WO2004088582A3 - Method for making a smart card antenna on a thermoplastic support and resulting smart card - Google Patents

Method for making a smart card antenna on a thermoplastic support and resulting smart card Download PDF

Info

Publication number
WO2004088582A3
WO2004088582A3 PCT/FR2004/000777 FR2004000777W WO2004088582A3 WO 2004088582 A3 WO2004088582 A3 WO 2004088582A3 FR 2004000777 W FR2004000777 W FR 2004000777W WO 2004088582 A3 WO2004088582 A3 WO 2004088582A3
Authority
WO
WIPO (PCT)
Prior art keywords
smart card
antenna
support
making
contact
Prior art date
Application number
PCT/FR2004/000777
Other languages
French (fr)
Other versions
WO2004088582A2 (en
Inventor
Pierre Benato
Original Assignee
Ask Sa
Pierre Benato
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN2004800085926A priority Critical patent/CN1768349B/en
Priority to US10/550,294 priority patent/US7597266B2/en
Priority to DE602004022031T priority patent/DE602004022031D1/en
Priority to AU2004225311A priority patent/AU2004225311A1/en
Priority to CA2520441A priority patent/CA2520441C/en
Priority to EP04742381A priority patent/EP1609117B1/en
Priority to JP2006505761A priority patent/JP4423287B2/en
Priority to MXPA05010211A priority patent/MXPA05010211A/en
Application filed by Ask Sa, Pierre Benato filed Critical Ask Sa
Priority to BRPI0408701-1A priority patent/BRPI0408701A/en
Publication of WO2004088582A2 publication Critical patent/WO2004088582A2/en
Publication of WO2004088582A3 publication Critical patent/WO2004088582A3/en
Priority to IL170967A priority patent/IL170967A/en
Priority to HK06112151.4A priority patent/HK1091571A1/en
Priority to AU2011200175A priority patent/AU2011200175B2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • B32B37/185—Laminating sheets, panels or inserts between two discrete plastic layers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/0773—Physical layout of the record carrier the record carrier comprising means to protect itself against external heat sources
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B32B2305/342—Chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards

Abstract

The invention concerns a method for making a hybrid contact/non-contact or non-contact smart card comprising a support (10, 11) whereon is produced the antenna, two card bodies (32, 42, 34, 44) on either side of the support, each of the card bodies consisting of at least one thermoplastic layer, and one chip (30) or module connected to the antenna. Said method comprises the following steps: depositing a layer of a material consisting of a major amount of resin on a predetermined zone (12, 13) of the antenna support; making the antenna which consists in screen-printing turns (14, 15) and two connection pads (16, 18, 17, 19) of conductive polymer ink on the zone previously produced on the support and subjecting the support to a heat treatment to cure the ink.
PCT/FR2004/000777 2003-03-28 2004-03-26 Method for making a smart card antenna on a thermoplastic support and resulting smart card WO2004088582A2 (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
JP2006505761A JP4423287B2 (en) 2003-03-28 2004-03-26 Method of making smart card antenna on thermoplastic support and resulting smart card
DE602004022031T DE602004022031D1 (en) 2003-03-28 2004-03-26 METHOD FOR PRODUCING A CHIP CARDS ANTENNA ON A THERMOPLASTIC CARRIER AND A CHIP CARD PRODUCED THEREFROM
AU2004225311A AU2004225311A1 (en) 2003-03-28 2004-03-26 Method for making a smart card antenna on a thermoplastic support and resulting smart card
CA2520441A CA2520441C (en) 2003-03-28 2004-03-26 Method for making a smart card antenna on a thermoplastic support and resulting smart card
EP04742381A EP1609117B1 (en) 2003-03-28 2004-03-26 Method for making a smart card antenna on a thermoplastic support and resulting smart card
CN2004800085926A CN1768349B (en) 2003-03-28 2004-03-26 Method for making a smart card antenna on a thermoplastic support and resulting smart card.
MXPA05010211A MXPA05010211A (en) 2003-03-28 2004-03-26 Method for making a smart card antenna on a thermoplastic support and resulting smart card.
US10/550,294 US7597266B2 (en) 2003-03-28 2004-03-26 Method for making a smart card antenna on a thermoplastic support and resulting smartcard
BRPI0408701-1A BRPI0408701A (en) 2003-03-28 2004-03-26 The process of manufacturing a contactless contactless contactless chip card antenna and contactless contactless contactless chip card antenna
IL170967A IL170967A (en) 2003-03-28 2005-09-19 Method for making a smart card antenna on a thermoplastic support and resulting smart card
HK06112151.4A HK1091571A1 (en) 2003-03-28 2006-11-03 Method for making a smart card antenna on a thermoplastic support and resulting smart card
AU2011200175A AU2011200175B2 (en) 2003-03-28 2011-01-17 Method for making a smart card antenna on a thermoplastic support and resulting smart card

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0303817A FR2853115B1 (en) 2003-03-28 2003-03-28 METHOD FOR MANUFACTURING A CHIP CARD ANTENNA ON A THERMOPLASTIC CARRIER AND A CHIP CARD OBTAINED BY SAID METHOD
FR03/03817 2003-03-28

Publications (2)

Publication Number Publication Date
WO2004088582A2 WO2004088582A2 (en) 2004-10-14
WO2004088582A3 true WO2004088582A3 (en) 2005-05-19

Family

ID=32947238

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2004/000777 WO2004088582A2 (en) 2003-03-28 2004-03-26 Method for making a smart card antenna on a thermoplastic support and resulting smart card

Country Status (19)

Country Link
US (1) US7597266B2 (en)
EP (1) EP1609117B1 (en)
JP (1) JP4423287B2 (en)
KR (1) KR101033013B1 (en)
CN (1) CN1768349B (en)
AU (2) AU2004225311A1 (en)
BR (1) BRPI0408701A (en)
CA (1) CA2520441C (en)
DE (1) DE602004022031D1 (en)
ES (1) ES2330336T3 (en)
FR (1) FR2853115B1 (en)
HK (1) HK1091571A1 (en)
IL (1) IL170967A (en)
MX (1) MXPA05010211A (en)
PT (1) PT1609117E (en)
RU (1) RU2337400C2 (en)
TW (1) TWI337423B (en)
WO (1) WO2004088582A2 (en)
ZA (1) ZA200507781B (en)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005030627A1 (en) * 2005-06-30 2007-01-04 Bundesdruckerei Gmbh Security or value document with a device for contactless communication with an external reading and / or writing device
US7224278B2 (en) 2005-10-18 2007-05-29 Avery Dennison Corporation Label with electronic components and method of making same
EP2021985B1 (en) * 2006-04-28 2012-04-18 Ask S.A. Radio frequency identification device medium and method for making same
US7701352B2 (en) 2006-11-22 2010-04-20 Avery Dennison Corporation RFID label with release liner window, and method of making
CA2678556C (en) * 2007-02-23 2012-01-31 Newpage Wisconsin System Inc. Multifunctional paper identification label
HK1109708A2 (en) 2007-04-24 2008-06-13 On Track Innovations Ltd Interface card and apparatus and process for the formation thereof
WO2008143043A1 (en) * 2007-05-14 2008-11-27 Tateyama Kagaku Industry Co., Ltd. Wireless ic tag and method for manufacturing wireless ic tag
FR2917534B1 (en) * 2007-06-15 2009-10-02 Ask Sa METHOD FOR CONNECTING AN ELECTRONIC CHIP TO A RADIO FREQUENCY IDENTIFICATION DEVICE
EP2232414A4 (en) * 2007-12-19 2011-05-04 Linda Seah Contact-less and dual interface inlays and methods for producing the same
AU2009200139B2 (en) 2008-01-15 2012-02-16 Aristocrat Technologies Australia Pty Limited A method of processing a user data card, an interface module and a gaming system
US7744005B2 (en) * 2008-01-16 2010-06-29 Taiwan Name Plate Co., Ltd. Induction card with a printed antenna
US20090229108A1 (en) * 2008-03-17 2009-09-17 Ethertronics, Inc. Methods for forming antennas using thermoforming
CN101873776A (en) * 2009-04-27 2010-10-27 深圳富泰宏精密工业有限公司 Electronic device housing with antenna function and manufacturing method thereof
CN101888751A (en) * 2009-05-11 2010-11-17 深圳富泰宏精密工业有限公司 Electronic device case with antenna function and manufacturing method thereof
FR2948796A1 (en) * 2009-07-28 2011-02-04 Ask Sa RADIOFREQUENCY IDENTIFICATION DEVICE MEDIUM FOR A HYBRID CARD AND METHOD FOR MANUFACTURING THE SAME
FR2962579A1 (en) * 2010-07-12 2012-01-13 Ask Sa RADIO FREQUENCY IDENTIFICATION DEVICE OF POLYCARBONATE AND METHOD OF MANUFACTURING THE SAME
FR2977958A1 (en) * 2011-07-12 2013-01-18 Ask Sa CONTACT-CONTACTLESS HYBRID INTEGRATED CIRCUIT BOARD WITH REINFORCED HOLDING OF THE ELECTRONIC MODULE
US20130075469A1 (en) * 2011-09-28 2013-03-28 Silviu Stochita My Vacation Card
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
US9439334B2 (en) 2012-04-03 2016-09-06 X-Card Holdings, Llc Information carrying card comprising crosslinked polymer composition, and method of making the same
US9122968B2 (en) 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
FR3002108A1 (en) * 2013-02-14 2014-08-15 Ask Sa Method for manufacturing thin carrier of radio frequency device e.g. smart card, operating in high frequency field, involves heat treating contact pads of antenna to dry polymer ink, and connecting chip or electronic module to contact pads
EP2973236B1 (en) 2013-03-15 2019-01-09 X-Card Holdings, LLC Methods of making a core layer for an information carrying card, and resulting products
RU2607725C1 (en) * 2015-08-06 2017-01-10 Общество с ограниченной ответственностью "Интеллектуальные Системы Управления Бизнесом" Smart card with dual interface and its manufacturing method
FR3045891A1 (en) * 2015-12-22 2017-06-23 Oberthur Technologies METHOD FOR MANUFACTURING BY HOT LAMINATION A MICROCIRCUIT CARD COMPRISING A FLEX IN A CAVITY AND CARD THUS OBTAINED
CN107181049B (en) * 2016-03-10 2020-01-31 速码波科技股份有限公司 Antenna module
RU2629143C1 (en) * 2016-07-21 2017-08-24 Общество с ограниченной ответственностью "Интеллектуальные Системы Управления Бизнесом" Plastic keychain with full-colour printing, equipped with built-in rfid-tag, and method of its manufacture
DE102016216365A1 (en) 2016-08-31 2018-03-01 Robert Bosch Gmbh transducer means
US10163050B2 (en) * 2016-11-29 2018-12-25 Capital One Services, Llc Wood inlay card and method for making the same
CN109769044A (en) * 2017-11-09 2019-05-17 天翼电信终端有限公司 A kind of mobile terminal
WO2019173455A1 (en) 2018-03-07 2019-09-12 X-Card Holdings, Llc Metal card

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2782821A1 (en) * 1998-08-27 2000-03-03 Gemplus Card Int NON-CONTACT CHIP CARD MANUFACTURING PROCESS
WO2001003188A1 (en) * 1999-07-01 2001-01-11 Intermec Ip Corp. Integrated circuit attachment process and apparatus
WO2001095252A1 (en) * 2000-06-06 2001-12-13 Rafsec Oy A smart card web and a method for its manufacture
EP1189168A2 (en) * 2000-09-14 2002-03-20 Shinko Electric Industries Co., Ltd. IC card, antenna frame for IC card and method for manufacturing the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2716281B1 (en) * 1994-02-14 1996-05-03 Gemplus Card Int Method of manufacturing a contactless card.
FR2769440B1 (en) * 1997-10-03 1999-12-03 Gemplus Card Int METHOD FOR MANUFACTURING AN ELECTRONIC CHIP AND / OR ANTENNA DEVICE AND DEVICE OBTAINED BY THE METHOD
FR2769389B1 (en) * 1997-10-07 2000-01-28 Rue Cartes Et Systemes De MICROCIRCUIT CARD COMBINING EXTERIOR CONTACT RANGES AND AN ANTENNA, AND METHOD FOR MANUFACTURING SUCH A CARD
FR2778475B1 (en) * 1998-05-11 2001-11-23 Schlumberger Systems & Service NON-CONTACT TYPE MEMORY CARD, AND METHOD FOR MANUFACTURING SUCH A CARD
US6459588B1 (en) * 1998-07-08 2002-10-01 Dai Nippon Printing Co., Ltd. Noncontact IC card and fabrication method thereof
FR2800518B1 (en) * 1999-10-28 2007-02-23 A S K HIGH INDUCTANCE COUPLING ANTENNA
FR2801709B1 (en) * 1999-11-29 2002-02-15 A S K CONTACTLESS OR CONTACT-FREE HYBRID CHIP CARD TO REDUCE THE RISK OF FRAUD
FR2801707B1 (en) * 1999-11-29 2002-02-15 A S K METHOD FOR MANUFACTURING A CONTACT-FREE CONTACT HYBRID CHIP CARD WITH AN ANTENNA SUPPORT OF FIBROUS MATERIAL
JP3680676B2 (en) * 2000-02-03 2005-08-10 松下電器産業株式会社 Contactless data carrier
JP2002074300A (en) * 2000-08-31 2002-03-15 Shinko Electric Ind Co Ltd Non-contact type ic card and method for manufacturing the same
JP4873776B2 (en) * 2000-11-30 2012-02-08 ソニー株式会社 Non-contact IC card
FR2826154B1 (en) * 2001-06-14 2004-07-23 A S K CHIP CARD WITHOUT CONTACT WITH AN ANTENNA SUPPORT AND CHIP SUPPORT OF FIBROUS MATERIAL
EP1426177A4 (en) * 2001-09-05 2008-01-02 Sony Corp Plastic card
FR2881252A1 (en) * 2005-01-24 2006-07-28 Ask Sa MEDIUM-RESISTANT RADIOFREQUENCY IDENTIFICATION DEVICE AND METHOD FOR MANUFACTURING THE SAME

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2782821A1 (en) * 1998-08-27 2000-03-03 Gemplus Card Int NON-CONTACT CHIP CARD MANUFACTURING PROCESS
WO2001003188A1 (en) * 1999-07-01 2001-01-11 Intermec Ip Corp. Integrated circuit attachment process and apparatus
WO2001095252A1 (en) * 2000-06-06 2001-12-13 Rafsec Oy A smart card web and a method for its manufacture
EP1189168A2 (en) * 2000-09-14 2002-03-20 Shinko Electric Industries Co., Ltd. IC card, antenna frame for IC card and method for manufacturing the same

Also Published As

Publication number Publication date
RU2005133201A (en) 2006-03-10
CN1768349B (en) 2010-04-28
WO2004088582A2 (en) 2004-10-14
FR2853115B1 (en) 2005-05-06
MXPA05010211A (en) 2005-11-08
BRPI0408701A (en) 2006-03-07
IL170967A (en) 2011-05-31
EP1609117A2 (en) 2005-12-28
TWI337423B (en) 2011-02-11
AU2011200175B2 (en) 2011-09-15
KR20060009823A (en) 2006-02-01
FR2853115A1 (en) 2004-10-01
HK1091571A1 (en) 2007-01-19
CN1768349A (en) 2006-05-03
EP1609117B1 (en) 2009-07-15
US20060181478A1 (en) 2006-08-17
CA2520441C (en) 2012-11-06
KR101033013B1 (en) 2011-05-09
DE602004022031D1 (en) 2009-08-27
PT1609117E (en) 2009-10-20
ZA200507781B (en) 2006-06-28
US7597266B2 (en) 2009-10-06
AU2011200175A1 (en) 2011-02-03
RU2337400C2 (en) 2008-10-27
ES2330336T3 (en) 2009-12-09
JP4423287B2 (en) 2010-03-03
AU2004225311A1 (en) 2004-10-14
TW200419845A (en) 2004-10-01
JP2006523395A (en) 2006-10-12
CA2520441A1 (en) 2004-10-14

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