WO2003078304A3 - Surface relief structures for joining and adhesion - Google Patents

Surface relief structures for joining and adhesion Download PDF

Info

Publication number
WO2003078304A3
WO2003078304A3 PCT/US2003/008117 US0308117W WO03078304A3 WO 2003078304 A3 WO2003078304 A3 WO 2003078304A3 US 0308117 W US0308117 W US 0308117W WO 03078304 A3 WO03078304 A3 WO 03078304A3
Authority
WO
WIPO (PCT)
Prior art keywords
joining
adhesion
relief structures
substrate
surface relief
Prior art date
Application number
PCT/US2003/008117
Other languages
French (fr)
Other versions
WO2003078304A2 (en
Inventor
Renyuan Gao
Anthony F Garito
Donald Bitting
Joseph Chang
Kazuya Takayama
Original Assignee
Photon X Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photon X Inc filed Critical Photon X Inc
Priority to AU2003220334A priority Critical patent/AU2003220334A1/en
Publication of WO2003078304A2 publication Critical patent/WO2003078304A2/en
Publication of WO2003078304A3 publication Critical patent/WO2003078304A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0078—Measures or configurations for obtaining anchoring effects in the contact areas between layers
    • B29C37/0082—Mechanical anchoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/756—Microarticles, nanoarticles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • G02B6/364—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves inverted grooves, e.g. dovetails

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Micromachines (AREA)

Abstract

A solid substrate comprising a first major surface and a second major surface juxtaposed from and parallel or substantially parallel to the first major surface, wherein the substrate has a plurality of surface relief structures located on the substrate between the first major surface and second major surface, and further wherein the substrate has at least one channel extending through the substrate between the first and second major surfaces.
PCT/US2003/008117 2002-03-15 2003-03-17 Surface relief structures for joining and adhesion WO2003078304A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003220334A AU2003220334A1 (en) 2002-03-15 2003-03-17 Surface relief structures for joining and adhesion

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US36486502P 2002-03-15 2002-03-15
US60/364,865 2002-03-15

Publications (2)

Publication Number Publication Date
WO2003078304A2 WO2003078304A2 (en) 2003-09-25
WO2003078304A3 true WO2003078304A3 (en) 2004-10-21

Family

ID=28041975

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/008117 WO2003078304A2 (en) 2002-03-15 2003-03-17 Surface relief structures for joining and adhesion

Country Status (2)

Country Link
AU (1) AU2003220334A1 (en)
WO (1) WO2003078304A2 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4838634A (en) * 1986-04-25 1989-06-13 The Plessey Company Plc Organic optical waveguides and method of fabricating waveguide structures
EP0451858A2 (en) * 1990-04-13 1991-10-16 Nippon Zeon Co., Ltd. Molded article of norbornene-based polymer
US5106211A (en) * 1991-02-14 1992-04-21 Hoechst Celanese Corp. Formation of polymer channel waveguides by excimer laser ablation and method of making same
US5143577A (en) * 1991-02-08 1992-09-01 Hoechst Celanese Corporation Smooth-wall polymeric channel and rib waveguides exhibiting low optical loss
WO1997022961A1 (en) * 1995-12-18 1997-06-26 Philips Electronics N.V. Plasma addressed liquid crystal display with organic-walled plasma channels
US6177236B1 (en) * 1997-12-05 2001-01-23 Xerox Corporation Method of making a pixelized scintillation layer and structures incorporating same
WO2001051220A2 (en) * 2000-01-13 2001-07-19 Institut Für Neue Materialien Gem. Gmbh Method for producing a microstructured surface relief by embossing thixotropic layers
US6327454B1 (en) * 2000-09-12 2001-12-04 Xerox Corporation Imagable seamed belts having fluoropolymer adhesive between interlocking seaming members

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4838634A (en) * 1986-04-25 1989-06-13 The Plessey Company Plc Organic optical waveguides and method of fabricating waveguide structures
EP0451858A2 (en) * 1990-04-13 1991-10-16 Nippon Zeon Co., Ltd. Molded article of norbornene-based polymer
US5143577A (en) * 1991-02-08 1992-09-01 Hoechst Celanese Corporation Smooth-wall polymeric channel and rib waveguides exhibiting low optical loss
US5106211A (en) * 1991-02-14 1992-04-21 Hoechst Celanese Corp. Formation of polymer channel waveguides by excimer laser ablation and method of making same
WO1997022961A1 (en) * 1995-12-18 1997-06-26 Philips Electronics N.V. Plasma addressed liquid crystal display with organic-walled plasma channels
US6177236B1 (en) * 1997-12-05 2001-01-23 Xerox Corporation Method of making a pixelized scintillation layer and structures incorporating same
WO2001051220A2 (en) * 2000-01-13 2001-07-19 Institut Für Neue Materialien Gem. Gmbh Method for producing a microstructured surface relief by embossing thixotropic layers
US6327454B1 (en) * 2000-09-12 2001-12-04 Xerox Corporation Imagable seamed belts having fluoropolymer adhesive between interlocking seaming members

Also Published As

Publication number Publication date
AU2003220334A8 (en) 2003-09-29
WO2003078304A2 (en) 2003-09-25
AU2003220334A1 (en) 2003-09-29

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