WO2003082507A3 - Method and system for high-speed, precise micromachining an array of devices - Google Patents

Method and system for high-speed, precise micromachining an array of devices Download PDF

Info

Publication number
WO2003082507A3
WO2003082507A3 PCT/US2003/009323 US0309323W WO03082507A3 WO 2003082507 A3 WO2003082507 A3 WO 2003082507A3 US 0309323 W US0309323 W US 0309323W WO 03082507 A3 WO03082507 A3 WO 03082507A3
Authority
WO
WIPO (PCT)
Prior art keywords
cuts
array
accuracy
cutting
speed
Prior art date
Application number
PCT/US2003/009323
Other languages
French (fr)
Other versions
WO2003082507A2 (en
Inventor
Bruce L Couch
Jonathan S Ehrmann
Yun Fee Chu
Joseph V Lento
Shepard D Johnson
Original Assignee
Gsi Lumonics Corp
Bruce L Couch
Jonathan S Ehrmann
Yun Fee Chu
Joseph V Lento
Shepard D Johnson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gsi Lumonics Corp, Bruce L Couch, Jonathan S Ehrmann, Yun Fee Chu, Joseph V Lento, Shepard D Johnson filed Critical Gsi Lumonics Corp
Priority to JP2003580024A priority Critical patent/JP5087205B2/en
Priority to AU2003218419A priority patent/AU2003218419A1/en
Priority to KR1020047015434A priority patent/KR100826633B1/en
Priority to EP03714419A priority patent/EP1487602A4/en
Publication of WO2003082507A2 publication Critical patent/WO2003082507A2/en
Publication of WO2003082507A3 publication Critical patent/WO2003082507A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measurement cuts, using non-sequential collinear cutting, using spot fan-out parallel cutting, and using a retrograde scanning technique for faster collinear cuts. Non-sequential cutting is also used to manage thermal effects and calibrated cuts are used for improved accuracy. Test voltage is controlled to avoid resistor damage.
PCT/US2003/009323 2002-03-28 2003-03-27 Method and system for high-speed, precise micromachining an array of devices WO2003082507A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003580024A JP5087205B2 (en) 2002-03-28 2003-03-27 Method and system for high speed and accurate micromachining of an array of devices
AU2003218419A AU2003218419A1 (en) 2002-03-28 2003-03-27 Method and system for high-speed, precise micromachining an array of devices
KR1020047015434A KR100826633B1 (en) 2002-03-28 2003-03-27 Method and system for high-speed, precise micromachining an array of devices
EP03714419A EP1487602A4 (en) 2002-03-28 2003-03-27 Method and system for high-speed, precise micromachining an array of devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US36842102P 2002-03-28 2002-03-28
US60/368,421 2002-03-28

Publications (2)

Publication Number Publication Date
WO2003082507A2 WO2003082507A2 (en) 2003-10-09
WO2003082507A3 true WO2003082507A3 (en) 2004-07-15

Family

ID=28675486

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/009323 WO2003082507A2 (en) 2002-03-28 2003-03-27 Method and system for high-speed, precise micromachining an array of devices

Country Status (6)

Country Link
EP (1) EP1487602A4 (en)
JP (1) JP5087205B2 (en)
KR (1) KR100826633B1 (en)
AU (1) AU2003218419A1 (en)
TW (1) TWI223284B (en)
WO (1) WO2003082507A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100707961B1 (en) * 2006-07-12 2007-04-16 주식회사 쿠키혼 Method and apparatus for laser manufacturing
US7732731B2 (en) * 2006-09-15 2010-06-08 Gsi Group Corporation Method and system for laser processing targets of different types on a workpiece

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5865832A (en) * 1992-02-27 1999-02-02 Visx, Incorporated System for detecting, measuring and compensating for lateral movements of a target
US20010045419A1 (en) * 2000-03-30 2001-11-29 Dunsky Corey M. Laser system and method for single pass micromachining of multilayer workpieces

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57157505A (en) * 1981-03-25 1982-09-29 Nippon Electric Co Laser trimming device
US4429298A (en) 1982-02-22 1984-01-31 Western Electric Co., Inc. Methods of trimming film resistors
US4511607A (en) 1984-04-11 1985-04-16 White John D Window-mounted Christmas tree
JPS60218804A (en) * 1984-04-16 1985-11-01 株式会社日立製作所 Method of trimming hybrid ic resistance element
US4647899A (en) 1984-04-30 1987-03-03 Beltone Electronics Corporation Electrical film resistor
JPS6130004A (en) * 1984-07-21 1986-02-12 松下電器産業株式会社 Method of trimming resistor
US4901052A (en) 1985-09-23 1990-02-13 John Fluke Mfg. Co., Inc. Resistor network having bi-axial symmetry
JPS63226005A (en) * 1987-03-13 1988-09-20 松下電器産業株式会社 Laser trimming of film resistor
DE3722576A1 (en) 1987-07-08 1989-01-19 Danfoss As ELECTRIC LAYER RESISTANCE AND METHOD FOR PRODUCING THE SAME
JP2632523B2 (en) * 1987-12-10 1997-07-23 ローム 株式会社 Membrane resistance element
JPH01184861A (en) * 1988-01-13 1989-07-24 Toshiba Corp Trimming using laser light beam
US4918284A (en) * 1988-10-14 1990-04-17 Teradyne Laser Systems, Inc. Calibrating laser trimming apparatus
JPH066236B2 (en) * 1989-01-20 1994-01-26 ティーディーケイ株式会社 Laser irradiation processing device
JPH03102803A (en) * 1989-09-18 1991-04-30 Hitachi Ltd Trimming for thin-film resistor
JPH03169492A (en) * 1989-11-28 1991-07-23 Teradyne Laser Syst Inc Method of calibrating and controlling laser trimming device
US5656186A (en) * 1994-04-08 1997-08-12 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
US5744780A (en) * 1995-09-05 1998-04-28 The United States Of America As Represented By The United States Department Of Energy Apparatus for precision micromachining with lasers
US5796392A (en) 1997-02-24 1998-08-18 Paradise Electronics, Inc. Method and apparatus for clock recovery in a digital display unit
US5976392A (en) 1997-03-07 1999-11-02 Yageo Corporation Method for fabrication of thin film resistor
JPH11195513A (en) * 1997-10-02 1999-07-21 Gore Enterp Holdings Inc Laser trimmed resistor device and production thereof
US6510605B1 (en) 1999-12-21 2003-01-28 Vishay Dale Electronics, Inc. Method for making formed surface mount resistor
TW523837B (en) * 2001-02-01 2003-03-11 Electro Scient Ind Inc Resistor trimming with small uniform spot from solid-state UV laser

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5865832A (en) * 1992-02-27 1999-02-02 Visx, Incorporated System for detecting, measuring and compensating for lateral movements of a target
US20010045419A1 (en) * 2000-03-30 2001-11-29 Dunsky Corey M. Laser system and method for single pass micromachining of multilayer workpieces

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1487602A4 *

Also Published As

Publication number Publication date
TWI223284B (en) 2004-11-01
KR20040104556A (en) 2004-12-10
KR100826633B1 (en) 2008-05-02
AU2003218419A8 (en) 2003-10-13
JP5087205B2 (en) 2012-12-05
AU2003218419A1 (en) 2003-10-13
TW200305891A (en) 2003-11-01
WO2003082507A2 (en) 2003-10-09
EP1487602A2 (en) 2004-12-22
JP2005522023A (en) 2005-07-21
EP1487602A4 (en) 2008-03-19

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