WO2004063089A3 - Recessed microstructure device and fabrication method thereof - Google Patents

Recessed microstructure device and fabrication method thereof Download PDF

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Publication number
WO2004063089A3
WO2004063089A3 PCT/IN2004/000005 IN2004000005W WO2004063089A3 WO 2004063089 A3 WO2004063089 A3 WO 2004063089A3 IN 2004000005 W IN2004000005 W IN 2004000005W WO 2004063089 A3 WO2004063089 A3 WO 2004063089A3
Authority
WO
WIPO (PCT)
Prior art keywords
fabrication method
microstructure device
electro
micro
present
Prior art date
Application number
PCT/IN2004/000005
Other languages
French (fr)
Other versions
WO2004063089A2 (en
Inventor
Prem Pal
Sudhir Chandra
Suneet Tuli
Original Assignee
Indian Inst Of Technology Delh
Prem Pal
Sudhir Chandra
Suneet Tuli
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Indian Inst Of Technology Delh, Prem Pal, Sudhir Chandra, Suneet Tuli filed Critical Indian Inst Of Technology Delh
Publication of WO2004063089A2 publication Critical patent/WO2004063089A2/en
Publication of WO2004063089A3 publication Critical patent/WO2004063089A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0118—Cantilevers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0176—Chemical vapour Deposition
    • B81C2201/0178—Oxidation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thin Film Transistor (AREA)
  • Micromachines (AREA)

Abstract

The present invention provides a micro-electro-mechanical device with a recessed micromechanical structure and to a method of fabrication thereof. The present invention also provides silicon wafers provided with recessed micromechanical structures, which are useful in the field of micro-electro-mechanical systems. The present invention also provides a method for fabrication of micro-electro-mechanical device using micromachining techniques.
PCT/IN2004/000005 2003-01-13 2004-01-05 Recessed microstructure device and fabrication method thereof WO2004063089A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IN39DE2003 2003-01-13
IN39/DEL/2003 2003-01-13

Publications (2)

Publication Number Publication Date
WO2004063089A2 WO2004063089A2 (en) 2004-07-29
WO2004063089A3 true WO2004063089A3 (en) 2004-11-04

Family

ID=32697219

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IN2004/000005 WO2004063089A2 (en) 2003-01-13 2004-01-05 Recessed microstructure device and fabrication method thereof

Country Status (1)

Country Link
WO (1) WO2004063089A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067722A (en) 2008-09-09 2010-03-25 Freescale Semiconductor Inc Electronic device and method of manufacturing structure used for the same
WO2016071576A1 (en) * 2014-11-07 2016-05-12 Teknologian Tutkimuskeskus Vtt Oy Surface micromechanical pressure sensor and method for manufacturing the same
EP3452406B1 (en) 2016-05-02 2020-05-13 Teknologian Tutkimuskeskus VTT Oy Mechanically decoupled surface micromechanical element and method for manufacturing the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5149673A (en) * 1989-02-21 1992-09-22 Cornell Research Foundation, Inc. Selective chemical vapor deposition of tungsten for microdynamic structures
EP0843191A1 (en) * 1996-11-15 1998-05-20 Eastman Kodak Company Micromolded integrated ceramic light reflector
EP0881651A1 (en) * 1997-05-30 1998-12-02 Hyundai Motor Company Threshold microswitch and a manufacturing method thereof
US6100477A (en) * 1998-07-17 2000-08-08 Texas Instruments Incorporated Recessed etch RF micro-electro-mechanical switch
US20020086456A1 (en) * 2000-12-19 2002-07-04 Cunningham Shawn Jay Bulk micromachining process for fabricating an optical MEMS device with integrated optical aperture

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5149673A (en) * 1989-02-21 1992-09-22 Cornell Research Foundation, Inc. Selective chemical vapor deposition of tungsten for microdynamic structures
EP0843191A1 (en) * 1996-11-15 1998-05-20 Eastman Kodak Company Micromolded integrated ceramic light reflector
EP0881651A1 (en) * 1997-05-30 1998-12-02 Hyundai Motor Company Threshold microswitch and a manufacturing method thereof
US6100477A (en) * 1998-07-17 2000-08-08 Texas Instruments Incorporated Recessed etch RF micro-electro-mechanical switch
US20020086456A1 (en) * 2000-12-19 2002-07-04 Cunningham Shawn Jay Bulk micromachining process for fabricating an optical MEMS device with integrated optical aperture

Also Published As

Publication number Publication date
WO2004063089A2 (en) 2004-07-29

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