WO2004085706A1 - Solution for etching copper surfaces and method of depositing metal on copper surfaces - Google Patents
Solution for etching copper surfaces and method of depositing metal on copper surfaces Download PDFInfo
- Publication number
- WO2004085706A1 WO2004085706A1 PCT/EP2004/002702 EP2004002702W WO2004085706A1 WO 2004085706 A1 WO2004085706 A1 WO 2004085706A1 EP 2004002702 W EP2004002702 W EP 2004002702W WO 2004085706 A1 WO2004085706 A1 WO 2004085706A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solution
- copper
- group
- sulfonic acid
- solution according
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 93
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 92
- 239000010949 copper Substances 0.000 title claims abstract description 92
- 238000000034 method Methods 0.000 title claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 40
- 239000002184 metal Substances 0.000 title claims abstract description 40
- 238000005530 etching Methods 0.000 title claims abstract description 17
- 238000000151 deposition Methods 0.000 title claims abstract description 8
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims abstract description 35
- -1 aromatic sulfonic acids Chemical class 0.000 claims abstract description 26
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000000126 substance Substances 0.000 claims abstract description 16
- 150000003839 salts Chemical class 0.000 claims abstract description 14
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 12
- 239000000969 carrier Substances 0.000 claims abstract description 9
- 239000004065 semiconductor Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 239000007800 oxidant agent Substances 0.000 claims abstract description 5
- 150000004965 peroxy acids Chemical class 0.000 claims abstract description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 26
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 19
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
- 229910052718 tin Inorganic materials 0.000 claims description 13
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 239000011135 tin Substances 0.000 claims description 12
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 10
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 230000002378 acidificating effect Effects 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 229910052763 palladium Inorganic materials 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 125000003118 aryl group Chemical group 0.000 claims description 6
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 5
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 5
- 229920001223 polyethylene glycol Polymers 0.000 claims description 5
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 5
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- 239000002671 adjuvant Substances 0.000 claims description 4
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 claims description 4
- 229940092714 benzenesulfonic acid Drugs 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- UYTPUPDQBNUYGX-UHFFFAOYSA-N guanine Chemical compound O=C1NC(N)=NC2=C1N=CN2 UYTPUPDQBNUYGX-UHFFFAOYSA-N 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- 150000002391 heterocyclic compounds Chemical class 0.000 claims description 3
- 150000003254 radicals Chemical class 0.000 claims description 3
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 claims description 2
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 claims description 2
- RSEBUVRVKCANEP-UHFFFAOYSA-N 2-pyrroline Chemical compound C1CC=CN1 RSEBUVRVKCANEP-UHFFFAOYSA-N 0.000 claims description 2
- ZAJAQTYSTDTMCU-UHFFFAOYSA-N 3-aminobenzenesulfonic acid Chemical compound NC1=CC=CC(S(O)(=O)=O)=C1 ZAJAQTYSTDTMCU-UHFFFAOYSA-N 0.000 claims description 2
- GFFGJBXGBJISGV-UHFFFAOYSA-N Adenine Chemical compound NC1=NC=NC2=C1N=CN2 GFFGJBXGBJISGV-UHFFFAOYSA-N 0.000 claims description 2
- 229930024421 Adenine Natural products 0.000 claims description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 2
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 claims description 2
- LEHOTFFKMJEONL-UHFFFAOYSA-N Uric Acid Chemical compound N1C(=O)NC(=O)C2=C1NC(=O)N2 LEHOTFFKMJEONL-UHFFFAOYSA-N 0.000 claims description 2
- TVWHNULVHGKJHS-UHFFFAOYSA-N Uric acid Natural products N1C(=O)NC(=O)C2NC(=O)NC21 TVWHNULVHGKJHS-UHFFFAOYSA-N 0.000 claims description 2
- 229960000643 adenine Drugs 0.000 claims description 2
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 claims description 2
- 229940044654 phenolsulfonic acid Drugs 0.000 claims description 2
- 229920001451 polypropylene glycol Polymers 0.000 claims description 2
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 claims description 2
- ZVJHJDDKYZXRJI-UHFFFAOYSA-N pyrroline Natural products C1CC=NC1 ZVJHJDDKYZXRJI-UHFFFAOYSA-N 0.000 claims description 2
- 150000003536 tetrazoles Chemical class 0.000 claims description 2
- 150000003852 triazoles Chemical class 0.000 claims description 2
- 229940116269 uric acid Drugs 0.000 claims description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 1
- 159000000001 potassium salts Chemical class 0.000 claims 1
- 229910052708 sodium Inorganic materials 0.000 claims 1
- 239000011734 sodium Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000001465 metallisation Methods 0.000 abstract description 8
- 239000000243 solution Substances 0.000 description 106
- 239000010410 layer Substances 0.000 description 36
- 238000007747 plating Methods 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 239000008367 deionised water Substances 0.000 description 9
- 229910021641 deionized water Inorganic materials 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 239000002253 acid Substances 0.000 description 8
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 230000001464 adherent effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000003638 chemical reducing agent Chemical class 0.000 description 5
- 239000008139 complexing agent Substances 0.000 description 5
- 239000000470 constituent Substances 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 238000011282 treatment Methods 0.000 description 5
- 159000000009 barium salts Chemical class 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 4
- AZUYLZMQTIKGSC-UHFFFAOYSA-N 1-[6-[4-(5-chloro-6-methyl-1H-indazol-4-yl)-5-methyl-3-(1-methylindazol-5-yl)pyrazol-1-yl]-2-azaspiro[3.3]heptan-2-yl]prop-2-en-1-one Chemical compound ClC=1C(=C2C=NNC2=CC=1C)C=1C(=NN(C=1C)C1CC2(CN(C2)C(C=C)=O)C1)C=1C=C2C=NN(C2=CC=1)C AZUYLZMQTIKGSC-UHFFFAOYSA-N 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 238000004630 atomic force microscopy Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 125000005385 peroxodisulfate group Chemical group 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- FEPBITJSIHRMRT-UHFFFAOYSA-N 4-hydroxybenzenesulfonic acid Chemical compound OC1=CC=C(S(O)(=O)=O)C=C1 FEPBITJSIHRMRT-UHFFFAOYSA-N 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- WQYVRQLZKVEZGA-UHFFFAOYSA-N hypochlorite Chemical compound Cl[O-] WQYVRQLZKVEZGA-UHFFFAOYSA-N 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000008929 regeneration Effects 0.000 description 2
- 238000011069 regeneration method Methods 0.000 description 2
- 239000012266 salt solution Substances 0.000 description 2
- 150000003460 sulfonic acids Chemical class 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 150000003585 thioureas Chemical class 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 description 1
- YNJSNEKCXVFDKW-UHFFFAOYSA-N 3-(5-amino-1h-indol-3-yl)-2-azaniumylpropanoate Chemical compound C1=C(N)C=C2C(CC(N)C(O)=O)=CNC2=C1 YNJSNEKCXVFDKW-UHFFFAOYSA-N 0.000 description 1
- ONMOULMPIIOVTQ-UHFFFAOYSA-M 3-Nitrobenzene sulphonate Chemical compound [O-][N+](=O)C1=CC=CC(S([O-])(=O)=O)=C1 ONMOULMPIIOVTQ-UHFFFAOYSA-M 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000005695 Ammonium acetate Substances 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical class [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical class [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 description 1
- 241001424392 Lucia limbaria Species 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- CWRVKFFCRWGWCS-UHFFFAOYSA-N Pentrazole Chemical compound C1CCCCC2=NN=NN21 CWRVKFFCRWGWCS-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 238000006887 Ullmann reaction Methods 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- WNWZEDFKCSYSFH-UHFFFAOYSA-N [O-2].[O-2].[Zr+4].[O-2].[Ce+3].[O-2].[O-2].[Al+3].[Si](=O)=O Chemical compound [O-2].[O-2].[Zr+4].[O-2].[Ce+3].[O-2].[O-2].[Al+3].[Si](=O)=O WNWZEDFKCSYSFH-UHFFFAOYSA-N 0.000 description 1
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- WDIHJSXYQDMJHN-UHFFFAOYSA-L barium chloride Chemical compound [Cl-].[Cl-].[Ba+2] WDIHJSXYQDMJHN-UHFFFAOYSA-L 0.000 description 1
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- 239000002585 base Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 1
- MOOAHMCRPCTRLV-UHFFFAOYSA-N boron sodium Chemical compound [B].[Na] MOOAHMCRPCTRLV-UHFFFAOYSA-N 0.000 description 1
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- BLNWTAHYTCHDJH-UHFFFAOYSA-O hydroxy(oxo)azanium Chemical compound O[NH+]=O BLNWTAHYTCHDJH-UHFFFAOYSA-O 0.000 description 1
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- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
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- 238000012360 testing method Methods 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- OBBXFSIWZVFYJR-UHFFFAOYSA-L tin(2+);sulfate Chemical compound [Sn+2].[O-]S([O-])(=O)=O OBBXFSIWZVFYJR-UHFFFAOYSA-L 0.000 description 1
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 1
- 238000006276 transfer reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
Definitions
- the invention relates to a solution for etching copper or of a copper alloy and to a method of depositing metal onto the surface of copper or a copper alloy, said surface having been previously etched using said solution.
- Both the solution and the method preferably serve to produce circuit carriers, more specifically printed circuit boards, or are suitable for the semiconductor technique, as well as to produce leadframes and contacts such as e.g., multipoint connectors and contacts in switches, plug and socket connectors, sockets and plugs.
- copper surfaces are treated, inter alia, with an etch solution to remove contaminants on the surface or to prepare them for the treatment that is to follow.
- an etch solution to remove contaminants on the surface or to prepare them for the treatment that is to follow.
- organic or metal layers are then applied. These layers may perform different functions. Metal layers for example can form solderable or bondable regions or serve as an etch resist. Depending on the purpose they serve, these layers may remain either permanently or temporarily on the copper surface.
- etch solutions for slightly etching copper surfaces in view of a metallization to follow often consist of aqueous solutions of alkali peroxodisulfate or of hydrogen peroxide, each combined with sulfuric acid. These etchants permit to achieve etch textures with residual roughness of 1 - 2 ⁇ m which results in a size increase of the surface of up to 50 % as compared to the geometrical surface. This surface increase is due to the coarse copper texture obtained.
- copper etchants are iron(III) salts, hypochlorite and copper(II) salts in an aqueous acidic or alkaline solution; however, these are hardly considered for the application described herein above because their etch effect is too strong, which makes them more suited for use for differential etching or for completely removing copper on base material.
- the undercuts (steepness of the slope of the conductor lines for example) must be considered, whereas in these cases the etch textures are not important.
- the etch resist must be prevented from being attacked and it must be possible to regenerate the etch solution (copper recovery) without any problem.
- the composition of the etch solution depends, inter alia, on the type of layer to be applied thereon.
- Metallic and organic layers for example pose different demands on the structure and quality of the copper surface.
- Metallic bright copper surfaces are not considered to be suited for being subsequently coated with organic coatings such as photoresists or solder resist masks nor are they suited for press-laminating multilayers. For this reason, modified etchants are used to roughen the copper and to simultaneously form a brown-black copper(I)/copper(II) oxide film.
- the adhering layers of the photoresists and the solder resist masks or of epoxy resin can become anchored in said oxide film during press-laminating (U.S. Patent No. 6,036,758; EP 0 442 197 A2; EP 0 926 265 A1 ).
- Said etchants contain mineral acids, alkane sulfonic acids, mixtures of the acids mentioned, inhibitors and known oxidizing agents and are intended to oxidize and roughen smooth copper areas. They are not suited for subsequent metallization though.
- the composition and effect of these etch (polishing) solutions considerably differ from the etch solutions mentioned herein above.
- abrasive substances silicon dioxide - aluminum dioxide - ceroxide - zirconium dioxide
- the solutions are disclosed to contain viscosity increasing agents (polyalcohols, polyethylene glycols, etc.), organic acids (amino acetic acid, amido sulfuric acid, oxalic acid, citric acid, gluconic acid), inorganic acids and inhibitors (N-methyl formamide, benzotriazole, imidazole, phenacetine, thiourea, mercaptobenzothiazole).
- the pH of the solutions varies from slightly acid to strongly alkaline (9 - 14, 3 - 10, 5 - 8) thus clearly exceeding that of current etchants.
- the solutions mentioned also serve to etch, slightly etch or level copper surfaces, with only low removal rates of from 0.03 to 0.1 ⁇ m being expected for polishing in accordance with the intended purpose. Higher removal rates may for example be achieved by increasing the temperatures and by adding abrasive substances.
- the amount of added complexing agents has to be increased in order to keep the oxidized copper in solution as oxidized copper, because of the high pH of the solution, can only be kept in solution using complexing agents such as EDTA or NTA for example. If the etch solution contains too much copper, it cannot be used any longer.
- DE-OS 21 49 196 discloses an aqueous solution for etching copper or a copper alloy, the solution comprising peroxodisulfate and at least one heterocyclic azol compound. Further this solution may also contain one or more halides and sulfuric acid or phosphoric acid. This solution is intended to be used for etching copper on printed circuit board material.
- DE 100 34 022 A1 discloses an acid treatment solution for copper surfaces, the solution comprising hydrogen peroxide, at least one five-membered heterocyclic compound, such as a tetrazol, and at least one microstructuring agent, this agent being selected from the group comprising organic thioles, sulfides, disulfides and thioureas.
- the solution may further contain an acid, sulfuric acid for example.
- the copper surfaces produced by a treatment with this solution have a microstructure having two roughness values, the first one being in the range of from 1 to 10 ⁇ m and the second one being in the range of from 50 to 500 nm.
- the solution is intended to be used for the manufacture of printed circuit boards.
- U.S. Patent No. 6,036,758 describes an etch solution for the surface treatment of copper that comprises hydrogen peroxide and an aromatic sulfonic acid or a salt thereof.
- this etch solution includes, inter alia, an inorganic acid, with sulfuric acid comprised in a range between 2 and 20 % (w/v) being preferred, a concentration between 5 and 10 % (w/v) being particularly preferred.
- EP 1 167482 A2 discloses an etch (polishing) solution comprising an N- heterocyclic compound, hydrogen peroxide and a salt of the dodecyl benzene sulfonic acid.
- the solution is suited for manufacturing integrated circuits, the excess wiring material being intended to be etched away after the metal plating step.
- abrasive substances and additives such as sulfuric acid for example, may be added to the etch (polishing) solution.
- the removal rate is a function of the pH, the temperature and the kind and strength of the acids used.
- the solution operates at a pH of between 5 and 12.
- miniaturization poses new demands on the surfaces, more specifically on the copper surfaces, which may for example form the basis for end layers such as electroless nickel-gold, chemical tin, silver, palladium and combinations of the metals mentioned.
- the surfaces produced must provide good bonding for subsequent metallization.
- Bonding strength is determined, inter alia, by the surface structure of the etched copper, whereby it is assumed that the achieved bonding strength will be the greater the coarser the surface structure of the copper surface is. As a result, it is expected that bright copper surfaces will have a reduced bonding strength.
- defect bondings of the metal layers to be applied do not allow to dispense with slightly etching the copper.
- the etched surfaces on the leadframes are intended to additionally minimize the formation of resin smear as a result of the observed epoxy bleed out or to largely prevent said resin smear from contaminating the external contacts. Furthermore, the etchants are intended to be affordable and easy to handle.
- the basic object of the present invention is to meet the requirements mentioned in order to overcome the drawbacks of the known solutions and methods. More specifically, it is intended to produce the brightest possible copper surface.
- the solution in accordance with the invention serves to etch copper or a copper alloy on substrates, preferably on electric circuit carriers, more specifically on printed circuit boards or in the semiconductor technique, as well as to produce leadframes and contacts such as e.g., multipoint connectors and contacts in switches, plug and socket connectors, sockets and plugs.
- the etch solution preferably serves to produce a copper surface that is suited for being subsequently coated with metals.
- the solution in accordance with the invention is a solution having a pH of about 4 and lower. It does not contain sulfate ions. It comprises:
- At least one oxidizing agent selected from the group comprising hydrogen peroxide and peracids
- at least one substance selected from the group comprising aromatic sulfonic acids and salts of the aromatic sulfonic acids.
- aromatic sulfonic acids Due to their manufacturing method, organic and especially aromatic sulfonic acids have residual concentrations in sulfate ions. This is due to the fact that the sulfonic acids are subject to hydrolysis thus forming the respective non- sulfonated aromatic compounds and sulfate ion. This reaction is the reversal of the sulfonation reaction. Therefore aromatic sulfonic acids are always accompanied by sulfate ions (Ullmanns Encyclopadie der ischen Chemie [Ullmann's encyclopedia of technical chemistry], 4 th edition, volume 8, pages 412-416).
- aromatic sulfonic acids that contain a group, such as a nitro radical, in a mefa-position at the aromatic ring are preferably subject to such hydrolyzation.
- a group such as a nitro radical
- m-nitrobenzenesulfonate which is expressis verhis mentioned in U.S. Patent No. 6,036,758 for its use as an additive to a composition useful for the surface treatment of copper. Therefore it is considered that the solutions disclosed in this document are not free of sulfate as required according to the present invention.
- sulfate ion free solution in accordance with the invention a solution is meant that has a sulfate ion concentration of less than 0.2 % (w/v).
- sulfate ion in the solution, which concentration corresponds to that concentration of sulfate ion in the solution established if sulfate ion is brought into the solution by adding sulfate containing sulfonic acid or the salt thereof to be used in accordance with this invention to the solution wherein the sulfate ion concentration in the sulfonic acid or the salt thereof is less than 0.2 % (w/v).
- sulfate free solution sulfate ion may originate from sulfonic acid, the salt thereof and/or from any other source.
- sulfate ion in a sulfonic acid or in the salt thereof or in the solution according to the present invention known methods may be utilized such as ion chromatography or the method for gravimetric determination of sulfate ion as the barium sulfate. If the concentration of sulfate ion in the solution is higher than the value given above, its concentration must be reduced to less than this value, for example by precipitating sulfate ion as barium sulfate by using barium chloride.
- the aromatic sulfonic acids themselves do not form hardly soluble barium salts. Therefore the aromatic sulfonic acids do not precipitate and sulfate can be easily separated from the solution.
- the solution may be regenerated with a barium salt solution, e.g. a solution of barium carbonate.
- a barium salt solution e.g. a solution of barium carbonate.
- Such regeneration may be performed by subjecting the solution to a barium salt solution in a batch operation.
- regeneration can also be performed continuously by adding the barium salt in a small excess to the solution according to the invention in order to continuously remove sulfate thereof by precipitation.
- the method in accordance with the invention is simple, easy to perform and cheap. It serves to prepare the copper or copper alloy surface to thereafter deposit metal to this surface, especially of a copper or copper alloy layer applied to a substrate. It involves the following method steps: a) contacting the surface with the solution in accordance with the invention and thereafter b) coating the surface with at least one metal.
- the substrates comprising copper surfaces more specifically include electric circuit carriers, leadframes and contacts such as e.g., multipoint connectors and contacts in switches, plug and socket connectors, sockets and plugs.
- the solution in accordance with the invention has a micro-etching effect. At 23°C, the etch rate is on the order of 1 - 2 ⁇ m per minute.
- the solution in accordance with the invention permits to obtain an excellent quality, oxide free, smooth, salmon-pink copper surface with a satin to bright finish. This appearance is due to the obtained very small copper crystals that form a uniform microstructure on the surface of the metal, thus being responsible for the superior optical appearance.
- the microstructure of metal surfaces may for example be analyzed using Atomic Force Microscopy (AFM), which concurrently permits to determine the residual roughness of the surface. AFM measurements rely on measuring the strength and contributions of interparticular interactions such as Van der Waals interactions or electrostatic interactions and permit to image surface structures at the atomic level.
- AFM Atomic Force Microscopy
- the residual roughness depends on the acidic strength of the solution in accordance with the invention. It can be noted that higher acidic strength leads to greater residual roughness and, as a result thereof, to a greater increase of the surface and vice versa.
- the acidic strength may also influence the etch rate which in turn affects the residual roughness with higher etch rates usually resulting in comparatively greater residual roughness.
- the etch rate is not the sole factor responsible for the formation of surfaces having the brightest possible finish. It was clearly to be seen that the use of the more specifically sulfate free solution in accordance with the invention produced, even at the same etch rate, a significantly enhanced appearance i.e., a surface with a brighter finish.
- the solution and the method in accordance with the invention permit to eliminate the problems arising using the known means.
- the bright surfaces required as a result of the ever-increasing miniaturization can be produced with the solution in accordance with the invention without the trade-off of a simultaneous reduction of bonding strength of the metallization to follow.
- resin smear which may form on the areas of contact of leadframes as a result of "epoxy bleed out" as they are being cast in plastic, may be minimized using the solution in accordance with the invention prior to electrolytically coating with solder metal.
- Another advantage of a metallic bright surface showing no stains is that one avoids the problems stemming from a matte and/or stained surface during adjustment of a photomask on the conductive pattern. Adverse effects during the following metal plating step, for example during electroless deposition of bismuth, copper, tin, silver, nickel, gold or palladium are not observed.
- the solution in accordance with the invention also permits to overcome the problem arising using known solutions, the problem being that in some cases there is no metal deposit at all though the surface has previously been etched with the etch solution or that the deposit obtained is non-uniform.
- These problems arising using the known etch solutions are due to the fact that the copper surfaces produced have too coarse a structure i.e., too high roughness depth values. If one assumes for example that the copper surfaces have a roughness depth of 1 - 2 ⁇ m, the subsequent layers to be formed thereon, which usually have a thickness of 0.2 - 5 ⁇ m, will adapt to the given texture.
- the epitaxial effects resulting from the structure can be demonstrated. They negatively affect corrosion behavior of chemically deposited nickel for example. For the reasons mentioned, surfaces that are etched in this manner are not suited for producing fine circuit structures.
- the resulting copper removal is low so that after etching the thickness of the copper layer varies within but a narrow range.
- Another advantage is the low pH of the solution, which is 4 or less, as such a pH permits, in contrast to many prior art etch (polishing) solutions, to utilize the solution while using alkaline soluble solder resists.
- the service life i.e., the copper absorption of such an etchant without the trade-off of a reduction of the brightness of the copper surfaces, is on the order of 20 g/l and more, which is also due to the low pH without complexing agents having to be added to the solution.
- the operation of the bath, the analyses and the necessary replenishments are easy to perform.
- the solution in accordance with the invention has a pH on the order of 4 and less, preferably of 3 and less. A pH ranging from 2.2 to 1.8 is particularly preferred.
- the aromatic part of the aromatic sulfonic acids and of the salts of the aromatic sulfonic acids preferably comprises at least one phenyl group, which may be substituted by one or more radicals selected from the group comprising nitro, amino, hydroxy, halogen, Ci - C 5 -alkyl radicals and Ci - C 5 - alkoxy radicals.
- the alkyl and alkoxy radicals may also be substituted, preferably by amino, hydroxy and/or halogen. If the phenyl group is substituted by a plurality of radicals, these may be selected independently from one another.
- Compounds which are selected from the group comprising benzene sulfonic acid, phenol sulfonic acid, toluene sulfonic acid and amino benzene sulfonic acid are particularly preferred.
- Naphthalene sulfonic acid is another preferred substance.
- the aromatic sulfonic acids of particular preference are such having a comparatively low acidic strength.
- the solution may further preferably contain at least one N-heterocyclic compound.
- the N-heterocyclic compounds are preferably selected from the group comprising mono-N, di-N, tri-N and tetra-N heterocyclic compounds.
- the compounds may thereby have 5 or 6 members.
- N-heterocyclic compounds contained in the solution in accordance with the invention do not substantially influence the etch rate of the solution.
- the preferred concentration ranges of the solution constituents are as follows:
- aromatic sulfonic acids and the salts of the aromatic sulfonic acids preferably from 2 to 250 g/l, more preferably from about 20 to about 60 g/l
- N-heterocyclic compounds preferably from 0.1 to 300 g/l, more preferably from about 10 to about 80 g/l
- hydrogen peroxide 35 % (w/v): preferably from about 60 to about 110 g/l, more preferably from about 80 to about 100 g/l, most preferably about 100 g/l.
- the etch solution also operates outside of the concentration ranges indicated. Accordingly, the concentration ranges indicated are mere standard values.
- the peracids used are selected from the group comprising organic and inorganic peracids, said peracids being preferably selected from the group comprising perboric acid and perbenzoic acid.
- the solution in accordance with the invention may comprise at least one adjuvant selected from the group comprising polyethylene glycol, polypropylene glycol and the derivatives thereof. It could be observed that, by adding this adjuvant, the copper crystals became even smaller, which additionally minimizes the size increase of the surface, thus further reinforcing the bright finish of the surface treated.
- Said adjuvants preferably have a degree of polymerization in the range of from about 100 to about 1000.
- the copper surfaces are preferably cleaned prior to being treated with the solution in accordance with the invention in order to remove from the copper surface contaminations that would interfere with the treatment.
- Conventional acidic cleaning fluids may be utilized.
- surfactants and, if need be, complexing agents such as triethanolamine are added to the aqueous cleaning fluids in order to improve the cleaning effect.
- a rinse step with deionized water for example may be provided for after cleaning.
- the copper surfaces are treated with the solution in accordance with the invention, said solution being preferably operated in the method at a temperature of from about 20°C to about 60 °C.
- the processing time preferably amounts to from about 10 sec to about 400 sec. The higher the temperature of the solution during etching, the faster the etch reaction will proceed. Accordingly, a shorter processing time is needed in this case to obtain a certain etch result.
- an etch temperature ranging from about 20 to about 25°C is preferred to keep easy control of the method, with the preferred processing time being about 120 sec.
- the copper surfaces can be contacted with sulfuric acid, more preferably with 1 % (w/v) sulfuric acid.
- sulfuric acid more preferably with 1 % (w/v) sulfuric acid.
- the surfaces Prior to metal plating, the surfaces can preferably be rinsed, more specifically using deionized water.
- the metal deposited is preferably selected from the group comprising bismuth, copper, tin, gold, silver, palladium and nickel, with the metal being more preferably formed as electroless nickel-gold or as chemical tin.
- the metal layers applied may for example serve as bondable and solderable contact areas or as electrical contact layers for push buttons or plug contacts.
- the metal layers may for example be deposited by electrochemical, electroless or chemical plating. Chemical deposition by metal to metal charge transfer is preferred, one metal (here copper or a copper alloy) dissolving partially while the dissolved metal, chemical tin for example, is deposited. Electroless plating e.g., electroless nickel-gold is also preferred.
- the copper surface is first treated with a bath by means of which palladium nuclei are deposited onto the surface.
- metal plating may be performed in another bath comprising nickel ions, for example in the form of a sulfate salt, and a reducing agent.
- the reducing agent utilized is a hypophosphite salt, for example the sodium salt thereof, or the corresponding acid thereof.
- a nickel-phosphorus layer forms.
- the reducing agent utilized will be a borane, for example dimethylamine borane or a boranate such as sodium boron hydride.
- the reducing agent used will preferably be hydrazine or a derivative thereof.
- These baths additionally comprise complexing agents, more specifically organic carboxylic acids, pH adjusting agents such as ammonium hydroxide or acetate, as well as stabilizers such as sulfur compounds or lead salts.
- the gold layer is applied to the electroless plated nickel layer, for example by a charge transfer method or by electroless plating, i.e., using a reducing agent.
- the copper surface is contacted with a solution comprising tin(II) ions, for example tin(II) sulfate, an acid such as sulfuric acid, and a thiourea derivative.
- tin(II) ions for example tin(II) sulfate, an acid such as sulfuric acid, and a thiourea derivative.
- the tin layer is formed on the copper surface- via a charge transfer reaction, with copper dissolving to the benefit of tin.
- the substrates comprising the copper surfaces can be processed in current dip plants.
- conveyorized plating lines in which the printed circuit boards are conveyed through the plant on a horizontal conveying direction (path) while being contacted with the processing fluids via suited nozzles such as spray or flow nozzles is particularly advantageous.
- the printed circuit boards can be held horizontally or vertically or in any other orientation.
- substrates comprising copper surfaces such as leadframes can be processed in reel-to-reel (RTR) systems.
- RTR reel-to-reel
- the concentration of the sulfate ions in all of the etch solutions of the examples described was reduced to a value that corresponds to a concentration of sulfate ion in the sulfonic acid of less than 0.2 % (w/v) which is added to the solution. This was achieved by means of barium sulfate precipitation. The barium sulfate thus obtained was filtered away.
- the pH in the solutions according to the present invention was always about 4 or less.
- Example 1a Example in accordance with the invention:
- An aqueous solution was prepared by mixing the following constituents:
- Deionized water was added to bring the volume to 1 L.
- the solution was heated to 23°C. Then, two copper foils (printed circuit board quality) were each treated according to the aforementioned method scheme by dipping them for 120 sec into the solution. After treatment with warm deionized water, they were dried. One foil was used to determine the residual roughness while the other foil was metal plated in compliance with the method scheme.
- Example 1a was repeated using a solution with the following composition:
- toluene-4-sulfonic acid (sulfate free) 25 g hydrogen peroxide 35 % (w/v) 100 g
- Deionized water was added to bring the volume to 1 L.
- the copper layer had a satin finish and a residual roughness of 63 nm. No stains formed while it was taken to the rinse tank. The etch rate was 2.0 /m/min. After silver plating, a sufficiently adherent bond between the copper surface and the applied silver layer could be observed.
- Phenol- 4-sulfonic acid has a lower acidity and accordingly had a much lower etch rate than toluene-4-sulfonic acid. This, together with the formation of smaller copper crystals, resulted in a reduced residual roughness in Example 1a.
- Example 2 Example in accordance with the invention:
- Example 1 b was repeated using a solution with the following composition:
- toluene-4-sulfonic acid (sulfate free) 25 g hydrogen peroxide 35 % (w/v) 100 g polyethylene glycol
- Deionized water was added to bring the volume to 1 L.
- the copper layer had a satin to bright finish and had a residual roughness of 43 nm. No stains formed while it was taken to the rinse tank. The etch rate was 1.8 m/min. After nickel plating, an adherent bond between the copper surface and the applied nickel layer could be observed.
- Example 2 By adding polyethylene glycol in Example 2, one obtained a reduced etch rate and, as a result thereof, a reduced residual roughness when directly compared with Example 1b.
- Example 3 Example in accordance with the invention:
- Example 1 b was repeated using a solution with the following composition:
- toluene-4-sulfonic acid (sulfate free) 25 g hydrogen peroxide 35 % (w/v) 100 g pyridine 30 ml
- Deionized water was added to bring the volume to 1 L.
- the copper layer was bright and had a residual roughness of 31 nm. No stains formed while it was taken to the rinse tank. The etch rate was 1.5 ⁇ m/min. After electroless palladium plating, an adherent bond between the copper surface and the applied palladium layer could be observed.
- the solution in accordance with the invention was prepared, using the same sulfonic acid as in Example 1 b and adding an N-heterocyclic compound. As compared to Example 1 b, the etch rate diminished and the size of the copper crystals was strongly reduced. As a result, the residual roughness dropped significantly and the surface accordingly had a uniform bright appearance.
- Example 1 a was repeated using a solution with the following composition:
- Deionized water was added to bring the volume to 1 L.
- the copper layer was matte and had a residual roughness of 88 nm. No stains formed while it was taken to the rinse tank.
- the etch rate was 1.2 //m/min at a temperature of 25°C. After bismuth plating, an adherent bond between the copper surface and the applied bismuth layer could be observed.
- Example 4b Example in accordance with the invention:
- Deionized water was added to bring the volume to 1 L.
- the copper layer had a satin to bright finish and had a residual roughness of 45 nm. No stains formed while it was taken to the rinse tank. The etch rate was 1.3 m/min. After chemical gold plating, an adherent bond between the copper surface and the applied gold layer could be observed.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
- Electrodes Of Semiconductors (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Chemically Coating (AREA)
- Chemical Treatment Of Metals (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/550,829 US20060189141A1 (en) | 2003-03-25 | 2004-03-16 | Solution for etching copper surfaces and method of depositing metal on copper surfaces |
EP04720872A EP1606431B1 (en) | 2003-03-25 | 2004-03-16 | Solution for etching copper surfaces and method of depositing metal on copper surfaces |
JP2006504699A JP4445960B2 (en) | 2003-03-25 | 2004-03-16 | Method for producing a solution for etching a copper surface and method for depositing a metal on a copper surface |
DE602004015748T DE602004015748D1 (en) | 2003-03-25 | 2004-03-16 | SOLUTION FOR COATING COPPER SURFACES AND METHOD FOR DECOMPOSING ON COPPER SURFACES |
KR1020057018001A KR101059707B1 (en) | 2003-03-25 | 2004-03-16 | Solution for etching copper surface and depositing metal on copper surface |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10313517A DE10313517B4 (en) | 2003-03-25 | 2003-03-25 | Solution for etching copper, method for pretreating a layer of copper and application of the method |
DE10313517.0 | 2003-03-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004085706A1 true WO2004085706A1 (en) | 2004-10-07 |
Family
ID=32980716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2004/002702 WO2004085706A1 (en) | 2003-03-25 | 2004-03-16 | Solution for etching copper surfaces and method of depositing metal on copper surfaces |
Country Status (10)
Country | Link |
---|---|
US (1) | US20060189141A1 (en) |
EP (1) | EP1606431B1 (en) |
JP (1) | JP4445960B2 (en) |
KR (1) | KR101059707B1 (en) |
CN (1) | CN100379898C (en) |
AT (1) | ATE404713T1 (en) |
DE (2) | DE10313517B4 (en) |
MY (1) | MY140151A (en) |
TW (1) | TW200502437A (en) |
WO (1) | WO2004085706A1 (en) |
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WO2013004624A1 (en) | 2011-07-07 | 2013-01-10 | Atotech Deutschland Gmbh | Method for providing organic resist adhesion to a copper or copper alloy surface |
EP2274460B2 (en) † | 2008-03-21 | 2016-08-31 | Enthone, Inc. | Adhesion promotion of metal to laminate with a multi-functional compound |
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- 2004-03-16 EP EP04720872A patent/EP1606431B1/en not_active Expired - Lifetime
- 2004-03-16 AT AT04720872T patent/ATE404713T1/en active
- 2004-03-16 WO PCT/EP2004/002702 patent/WO2004085706A1/en active IP Right Grant
- 2004-03-16 KR KR1020057018001A patent/KR101059707B1/en not_active IP Right Cessation
- 2004-03-16 JP JP2006504699A patent/JP4445960B2/en not_active Expired - Fee Related
- 2004-03-16 DE DE602004015748T patent/DE602004015748D1/en not_active Expired - Lifetime
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---|---|---|---|---|
CN100368598C (en) * | 2005-08-09 | 2008-02-13 | 广东省石油化工研究院 | Copper or copper alloy surface tiny-etching treatment fluid for smoothing |
EP2274460B2 (en) † | 2008-03-21 | 2016-08-31 | Enthone, Inc. | Adhesion promotion of metal to laminate with a multi-functional compound |
WO2013004624A1 (en) | 2011-07-07 | 2013-01-10 | Atotech Deutschland Gmbh | Method for providing organic resist adhesion to a copper or copper alloy surface |
Also Published As
Publication number | Publication date |
---|---|
KR20050110699A (en) | 2005-11-23 |
EP1606431A1 (en) | 2005-12-21 |
CN1764739A (en) | 2006-04-26 |
TW200502437A (en) | 2005-01-16 |
US20060189141A1 (en) | 2006-08-24 |
ATE404713T1 (en) | 2008-08-15 |
MY140151A (en) | 2009-11-30 |
JP4445960B2 (en) | 2010-04-07 |
DE10313517B4 (en) | 2006-03-30 |
DE602004015748D1 (en) | 2008-09-25 |
DE10313517A1 (en) | 2004-10-14 |
KR101059707B1 (en) | 2011-08-29 |
CN100379898C (en) | 2008-04-09 |
JP2006521464A (en) | 2006-09-21 |
EP1606431B1 (en) | 2008-08-13 |
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