WO2004081985A3 - Methods and systems for estimating reticle bias states - Google Patents

Methods and systems for estimating reticle bias states Download PDF

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Publication number
WO2004081985A3
WO2004081985A3 PCT/US2004/007280 US2004007280W WO2004081985A3 WO 2004081985 A3 WO2004081985 A3 WO 2004081985A3 US 2004007280 W US2004007280 W US 2004007280W WO 2004081985 A3 WO2004081985 A3 WO 2004081985A3
Authority
WO
WIPO (PCT)
Prior art keywords
reticle
bias state
reticle bias
estimating
methods
Prior art date
Application number
PCT/US2004/007280
Other languages
French (fr)
Other versions
WO2004081985A2 (en
Inventor
Joseph Pellegrini
David Crow
Original Assignee
Inficon Lt Inc
Joseph Pellegrini
David Crow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inficon Lt Inc, Joseph Pellegrini, David Crow filed Critical Inficon Lt Inc
Priority to EP04719204A priority Critical patent/EP1623449A4/en
Publication of WO2004081985A2 publication Critical patent/WO2004081985A2/en
Publication of WO2004081985A3 publication Critical patent/WO2004081985A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness

Abstract

Disclosed are methods and systems for estimating a reticle bias state for a process system, that include computing a difference between control data provided to the process system and error data based on a process system output(s), and estimating the reticle bias state based on weighted measures associated with the control data, the weighted measures being based on the number of data points included in the difference. The methods and systems include associating the reticle bias state estimate with a first quality factor, computing at least one weighted measure based on a number of data elements associated with the reticle, using the weighted measures) to provide a computed reticle bias state estimate and an associated computed quality factor, and, comparing the computed quality factor with the first quality factor to determine whether to update the reticle bias state estimate with the computed reticle bias state estimate.
PCT/US2004/007280 2003-03-11 2004-03-10 Methods and systems for estimating reticle bias states WO2004081985A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP04719204A EP1623449A4 (en) 2003-03-11 2004-03-10 Methods and systems for estimating reticle bias states

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US45377403P 2003-03-11 2003-03-11
US60/453,774 2003-03-11

Publications (2)

Publication Number Publication Date
WO2004081985A2 WO2004081985A2 (en) 2004-09-23
WO2004081985A3 true WO2004081985A3 (en) 2006-07-06

Family

ID=32990818

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/007280 WO2004081985A2 (en) 2003-03-11 2004-03-10 Methods and systems for estimating reticle bias states

Country Status (2)

Country Link
EP (1) EP1623449A4 (en)
WO (1) WO2004081985A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116721704B (en) * 2023-08-03 2023-10-20 北京星云医学检验实验室有限公司 Method and system for updating hierarchical protection biological information database

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6453457B1 (en) * 2000-09-29 2002-09-17 Numerical Technologies, Inc. Selection of evaluation point locations based on proximity effects model amplitudes for correcting proximity effects in a fabrication layout

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7089528B2 (en) * 2003-03-11 2006-08-08 International Business Machines Corporation Methods and systems for estimating reticle bias states

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6453457B1 (en) * 2000-09-29 2002-09-17 Numerical Technologies, Inc. Selection of evaluation point locations based on proximity effects model amplitudes for correcting proximity effects in a fabrication layout

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1623449A4 *

Also Published As

Publication number Publication date
WO2004081985A2 (en) 2004-09-23
EP1623449A2 (en) 2006-02-08
EP1623449A4 (en) 2010-08-11

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