WO2004068127A1 - Procede et dispositif permettant de controler la consistance d'une suspension epaisse - Google Patents

Procede et dispositif permettant de controler la consistance d'une suspension epaisse Download PDF

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Publication number
WO2004068127A1
WO2004068127A1 PCT/IB2004/000234 IB2004000234W WO2004068127A1 WO 2004068127 A1 WO2004068127 A1 WO 2004068127A1 IB 2004000234 W IB2004000234 W IB 2004000234W WO 2004068127 A1 WO2004068127 A1 WO 2004068127A1
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WO
WIPO (PCT)
Prior art keywords
slurry
physical characteristic
optical signal
solid
unit
Prior art date
Application number
PCT/IB2004/000234
Other languages
English (en)
Inventor
Ashutosh Misra
Matthew L. Fisher
Original Assignee
L'air Liquide - Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/734,092 external-priority patent/US20040159399A1/en
Priority claimed from US10/733,865 external-priority patent/US20040166584A1/en
Application filed by L'air Liquide - Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude filed Critical L'air Liquide - Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude
Priority to TW093102902A priority Critical patent/TWI235234B/zh
Publication of WO2004068127A1 publication Critical patent/WO2004068127A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/85—Investigating moving fluids or granular solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
    • G01N15/02—Investigating particle size or size distribution
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
    • G01N15/10—Investigating individual particles
    • G01N15/14—Optical investigation techniques, e.g. flow cytometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
    • G01N2015/0042—Investigating dispersion of solids
    • G01N2015/0053—Investigating dispersion of solids in liquids, e.g. trouble

Definitions

  • This invention relates to supplying chemicals for manufacturing processes and, in particular, to an apparatus and a method for performing online monitoring of the consistency of a chemical slurry.
  • the manufacture of semiconductor devices requires a number of discrete process steps to create a packaged semiconductor device from raw semiconductor material.
  • the various processes from the initial growth of the semiconductor material, the slicing of the semiconductor crystal into individual wafers, the fabrication stages (etching, doping, ion implanting, chemical-mechanical planarization, or the like), to the packaging and final testing of the completed device, are so different from one another and specialized that the processes may be performed in different manufacturing locations that contain different control schemes and involve delivery of various materials from one site to another.
  • CMP chemical mechanical planarization
  • the films that are processed may include silicon oxide, silicon nitride, aluminum fill, and/or tantalum nitride film.
  • copper has been used to develop interconnects and other structures on semiconductor wafers. Generally, a copper film is polished in order to planarize the copper film placed upon a layer of the semiconductor wafer being processed. Processes such as oxide CMP and nitride CMP may be performed to polish copper layers.
  • CMP processes The consistency of the chemicals that are used in performing various processes performed on semiconductor wafers, such as CMP processes, may become important in achieving consistent results.
  • Many chemicals used for processes, such as CMP are delivered in a slurry form.
  • copper slurry contains particles of aluminum oxide used as an abrasive agent in performing the CMP process.
  • the slurries may contain chemical mediums, such as benzotriazole, which may be used to protect the copper film from corrosion.
  • other chemical agents such as hydrogen peroxide, maybe used as an oxidizing agent, atonalamean and other complexing agents. Disruption or changes in the physical characteristic of the slurry may cause errors and misprocessing of various processes, such as CMP processes, performed on the semiconductor wafers.
  • U.S. Patent No. 6,275,290 describes a particle distribution probe which uses special processing including a modified Twomey/Chahine iterative convergence technique and a specially constructed sample cell to obtain particle size distribution measurements from optically dense slurries, such as the slurries used in the semiconductor industry for chemical mechanical planarization. Spectral transmission data is taken over the spectral range of 0.20-2.5 microns.
  • U.S. Patent No. 6,275,290 In addition to the calculation of particle size distribution from the measured transmitted light, the invention described in U.S. Patent No. 6,275,290 is claimed to assist in the detection of other fundamental causes of slurry degradation, such as foaming and jelling.
  • the technology provided by U.S. Patent No. 6,275,290 has various drawbacks.
  • the technique described in U.S. Patent No. 6,275,290 is not a direct measure of suspended solids in a slurry; it only gives a qualitative measure of the change in suspended solids.
  • the consistency of the chemical product i.e., the slurry, the impurity levels, the amount of dissolved materials, etc.
  • the state of the art generally lacks an efficient and accurate assessment of the slurry for use in various wafer-processing steps.
  • the present invention is directed to overcoming, or at least reducing, the effects of one or more of the problems set forth above.
  • an apparatus for performing online monitoring of a physical characteristic of a process material includes an optical source for providing an optical signal into a slurry.
  • the apparatus also includes an optical sensor for detecting the optical signal.
  • the apparatus of the present invention also includes a controller for determining whether a physical characteristic of the slurry is within a predetermined tolerance level in an online manner, in response the optical signal.
  • a method for performing online monitoring of a physical characteristic of a process material is provided.
  • a request to provide a slurry to a processing tool is received.
  • the slurry is transported through a slurry transport unit, based upon the request, to the processing tool.
  • An online monitoring of a physical characteristic of the slurry is performed.
  • the online monitoring of the slurry includes analyzing an optical signal sent through the slurry to determine whether the physical characteristic of the slurry is within a predetermined level of tolerance.
  • a system for performing online monitoring of a physical characteristic of a process material includes a process chemical unit for providing a slurry.
  • the system also includes a processing tool for performing a process upon a semiconductor wafer using the slurry.
  • a slurry transport conduit transports the slurry from the process chemical unit to the processing tool.
  • the slurry transport conduit includes an optical source for providing an optical signal into the slurry, and an optical sensor for detecting the optical signal.
  • the system of the present invention also includes a slurry analysis unit for performing an online analysis of the slurry in the slurry transport conduit.
  • the slurry analysis unit includes a controller to determine whether a physical characteristic of the slurry is within a predetermined tolerance level in an online manner, in response to the optical signal.
  • Figure 1 illustrates a block diagram of a system for monitoring a physical characteristic of a material used for a manufacturing process, in accordance with one embodiment of the present invention
  • Figure 2 illustrates a more detailed block diagram depiction of a slurry analysis unit of Figure 1, in accordance with one embodiment of the present invention
  • Figure 3 illustrates a more detailed block diagram depiction of a slurry transport conduit of Figures 1 and 2, in accordance with one embodiment of the present invention
  • Figure 4 illustrates a graph that depicts the percentage of solids detected by the system of the present invention based upon the operation of a pump, in accordance with one embodiment of the present invention
  • Figure 5 illustrates a graph that depicts the percentage of solids detected by the system of the present invention based upon the addition of a liquid, in accordance with one embodiment of the present invention
  • FIG. 6 illustrates a more detailed block diagram depiction of the system, in accordance with one illustrative embodiment of the present invention.
  • Figure 7 illustrates a flowchart that provides a method for monitoring a physical characteristic of a material used for a manufacturing process, in accordance with one illustrative embodiment of the present invention.
  • Embodiments of the present invention provide for monitoring a physical characteristic (e.g., the consistency) of a material, such as a chemical slurry, used for a manufacturing process.
  • a physical characteristic e.g., the consistency
  • a chemical slurry used for a chemical-mechanical planarization (CMP) process is monitored in an online fashion (e.g., substantially real time or a near real time manner).
  • CMP chemical-mechanical planarization
  • slurry that comprises a chemical compound used in semiconductor wafer processing may be monitored using various sensors. Data from these sensors may be analyzed by a slurry analysis unit, which may be used in a feedback manner to affect the physical nature of the slurry.
  • Embodiments of the present invention provide for utilizing an optical source that provides an optical stimulation within the slurry, and an optical sensor to detect the resultant optical signal.
  • the optical signal is used to monitor the physical characteristics of the slurry, such as the percentage of solids in the slurry.
  • other physical sensors may also be used to monitor various other physical characteristics of the slurry (e.g., the flow characteristics of the slurry, the pressure experienced by the slurry, etc.). Data from the optical sensors and/or the physical sensors may be utilized to perform a feedback analysis of the physical nature of the slurry.
  • Embodiments of the present invention provide for a substantially real time analysis of the slurry.
  • Embodiments of the present invention provide for a method and apparatus for performing a feedback correction directed to modifying the nature of the slurry to have physical characteristics that are generally within predetermined tolerances for use in semiconductor wafer processing, such as CMP processes.
  • the system 100 comprises a process chemical unit 110, a processing tool 120, which may include a set of processing tools, a slurry analysis unit 140, and a slurry transport conduit 130, which is capable of transporting chemical compounds.
  • the slurry transport conduit 130 is capable of transporting process chemical compounds from the process chemical unit 110 to the processing tools 120.
  • the process chemical unit 110 may store chemicals, mix, or prepare chemicals for use by various processes performed by the processing tools 120.
  • the slurry transport conduit 130 may comprise various mechanical and electrical devices designed to generate pressure and/or other stimuli to transport the chemical compound/slurry from the process chemical unit 110 to the processing tools 120.
  • the slurry transport conduit 130 may comprise various sensors (described and illustrated in various Figures and descriptions provided herein) that provide data to the slurry analysis unit 140.
  • the slurry analysis unit 140 is capable of analyzing data from various sensors in an online and/or an offline manner.
  • the slurry analysis unit 140 is also capable of providing feedback signals to affect the physical characteristics of the slurry in the slurry transport conduit 130.
  • the slurry analysis unit 140 may comprise an optical source 210 that is capable of providing an optical signal in a predetermined position, such as position a, in the slurry transport conduit 130.
  • the slurry analysis unit 140 also comprises an optical sensor 220 that may be positioned in a predetermined position b in the slurry transport conduit 130.
  • the optical signal provided by the optical source 210 is affected by the solids in the slurry. By examining the optical source, the percentage of solids in the slurry may be determined.
  • an extension of the optical source 210 and the optical sensor 220 may be placed within the slurry transport conduit 130.
  • the optical source 210 and the optical sensor 220 may be physically placed in the slurry transport conduit 130. In either case, data from an optical sensor 220 is received by the slurry analysis unit 140.
  • the slurry analysis unit 140 may be associated with one or more physical sensors 250 that may be placed within the slurry analysis unit 140 with an extension of such physical sensors 250 placed within the slurry transport conduit 130.
  • the physical sensors 250 may actually be placed within the slurry transport conduit 130 and is capable of providing data to the slurry analysis unit 140.
  • Data from the physical sensors 250 and the optical sensors 220 is sent to a computer system 240, which is capable of analyzing the data.
  • the computer system 240 may determine the physical characteristics of the slurry in the slurry transport conduit 130.
  • the computer system 240 may include a variety of types of computer systems, such as an PC (IBM ® compatible computer), an Apple ® computer, a mainframe, a network computer, or the like.
  • the physical characteristics determined by the slurry analysis unit 140 may include various characteristics, such as the percentage of solids in the slurry, the pressure experienced by the slurry, the flow characteristics (e.g., flow rate) of the slurry, and the like.
  • the slurry may start to settle at the bottom of the slurry transport conduit 130, thereby affecting the data relating to the percentage of solids in the slurry.
  • Some slurries may have physical characteristics such that without proper movement of the slurry, alumina particles, for example, may become settled at the bottom.
  • various chemical mediums may be dispersed within the slurry transport conduit 130. The pH of the chemical medium may be used to decrease the possibility of settling of various particles, such as alumina.
  • a certain pH may be required for proper operation of the processing of semiconductor wafers where the slurry is used. Additionally, proper mixing of the slurry may be important in the proper utilization of the slurry for processing semiconductor wafers, e.g., CMP processes performed on semiconductor wafers.
  • An optical source 210 may be placed in a predetermined location within the slurry transport conduit 130.
  • the optical source 210 may be placed near the center of the slurry transport conduit 130 where a first length (£ x ) 330 and a second length
  • (£ 2 ) 340 is used to displace the optical source 210 from the top and bottom of the slurry transport conduit 130.
  • the optical sensor 220 may also be displaced from the top and bottom portion of the slurry transport conduit 130 by the length (£ 3 ) 350 and the length
  • the distance between the optical source 210 and the optical sensor 220 may be displaced by the length ( £ 5 ) 370, which is strategically predetermined for improving data accuracy.
  • the physical sensors 250 which senses various physical characteristics of the slurry and/or the slurry transport conduit 130, may be positioned within the conduit 130.
  • the physical sensors 250 may include sensors that measure the pressure in the slurry transport conduit 130, the flow characteristics (e.g., the velocity of the flow) of the slurry in the slurry transport conduit 130, and the like.
  • the slurry transport conduitl30 may comprise various pumps 378 and/or valves 380 that control the movement of the slurry in the slurry transport conduit 130.
  • feedback signals may be sent to the pumps 378 and/or the valves 380 to adjust the flow of the slurry in the slurry transport conduit 130.
  • the velocity of the slurry flow and the pressure inside the slurry transport conduit 130 are generally maintained such that the possibility of particles settling at the bottom of the slurry transport conduit 130 is reduced.
  • FIG 4 a diagram illustrating the percentage of solids within the slurry versus the time the slurry is in the slurry transport conduit 130 is illustrated.
  • the sensors 220, 250 may detect that the solid contents in the slurry is negligible as the pumps 378 begin operation and the slurry begins to re-circulate.
  • the region 420 is initiated and as the pump speed becomes greater a certain level of solids within the slurry is maintained.
  • a certain amount of solids are mixed within the slurry such that a predetermined percentage of solids are maintained in the slurry.
  • the particles in the slurry may begin to settle. This would cause the percentage of solids in the slurry to decline, which may be detected by the sensors 220, 250 (see region 440 in Figure 4).
  • the slurry essentially settles at the bottom of the slurry transport conduit 130, and the sensor 220, 250 will detect that the percentage of solids is very low.
  • the percentage of solids in relation to time may vary based upon the addition of various liquid compounds, such as H 2 O 2 .
  • the region 560 in the graph illustrated in Figure 5, shows a particular level of percentage of solid in the slurry detected by the optical sensor 220 in the slurry transport conduit 130.
  • 2% of H 2 O may be added to the slurry, thereby reducing the percent of solid detected by the sensor 220, as indicated by the graph in Figure 5. This causes a decline in the percent of solid in the slurry.
  • an additional 0.1% of H 2 O 2 is added to the slurry, thereby further reducing the percent of solid detected in the slurry transport conduit 130.
  • the percentage of solid variation may be controlled in the slurry transport conduit 130 by adding various compounds such as H 2 O 2 . Since the physical characteristics of the slurry may be detected in an online fashion, an online feedback control of the slurry may be implemented to modify the characteristics of the slurry.
  • the slurry transport conduit 130 may be fitted with various sensors, such as the optical sensor 220, a pressure sensor 620, and a flow sensor 630.
  • the optical sensor 220 is capable of receiving affected optical signals provided by the optical source 210.
  • the pressure sensor 620 is capable of detecting the online pressure in the slurry transport conduit 130 in a real time manner. Therefore, a real time evaluation of the pressure experienced by the slurry may be quantified.
  • the flow sensor 630 is capable of detecting the flow rates (i.e., the flow velocity) of the slurry flow in the slurry transport conduit 130. The flow rate of the slurry, the pressure experienced by the slurry, the amount of liquid compound added to the slurry may generally influence the percentage of solids in the slurry detected by the system 100.
  • the slurry analysis unit 140 may comprise an optical sensor interface 640 that is capable of receiving a signal from the optical sensor 220 and generating a decipherable signal, such as a digital signal, that represents optical data.
  • the slurry analysis unit 140 may also comprise a pressure sensor interface 650 that receives data from the pressure sensor 620 and generates a decipherable pressure signal, digital or analog.
  • a flow sensor interface 660 in the slurry analysis unit 140 is capable of receiving a signal from the flow sensor 630 and generating a decipherable signal, analog or digital, that represents a flow velocity of the slurry in the slurry transport conduit 130.
  • the slurry analysis unit 140 may comprise a sensor data analysis unit 670 that is capable of performing an analysis of the optical, pressure, and or the flow rate data received by the slurry analysis unit 140.
  • the sensor data analysis unit 670 may have access to various theoretical calculations of slurry data, optimum pressure and flow- velocities for maintaining desirable physical characteristics that are tailored to particular slurries that are used for various processes.
  • the sensor data analysis unit 670 is capable of correlating various pressure and/or flow- velocity to the percentage of solids in the slurry, as determined from the analysis of the optical data. This correlation may be compared to stored data that provides for acceptable tolerances from the library 675. For particular types of slurry, a predetermined range of pressure, flow- velocity and percent solid count is desirable.
  • the percent solid count may relate to the percentage of solids in the middle of the slurry transport conduit 130.
  • the middle of the slurry transport conduit 130 is of interest, since examining the characteristics in the middle of the conduit 130 generally takes into account for any possible settling of various particles in the slurry. Based upon such an analysis, data may be generated as to the state of the slurry and whether it is within predetermined tolerance levels.
  • the data relating to whether the state of the slurry is within predetermined tolerance levels may be sent to a feedback unit 680.
  • the feedback unit 680 is capable of determining feedback signals based upon the characteristics of the slurry determined by the sensor data analysis unit 670.
  • the feedback signals are generally directed to compensating or adjusting the physical characteristics of the slurry, to place it within predetermined tolerance ranges.
  • a flow controller 690 may determine what types of adjustment may be needed. For example, as part of the adjustments, the operation of various pumps 378 and valves 380 may be adjusted, and additional compounds, such as H 2 O 2 , may be added to the slurry.
  • the data from the flow controller 690 may then be sent from the flow controller 690 to a flow control unit 695, which is capable of affecting the operation of various components in the slurry transport conduit 130.
  • the flow control unit 695 may be affect the operation of the pumps 378, the valves 380, or affect liquid compounds that may injected into the slurry in the slurry transport conduit 130. Therefore, the sensor data is analyzed and feedback data may be generated in a real time, near real time, or online fashion, such that the flow control unit 695 may affect the consistency and the physical characteristics of the slurry in the slurry transport conduit 130. These adjustments may be made in an online, substantially real time manner. Therefore, the slurry received by the processing tools 120 may be of a quality that is within predetermined tolerance levels such that the processes, such as CMP processes, performed by the processing tool 120, is more efficient and accurate.
  • the sensor data analysis unit 670, the feedback unit 680, the flow controller 690 and the flow control unit 695 may be hardware, software, or firmware components, or alternatively, a combination thereof.
  • Various computer programs or portions of computer programs, PC cards, and software components may be utilized to perform the various functions of the slurry analysis unit 140.
  • the system 100 receives a signal to provide a chemical/slurry for use in processing semiconductor wafers (block 710). Based upon such a request, the system 100 provides the chemical/slurry to the processing tools 120 via the slurry transport unit 130 (block 720). Various pressures and velocities are calculated for optimum delivery of the slurry, while maintaining desired physical characteristics of the slurry.
  • the system 100 also performs an online monitoring of the slurry (block 730). For example, the system 100 may analyze the optical characteristics of the slurry to determine whether a desirable percentage of solids in the slurry are present at various areas (e.g., the middle portion) of the slurry fransport conduit 130. Additionally, the system 100 may also analyze other physical characteristics of the slurry, such as the pressure experienced by the slurry and/or the flow rate of the slurry. Based upon the online monitoring of the slurry, the system 100 generally correlates the various physical characteristics of the slurry (block 740). For example, the system 100 correlates the flow rate of the slurry to the percentage of solid in the middle of the slurry transport conduit 130.
  • the system 100 makes a determination whether the physical characteristics are within predetermined tolerance levels (block 750). In other words, the system 100 determines whether the slurry contains adequate percent solid at various points of the slurry in the slurry transport conduit 130. These predetermined tolerance levels are generally calculated specifically for the type of process being performed, the characteristics of the type of chemicals and abrasives in the slurry, and the like. The predetermined tolerance levels may be stored in the library 675 for access and comparison by the system 100.
  • the system 100 determines that the physical characteristics of the slurry are within predetermined tolerance levels, the system 100 generally continues to perform online monitoring of the slurry as indicated in Figure 7.
  • the frequency of the online monitoring of the physical characteristics of the slurry may be variable, and may depend on the specific type of slurry used for particular processes (i. e. , the particular type of CMP being implemented).
  • the system 100 determines that the physical characteristics of the slurry are not within predetermined tolerance levels, the system 100 performs corrective action based upon the correlation of the physical characteristics and tolerance levels (block 760).
  • the corrective actions may include various tasks, such as adjusting the flow rate in the slurry transport conduit 130, adjusting the pressure experienced by the slurry, further mixing of the slurry, and/or the like.
  • the method steps illustrated in Figure 7 are performed to obtain adequate and acceptable physical characteristics of the slurry when delivering it from the process chemical unit 110 to the processing tools 120. Therefore, the chemical/slurry used by the processing tools 120 may be within predetermined tolerance levels, thereby providing for more uniform quality of processed semiconductor wafers.

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Dispersion Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

L'invention concerne un procédé et un dispositif permettant de contrôler en ligne une caractéristique physique d'un matériau traité. Ce procédé consiste à recevoir une demande de distribution d'une suspension à un outil de traitement, à transporter la suspension épaisse à travers un conduit de transport de suspensions épaisses, sur la base de ladite demande, vers l'outil de traitement, et à contrôler en ligne une caractéristique physique de la suspension épaisse. Le contrôle en ligne de la suspension épaisse consiste à analyser un signal optique transmis à travers la suspension épaisse pour déterminer si la caractéristique physique de la suspension épaisse est comprise dans un niveau de tolérance prédéterminé.
PCT/IB2004/000234 2003-01-31 2004-01-30 Procede et dispositif permettant de controler la consistance d'une suspension epaisse WO2004068127A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW093102902A TWI235234B (en) 2003-07-11 2004-02-09 Method and apparatus for monitoring of slurry consistency

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US44401303P 2003-01-31 2003-01-31
US44408703P 2003-01-31 2003-01-31
US60/444,087 2003-01-31
US60/444,013 2003-01-31
US48638703P 2003-07-11 2003-07-11
US60/486,387 2003-07-11
US10/733,865 2003-12-11
US10/734,092 2003-12-11
US10/734,092 US20040159399A1 (en) 2003-01-31 2003-12-11 Method and apparatus for monitoring of slurry consistency
US10/733,865 US20040166584A1 (en) 2000-12-21 2003-12-11 Method and apparatus for monitoring of a chemical characteristic of a process chemical

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Publication Number Publication Date
WO2004068127A1 true WO2004068127A1 (fr) 2004-08-12

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4680957A (en) * 1985-05-02 1987-07-21 The Davey Company Non-invasive, in-line consistency measurement of a non-newtonian fluid
WO1991013340A1 (fr) * 1990-02-26 1991-09-05 Lys & Optik Procede de mesure d'une boue liquide
US5710069A (en) * 1996-08-26 1998-01-20 Motorola, Inc. Measuring slurry particle size during substrate polishing
US6275290B1 (en) * 1998-04-29 2001-08-14 Particle Measuring Systems, Inc. Chemical mechanical planarization (CMP) slurry quality control process and particle size distribution measuring systems
US20020171837A1 (en) * 2001-05-17 2002-11-21 Chi-Feng Cheng System for monitoring oxidant concentration of slurry in a chemical mechanical polishing process
US20030020907A1 (en) * 2001-07-18 2003-01-30 Fisher Matthew L. Methods and systems for controlling the concentration of a component in a composition with absorption spectroscopy

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4680957A (en) * 1985-05-02 1987-07-21 The Davey Company Non-invasive, in-line consistency measurement of a non-newtonian fluid
WO1991013340A1 (fr) * 1990-02-26 1991-09-05 Lys & Optik Procede de mesure d'une boue liquide
US5710069A (en) * 1996-08-26 1998-01-20 Motorola, Inc. Measuring slurry particle size during substrate polishing
US6275290B1 (en) * 1998-04-29 2001-08-14 Particle Measuring Systems, Inc. Chemical mechanical planarization (CMP) slurry quality control process and particle size distribution measuring systems
US20020171837A1 (en) * 2001-05-17 2002-11-21 Chi-Feng Cheng System for monitoring oxidant concentration of slurry in a chemical mechanical polishing process
US20030020907A1 (en) * 2001-07-18 2003-01-30 Fisher Matthew L. Methods and systems for controlling the concentration of a component in a composition with absorption spectroscopy

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