WO2004020953A1 - Systeme et procede de mesure par voie capacitive - Google Patents
Systeme et procede de mesure par voie capacitive Download PDFInfo
- Publication number
- WO2004020953A1 WO2004020953A1 PCT/FR2003/002587 FR0302587W WO2004020953A1 WO 2004020953 A1 WO2004020953 A1 WO 2004020953A1 FR 0302587 W FR0302587 W FR 0302587W WO 2004020953 A1 WO2004020953 A1 WO 2004020953A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- emitting
- receiving
- electrodes
- electrode
- capacitance
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
- G01D5/241—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes
Definitions
- the present invention relates to a contactless measurement system of a displacement or a relative positioning of two adjacent objects, by capacitive channel. It also relates to the contactless measurement method implemented in this system, as well as the application of this system to the control of mirrors, in particular segmented mirrors.
- the main but nonlimiting field of application of the present invention is that of giant segmented mirror telescopes in which it is necessary to control the tip, tilt and piston devices of segmented mirrors with high resolution, as well as the overall radius of curvature of the mirror designated as GROC.
- GROC Global System
- CA-CB type of calculation
- CA + CB capacitances constituted by two emitting electrodes and two receiving electrodes in a situation of relative misalignment.
- the object of the present invention is to provide a contactless measurement system by capacitive channel, which has better performance in measurement accuracy than current capacitive measurement systems, while allowing a reduction in production costs.
- This objective is achieved with a contactless measurement system of a relative displacement or a relative position of a first object relative to a second object, comprising:
- a sensor module comprising a transmitting plate fixed to said first object and a receiving plate linked to said second object, said first and second transmitting and receiving plates being arranged substantially opposite and provided with respectively transmitting and receiving electrodes,
- the emitting and receiving electrodes are arranged to constitute a first capacitance varying as a function of the distance separating the respectively emitting and receiving plates and a second capacitance varying as a function of the relative misalignment of said plates, and the processing means are arranged to carry out, from the measurement signals taken, an analog calculation (i) of a first signal representative of the inverse of said first capacitance and (ii) of a second signal representative of the ratio of the second capacitance to said first capacitance.
- the contactless measurement system it is thus possible to simultaneously deliver both information representative of the relative spacing of two objects, for example segmented mirrors, and information representative of the misalignment of these two objects, with very high precision made possible by analog calculation on capacitive measurement signals.
- the analog computer is preferably made with one or more modulators.
- the emitting electrodes comprise at least a first emitting electrode (T1) with a first polarity, a second emitting electrode (TA) with said first polarity and a transmitting electrode (TB) with a second polarity opposite to said first polarity
- the receiving electrodes comprise at least a first receiving electrode (R1) substantially opposite to said first transmitting electrode (T1) and a second receiving electrode (R ( AB)) substantially opposite a part of said second emitting electrode (TA) and a part of said emitting electrode (TB) of reverse polarity.
- the emitting electrodes can for example comprise two first emitting electrodes (T1, T2) with the first polarity having substantially the same first geometric shape, and in that the receiving electrodes comprise two first receiving electrodes (R1,
- R2 having the first geometric shape and arranged within the receiving plate to be opposite respectively of said first emitting electrodes when said emitting and receiving plates are in alignment.
- the second emitting electrode (TA) and the emitting electrode of reverse polarity (TB) have the same second geometric shape, for example rectangular, and are arranged parallel in close proximity to one another.
- the second receiving electrode (R (AB)) is preferably arranged within the receiving plate so that the projection of said second receiving electrode on the transmitting plate is included in a perimeter including the contours of the second transmitting electrode (TA) and the reverse polarity (TB) receiving electrode.
- the first two emitting electrodes (T1, T2) and the second emitting electrode (TA) can be electrically connected and excited by the same excitation signal modulated at high frequency, and the first two receiving electrodes (R1, R2) are electrically connected .
- C1 and C2 are the capacitances constituted respectively by the first emitting electrodes (T1, T2) and the first receiving electrodes (R1, R2), and means for performing analog calculation:
- the differential measurement CA-CB can be carried out either with a bi-electrode transmitter and a mono-electrode receiver, or with a mono-electrode transmitter and a bi-electrode receiver.
- the capacitances C1 and C2 make it possible to avoid the use of two charge amplifiers which would considerably degrade the thermal drift of the electronics.
- the processing means preferably comprise a preamplifier stage (20) for preamplifying the measurement signals taken respectively from the second receiving electrode (R (AB)) and from the first two receiving electrodes (R1, R2) electrically connected, upstream analog computing means (21).
- R (AB) second receiving electrode
- R1, R2 first two receiving electrodes
- a method for contactless measurement of a relative displacement or of a relative position of a first object with respect to a second object implemented in the system according to the invention.
- invention comprising: - an application of high frequency excitation signals on emitting electrodes arranged on a transmitting plate fixed on said first object, - a sampling of measurement signals modulated at high frequency on receiving electrodes arranged on a plate receiver attached to said second object, at least a portion of said respectively emitting and receiving electrodes being substantially opposite when the respectively emitting and receiving plates are substantially aligned,
- this processing comprises an analog calculation (i) of a first signal representative of the inverse of a first capacitance and (ii) of a second signal representative of the ratio of a second capacitance to said first capacitance, said first capacitance being constituted by at least one of said emitting electrodes and at least one of said electrodes receptors so as to vary as a function of the distance separating the respectively transmitting and receiving plates and said second capacitance being constituted by at least one of said transmitting electrodes and at least one other of said receiving electrodes so as to vary as a function of the relative misalignment of said plates .
- FIG. 3 schematically illustrates a first embodiment of the internal structure of a measurement system according to the invention
- FIG. 5 illustrates a second embodiment of a measurement system according to the invention.
- This sensor module 1 disposed between two mirror segments M, M ', comprises a transmitting plate T fixed on a side wall 10 of the segment M and a receiving plate R fixed on a side wall 11 of the segment M ', these two respectively transmitting and receiving plates T, R being substantially opposite and parallel.
- the emitting plate T comprises, on a flat support 12 of small thickness made of insulating material, two first and second emitting electrodes
- the transmitting plate T further comprises a transmitting electrode of negative polarity TB of identical shape to that of the third transmitting electrode TA and arranged parallel thereto.
- the receiving plate R comprises, on a flat support 14 of small thickness made of insulating material, two first and second electrodes R1, R2 receiving receptors of square shape, and a third receiving electrode R (AB) of rectangular shape arranged between the two first and second receiving electrodes R1, R2.
- the surface of the supports 12, 14 not occupied by the aforementioned electrodes is metallized and constitutes for these electrodes an electrostatic guard.
- the supports 12, 14 can be made of zerodur material, which makes it possible to obtain the required dimensional stability, and are covered with gold.
- the supports can also be made of flexible material, such as polyimide, glued to the mirror. Bonding, with a thin resin, makes it possible to greatly reduce the coefficient of thermal expansion of the sensor and to improve the dimensional stability of the flexible material supporting the sensor, thanks to the low coefficient of thermal expansion of the mirror.
- the flexible material can be produced with conventional flexible printed circuit.
- a first capacitance C1 is then obtained, consisting of the first emitting electrode T1 and the first receiving electrode R1, a second capacitance C2 constituted by the second emitting electrode T2 and the second receiving electrode R2, and a subtractive capacitive device CA-CB constituted, on the one hand, by the third rectangular positive emitting electrode TA and the negative emitting electrode TB and, on the other hand, the third receiving electrode R (AB).
- the sensor module 1 is connected by one or more shielded cables 15 to an electronic processing module 10 installed in a rack 100 in the standard 3U format which can contain several electronic processing modules and disposed within a container 101.
- the shielded cable 15 is connected, on the one hand, to electrical conductors connected to the sensor module 1 by means of a first connector 16 and on the other hand, to the container 101 by means of a second connector 18 then the electronic equipment 10 to the by means of a third connector 17.
- the rack 100 also includes a multi-channel acquisition module connected to the various electronic processing modules 10 and to an external link bus 103.
- the arrangement of the sensor module 1 between two mirror segments allows a quality measurement because it is very close to the optical surfaces. Furthermore, due to the remote nature of the electronic processing modules, there is no heat dissipation in the vicinity of the mirror segments.
- FIG. 3 a first embodiment of an electronic processing module 2 connected on the one hand to the sensor module 1 via the shielded cable 15 and on the other hand to a digital card of acquisition 3 provided with a microcontroller 30 and a clock 31.
- the electronic processing module 2 comprises a first preamplification stage 20 including a first preamplifier 201 and a second ultra-low noise preamplifier 202 receiving as input respectively a signal taken from the receiving electrode R (AB) and a signal taken from the two receiving electrodes R1 and R2 connected in parallel.
- This first pre-amplification step 20 is connected at output to an analog computer 21, the two output signals of which are applied at the input of two 16-bit analog / digital converters 24, 25 delivering digital data passing through to the microcontroller 30 via an internal bus. 300.
- the electronic processing module 2 also comprises a high stability differential amplifier 22 designed to deliver an excitation signal from the three positive emitting electrodes T1, T2, TA and an excitation signal from the electrode. negative transmitter TB.
- This differential amplifier 22 receives a reference signal delivered by a reference oscillator 23 driven by a clock signal generated by the clock circuit 31, and also delivers a modulation reference signal applied at the input of the analog computer 21 which also receives a offset control signal representing an analog coefficient ko delivered by a digital / analog converter connected to the digital bus 300.
- the analog processing module 2 is electrically supplied by an electrical supply module 4 also provided for supplying the digital card 3.
- the two excitation signals delivered by the differential amplifier 22 are transmitted respectively to all of the positive emitting electrodes T1, T2, TA and to the negative emitting electrode TB via respectively two wired links 154, 153 included in the shielded cable 15, while the two pre reception signals eves respectively on the differential receiving electrode R (AB) and on the two receiving electrodes RA, RB are transmitted at the input of the preamplification stage 20 via respectively two wired links 151, 152.
- the first preamplifier 201 is designed to deliver a signal representative of the difference CA - CB, while the second preamplifier 202 is designed to deliver a signal representative of the sum C1 + C2. These two analog signals are applied to the input of the analog computer 21 which is arranged to generate two representative analog signals respectively.
- FIG. 4 illustrates a practical example of embodiment of an electronic processing module 21 ′.
- the low noise preamplifiers 201, 202 are produced according to a conventional structure from operational amplifiers.
- the differential amplifier 22 comprises a transformer TR comprising a primary winding 221 connected to the output of an amplifier 220 to which an oscillation reference signal Vosc is applied, a first secondary winding 222 provided for delivering a reference voltage Vref used by the analog computer 21, and two secondary windings 223, 224 at mid-point provided for delivering the respective excitation signals of the set of positive emitting electrodes T1, T2, TA and of the negative emitting electrode TB.
- the analog computer 21 comprises a first calculation module 21.1 including a mixer circuit 211 receiving as input the signal delivered by the first preamplifier stage 201 and representative of the quantity CA-CB, the signal delivered by the second preamplifier stage 202 and representative of the quantity C1 + C2, an offset signal delivered by the digital / analog converter 26 and the output signal Vs1z of this first calculation module, and delivering a signal applied to the negative input of a differential amplifier stage 215 whose input positive is connected to a first switch 213 between the output signal of the mixer 211 and the ground, this first switch
- a second calculation module 21.2 includes a mixer circuit 212 receiving as input the signal delivered by the second preamplifier 202, the reference voltage Vref, and the output signal Vs1G from this second calculation module, and delivering a signal which is applied in negative input of a differential amplifier stage 216, the positive input of which is connected to a second switch 214 between the output signal of the mixer 212 and ground, this second switch
- the respective outputs of the two differential amplifiers 215, 216 are applied at the input of two demodulator integrator circuits 217, 218 to deliver the output signals Vs1z, Vs1G from the analog computer 21. These two output signals are applied at the input of a multiplexer 249 whose analog output is applied to the input of an analog / digital converter 250 generating digital data intended to be processed by the microcontroller 30 of the digital card 3 of the contactless measurement system according to the invention.
- n- and n + are the respective numbers of turns of
- This measurement system S ′ comprises a sensor module 1 of the type described above and an electronic processing module 500 which implements conventional bridges controlled by means of modulators at the input of the charge amplifiers.
- the positive emitting electrodes T1, T2, TA and the negative emitting electrode TB are supplied with high frequency excitation signals by the power supply module 22 'driven by the output signal from the oscillator circuit 520.
- the third receiving electrode R (AB) is connected via a conductor 151 to the input of a first charge amplifier 501, while the first and second receiving electrodes R1, R2 are connected via a conductor 152 to the input of a second charge amplifier 502.
- a first modulator 511 mounted as a multiplier, receives as input: a first Voz output signal from the processing module 500, an analog signal kb generated by a digital-analog converter (DAC) 26 controlled by a microcontroller ( ⁇ C), and a analog signal Vx produced internally by the processing module 500.
- This first modulator 511 which is associated with a first modulation coefficient m1, delivers a modulation output signal which is applied via a gain K1 and a first reference capacity Crefl at the input of the first charge amplifier 501.
- a second modulator 512 mounted as a divider, to which a second modulation coefficient m2 is associated, receives as input: a reference signal Vref to which a multiplicative coefficient K is applied, a second output signal Voy of the processing module 500.
- This second modulator 512 delivers a modulation output signal Vx which is applied, via a gain K2 and a second capacitance Cref2, at the input of the second charge amplifier 502.
- the output signal of the first charge amplifier 501 is applied to the input of a first high frequency amplifier 505, the output of which is applied to the input of a first synchronous demodulator 515.
- the output signal of this first synchronous demodulator is applied to the input an integrator 517 which delivers the first output signal Voz representative of a displacement along the z axis.
- the output signal of the second charge amplifier 502 is applied to the input of a second high frequency amplifier 504 whose output is applied to the input of a second synchronous demodulator 516 generating a demodulated signal which is applied to the input of a second integrator 518 delivering the second output signal Voy.
- the two first and second synchronous demodulators 515, 516 are controlled by the oscillator circuit 520.
- the Voz and Voy output signals can be expressed as follows:
- the sensor module inserted between the mirror segments has the following dimensional and electrical characteristics:
- Emitting plate
- TA and TB electrode area 20 x 40 mm 2
- Electrodes T1 and T2 40 x 40 mm 2 Surface of the emitting plate: 50 x 130 mm 2 Receiver plate:
- Electrode R (AB) 20 x 30 mm 2
- Surface of electrodes R1 and R2 20 x 20 mm 2
- Surface of receiving plate 50 x 130 mm 2
- Inter-plate distance between 6 and 18 mm
- Length of sensor-electronic cable 15 m
- the measurement system according to the invention can in particular be implemented for the control of segmented primary mirrors and in adaptive optics, but also for the control of secondary mirrors.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03769529A EP1540285A1 (fr) | 2002-08-30 | 2003-08-27 | Systeme et procede de mesure par voie capacitive |
US10/525,775 US20060097733A1 (en) | 2002-08-30 | 2003-08-27 | System and method for capacitive measuring |
AU2003278216A AU2003278216A1 (en) | 2002-08-30 | 2003-08-27 | System and method for capacitive measuring |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0210754A FR2844048B1 (fr) | 2002-08-30 | 2002-08-30 | Systeme et procede de mesure sans contact d'un deplacement ou positionnement relatif de deux objets adjacents par voie capacitive, et application au controle de miroirs |
FR02/10754 | 2002-08-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004020953A1 true WO2004020953A1 (fr) | 2004-03-11 |
Family
ID=31503003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2003/002587 WO2004020953A1 (fr) | 2002-08-30 | 2003-08-27 | Systeme et procede de mesure par voie capacitive |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060097733A1 (fr) |
EP (1) | EP1540285A1 (fr) |
AU (1) | AU2003278216A1 (fr) |
FR (1) | FR2844048B1 (fr) |
WO (1) | WO2004020953A1 (fr) |
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FR2888319A1 (fr) * | 2005-07-07 | 2007-01-12 | Nanotec Solution Soc Civ Ile | Procede de mesure sans contact d'un deplacement relatif ou d'un positionnement relatif d'un premier objet par rapport a un second objet, par voie inductive. |
US7722310B2 (en) * | 2004-12-17 | 2010-05-25 | General Electric Company | System and method for measuring clearance between two objects |
US8159681B2 (en) | 2006-05-05 | 2012-04-17 | Dr. Johannes Heidenhain Gmbh | Measuring device for determining the relative offset between two components |
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FR3033203B1 (fr) | 2015-02-27 | 2018-03-23 | Quickstep Technologies Llc | Procede pour interagir avec un appareil electronique et/ou informatique mettant en œuvre une surface de commande capacitive et une surface peripherique, interface et appareil mettant en œuvre ce procede |
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- 2003-08-27 US US10/525,775 patent/US20060097733A1/en not_active Abandoned
- 2003-08-27 AU AU2003278216A patent/AU2003278216A1/en not_active Abandoned
- 2003-08-27 WO PCT/FR2003/002587 patent/WO2004020953A1/fr not_active Application Discontinuation
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7722310B2 (en) * | 2004-12-17 | 2010-05-25 | General Electric Company | System and method for measuring clearance between two objects |
FR2888319A1 (fr) * | 2005-07-07 | 2007-01-12 | Nanotec Solution Soc Civ Ile | Procede de mesure sans contact d'un deplacement relatif ou d'un positionnement relatif d'un premier objet par rapport a un second objet, par voie inductive. |
WO2007006910A1 (fr) * | 2005-07-07 | 2007-01-18 | Nanotec Solution | Procede de mesure sans contact d'un deplacement relatif ou d'un positionnement relatif d'un premier objet par rapport a un second objet, par voie inductive |
US8159681B2 (en) | 2006-05-05 | 2012-04-17 | Dr. Johannes Heidenhain Gmbh | Measuring device for determining the relative offset between two components |
Also Published As
Publication number | Publication date |
---|---|
EP1540285A1 (fr) | 2005-06-15 |
FR2844048A1 (fr) | 2004-03-05 |
US20060097733A1 (en) | 2006-05-11 |
AU2003278216A1 (en) | 2004-03-19 |
FR2844048B1 (fr) | 2005-09-30 |
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