the light emitting diodes 109. Controller 300 is utilized to control the rate of cooling provided by cooling device 199. It will be appreciated by those skilled in the art that although controller 300 and sensor 301 are shown separated from each other in the drawing, that such separation is provided merely for clarity in understanding the invention and controller 300 and sensor 301 may be fabricated as a single integrated device. [0038] The exterior surface 107 of elongate heat sink 101 has a plurality of Light Emitting Diodes 109 disposed thereon.
  • Each LED 109 in the illustrative embodiment comprises a white light emitting LED of a type that provides a high light output.
  • Each LED 109 also generates significant amount of heat that must be dissipated to avoid thermal destruction of the LED.
  • cooling device 199 provides cooling to avoid thermal destruction.
  • Conductive paths 129 are provided to connect 109 to an electrical connector 111.
  • the conductive paths may be disposed on an electrically insulating layer 131 or layers disposed on exterior surface 107.
  • the conductive paths and insulating layer are provided by means of one or more flexible printed circuits 113 that are permanently disposed on surface 107.
  • printed circuit 113 includes an electrically insulating layer 131 that carries conductive paths 129.
  • other means of providing the electrically conductive paths may be provided.
  • Flexible printed circuit 113 has LEDs 109 mounted to it in a variety of orientations ranging from 360 degrees to 180 degrees and possibly others depending on the application. Electrical connector 111 is disposed at one end of printed circuit 113. Connector 113 is coupleable to a separate power supply to receive electrical current. Flexible printed circuit 113, in the illustrative embodiment is coated with a non-electrical ly conductive epoxy that may be infused with optically reflective materials. Flexible printed circuit 113 is adhered to the tube 101 with a heat conducting epoxy to aid in the transmission of the heat from 109 to tube 101. Flexible printed circuit 113 has mounting holes 134 for receiving 109 such that the backs of 109 are in thermal contact with the tube surface 107.
  • Tubular heat sink 101 in the illustrative embodiment is formed in the shape of a polygon and may have any number of sides. Although tubular heat sink 101 in the illustrative embodiment is extruded aluminum, tubular heat sink 101 may comprise other thermal conductive material. Fins 105 may vary in number and location depending on particular LED layouts and wattage. In some instances, surface discontinuities such as heat dissipation protrusions or fins may be added to the exterior surface of tubular heat sink 101. In addition, apertures may be added as surface discontinuities to the tubular heat sink to enhance heat flow.
  • FIGs. 7 and 8 show an alternate elongate thermally conductive member 201 that has both exterior surface discontinuities or heat dissipation protrusions or fins 205 in addition to interior surface discontinuities or heat dissipation protrusions or fins 241.
  • Controller 300 is advantageously utilized in accordance with the principles of the invention.
  • Controller 300 may be any one of a number of commercially available controllers. Each such controller is programmable and includes a processor, and memory (which are not shown). Controller 300 memory is utilized to program operation of the microprocessor. It will be appreciated by those skilled in the art that controller 300 may be integrated into the same chip as sensor 301 and interface 303 that is utilized to interface controller 300 to the cooling device 199. Controller 300 is programmed so that when temperature sensor 301 detects a temperature that is too high, cooling device 199 is activated or, if activated at less than full capacity, is activated to a higher cooling capacity.
  • controller 300 is coupled to power supply 305, which in turn provides power to LEDs 109 at the appropriate voltage level and type via power bus 307, so that the amount of power provided to LEDs 109 may also be regulated to control the amount of power dissipated by LEDs 109.
  • Controller 300 controls the amount of cooling provided by cooling device 199. The amount of cooling provided by cooling device 199 is increased when temperature sensor 301 indicates a predetermined temperature. In addition, controller 300 will turn off all LEDs 109 in the event that a second predetermined temperature threshold is reached or exceeded. Controller 300 also operates to increase the power provided to LEDs 109 in the event that the temperature sensed is below another predetermined threshold.
  • Controller 300 has control input 309 to receive control inputs to determine the on-off status of LEDs 109 and to determine the brightness level output of LEDs 109. In addition, controller 300 is programmed to be responsive to control signals that will command controller 300 to brighten or dim the light output of LEDs 109. Interface 303 is provides the appropriate interface between controller 300 and cooling device 199. [0044] Light source 100 is mounted into a fixture and retained in position by mounting clips 121,123 as most clearly seen in FIGs. 3, 4, and 5. Each of the clips is shaped so as to engage and retain light source 100. Each clip is affixed on one surface 122, 124 to a light fixture.
  • light source 100 is shown as comprising elongate tubular thermally conductive members or heat sinks 101, 201, other extruded elongate members may be used such as channels.
  • cooling by flow of air through elongate thermally conductive members or tubular heat sinks 101, 201 is utilized such that cool or unheated air enters elongate thermally conductive members 101, 201 by fluid movement device 199, passes over the surface discontinuities or heat dissipation protrusions, and exits from the opposite end of elongate thermally conductive member 101, 201 as heated air.
  • fluid movement device 199 In higher wattage light sources, rather than utilizing air as the cooling medium, other fluids may be utilized. In particular, convective heat pumping may be used to remove heat from the interior of the heat sink.
  • the light source of the invention is configured to replace compact fluorescent lighting in decorative applications.
  • the uniformity of light distribution of a light source having an elongate thermally conductive member with heat dissipation protrusions or fins 205 on the outer surface of the elongate thermally conductive member 201 is enhanced by utilization of an appropriately selected coating or treatment to the outer or exterior surfaces of elongate thermally conductive member 201.
  • an appropriately selected coating or treatment to the outer or exterior surfaces of elongate thermally conductive member 201.
  • it has been found that the use of a non-reflective or black surface on the protrusions or fins 205 provides a more uniform light output.
  • the use of reflective or white surfaces on protrusions results in the protrusions producing shadows in the light output.
  • the principles of the invention are not limited to the use of light emitting diodes that emit white light. Different colored light emitting diodes may be used to produce monochromatic light or to produce light that is the combination of different colors.
  • Controller 300 is programmable to be further responsive to control signals 309 to control which of different colored LEDs are activated and the amount of power provided to the different colors such that the color output of lights source 100 is varied.

Abstract

L'invention concerne une source lumineuse utilisant des diodes électroluminescentes qui émettent une lumière blanche. Ces diodes sont montées sur un élément allongé comportant au moins deux surfaces sur lesquelles les diodes électroluminescentes sont montées. Cet élément allongé est thermo-conducteur et est utilisé pour refroidir les diodes électroluminescentes. Dans le mode de réalisation illustré, l'élément allongé est un élément tubulaire par lequel circule un agent caloporteur. Un dispositif de refroidissement ou de mise en mouvement du fluide, couplé à l'élément thermo-conducteur allongé, augmente le refroidissement des diodes électroluminescentes.
PCT/US2004/012991 2003-05-05 2004-04-30 Source lumineuse a diodes electroluminescentes WO2004100220A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/430,698 2003-05-05
US10/430,698 US6815724B2 (en) 2002-05-29 2003-05-05 Light emitting diode light source
US10/430,696 US20040026721A1 (en) 2002-05-29 2003-05-05 Light emitting diode light source
US10/430,696 2003-05-05

Publications (2)

Publication Number Publication Date
WO2004100220A2 true WO2004100220A2 (fr) 2004-11-18
WO2004100220A3 WO2004100220A3 (fr) 2005-01-20

Family

ID=33436686

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/012991 WO2004100220A2 (fr) 2003-05-05 2004-04-30 Source lumineuse a diodes electroluminescentes

Country Status (1)

Country Link
WO (1) WO2004100220A2 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1528315A2 (fr) * 2005-01-11 2005-05-04 Jeffrey Chen Dispositif d'éclairage à moyens de dissipation de chaleur
JP2006310515A (ja) * 2005-04-28 2006-11-09 Citizen Electronics Co Ltd 発光ユニット
US7438448B2 (en) 2004-10-11 2008-10-21 Neobulb Technologies, Inc. Light set with heat dissipation means
WO2009040198A2 (fr) * 2007-09-24 2009-04-02 Osram Gesellschaft mit beschränkter Haftung Dispositif d'éclairage et dispositif de refroidissement

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5890794A (en) * 1996-04-03 1999-04-06 Abtahi; Homayoon Lighting units
US6274924B1 (en) * 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
US6411046B1 (en) * 2000-12-27 2002-06-25 Koninklijke Philips Electronics, N. V. Effective modeling of CIE xy coordinates for a plurality of LEDs for white LED light control

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5890794A (en) * 1996-04-03 1999-04-06 Abtahi; Homayoon Lighting units
US6274924B1 (en) * 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
US6411046B1 (en) * 2000-12-27 2002-06-25 Koninklijke Philips Electronics, N. V. Effective modeling of CIE xy coordinates for a plurality of LEDs for white LED light control

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7438448B2 (en) 2004-10-11 2008-10-21 Neobulb Technologies, Inc. Light set with heat dissipation means
EP1528315A2 (fr) * 2005-01-11 2005-05-04 Jeffrey Chen Dispositif d'éclairage à moyens de dissipation de chaleur
EP1528315A3 (fr) * 2005-01-11 2005-07-06 Jeffrey Chen Dispositif d'éclairage à moyens de dissipation de chaleur
JP2006310515A (ja) * 2005-04-28 2006-11-09 Citizen Electronics Co Ltd 発光ユニット
WO2009040198A2 (fr) * 2007-09-24 2009-04-02 Osram Gesellschaft mit beschränkter Haftung Dispositif d'éclairage et dispositif de refroidissement
WO2009040198A3 (fr) * 2007-09-24 2009-10-15 Osram Gesellschaft mit beschränkter Haftung Dispositif d'éclairage et dispositif de refroidissement

Also Published As

Publication number Publication date
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