WO2004062374A1 - Wafer - Google Patents
Wafer Download PDFInfo
- Publication number
- WO2004062374A1 WO2004062374A1 PCT/GB2004/000028 GB2004000028W WO2004062374A1 WO 2004062374 A1 WO2004062374 A1 WO 2004062374A1 GB 2004000028 W GB2004000028 W GB 2004000028W WO 2004062374 A1 WO2004062374 A1 WO 2004062374A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- rippled
- wafers
- confectionery product
- ribbon
- Prior art date
Links
Classifications
-
- A—HUMAN NECESSITIES
- A21—BAKING; EDIBLE DOUGHS
- A21C—MACHINES OR EQUIPMENT FOR MAKING OR PROCESSING DOUGHS; HANDLING BAKED ARTICLES MADE FROM DOUGH
- A21C15/00—Apparatus for handling baked articles
- A21C15/02—Apparatus for shaping or moulding baked wafers; Making multi-layer wafer sheets
- A21C15/025—Apparatus for shaping or moulding baked wafers, e.g. to obtain cones for ice cream
Definitions
- the invention relates to a rippled wafer and to a confectionery product comprising a rippled wafer.
- Edible baked wafers are known in the art.
- WO 98/25474 discloses a method and device for producing wafer rolls in which an endless wafer strip made of a sugar based wafer dough is baked on a rotating baking surface and then wound around a rotating mandrel to produce a continuous overlapping wafer tube. The tube is then cut into sections which are cooled to produce individual hard, cylindrical wafer rolls having a characteristic "snap" when consumed.
- Another type of known wafer is formed by stacking individual sheets of baked wafer together with a cream or other adhesive to form a three-dimensional book wafer. Fan-shaped ice cream wafers formed from baked wafer sheets are also known.
- Such wafers are commonly corrugated, the corrugations being formed by compressing the sheet after baking while it is still flexible.
- Another type of known wafer is formed by cutting pieces of baked wafer into discrete lengths or strips which are rolled into a loose tube.
- the loose tubes may be flattened to form flattened rolled wafers or flattened and folded in upon themselves to form folded convoluted wafers .
- Confectionery products incorporating such wafers are also known.
- a rippled wafer formed of a convoluted wafer ribbon, the rippled wafer having an average of at least 12 turns/cm 2 , a turn being as defined below.
- rippled wafer is used throughout the specification to mean a wafer comprising a plurality of non-concentric convolutions .
- the term turn is used here to mean a change in direction of the wafer ribbon of at least 45°, more preferably at least 90°, most preferably at least 135°.
- the average number of turns/cm 2 is at least 15, more preferably at least 20, most preferably at least 25.
- the known folded convoluted wafers described above are comprised mainly of flat or straight portions of wafer ribbon with relatively few turns .
- the rippled wafer has a ratio of cross sectional edge length, as defined below, to average cross sectional area of greater than 2/r e , as defined below.
- the rippled wafer has a ratio of cross sectional edge length to average cross sectional area of at least 4/r e .
- the cross sectional edge length is defined as the length of the cut edges exposed by a cross sectional cut through the formed wafer, perpendicular to the principal axis of the wafer or the length of the exposed edges at either end of the formed wafer. Where one or more layers of wafer are in intimate contact, the exposed edge contributes once only to the cross sectional edge length for so long as they are in intimate contact .
- cross sectional edge length and average number of turns in a given cross sectional area gives an indication of the degree of convolution of the formed wafer.
- the cross sectional edge length is substantially the circumference of the formed wafer, that is the cross sectional edge length equals 2 ⁇ r where r is the radius of the cylinder.
- a typical value for the cross sectional edge length to average cross sectional area (7-r 2 ) , ratio for such a wafer is, therefore, 2/r.
- the maximum value of the cross sectional edge length is the length of the wafer ribbon forming the wafer. In the rippled wafers of the present invention, the cross sectional edge length approaches this value. In the known folded convoluted wafers described above, the cross sectional edge length is significantly less than the theoretical maximum.
- the average cross sectional area of a formed wafer is obtained by measuring the volume of the formed wafer (rather than the volume of the wafer ribbon in the formed wafer) and dividing this by the length of the formed wafer.
- the rippled wafers of the present invention need not be circular in cross section.
- the average cross sectional area of the rippled wafers may be considered to be equivalent to that of a circle having a radius r e , where r e equals (average cross sectional area/7r) V2 .
- r e is typically between about 5mm and about 10mm.
- a confectionery product comprising a rippled wafer formed of a convoluted wafer ribbon, wherein the turns are substantially uniformly distributed across the cross section of the rippled wafer, where a turn is a change in direction of the wafer ribbon of at least 45°.
- a confectionery product comprising a three- dimensional rippled wafer formed in a single step.
- the rippled wafer has a ratio of cross sectional edge length to average cross sectional area of greater than 2/r ⁇ . More preferably the rippled wafer has a ratio of cross sectional edge length to average cross sectional area of at least 4/r e .
- the invention also provides a confectionery product comprising a rippled wafer according to the invention.
- the confectionery product further comprises a soft layer at least partly surrounding the rippled wafer and a hard shell.
- the soft layer is a fat-based cream.
- the hard shell may be a sugar based shell or other hard coating employed in confectionery products such as a caramel or toffee coating.
- the hard shell is chocolate.
- the fat-based cream may be any cream employed in confectionery products such as a chocolate cream or a caramel cream.
- Confectionery products according to the invention can be made to emulate or incorporate the taste attributes of conventional chocolate bars.
- the inclusion of low density, low satiating rippled wafers which melt away quickly with no tooth-packing and no hard "snap" in confectionery products according to the invention delivers textural lightness and variation not found in known confectionery products .
- the rippled wafers of the invention may constitute a major or minor component of the confectionery product.
- the known three-dimensional book wafers described above comprise a plurality of flat layers of wafer separated by layers of cream.
- rippled wafers according to the present invention comprise a plurality of convolutions separated by air pockets .
- Confectionery products comprising rippled wafers according to the invention at least partly surrounded by a cream deliver a texture not found in known confectionery products comprising book wafers .
- the production of known three-dimensional book wafers involves a series of steps during which cream and/or wafer may be lost .
- the three-dimensional rippled wafers of the present invention are, in contrast, formed in a single processing step.
- Figure 1 is a schematic view of apparatus for the production of a rippled wafer of the invention
- Figure 2 shows an enlarged schematic view of a part of the rotary forming unit of Figure 1;
- Figure 3 shows an end view of a rippled wafer produced using the apparatus shown in Figures 1 and 2 ;
- Figure 4 shows a plan view of the rippled wafer of Figure 3 ;
- Figure 5 is a graph showing the results of compression tests on a known cylindrical rolled wafer
- Figure 6 is a graph showing the results of compression tests on a known folded convoluted wafer
- Figure 7 is a graph showing the results of compression tests on a known flattened rolled wafer
- Figure 8 is a graph showing the results of compression tests on a first rippled wafer of the present invention,-
- Figure 9 is a graph showing the results of compression tests on a second rippled wafer of the present invention.
- Figure 10 is a graph showing the results of compression tests on a third rippled wafer of the present invention.
- Figure 11 shows a cross-sectional view of an embodiment of a confectionery product according to the invention.
- the apparatus of Figures 1 and 2 comprises a roll wafer oven 10 having a heated drum 20 mounted for clockwise rotation about its central axis, as shown by the arrow in Figure 1.
- a rotary former 30, having a plurality of cavities 40 disposed about its circumference, is mounted adjacent to the drum 20 for rotation in an anti-clockwise direction about its central axis.
- a doctor blade 50 is mounted between the drum 20 and the rotary former 30.
- a take-off belt 60 is located beneath the rotary former 30 on the side distant from the drum 20.
- wafer batter is applied to the heated surface of the rotating drum 20 of the roll wafer oven 10.
- the wafer batter bakes as the drum rotates to form a continuous baked layer of wafer 70 which is removed from the surface of the drum 20 as a continuous ribbon 80 by the doctor blade 50.
- As the wafer ribbon 80 is removed from the drum 20 it collects in a cavity 40 on the rotary former 30.
- the continued counter rotation of the drum 20 and the rotary former 30, causes the doctor blade 50 and the divide between the cavity 40 and the adjacent cavity in a clockwise direction to cooperate in a scissor like action, cutting the wafer ribbon 80 to form a discrete rippled wafer 90 in the cavity 40.
- the wafer ribbon 80 then begins to collect in the adjacent cavity and the process is repeated.
- the rippled wafers 90 are ejected from the rotary former 30 onto the take-off belt 60 by removal means such as an air jet (not shown) and transported downstream of the rotary former where they may be incorporated into confectionery products by conventional means .
- the width of the wafer ribbon 80 formed on the surface drum 20 determines the maximum length of the formed rippled wafers 90, while the length of wafer ribbon 80 collected in each cavity 40 on the rotary former 30 affects the density of convolutions of the rippled wafers 90 and hence their overall density.
- the shape of the rippled wafers 90 formed are in part determined by the dimensions of the cavities 40 on the rotary former 30 and the density of the rippled wafers 90 formed are in part determined by the relative speeds of the rotary former 30 and the drum 20, which determine the length of wafer ribbon 80 collected in each cavity 40.
- an increase in the rotational speed of the rotary former 30 leads to a decrease in the length of wafer ribbon 80 collected in each cavity 40 and hence to a decrease in the density of the rippled wafers 90 formed.
- a decrease in the rotational speed of the rotary former 30 leads to a increase in the length of wafer ribbon 80 collected in each cavity 40 and hence to an increase in the density of the rippled wafers 90 formed.
- the temperature of and residence time of the rippled wafer within the rotary former should be sufficient to cool the wafer below its glass transition temperature to ensure it maintains its formed shape upon exiting the rotary former. If the rippled wafer is not sufficiently cooled before being removed from the rotary former, it will remain flexible and may expand or relax from its formed shape to its original shape. Decreasing the amount of wafer introduced into each cavity of the rotary former reduces the density of the rippled wafers produced, resulting in less efficient cooling as the specific heat capacity of the rippled wafers (wafer and air) increases. However, the amount of wafer to be cooled is reduced. Conversely, increasing the amount of wafer introduced into each cavity of the rotary former increases the density of the rippled wafers produced and so results in more efficient cooling. However, the amount of wafer to be cooled is also increased.
- a continuous layer of the batter was deposited onto the drum surface of a gas heated 2 meter diameter drum oven and baked for 32 seconds at a temperature of between 155°C and 165°C to form a flexible wafer layer.
- the hot flexible wafer layer was removed from the surface of the drum as a wafer ribbon by means of a doctor blade and rippled directly into a water-cooled rotary forming unit, indexed by servomotor control and surrounded by a mains water-cooled jacket.
- the cavities of the rotary former unit were each approximately 9mm x 9mm x 300mm.
- the resulting rippled wafers were cooled to less than 80°C in the rotary former for about 10 seconds before being blown by an air jet horizontally along the rotary former channel down a hose into a collection channel.
- the length, thickness, weight, and density of the rippled wafers obtained in Example 1 are given in Table 2.
- Rippled wafers were produced in the same way as in Example 1 using a wafer batter having the ingredients given in Table 1 but in which the skimmed milk powder was replaced by malted milk powder.
- Rippled wafers were produced in the same way as in Example 1 using a wafer batter in which the cocoa powder content was increased from 0.4% by weight to 1.1% by weight.
- Examples 1 to 7 the wafers retained their formed rippled shape upon being removed from the rotary former.
- rippled wafers of varying density were produced in the same way as in Example 1.
- the rippled wafer density was modified for a given wafer width by varying the amount of wafer collected in each cavity of the rotary former through variation of the index speed of the rotary former; increasing the index speed leads to decreased rippled wafer density, decreasing the index speed leads to increased rippled wafer density.
- the texture of the rippled wafers produced was analysed by a flat disc compression test on a Micro Stable Systems Texture Analyser. The averaged results for a number of individual tests are given in Table 4 along with those for: a known cylindrical rolled wafer; a known folded convoluted wafer and a known flattened rolled wafer all of the recipe of Example 1 and of the same weight per unit length.
- the force listed in Table 4 is the force required to initially crush the various wafers as measured by the highest initial peak height in the compression tests and gives as an indication of the hardness of the wafers .
- the peak count listed in Table 4 is the number of distinct peaks detected during the flat disc compression tests and gives an indication of the crispness of the wafers.
- Table 5 As can be seen from Table 5, while there is some variation in the average number of turns/cm 2 of the rippled wafers of Examples 14 to 16, in all cases the average number of turns is much greater than for the known folded convoluted wafer.
- the average number of turns for a given cross sectional area gives an indication of the degree of convolution and the crispness of the formed wafer.
- known folded convoluted wafers are not hard and have a delicate texture, they do not exhibit the same level of convolution and crispness as the rippled wafers of the present invention.
- Figure 11 shows an embodiment of a layered confectionery product 100 according to the present invention comprising a lower chocolate cream layer 110 and an upper caramel layer 120 on top of the chocolate cream layer 110.
- the lower chocolate cream layer 110 and the upper caramel cream layer 120 are covered by an outer layer of chocolate 130.
- a rippled wafer 140 is disposed at the interface between the lower chocolate cream layer 110 and the upper caramel cream layer 120 such that the upper surface of the rippled wafer 140 is surrounded by the caramel cream layer 120 and the lower surface of the rippled wafer 140 is surrounded by the chocolate cream layer 110.
- the rippled wafer 140 delivers a light, crisp and even texture to the confectionery product 100.
- rippled wafers of the invention were formed using a gas heated roll wafer oven, it will be appreciated that other ovens such as infra-red or induction heated ovens could also be employed.
- the means for ejecting the rippled wafers from the rotary former comprise an air jet, other removal means including suction means, gravitational means or physical means such as rod pushers could be employed.
- other removal means including suction means, gravitational means or physical means such as rod pushers could be employed.
- different sugars and/or base recipes may be employed in the manufacture of rippled wafers according to the invention to produce sweet or savoury wafers .
- Rippled wafers to which inclusions or other product layers have been added during the baking process may be included in confectionery products according to the invention. Rippled wafers according to the invention may also be incorporated as components in other products such as petfoods .
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006500178A JP2006517098A (en) | 2003-01-10 | 2004-01-07 | Wafer |
US10/541,302 US8613966B2 (en) | 2003-01-10 | 2004-01-07 | Wafer |
AU2004204374A AU2004204374B2 (en) | 2003-01-10 | 2004-01-07 | Wafer |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0300569.1 | 2003-01-10 | ||
GB0300569A GB2403393B (en) | 2003-01-10 | 2003-01-10 | Wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004062374A1 true WO2004062374A1 (en) | 2004-07-29 |
Family
ID=9950946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB2004/000028 WO2004062374A1 (en) | 2003-01-10 | 2004-01-07 | Wafer |
Country Status (9)
Country | Link |
---|---|
US (1) | US8613966B2 (en) |
EP (1) | EP1437045B1 (en) |
JP (1) | JP2006517098A (en) |
AT (1) | ATE320716T1 (en) |
AU (1) | AU2004204374B2 (en) |
DE (1) | DE602004000515T2 (en) |
FR (1) | FR2849747B1 (en) |
GB (1) | GB2403393B (en) |
WO (1) | WO2004062374A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2108262A1 (en) | 2008-04-11 | 2009-10-14 | Mars, Incorporated | Rippled wafer |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0820103D0 (en) * | 2008-10-31 | 2008-12-10 | Cadbury Holdings Ltd | Centrefilled confectionery composition |
GB0908781D0 (en) | 2009-05-21 | 2009-07-01 | Cadbury Uk Ltd | Confectionery product |
AT512716A1 (en) * | 2012-03-30 | 2013-10-15 | Haas Food Equipment Gmbh | Process for the continuous production of rolling waffles with a mourning texture |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3956517A (en) * | 1974-05-13 | 1976-05-11 | The Procter & Gamble Company | Method of forming rippled chip-type products |
GB2128130A (en) * | 1982-09-16 | 1984-04-26 | Haas Franz Waffelmasch | Production of products from a dough strip |
US4508739A (en) * | 1982-12-07 | 1985-04-02 | Frito-Lay, Inc. | Potato product with opposite corrugations of different frequencies |
US4973481A (en) * | 1989-03-17 | 1990-11-27 | Miles J. Willard | Process for producing rippled snack chips and product thereof |
US5419903A (en) * | 1990-12-12 | 1995-05-30 | United Biscuits (Uk) Limited | Product and process of making biscuits with a corrugated configuration |
WO2003005832A1 (en) * | 2001-07-13 | 2003-01-23 | Mars (Uk) Limited | Thin film forming |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH569424A5 (en) * | 1973-05-11 | 1975-11-28 | Battelle Development Corp | |
DK105793A (en) * | 1993-09-21 | 1995-03-22 | Henrik Kloeft | Packaging, especially for ice cream, as well as the method and apparatus for making it |
GB2316852B (en) * | 1996-09-04 | 2000-04-26 | Unilever Plc | Process for the preparation of a food product |
AT409703B (en) | 1996-12-13 | 2002-10-25 | Haas Franz Waffelmasch | METHOD AND DEVICES FOR PRODUCING EDIBLE WAFFLE ROLLS |
US6852957B2 (en) * | 2002-06-28 | 2005-02-08 | Kerry Group Services International, Ltd. | Breadcrumb processing line and method |
-
2003
- 2003-01-10 GB GB0300569A patent/GB2403393B/en not_active Expired - Lifetime
-
2004
- 2004-01-07 JP JP2006500178A patent/JP2006517098A/en active Pending
- 2004-01-07 US US10/541,302 patent/US8613966B2/en active Active
- 2004-01-07 AU AU2004204374A patent/AU2004204374B2/en not_active Expired
- 2004-01-07 WO PCT/GB2004/000028 patent/WO2004062374A1/en active Application Filing
- 2004-01-09 EP EP04250103A patent/EP1437045B1/en not_active Expired - Lifetime
- 2004-01-09 AT AT04250103T patent/ATE320716T1/en active
- 2004-01-09 FR FR0400176A patent/FR2849747B1/en not_active Expired - Lifetime
- 2004-01-09 DE DE602004000515T patent/DE602004000515T2/en not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3956517A (en) * | 1974-05-13 | 1976-05-11 | The Procter & Gamble Company | Method of forming rippled chip-type products |
GB2128130A (en) * | 1982-09-16 | 1984-04-26 | Haas Franz Waffelmasch | Production of products from a dough strip |
US4508739A (en) * | 1982-12-07 | 1985-04-02 | Frito-Lay, Inc. | Potato product with opposite corrugations of different frequencies |
US4973481A (en) * | 1989-03-17 | 1990-11-27 | Miles J. Willard | Process for producing rippled snack chips and product thereof |
US5419903A (en) * | 1990-12-12 | 1995-05-30 | United Biscuits (Uk) Limited | Product and process of making biscuits with a corrugated configuration |
WO2003005832A1 (en) * | 2001-07-13 | 2003-01-23 | Mars (Uk) Limited | Thin film forming |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2108262A1 (en) | 2008-04-11 | 2009-10-14 | Mars, Incorporated | Rippled wafer |
WO2009125206A1 (en) * | 2008-04-11 | 2009-10-15 | Mars Incorporated | Rippled wafer |
Also Published As
Publication number | Publication date |
---|---|
EP1437045B1 (en) | 2006-03-22 |
JP2006517098A (en) | 2006-07-20 |
ATE320716T1 (en) | 2006-04-15 |
DE602004000515D1 (en) | 2006-05-11 |
US8613966B2 (en) | 2013-12-24 |
GB2403393B (en) | 2005-07-20 |
GB2403393A (en) | 2005-01-05 |
GB0300569D0 (en) | 2003-02-12 |
EP1437045A1 (en) | 2004-07-14 |
US20070166434A1 (en) | 2007-07-19 |
AU2004204374A1 (en) | 2004-07-29 |
FR2849747B1 (en) | 2007-01-26 |
AU2004204374B2 (en) | 2008-11-13 |
DE602004000515T2 (en) | 2006-11-23 |
FR2849747A1 (en) | 2004-07-16 |
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