Temperature control for semiconductor lasers
FIELD OF THE INVENTION AND PRIOR ART
This invention relates to systems and methods for controlling the temperature of laser diodes, especially for use in optical com- munication equipment.
Optical communication systems transport information in the form of modulated light signals. A semiconductor laser (laser = Mght amplification by stimulated emission of radiation) in a signal transmitter unit is here normally used in order to accomplish optical signals based on electrical ditto, and a photodiode in a signal receiver unit typically converts the optical signals back into electrical signals again. In most cases, the signal transmitter and the signal receiver are co-located to form an optoelectrical transceiver unit. These units, in turn, normally operate in an environment that includes one or more other units that dissipate comparatively large amounts of heat energy, such that the ambient temperature becomes fairly high. It is therefore important that the transceiver unit itself is efficiently cooled, especially since the laser diodes are very temperature sensitive. A controlled operating temperature for the laser diodes is necessary in order to guarantee their reliability and lifetime.
Traditionally, high performance laser diodes in wavelength ranges around 1310 nm and 1550 nm are cooled to 25-40°C, normally by using a TEC (Thermo Electric Cooler). However, efficient cooling arrangements for laser diodes consume large amounts of extra power, often up to 20% of the total power consumption in the transceiver. There is therefore an increasing demand for un-cooled systems. If the laser diodes have no cooling arrangements at all, it is however difficult to guarantee their reliability and lifetime without designing them for operation at very high temperatures, which would make the laser diodes very expensive. There is therefore a need for a better cooling system.
SUMMARY OF THE INVENTION
It is an object of the invention to provide an optical transmitter module with a laser diode cooling system which gives a sufficient cooling effect to guarantee the reliability and lifetime of the laser diode, without consuming unnecessarily large amounts of energy.
This object is achieved by limiting the cooling effect to the laser diode when the temperature of the optical transmitter module becomes higher than a predetermined temperature level. If the total time that the temperature is too high is limited, this will not affect the reliability and lifetime of the laser diode.
In a first embodiment of the invention, two different cooling conditions for the laser diode are defined: STANDARD and EXTREME, depending on the temperature of the optical transmitter module. STANDARD cooling conditions are specified as temperatures of less than a predetermined temperature (e.g. 60°C), and EXTREME cooling conditions are temperatures above this temperature. As long as the overall module temperature is below this temperature (STANDARD cooling conditions), the temperature of the laser diode is kept at a normal level (e.g. 40°C) by the use of a TEC, for example a Peltier cooler. During EXTREME cooling conditions, the temperature of the laser diode is instead allowed to rise in proportion to the module temperature. This is achieved by control of the cooling effect of the TEC.
In an alternative to the first embodiment of the invention, the total time that the laser diode operates in the EXTREME cooling condition is also measured, in order to ensure that this time is not so long that it affects the reliability and lifetime of the laser diode.
In a second embodiment of the invention, maximum power in the cooling device is instead specified. The cooling device cools the laser diode to a certain temperature (e.g. 40°C) as long as the power needed for the cooling does not exceed a certain level (e.g. 0,2 W). When the cooling power needed exceeds this level, the cooling power is instead kept constant at this level, and the temperature of the laser diode is allowed to rise.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention will now be described by means of preferred embodiments, with reference to the attached drawings, of which:
Figure 1 shows an exploded diagram over a laser capsule according to an embodiment of the invention,
Figure 2 illustrates, by means of a schematic flow diagram, a first embodiment of the invention,
Figure 3 illustrates, by means of a schematic flow diagram, an alternative to the first embodiment of the invention, and
Figure 4 illustrates, by means of a schematic flow diagram, a second embodiment of the invention.
DETAILED DESCRIPTION OF THE INVENTION
Conventionally, laser diodes that are used in optical transmitter modules are either cooled or un-cooled. When the laser diodes are constantly cooled to for example 40°C, reliability and lifetime only have to be guaranteed for this temperature. However, the cooling consumes large amounts of extra power. In un-cooled systems, reliability and lifetime instead have to be guaranteed for the hardest possible conditions, and the laser diodes would then become much more expensive to develop and manufacture.
However, the ambient temperatures allowed in network equipment environment are normally regulated, for example according to Telcordia Standard GR-468-CORE. This regulation restricts the long-term ambient temperature to a range of 4-38°C, but allows it to reach as high as 49°C (corresponding to a module temperature of 70-80°C when many transceivers are mounted close together) for up to 72 hours at a time during a total of not more than 15 days per year. Measurements show that if the temperature of the laser diode only reaches high levels during such short periods, this will not affect the reliability and lifetime of the laser diode.
According to the invention, the cooling effect to the laser diode is therefore limited when the temperature of the optical transmitter module becomes higher than a predetermined maximum temperature. As long as regulations or measurements ensure that the total time that the temperature is too high is limited, the reliability and lifetime of the laser diode will not be affected by this.
Figure 1 shows an exploded diagram over an embodiment of an optical transmitter module capsule 10 according to the invention. Here, a laser unit 13 (a laser diode on a carrier) is mounted on the inside of a side 1 1 a of the optical transmitter module capsule 10. The capsule 10 also contains a thermoelectric unit 12, for example a Peltier cooler, which actively transports heat energy from the laser unit 13 towards the exterior of the capsule side 1 1 a. A capsule side 1 1 b in the form of a lid is used to seal the capsule 10 after assembly of the units therein.
The first embodiment of the invention will now be described with reference to the schematic flow diagram in figure 2.
In step 21 , the temperature Tm of the optical transmitter module is measured, and a following step 22 checks if Tm<=TEχτm (e.g.
60°C). If so, the cooling condition is set to STANDARD in step
23, which means that the laser diode is cooled to the standard operating temperature TSTAd (e.g. 40°C). If Tm>TEXTm, the cooling condition is instead set to EXTREME in step 24, which means that the laser diode temperature Td is allowed to rise in proportion to the module temperature Tm, for example with a maximum temperature difference ΔT between the module temperature Tm and the laser diode temperature Td of approximately 20°C. The temperature Tm of the optical transmitter module is then again measured in step 21.
An alternative to the first embodiment of the invention will now be described with reference to the schematic flow diagram in figure 3.
In step 31 , the elapsed time during EXTREME conditions (tEχτ) is set to tEXT=0. Step 32 then measures the temperature Tm of the laser module, and a following step 33 checks if Tm<=TEχTm (e.g. 60°C). If so, the cooling condition is set to STANDARD and the total elapsed time during EXTREME conditions tEχτtot is set to tEχTtot=tEχTtot+tEχτ in step 34. tEXT is then reset to tEXT=0 in step 35. If Tm>TEχTm, a step 36 checks if the cooling condition is already EXTREME. If so, a step 37 checks that the cooling condition has not been EXTREME for too long (longer than tMAX). If this is the case, a warning is sent to the system in step 38. If the cooling condition is not already EXTREME, then the cooling condition is set to EXTREME in step 39, and measuring of tEXT begins in step 40. The temperature Tm of the laser module is then measured again in step 32. In this way, the total elapsed time during EXTREME conditions, tEXTt0t, can be measured, in order to ensure that this time is not so long that it affects the reliability and lifetime of the laser diode.
The second embodiment of the invention, in which the power consumption in the TEC is instead limited, will now be described with reference to the schematic flow diagram in figure 4.
In step 41 , the TEC power consumption Pc is measured, and a following step 42 checks if PC > =PMAXC- If so, the cooling effect is limited such that PC =PMAXC in step 43, which means that the laser diode temperature Td is allowed to rise. If PC<PMAXC, laser diode temperature Td is measured in step 44, and the TEC cools the laser such that Td=TSτAd in step 45. The TEC power consumption Pc is then again measured in step 41.
PMAXC is preferably chosen such that a TEC power consumption of PMAXC corresponds approximately to Tm=TEXTm, and can for example be set to 0,2 W. This would for a 1310 nm laser diode mean limiting the maximum power consumed in the TEC by more than 50%.
In an alternative to the second embodiment of the invention, the total time that the laser diode temperature Td is higher than TSτAd
is also measured (in analogy with the alternative to the first embodiment), in order to ensure that this time is not so long that it affects the reliability and lifetime of the laser diode.
Naturally, the laser diode performance at a temperature Td that is higher than TSτAd will not be as good as the laser diode performance at a temperature Td that is lower than TSτAd, but the invention still enables an optimized operating point regarding reliability, TEC power consumption and laser diode performance.
The invention is not restricted to the described embodiments in the figures, but may be varied freely within the scope of the claims. For example, the standard operating temperature TSTAd of the laser diode can be set to any suitable temperature, preferably between 25°C and 55°C. The predetermined temperature TEXTm can of course be set to any value, depending on the specifications of the laser diodes used, but is often chosen to be between 50°C and 70°C.
The maximum temperature difference ΔT between the module temperature Tm and the laser diode temperature Td can also be chosen to any suitable value. ΔT is often chosen to be between 10°C and 30°C, but even a ΔT of less than 10°C could optimize the relation between reliability, TEC power and laser diode performance, since reliability and performance still would be better than for completely un-cooled systems. When the module temperature is very high, even a ΔT as high as 50°C could mean decreased power consumption compared to standard cooling.
The maximum TEC power consumption PMAXC can be set to any value that limits the TEC power consumption Pc by a substantial amount. In some applications, even a PMAXC of less than 0,1 W could optimize the relation between reliability, TEC power and laser diode performance, since reliability and performance still would be better than for completely un-cooled systems. In other applications, where an unlimited Pc could become as high as 3 - 4 W, a PMAXC le el of as high as 2 W would still be a substantial limitation of the TEC power consumption.
The term "comprises/comprising" when used in this specification is taken to specify the presence of stated features, integers, steps or components. However, the term does not preclude the presence or addition of one or more additional features, integers, steps or components or groups thereof.