WO2003077038A2 - Reduced striae extreme ultraviolegt lithographic elements, a method of manufacturing the same and a method of measuring striae - Google Patents
Reduced striae extreme ultraviolegt lithographic elements, a method of manufacturing the same and a method of measuring striae Download PDFInfo
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- WO2003077038A2 WO2003077038A2 PCT/US2003/006825 US0306825W WO03077038A2 WO 2003077038 A2 WO2003077038 A2 WO 2003077038A2 US 0306825 W US0306825 W US 0306825W WO 03077038 A2 WO03077038 A2 WO 03077038A2
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- WIPO (PCT)
- Prior art keywords
- striae
- titania
- glass
- extreme ultraviolet
- titanium
- Prior art date
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- 206010040925 Skin striae Diseases 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 71
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000011521 glass Substances 0.000 claims abstract description 41
- 230000003287 optical effect Effects 0.000 claims description 18
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 16
- 239000000377 silicon dioxide Substances 0.000 claims description 16
- 229910052719 titanium Inorganic materials 0.000 claims description 16
- 239000010936 titanium Substances 0.000 claims description 16
- 239000004071 soot Substances 0.000 claims description 13
- 238000001459 lithography Methods 0.000 claims description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 238000001900 extreme ultraviolet lithography Methods 0.000 claims description 6
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 230000035945 sensitivity Effects 0.000 claims description 2
- 239000000843 powder Substances 0.000 description 8
- 230000007062 hydrolysis Effects 0.000 description 7
- 238000006460 hydrolysis reaction Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 230000010355 oscillation Effects 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000005350 fused silica glass Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 2
- 229910052845 zircon Inorganic materials 0.000 description 2
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- -1 siloxanes Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B19/00—Other methods of shaping glass
- C03B19/14—Other methods of shaping glass by gas- or vapour- phase reaction processes
- C03B19/1446—Means for after-treatment or catching of worked reactant gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B19/00—Other methods of shaping glass
- C03B19/14—Other methods of shaping glass by gas- or vapour- phase reaction processes
- C03B19/1484—Means for supporting, rotating or translating the article being formed
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/06—Glass compositions containing silica with more than 90% silica by weight, e.g. quartz
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
- C03C4/0085—Compositions for glass with special properties for UV-transmitting glass
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/52—Reflectors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2201/00—Type of glass produced
- C03B2201/06—Doped silica-based glasses
- C03B2201/30—Doped silica-based glasses doped with metals, e.g. Ga, Sn, Sb, Pb or Bi
- C03B2201/40—Doped silica-based glasses doped with metals, e.g. Ga, Sn, Sb, Pb or Bi doped with transition metals other than rare earth metals, e.g. Zr, Nb, Ta or Zn
- C03B2201/42—Doped silica-based glasses doped with metals, e.g. Ga, Sn, Sb, Pb or Bi doped with transition metals other than rare earth metals, e.g. Zr, Nb, Ta or Zn doped with titanium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2207/00—Glass deposition burners
- C03B2207/60—Relationship between burner and deposit, e.g. position
- C03B2207/62—Distance
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2207/00—Glass deposition burners
- C03B2207/60—Relationship between burner and deposit, e.g. position
- C03B2207/66—Relative motion
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2201/00—Glass compositions
- C03C2201/06—Doped silica-based glasses
- C03C2201/30—Doped silica-based glasses containing metals
- C03C2201/40—Doped silica-based glasses containing metals containing transition metals other than rare earth metals, e.g. Zr, Nb, Ta or Zn
- C03C2201/42—Doped silica-based glasses containing metals containing transition metals other than rare earth metals, e.g. Zr, Nb, Ta or Zn containing titanium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2203/00—Production processes
- C03C2203/40—Gas-phase processes
Definitions
- This invention relates to extreme ultraviolet elements made from glasses including silica and titania. More particularly, the invention relates to extreme ultraviolet elements having reduced striae and methods and apparatus for making such elements and measuring striae.
- Ultra low expansion glasses and soft x-ray or extreme ultraviolet (EUV) lithographic elements made from silica and titania traditionally have been made by flame hydrolysis of organometallic precursors of silica and titania.
- Ultra-low expansion silica-titania articles of glass made by the flame hydrolysis method are used in the manufacture of elements used in mirrors for telescopes used in space exploration and extreme ultraviolet or soft x-ray-based lithography. These lithography elements are used with extreme ultraviolet or soft x-ray radiation to illuminate, project and reduce pattern images that are utilized to form integrated circuit patterns.
- extreme ultraviolet or soft x-ray radiation is beneficial in that smaller integrated circuit features can be achieved, however, the manipulation and direction of radiation in this wavelength range is difficult. Accordingly, wavelengths in the extreme ultraviolet or soft x-ray range, such as in the 1 nm to 70 nm range, have not been widely used in commercial applications.
- One of the limitations in this area has been the inability to economically manufacture mirror elements that can withstand exposure to such radiation while maintaining a stable and high quality circuit pattern image.
- ultra low expansion titania-silica glass made in accordance with the method described above is that the glass contains striae.
- Striae are compositional inhomogeneities which adversely affect optical transmission in lens and window elements made from the glass. Striae can be measured by a microprobe that measures compositional variations that correlate to coefficient of thermal expansion (CTE) variations of a few ppb/°C. In some cases, striae have been found to impact surface finish at an angstrom root mean rms level in reflective optic elements made from the glass. Extreme ultraviolet lithographic elements require finishes having a very low rms level.
- CTE coefficient of thermal expansion
- the invention relates to ultra low expansion glass extreme ultraviolet optical or lithographic elements and methods for their manufacture. Methods and apparatus are provided for producing ultra low expansion glass bodies and extreme ultraviolet optical or lithographic elements having decreased striae.
- extreme ultraviolet abbreviated as EUV
- soft x-ray will be used interchangeably to refer to short wavelengths of electromagnetic radiation between 1 nm and 70 nm.
- lithographic systems that utilize EUV radiation operate between 5 and 15 nm, and typically around 13 nm.
- an extreme ultraviolet lithographic element includes a titania-containing silica glass having a polished and shaped surface and having a rms striae level less than about 0.05 mega Pascals.
- the element has a peak to valley striae level less than about 0.2 mega Pascals.
- the glass contains between about 5 and 10 weight percent titania and has a coefficient of thermal expansion in the range of about + 30 ppb/° C to -30 ppb/° C between about 20° C and 35° C.
- the glass contains between about 6 weight % titania and 8 weight % titania and has a homogeneous CTE in the range of about + 20 ppb/° C to -20 ppb/° C between about 20° C and 35° C.
- Still another embodiment of the invention relates to a method of manufacturing an extreme ultraviolet lithography element. The method includes the steps of providing a silicon-containing feedstock and a titanium-containing feedstock, delivering the feedstocks to a conversion site, and converting the feedstocks into titania-containing silica soot.
- the method further includes consolidating the titania- containing silica soot into a low inclusion, homogeneous titania-containing silica glass preform and finishing the titanium-containing glass preform into an extreme ultraviolet lithographic element having an rms striae level less than about 0.05 mega Pascals.
- the conversion site includes a furnace having exhaust vents and the method includes maintaining said striae level by controlling exhaust vent flow during the manufacturing process.
- the method includes providing the furnace with more than six exhaust vents.
- the striae level is controlled by adjusting the distance between the preform and the burner.
- the soot is deposited into a cup mounted on an oscillating table and the striae level is reduced by altering the oscillation pattern of the table, and in particular by increasing the rotation rate of the table. For example, in some embodiments, the rotation rate of the boule is greater than about 6 rpm.
- Another embodiment of the invention relates to a method of measuring striae in an extreme ultraviolet lithographic element which includes utilizing a polariscope to measure the optical retardance in the element as a function of position and converting the optical retardance to stress values.
- the retardance values are converted to a stress level value by knowing the path length, i.e. the thickness, over which optical retardance is measured and the stress optical coefficient of the material.
- the polariscope has a sensitivity of at least 0.05 nm, and in other embodiments, the polariscope utilizes a light source having a beam size less than the spacing of the striae in the extreme ultraviolet lithographic element.
- extreme ultraviolet elements having reduced striae and methods and apparatus are provided for the manufacture of these elements and measurement of striae in these elements. Methods and apparatus are also provided for measuring low levels of striae in glasses and extreme ultraviolet elements.
- FIG. 1 is a schematic drawing of an apparatus for manufacturing ultra low expansion glass according to one embodiment of the invention.
- FIG. 2 is a schematic drawing of an apparatus for manufacturing ultra low expansion glass according to one embodiment of the invention.
- FIG. 3 is a graph comparing striae measurement techniques utilizing a polariscope and utilizing a microprobe.
- the invention provides glass bodies and extreme ultraviolet elements having low thermal expansion and homogeneous titanium concentrations and methods and apparatus for their manufacture.
- the methods and apparatus are particularly beneficial for the manufacture of extreme ultraviolet optical elements such as lithography substrates for both lithography masks and lithography mirror optics.
- the methods and apparatus substantially reduce striae problems encountered during the formation of boules, particularly when the glass is ground and polished into a curved mirror reflective surface that cuts across the planar striae levels.
- the invention further pertains to making thermally stable EUV lithography structure objects such as optical mirror lithography element substrate structures and reflective lithography mask element substrate structures.
- PCT patent publication WO 01/08163 entitled EUV SOFT X-RAY PROJECTION LITHOGRAPHIC METHOD SYSTEM AND LITHOGRAPHY ELEMENTS commonly assigned to CORNING INCORPORATED and naming Davis et al. as inventors and WO 01/07967, entitled EUV SOFT X-RAY PROJECTION LITHOGRAPHIC METHOD AND MASK DEVICES commonly assigned to CORNING INCORPORATED and naming Davis et al. as inventors, the contents of which are hereby incorporated by reference discloses EUV lithography mirror element and mask structures.
- silica-titania powders are manufactured as shown in Fig. 1 through flame hydrolysis of silica- containing and titanium-containing feedstocks.
- a conventional apparatus for the manufacture of titania-containing silica glasses includes high purity silicon-containing feedstock or precursor 14 and high purity titanium-containing feedstock or precursor 26.
- the feedstock or precursor materials are typically siloxanes, alkoxides and tetrachlorides containing titanium or silicon.
- silicon-containing feedstock material is octamethylcyclotetrasiloxane
- titanium-containing feedstock material is titanium isopropoxide.
- An inert bubbler gas 20 such as nitrogen is bubbled through feedstocks 14 and 26, to produce mixtures containing the feedstock vapors and carrier gas.
- An inert carrier gas 22 such as nitrogen is combined with the silicon feedstock vapor and bubbler gas mixture and with the titanium feedstock vapor and bubbler gas mixture to prevent saturation and to deliver the feedstock materials 14, 26 to a conversion site 10 within furnace 16 through distribution systems 24 and manifold 28.
- the silicon feedstock and vapor and titanium feedstock and vapor are mixed in a manifold 28 to form a vaporous, titanium-containing silica glass precursor mixture which is delivered through conduits 34 to burners 36 mounted in the upper portion 38 of the furnace 16.
- the burners 36 produce burner flames 37.
- Conversion site burner flames 37 are formed with a fuel and oxygen mixture such as methane mixed with hydrogen and/or oxygen, which combusts, oxidizes and converts the feedstocks at temperatures greater than about 1600° C into soot 11.
- the burner flames 37 also provide heat to consolidate the soot 11 into glass.
- the temperature of the conduits 34 and the feedstocks contained in the conduits are typically controlled and monitored in minimize the possibility of reactions prior to the flames 37.
- the feedstocks are delivered to a conversion site 10, where they are converted into titania-containing silica soot particles 11.
- the soot 11 is deposited in a revolving collection cup 12 located in a refractory furnace 16 typically made from zircon and onto the upper glass surface of a hot titania-silica glass body 18 inside the furnace 16.
- the soot particles 11 consolidate into a titania-containing high purity silica glass body.
- the cup 12 typically has a circular diameter shape of between about
- the weight percent of titania in the fused silica glass can be adjusted by changing the amount of either the titanium feedstock or silicon-containing feedstock delivered to the conversion site 10 that is incorporated into the soot 11 and the glass 18.
- the amount of titania and/or silica is adjusted so that the glass body has a coefficient of thermal expansion of about zero at the operating temperature of an EUV or soft x-ray reflective lithography or mirror element.
- the furnace 16 further includes crown 40 which carries a plurality of burners 37 which produce silica soot. Further details on the structure and operation of furnaces of this type may be found in commonly assigned United States patent number 5,951 ,730, the entire contents of which are incorporated herein by reference. Particular details on burner configurations for making fused silica boules may be found in commonly- assigned PCT patent publication number WO 00/17115.
- the furnace 16 also includes a plurality of exhaust ports or vents 42, evenly spaced around the circumference of the furnace. Typically, a furnace 16 includes 6 exhaust ports 42.
- the furnace further includes a ring wall 44 which supports the crown 40.
- the furnace also includes a rotatable base 46 mounted on an oscillation table 48 that oscillates in an the x and y direction as shown in Figure 2.
- the base is rotatable about an axis 50.
- the crown 40, the ring wall 44, the base 46 and the lateral walls are all made from suitable refractory materials such as zircon.
- Commonly assigned United States patent number 5,696,038 describes oscillation and rotation patterns for improving off-axis homogeneity in fused silica boules.
- x(t) and y(t) represent the coordinates of the center of the boule as measured from the center of the furnace ringwall as a function of time (t) measured in minutes.
- the sum of r1 and r2 must be less than the difference between the radius of the ringwall and radius of the containment vessel or cup to avoid contact between these structures during formation of the boule.
- the parameters r**, r 2 , ⁇ - ⁇ , ⁇ 2 , and a fifth parameter, ⁇ 3 which represents the boule's rotation rate about its center in revolutions per minute (rpm) define the total motion of the boule.
- Typical values for ⁇ ⁇ , ⁇ 2 and ⁇ 3 used in the manufacture of titania- containing silica boules are 1.71018 rpm, 3.63418 rpm and 4.162 rpm, respectively.
- striae in silica-titania ultra low expansion glass boules can be reduced by modification of several manufacturing parameters during flame hydrolysis.
- Applicants have been able to manufacture boules and extreme ultraviolet elements having rms striae values less than about 0.05 MPa, preferably less than about 0.03 MPa, and more preferably less than about 0.02 MPa. Peak to valley striae values were reduced to less than 0.2 MPa and preferably less than 0.15 MPa.
- the titania-silica glass contains between about 5 weight percent and 10 weight percent titania, and preferably the amount of titania is between about 6 weight percent and 10 weight percent. According to one preferred embodiment of the present invention, the titania-silica glass contains about 7 weight percent titania.
- powders, ultra low expansion glass bodies and EUV optical elements having a homogeneous titania-silica glass titania level in the range from 6 wt. % to about 9 wt. % and a homogeneous CTE in the range of about + 30 ppb/° C to -30 ppb/° C between about 20° C and 35° C, preferably in the range of about + 20 ppb/° C to -20 ppb/° C between about 20° C and 35° C. More preferably, the powder, the glass and optical elements have a homogeneous titania-silica glass titania level in the range from 6 wt. % to about 9 wt.
- the powder particles and the titania-containing silica glass have a titania level in the range from 6 wt. % to 8 wt. %. More preferably, the powder, the consolidated glass and the EUV optical substrate have a titania level in the range from 6 wt. % to 8 wt. %. More preferably, the titania-containing silica powder particles and the silica glass titania level are between about 6.8 and 7.5 wt. %.
- a microprobe which measures titania concentration in the glass at one micron intervals.
- One disadvantage of using a microprobe for measuring striae is that such measurements are very time consuming and extensive sample preparation is required. Thus, the use of a microprobe for regularly measuring striae is not cost- effective.
- a polariscope which measures optical retardation in glass samples, can be used to measure striae in titania-silica glass. As polarized light propagates through a strained glass or plastic material, it experiences a retardation proportional to the amount of stress. A polariscope is an instrument which quantitatively measures this retardation. Stress in a sample can be determined by knowing the amount of retardation, the path length of light through the sample, which is typically the sample thickness, and the birefringence or stress optical constant of a sample which is a known value. United States patent number 4,668,086 contains more information on the operation and construction of a polariscope.
- the polariscope measures retardance through a sample as a function of position.
- the spatial resolution of a polariscope is much smaller than the size of the striae in titania-silica glass and therefore allows for measurement through striae layers.
- the retardance observed in the polariscope indicates stresses between striae layers, which are most likely due to thermal expansion mismatch between the layers.
- Figure 3 shows a comparison of striae measurements made on a sample.
- the lower line in Figure 3 represents striae measurements made by a polariscope, and the upper line represents measurements made by a microprobe.
- the polariscope used is available from Cambridge Research Instrumentation, Model LC, which was used with a Nikon microscope.
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- Chemical & Material Sciences (AREA)
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- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Nanotechnology (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Glass Compositions (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
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Abstract
Description
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Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020047013806A KR101190914B1 (en) | 2002-03-05 | 2003-03-04 | Reduced striae extreme ultraviolet elements |
DE60332429T DE60332429D1 (en) | 2002-03-05 | 2003-03-04 | EXTREMELY ULTRAVIOLET LITHOGRAPHIC ELEMENTS WITH REDUCED SLICES AND METHOD FOR THE PRODUCTION THEREOF |
JP2003575191A JP2005519349A (en) | 2002-03-05 | 2003-03-04 | Low striation extreme ultraviolet optical element |
EP03744207A EP1481288B1 (en) | 2002-03-05 | 2003-03-04 | Reduced striae extreme ultraviolet lithographic elements and a method of manufacturing the same |
AU2003220982A AU2003220982A1 (en) | 2002-03-05 | 2003-03-04 | Reduced striae extreme ultraviolegt lithographic elements, a method of manufacturing the same and a method of measuring striae |
Applications Claiming Priority (2)
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US36205202P | 2002-03-05 | 2002-03-05 | |
US60/362,052 | 2002-03-05 |
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WO2003077038A2 true WO2003077038A2 (en) | 2003-09-18 |
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PCT/US2003/006825 WO2003077038A2 (en) | 2002-03-05 | 2003-03-04 | Reduced striae extreme ultraviolegt lithographic elements, a method of manufacturing the same and a method of measuring striae |
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US (3) | US7053017B2 (en) |
EP (2) | EP2211232B1 (en) |
JP (3) | JP2005519349A (en) |
KR (1) | KR101190914B1 (en) |
AU (1) | AU2003220982A1 (en) |
DE (1) | DE60332429D1 (en) |
TW (1) | TWI247196B (en) |
WO (1) | WO2003077038A2 (en) |
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JP2005228875A (en) * | 2004-02-12 | 2005-08-25 | Canon Inc | Exposure apparatus and device manufacturing method |
JP2006306674A (en) * | 2005-04-28 | 2006-11-09 | Shinetsu Quartz Prod Co Ltd | Silica-titania glass for nanoimprint stamper |
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EP2426091A1 (en) * | 2010-09-02 | 2012-03-07 | Shin-Etsu Chemical Co., Ltd. | Titania-doped quartz glass and making method |
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WO2012105513A1 (en) | 2011-01-31 | 2012-08-09 | 旭硝子株式会社 | Method for producing silica glass body containing titania, and silica glass body containing titania |
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Also Published As
Publication number | Publication date |
---|---|
KR101190914B1 (en) | 2012-10-12 |
EP2211232B1 (en) | 2015-09-02 |
EP1481288B1 (en) | 2010-05-05 |
JP2005519349A (en) | 2005-06-30 |
EP1481288A2 (en) | 2004-12-01 |
DE60332429D1 (en) | 2010-06-17 |
USRE40586E1 (en) | 2008-11-25 |
WO2003077038A3 (en) | 2004-03-18 |
KR20040089703A (en) | 2004-10-21 |
US20050241338A1 (en) | 2005-11-03 |
JP2012042966A (en) | 2012-03-01 |
AU2003220982A8 (en) | 2003-09-22 |
TW200417822A (en) | 2004-09-16 |
EP2211232A1 (en) | 2010-07-28 |
AU2003220982A1 (en) | 2003-09-22 |
US7053017B2 (en) | 2006-05-30 |
JP4887271B2 (en) | 2012-02-29 |
US20040027555A1 (en) | 2004-02-12 |
TWI247196B (en) | 2006-01-11 |
JP2008182220A (en) | 2008-08-07 |
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