WO2004086500A3 - Boitier (opto-)electronique a fond alveolaire a regulation et de dissipation thermique par effet thermoelectrique (peltier) et procede pour sa fabrication - Google Patents

Boitier (opto-)electronique a fond alveolaire a regulation et de dissipation thermique par effet thermoelectrique (peltier) et procede pour sa fabrication Download PDF

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Publication number
WO2004086500A3
WO2004086500A3 PCT/FR2004/000727 FR2004000727W WO2004086500A3 WO 2004086500 A3 WO2004086500 A3 WO 2004086500A3 FR 2004000727 W FR2004000727 W FR 2004000727W WO 2004086500 A3 WO2004086500 A3 WO 2004086500A3
Authority
WO
WIPO (PCT)
Prior art keywords
peltier
opto
heat dissipation
production
thermoelectric effect
Prior art date
Application number
PCT/FR2004/000727
Other languages
English (en)
Other versions
WO2004086500A2 (fr
Inventor
Philippe Maeder
Jean-Francois Lecoeuche
Original Assignee
Egide Sa
Philippe Maeder
Jean-Francois Lecoeuche
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR0303802A external-priority patent/FR2853137B1/fr
Priority claimed from FR0303805A external-priority patent/FR2853138A1/fr
Application filed by Egide Sa, Philippe Maeder, Jean-Francois Lecoeuche filed Critical Egide Sa
Publication of WO2004086500A2 publication Critical patent/WO2004086500A2/fr
Publication of WO2004086500A3 publication Critical patent/WO2004086500A3/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H10N19/101—Multiple thermocouples connected in a cascade arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Hybrid Cells (AREA)

Abstract

Boîtier électronique ou optoélectronique thermo-régulant, hautement hermétique de type céramique / céramique ou céramique / métal, avec un fond céramique prenant la forme d’une alveoli, et integrand usr la face extern au Moines de ladite alveoli un système de régulation et de dissipation thermique par effet themoélectrique (Peltier).
PCT/FR2004/000727 2003-03-24 2004-03-24 Boitier (opto-)electronique a fond alveolaire a regulation et de dissipation thermique par effet thermoelectrique (peltier) et procede pour sa fabrication WO2004086500A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
FR0303802 2003-03-24
FR0303802A FR2853137B1 (fr) 2003-03-24 2003-03-24 Boitier electronique ou optoelectronique thermo-regulant a fond alveolaire hautement hermetique integrant un systeme de regulation et de dissipation thermique par effet thermoelectrique (peltier)
FR0303805A FR2853138A1 (fr) 2003-03-25 2003-03-25 Boitier electronique ou optoelectronique thermo-regulant hautement hermetique integrant au moins un systeme de regulation et de dissipation thermique par effet thermoelectrique (peltier)
FR0303805 2003-03-25

Publications (2)

Publication Number Publication Date
WO2004086500A2 WO2004086500A2 (fr) 2004-10-07
WO2004086500A3 true WO2004086500A3 (fr) 2005-04-14

Family

ID=33099894

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2004/000727 WO2004086500A2 (fr) 2003-03-24 2004-03-24 Boitier (opto-)electronique a fond alveolaire a regulation et de dissipation thermique par effet thermoelectrique (peltier) et procede pour sa fabrication

Country Status (1)

Country Link
WO (1) WO2004086500A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110085561A (zh) * 2019-06-06 2019-08-02 上海金卫实业有限公司 一种新型mos管及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4510000A (en) * 1983-11-30 1985-04-09 International Business Machines Corporation Method for palladium activating molybdenum metallized features on a ceramic substrate
US4873566A (en) * 1985-10-28 1989-10-10 American Telephone And Telegraph Company Multilayer ceramic laser package
US5040381A (en) * 1990-04-19 1991-08-20 Prime Computer, Inc. Apparatus for cooling circuits
US5637921A (en) * 1995-04-21 1997-06-10 Sun Microsystems, Inc. Sub-ambient temperature electronic package
US6043982A (en) * 1998-04-01 2000-03-28 Raytheon Company Integrated circuit package having a thermoelectric cooling element therein
US6262357B1 (en) * 1998-08-27 2001-07-17 International Business Machines Corporation Thermoelectric devices and methods for making the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4510000A (en) * 1983-11-30 1985-04-09 International Business Machines Corporation Method for palladium activating molybdenum metallized features on a ceramic substrate
US4873566A (en) * 1985-10-28 1989-10-10 American Telephone And Telegraph Company Multilayer ceramic laser package
US5040381A (en) * 1990-04-19 1991-08-20 Prime Computer, Inc. Apparatus for cooling circuits
US5637921A (en) * 1995-04-21 1997-06-10 Sun Microsystems, Inc. Sub-ambient temperature electronic package
US6043982A (en) * 1998-04-01 2000-03-28 Raytheon Company Integrated circuit package having a thermoelectric cooling element therein
US6262357B1 (en) * 1998-08-27 2001-07-17 International Business Machines Corporation Thermoelectric devices and methods for making the same

Also Published As

Publication number Publication date
WO2004086500A2 (fr) 2004-10-07

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