WO2004027839A3 - Electrostatic chuck having a low level of particle generation and method of fabricating same - Google Patents

Electrostatic chuck having a low level of particle generation and method of fabricating same Download PDF

Info

Publication number
WO2004027839A3
WO2004027839A3 PCT/US2003/029212 US0329212W WO2004027839A3 WO 2004027839 A3 WO2004027839 A3 WO 2004027839A3 US 0329212 W US0329212 W US 0329212W WO 2004027839 A3 WO2004027839 A3 WO 2004027839A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrostatic chuck
low level
particle generation
fabricating same
fabricating
Prior art date
Application number
PCT/US2003/029212
Other languages
French (fr)
Other versions
WO2004027839A2 (en
Inventor
Wendell G Boyd Jr
Jose-Antonio Marin
Ho T Fang
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/247,599 external-priority patent/US6894211B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to AU2003272478A priority Critical patent/AU2003272478A1/en
Publication of WO2004027839A2 publication Critical patent/WO2004027839A2/en
Publication of WO2004027839A3 publication Critical patent/WO2004027839A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

An electrostatic chuck having either a conformal or non-conformal coating upon a surface for supporting a substrate. The coating reduces a number of particles generated by the electrostatic chuck.
PCT/US2003/029212 2002-09-19 2003-09-18 Electrostatic chuck having a low level of particle generation and method of fabricating same WO2004027839A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003272478A AU2003272478A1 (en) 2002-09-19 2003-09-18 Electrostatic chuck having a low level of particle generation and method of fabricating same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/247,599 2002-09-19
US10/247,599 US6894211B2 (en) 2001-09-21 2002-09-19 Keyboard apparatus

Publications (2)

Publication Number Publication Date
WO2004027839A2 WO2004027839A2 (en) 2004-04-01
WO2004027839A3 true WO2004027839A3 (en) 2004-05-21

Family

ID=32028974

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/029212 WO2004027839A2 (en) 2002-09-19 2003-09-18 Electrostatic chuck having a low level of particle generation and method of fabricating same

Country Status (4)

Country Link
KR (1) KR20050054950A (en)
CN (1) CN1685473A (en)
AU (1) AU2003272478A1 (en)
WO (1) WO2004027839A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100368591C (en) * 2004-11-19 2008-02-13 上海华虹Nec电子有限公司 Electronic absorbing disk for chemical gas-phase depositor
EP1772901B1 (en) * 2005-10-07 2012-07-25 Rohm and Haas Electronic Materials, L.L.C. Wafer holding article and method for semiconductor processing
JP5295515B2 (en) 2007-03-30 2013-09-18 東京エレクトロン株式会社 Surface treatment method for mounting table
TWI475594B (en) 2008-05-19 2015-03-01 Entegris Inc Electrostatic chuck
US7884925B2 (en) * 2008-05-23 2011-02-08 Lam Research Corporation Electrical and optical system and methods for monitoring erosion of electrostatic chuck edge bead materials
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
US8879233B2 (en) 2009-05-15 2014-11-04 Entegris, Inc. Electrostatic chuck with polymer protrusions
CN102986017B (en) 2010-05-28 2015-09-16 恩特格林斯公司 high surface resistivity electrostatic chuck
WO2012057987A2 (en) * 2010-10-29 2012-05-03 Applied Materials, Inc. Deposition ring and electrostatic chuck for physical vapor deposition chamber
JP6238996B2 (en) * 2012-11-02 2017-11-29 インテグリス・インコーポレーテッド Electrostatic chuck with photopatternable soft protrusion contact surface
EP2956960B1 (en) * 2013-02-13 2023-03-29 Entegris, Inc. Vacuum chuck with polymeric embossments

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6117246A (en) * 1997-01-31 2000-09-12 Applied Materials, Inc. Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck
WO2002001611A2 (en) * 2000-06-23 2002-01-03 Applied Materials, Inc. Electrostatic chuck and method of fabricating the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6117246A (en) * 1997-01-31 2000-09-12 Applied Materials, Inc. Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck
WO2002001611A2 (en) * 2000-06-23 2002-01-03 Applied Materials, Inc. Electrostatic chuck and method of fabricating the same

Also Published As

Publication number Publication date
AU2003272478A1 (en) 2004-04-08
KR20050054950A (en) 2005-06-10
WO2004027839A2 (en) 2004-04-01
CN1685473A (en) 2005-10-19

Similar Documents

Publication Publication Date Title
CA2501362A1 (en) Electrophotographic photoreceptor, process cartridge and electrophotographic apparatus
WO2003008134A3 (en) Surface protection film
WO2008030862A3 (en) Magnetic particles and methods of making and using the same
AU2002243937A1 (en) Method for forming microelectronic spring structures on a substrate
AU2003288011A1 (en) Particle trap with coated fibre layer
AU2001255587A1 (en) Hydrophobic coating including dlc on substrate
AU2003253192A1 (en) Method for applying a hydrophobic coating to the surface of a porous substrate, maintaining its porosity
WO2004027839A3 (en) Electrostatic chuck having a low level of particle generation and method of fabricating same
EP1647842A3 (en) Lens and method of manufacturing lens
AU2001251305A1 (en) Coating compositions, coated substrates and methods for inhibiting sound transmission through a substrate
TWI256084B (en) Method for producing silicon wafer, silicon wafer, and SOI wafer
WO2009005042A1 (en) Metal material, method for producing the same, and electrical electronic component using the same
WO2008045745A3 (en) Chemically-directed electrostatic self-assembly of materials
AU2003229467A1 (en) Method and device for the production of an antireflective coating, antireflective coating, and antireflective-coated substrate
AU2003215669A1 (en) Method for coating a substrate and device for carrying out the method
AU2003277601A1 (en) Method of forming film on substrate
AU2003294557A1 (en) Method of coating microelectronic substrates
WO2001088045A3 (en) Method for coating an article, and corresponding powder coating
AU2003274221A1 (en) Method for coating the surface of metallic material, device for carrying out said method
AU2003212379A1 (en) Coated substrate
AU2002223671A1 (en) Method for generating a coating on a substrate
AU2002346401A1 (en) Method for improving the adhesion of a coating
AU2003259901A1 (en) Method and composition for forming a protective coating on an assay substrate and substrate produced by the same
WO2006043157A3 (en) Diamond coated surfaces
AU2003214435A1 (en) A method of implanting a substrate and an ion implanter for performing the method

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 1020057004679

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2003823372X

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 1020057004679

Country of ref document: KR

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP