WO2004090913A1 - Method for producing molded parts for low-voltage, medium-voltage and high-voltage switchgear - Google Patents
Method for producing molded parts for low-voltage, medium-voltage and high-voltage switchgear Download PDFInfo
- Publication number
- WO2004090913A1 WO2004090913A1 PCT/EP2004/003745 EP2004003745W WO2004090913A1 WO 2004090913 A1 WO2004090913 A1 WO 2004090913A1 EP 2004003745 W EP2004003745 W EP 2004003745W WO 2004090913 A1 WO2004090913 A1 WO 2004090913A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- balls
- switching device
- casting compound
- hollow
- molded parts
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
Definitions
- the invention relates to a method for producing molded insulating parts for switching devices in low, medium and high voltage technology, and to a switching device itself, according to the preamble of claims 1, 2, 3 and 17.
- Vacuum chambers and other parts that were built into the molded insulating parts were cast with their fixed and movable connections directly into the supporting housing made of epoxy resin.
- the materials of the molded parts are coated with a filler powder.
- the casting technique means that the vacuum interrupter or the inserts have to be padded with an elastomer material for mechanical reasons before the casting in epoxy resin.
- the requirements for this material are:
- This upholstery is to absorb stresses in the component caused by mechanical or thermal shrinkage during the manufacture and operation of the epoxy resin components.
- Filler powder mixtures give the components a correspondingly high total weight.
- the object of the invention is to improve a method of the generic type in such a way that the disadvantages mentioned are eliminated while at the same time maintaining the described advantages obtained.
- the essence of the process according to the invention is that a mixture of balls with a statistical distribution of diameters of a size Dx is introduced into the casting compound as a filler.
- Shrinkage during curing can be set significantly lower than the values currently available in the literature; this can also result in a reduction in the expansion coefficient in the finished component.
- the particle or particle matrix is thus distributed more densely or more densely. This creates a mechanically resistant direct casting or direct casting of parts and components.
- the spherical filling material also increases the notch toughness of the hardened casting compound.
- the mechanical shrinkage stresses that are unavoidable in the component can be absorbed by the filled casting resin by virtue of the fact that the filler is spherical in the epoxy resin, which in turn means that the mechanical characteristics of the corresponding mixture are significantly higher in comparison.
- At least one switching chamber is provided with a casting from a first casting compound and then with connections in a block from at least a second casting compound such as silicone or soft epoxy or plastic is poured.
- Epoxy resin is used as the first casting compound and silicone or polyurethane, or polyurethane derivatives or soft epoxy is used as the second casting compound.
- the particles are introduced into both the first and the second casting compound.
- the balls or the hollow balls consist of glass or of ceramic, preferably of aluminum nitride ceramic.
- a material that is suitable for use in electrical switching devices is thus selected
- the degree of filling is set between 50 and 90%. This ensures optimal results with regard to mechanical requirements and crack-preventing measures.
- a new combination of different filler powders in the epoxy resin mixture should enable the inserts (e.g. Vacuum interrupters or other metallic or non-metallic inserts) without the padding but also with the epoxy resin mixture.
- outer diameter mixtures of the spheres or hollow spheres with a bandwidth of 65 micrometers to 120 micrometers are used.
- the particles have an average density of 0.2 g / cm 3 .
- Hollow spheres with a diameter of up to 200 micrometers.
- the above-mentioned density of the hollow spheres means the effective density, that is to say weight per unit volume or the cavity.
- Another aspect is the improvement of thermal continuity when heat is generated in the switchgear. This heat has to be conducted from the inside to the outside, ie to be dissipated.
- Thermal conductivity selected is much more suitable than epoxy resin or another plastic alone. At the same time, the sensitivity to cracks is reduced and a high insulation effect is obtained by filling with particles according to the invention.
- Figure 2 Component according to Figure 1, already in three-phase version.
- Figure 3 Execution with a block encapsulation in, for example, silicone.
- Figure 1 shows an example of a pole part of a switchgear. Here is one
- Vacuum interrupter 1 is encapsulated by a first potting compound 10 made of epoxy resin.
- an epoxy resin casting compound is preferably chosen as the casting compound, which is referred to in the wording of the claims as the first casting compound.
- the particles or balls are preferably made of aluminum nitride.
- Aluminum oxides are also suitable, but the thermal conductivity of AIN is greater than that of Al 2 0 3 .
- Figure 2 shows the arrangement of a three-phase three-phase switching arrangement.
- the last wrapping material is used as the second casting compound 20 epoxy, silicone or polyurethane, into which the pole parts cast with the first casting compound together with the connections / busbars 2 are inserted and enveloped / encapsulated by the second casting compound 20.
- Injection molding processes can also be used here. Epoxy, silicone or polyurethane are used. This is then provided with the filler in the manner described.
- the fillers i.e. the balls, hollow balls and other fillers introduced.
- a statistical distribution of selected particles or sphere sizes leads to a high packing density.
- Epoxy resin composition can be used.
- the degree of filling determines the mechanical and thermal properties. It is primarily 50-90%.
- the density of the epoxy resin mixture is significantly reduced.
- thermosetting molding material eg polyurethane
- the hollow glass ball can be kept in contact with one another in the casting compound, so that the epoxy resin, silicone or polyurethane consequently fills the gusset between the hollow glass balls and fills them without bubbles.
- the coefficient of thermal expansion decreases down to that of glass.
- Pole parts before a series of connections and current transitions which in turn must also be insulated from solid matter and are to be dielectrically sealed at the connection points by appropriate insulation elements.
- all the necessary components such as the vacuum interrupter as an active switching element, a three-position switch -ggf, are placed in an optimized volume. as another vacuum chamber, the power supply rails, transducers and other components introduced. Then all the equipment is in one form preferably cast into a "block" or a unit with a silicone rubber.
- a ceramic filler can be introduced into the silicone. The filler can be introduced into the silicone mass beforehand. Another possibility is to soak the filler, eg with silicone in the evacuated form
- silicone as a potting compound makes it possible to encapsulate an entire technical device with an insulator without the formation of cracks.
- connections to a possibly three-phase "block” are preferably made via cables, connected to commercially available plug connections of the respective plug sizes.
- the sockets are firmly connected and cast in or on the "block".
- cast resin components pole parts, etc. can extend into the silicone compound, see the two sketches. On which e.g. a corresponding drive can be installed from the outside.
- the remaining parts are mounted between the components. After applying appropriate adhesion promoters, an electrically "tight" block with all the necessary components can be produced.
- the heat flow that arises in the interior of the block can be conducted to the surface of the block in particular using a filler made of AIN (up to 220W / mK). If this ceramic material with a high filler content is introduced into the silicone material, the thermal conductivity of the casting compound can be increased significantly and the dielectric performance can be maintained or increased at today's level.
- AIN up to 220W / mK
- the heat flow can be dissipated to the outside by appropriate enlargement of the surface (ribbing connected with convection of the surrounding air) or by cooling elements at corresponding dielectric non-critical points.
- the filler is introduced directly into a mold surrounding the components, comparatively "large" particle diameters of the ceramic component can be selected. That is, particle sizes, for example in the 1-1 .mu.m range, preferably with a spherical shape to increase the notch toughness on the finished block. Different in In the event of potting with a pre-assembled potting compound. In this case, correspondingly finer particles should be selected so that a sufficiently low viscosity is achieved for the subsequent processing process
- Components also produce individual blocks.
- the use of individual blocks can create a service-friendly and cost-effective solution
- Figure 3 shows the introduction of all described in a translucent representation
- the blocks are separated from one another by plates 3 located between them for heat dissipation.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04726149A EP1614124B1 (en) | 2003-04-08 | 2004-04-07 | Method for producing molded parts for low-voltage, medium-voltage and high-voltage switchgear |
US10/552,651 US20070057399A1 (en) | 2003-04-08 | 2004-04-07 | Method for producing molded parts for low-voltage, medium-voltage and high-voltage switchgear |
DE502004003142T DE502004003142D1 (en) | 2003-04-08 | 2004-04-07 | METHOD FOR PRODUCING SHAPES FOR SWITCHING DEVICES OF LOW, MEDIUM AND HIGH VOLTAGE ENGINEERING |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10315927.4 | 2003-04-08 | ||
DE10315927 | 2003-04-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004090913A1 true WO2004090913A1 (en) | 2004-10-21 |
Family
ID=33154114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2004/003745 WO2004090913A1 (en) | 2003-04-08 | 2004-04-07 | Method for producing molded parts for low-voltage, medium-voltage and high-voltage switchgear |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070057399A1 (en) |
EP (1) | EP1614124B1 (en) |
CN (1) | CN100578686C (en) |
AT (1) | ATE356413T1 (en) |
DE (1) | DE502004003142D1 (en) |
ES (1) | ES2284005T3 (en) |
WO (1) | WO2004090913A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010112272A1 (en) | 2009-04-02 | 2010-10-07 | Huntsman Advanced Materials (Switzerland) Gmbh | Direct overmolding |
EP2021809B1 (en) | 2006-05-05 | 2016-07-13 | WABCO GmbH | Inductive sensor |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007062220A2 (en) * | 2005-11-23 | 2007-05-31 | Polyplus Battery Company | Li/air non-aqueous batteries |
WO2008029329A2 (en) * | 2006-09-08 | 2008-03-13 | Philips Intellectual Property & Standards Gmbh | System and method for manufacturing molded structures using a high density matrix of microparticles |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3933712A (en) * | 1974-04-29 | 1976-01-20 | Burr-Brown Research Corporation | Novel encapsulating material and method |
US4134848A (en) * | 1976-06-28 | 1979-01-16 | The United States Of America As Represented By The Secretary Of The Navy | Composite for improved stripline board material |
DE3527696A1 (en) * | 1985-08-02 | 1987-02-12 | Jones Parker & Co Ltd | High density foamable casting composition |
DE3913488A1 (en) * | 1989-04-25 | 1990-10-31 | Bosch Gmbh Robert | Casting compsn. e.g. for encapsulating semiconductor - contg. cyclo-aliphatic and/or novolak epoxide] resin, methyl-nadic anhydride, imidazole and filler |
DE9321201U1 (en) * | 1993-10-28 | 1996-08-01 | Draegerwerk Ag | Potting compound for an electrical assembly |
US5608028A (en) * | 1994-02-02 | 1997-03-04 | Delco Electronics Corp. | Polybutadiene urethane potting material |
EP1300439A1 (en) * | 2001-09-26 | 2003-04-09 | Abb Research Ltd. | Filler and its use in isolating assemblies |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3812314A (en) * | 1971-08-23 | 1974-05-21 | Gen Electric | High power electrical bushing having a vacuum switch encapsulated therein |
CN1239593C (en) * | 2000-02-25 | 2006-02-01 | 阿尔卑斯电气株式会社 | Conductive resin composition and coded switch using said composition |
-
2004
- 2004-04-07 CN CN200480015156A patent/CN100578686C/en not_active Expired - Fee Related
- 2004-04-07 EP EP04726149A patent/EP1614124B1/en not_active Expired - Lifetime
- 2004-04-07 DE DE502004003142T patent/DE502004003142D1/en not_active Expired - Lifetime
- 2004-04-07 WO PCT/EP2004/003745 patent/WO2004090913A1/en active IP Right Grant
- 2004-04-07 ES ES04726149T patent/ES2284005T3/en not_active Expired - Lifetime
- 2004-04-07 US US10/552,651 patent/US20070057399A1/en not_active Abandoned
- 2004-04-07 AT AT04726149T patent/ATE356413T1/en not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3933712A (en) * | 1974-04-29 | 1976-01-20 | Burr-Brown Research Corporation | Novel encapsulating material and method |
US4134848A (en) * | 1976-06-28 | 1979-01-16 | The United States Of America As Represented By The Secretary Of The Navy | Composite for improved stripline board material |
DE3527696A1 (en) * | 1985-08-02 | 1987-02-12 | Jones Parker & Co Ltd | High density foamable casting composition |
DE3913488A1 (en) * | 1989-04-25 | 1990-10-31 | Bosch Gmbh Robert | Casting compsn. e.g. for encapsulating semiconductor - contg. cyclo-aliphatic and/or novolak epoxide] resin, methyl-nadic anhydride, imidazole and filler |
DE9321201U1 (en) * | 1993-10-28 | 1996-08-01 | Draegerwerk Ag | Potting compound for an electrical assembly |
US5608028A (en) * | 1994-02-02 | 1997-03-04 | Delco Electronics Corp. | Polybutadiene urethane potting material |
EP1300439A1 (en) * | 2001-09-26 | 2003-04-09 | Abb Research Ltd. | Filler and its use in isolating assemblies |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2021809B1 (en) | 2006-05-05 | 2016-07-13 | WABCO GmbH | Inductive sensor |
WO2010112272A1 (en) | 2009-04-02 | 2010-10-07 | Huntsman Advanced Materials (Switzerland) Gmbh | Direct overmolding |
US8999433B2 (en) | 2009-04-02 | 2015-04-07 | Huntsman International Llc | Direct overmolding |
Also Published As
Publication number | Publication date |
---|---|
DE502004003142D1 (en) | 2007-04-19 |
EP1614124B1 (en) | 2007-03-07 |
CN100578686C (en) | 2010-01-06 |
US20070057399A1 (en) | 2007-03-15 |
ES2284005T3 (en) | 2007-11-01 |
CN1799110A (en) | 2006-07-05 |
ATE356413T1 (en) | 2007-03-15 |
EP1614124A1 (en) | 2006-01-11 |
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