WO2004053403A3 - Method and system for cooling high power density devices - Google Patents

Method and system for cooling high power density devices Download PDF

Info

Publication number
WO2004053403A3
WO2004053403A3 PCT/US2003/037742 US0337742W WO2004053403A3 WO 2004053403 A3 WO2004053403 A3 WO 2004053403A3 US 0337742 W US0337742 W US 0337742W WO 2004053403 A3 WO2004053403 A3 WO 2004053403A3
Authority
WO
WIPO (PCT)
Prior art keywords
power density
high power
turbomachine
cooling high
density devices
Prior art date
Application number
PCT/US2003/037742
Other languages
French (fr)
Other versions
WO2004053403A2 (en
Inventor
Mehmet Arik
Warren Bessler
Michael Bowman
Charles Byrd
William Gerstler
Daniel P Smith
Todd Wetzel
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/065,985 external-priority patent/US20040107718A1/en
Application filed by Gen Electric filed Critical Gen Electric
Priority to AT03796457T priority Critical patent/ATE511620T1/en
Priority to JP2005508448A priority patent/JP2006514259A/en
Priority to AU2003298702A priority patent/AU2003298702A1/en
Priority to EP03796457A priority patent/EP1579155B1/en
Priority to CN200380109490.9A priority patent/CN1914968B/en
Priority to MXPA05006051A priority patent/MXPA05006051A/en
Publication of WO2004053403A2 publication Critical patent/WO2004053403A2/en
Publication of WO2004053403A3 publication Critical patent/WO2004053403A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2341/00—Details of ejectors not being used as compression device; Details of flow restrictors or expansion valves
    • F25B2341/001—Ejectors not being used as compression device
    • F25B2341/0014—Ejectors with a high pressure hot primary flow from a compressor discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A turbomachinery system (200) for cooling a high power density device (220) includes a turbomachine (300) configured to deliver a high flux cooling medium toward the high power density device (220), a housing (305) containing a motor (312), a compressor (340), or both, of the turbomachine (300) a heat exchanger (230) in fluid communication with the turbomachine (300) and arranged for being thermally coupled to the high power density device (220), and a transition duct (240) arranged intermediate the heat exchanger (230) and turbomachine (300).
PCT/US2003/037742 2002-12-06 2003-11-24 Method and system for cooling high power density devices WO2004053403A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
AT03796457T ATE511620T1 (en) 2002-12-06 2003-11-24 METHOD AND SYSTEM FOR COOLING INTEGRATED HIGH-PERFORMANCE DEVICES
JP2005508448A JP2006514259A (en) 2002-12-06 2003-11-24 Method and system for cooling high power density devices
AU2003298702A AU2003298702A1 (en) 2002-12-06 2003-11-24 Method and system for cooling high power density devices
EP03796457A EP1579155B1 (en) 2002-12-06 2003-11-24 Method and system for cooling high power density devices
CN200380109490.9A CN1914968B (en) 2002-12-06 2003-11-24 Method and system for cooling high power density devices
MXPA05006051A MXPA05006051A (en) 2002-12-06 2003-11-24 Method and system for cooling high power density devices.

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/065,985 US20040107718A1 (en) 2002-12-06 2002-12-06 Method, system and apparatus for cooling high power density devices
US10/065,985 2002-12-06
US10/670,533 US7010930B2 (en) 2002-12-06 2003-09-24 Method and system for cooling high power density devices
US10/670,533 2003-09-24

Publications (2)

Publication Number Publication Date
WO2004053403A2 WO2004053403A2 (en) 2004-06-24
WO2004053403A3 true WO2004053403A3 (en) 2009-07-23

Family

ID=32510808

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/037742 WO2004053403A2 (en) 2002-12-06 2003-11-24 Method and system for cooling high power density devices

Country Status (5)

Country Link
EP (1) EP1579155B1 (en)
JP (1) JP2006514259A (en)
AU (1) AU2003298702A1 (en)
MX (1) MXPA05006051A (en)
WO (1) WO2004053403A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7477516B2 (en) * 2006-08-17 2009-01-13 Delphi Technologies, Inc. Air cooled computer chip
US8347952B2 (en) * 2006-11-30 2013-01-08 Apple Inc. Enhanced vent for outlet for a cooling system
JP6541812B1 (en) * 2018-01-25 2019-07-10 三菱電機株式会社 Heat sink and semiconductor module
JP2023552920A (en) * 2020-11-25 2023-12-19 デジタル ポーポイス エルエルシー Cooling systems for data centers including offset cooling technology
CN116772953A (en) * 2022-04-21 2023-09-19 广东德立科技发展有限公司 Mass flowmeter and measuring system thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5010576A (en) * 1990-01-22 1991-04-23 Westinghouse Electric Corp. Active acoustic attenuation system for reducing tonal noise in rotating equipment
EP0615224A2 (en) * 1993-03-09 1994-09-14 Fujitsu Limited A method of determining the sound transfer characteristic of an active noise control system
DE19625606A1 (en) * 1996-06-26 1998-01-02 Walter Egger Ventilator noise suppression in personal computers
US6198627B1 (en) * 1998-12-17 2001-03-06 Hewlett-Packard Company Noise reduction back cover for computer devices
JP2002026560A (en) * 2000-07-07 2002-01-25 Fujikura Ltd Electronic device cooling unit
US6422303B1 (en) * 2000-03-14 2002-07-23 Intel Corporation Silent heat exchanger and fan assembly
US20020108743A1 (en) * 2000-12-11 2002-08-15 Wirtz Richard A. Porous media heat sink apparatus
US6587335B1 (en) * 2000-06-30 2003-07-01 Intel Corporation Converging cooling duct for a computer cooling system

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5010576A (en) * 1990-01-22 1991-04-23 Westinghouse Electric Corp. Active acoustic attenuation system for reducing tonal noise in rotating equipment
EP0615224A2 (en) * 1993-03-09 1994-09-14 Fujitsu Limited A method of determining the sound transfer characteristic of an active noise control system
DE19625606A1 (en) * 1996-06-26 1998-01-02 Walter Egger Ventilator noise suppression in personal computers
US6198627B1 (en) * 1998-12-17 2001-03-06 Hewlett-Packard Company Noise reduction back cover for computer devices
US6422303B1 (en) * 2000-03-14 2002-07-23 Intel Corporation Silent heat exchanger and fan assembly
US6587335B1 (en) * 2000-06-30 2003-07-01 Intel Corporation Converging cooling duct for a computer cooling system
JP2002026560A (en) * 2000-07-07 2002-01-25 Fujikura Ltd Electronic device cooling unit
US20020108743A1 (en) * 2000-12-11 2002-08-15 Wirtz Richard A. Porous media heat sink apparatus

Also Published As

Publication number Publication date
EP1579155B1 (en) 2011-06-01
AU2003298702A1 (en) 2004-06-30
WO2004053403A2 (en) 2004-06-24
JP2006514259A (en) 2006-04-27
MXPA05006051A (en) 2005-08-18
EP1579155A2 (en) 2005-09-28

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