WO2003058413A3 - Thermal interface assembly for a computer system - Google Patents

Thermal interface assembly for a computer system Download PDF

Info

Publication number
WO2003058413A3
WO2003058413A3 PCT/US2003/000176 US0300176W WO03058413A3 WO 2003058413 A3 WO2003058413 A3 WO 2003058413A3 US 0300176 W US0300176 W US 0300176W WO 03058413 A3 WO03058413 A3 WO 03058413A3
Authority
WO
WIPO (PCT)
Prior art keywords
frame
server unit
computer system
component
thermal interface
Prior art date
Application number
PCT/US2003/000176
Other languages
French (fr)
Other versions
WO2003058413A2 (en
Inventor
Barrett Faneuf
Lorenzo David De
Stephen Montgomery
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Priority to AU2003226434A priority Critical patent/AU2003226434A1/en
Priority to EP03729329A priority patent/EP1461682A2/en
Publication of WO2003058413A2 publication Critical patent/WO2003058413A2/en
Publication of WO2003058413A3 publication Critical patent/WO2003058413A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.
PCT/US2003/000176 2002-01-04 2003-01-03 Thermal interface assembly for a computer system WO2003058413A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2003226434A AU2003226434A1 (en) 2002-01-04 2003-01-03 Thermal interface assembly for a computer system
EP03729329A EP1461682A2 (en) 2002-01-04 2003-01-03 Thermal interface assembly for a computer system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/039,148 US6693797B2 (en) 2002-01-04 2002-01-04 Computer system having a chassis-level thermal interface component and a frame-level thermal interface component that are thermally engageable with and disengageable from one another
US10/039,148 2002-01-04

Publications (2)

Publication Number Publication Date
WO2003058413A2 WO2003058413A2 (en) 2003-07-17
WO2003058413A3 true WO2003058413A3 (en) 2004-04-08

Family

ID=21903913

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/000176 WO2003058413A2 (en) 2002-01-04 2003-01-03 Thermal interface assembly for a computer system

Country Status (5)

Country Link
US (1) US6693797B2 (en)
EP (1) EP1461682A2 (en)
CN (1) CN1308787C (en)
AU (1) AU2003226434A1 (en)
WO (1) WO2003058413A2 (en)

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US20060187639A1 (en) * 2005-02-23 2006-08-24 Lytron, Inc. Electronic component cooling and interface system
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US20070190920A1 (en) * 2006-02-15 2007-08-16 International Business Machines Corporation Server cooling and exhaust appendage system
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US20080013283A1 (en) * 2006-07-17 2008-01-17 Gilbert Gary L Mechanism for cooling electronic components
US7403384B2 (en) * 2006-07-26 2008-07-22 Dell Products L.P. Thermal docking station for electronics
US7564692B2 (en) * 2006-10-05 2009-07-21 William Tse Lin Hsiung Retaining structure for mounting two independent computers within one standard slot in a computer cabinet
US7551440B2 (en) * 2007-01-24 2009-06-23 Hewlett-Packard Development Company, L.P. System and method for cooling an electronic component
US7957132B2 (en) * 2007-04-16 2011-06-07 Fried Stephen S Efficiently cool data centers and electronic enclosures using loop heat pipes
JP4859823B2 (en) * 2007-12-14 2012-01-25 株式会社日立製作所 COOLING DEVICE AND ELECTRONIC DEVICE USING THE SAME
US8164901B2 (en) * 2008-04-16 2012-04-24 Julius Neudorfer High efficiency heat removal system for rack mounted computer equipment
US7869208B2 (en) * 2008-12-31 2011-01-11 Caterpillar Inc Electronics component packaging for power converter
US8310832B2 (en) * 2009-06-16 2012-11-13 Brocade Communications Systems, Inc. Side-exhaust cooling system for rack mounted equipment
US8582298B2 (en) * 2009-06-22 2013-11-12 Xyber Technologies Passive cooling enclosure system and method for electronics devices
US7961465B2 (en) * 2009-07-14 2011-06-14 International Business Machines Corporation Low cost liquid cooling
JP4783845B2 (en) 2009-07-23 2011-09-28 東芝テック株式会社 Electronics
WO2011053305A1 (en) * 2009-10-30 2011-05-05 Hewlett-Packard Development Co Thermal bus bar for a blade enclosure
FR2958829B1 (en) * 2010-04-13 2012-09-21 Airbus Operations Sas MODULAR ASSEMBLY FOR FIXING ELECTRONIC MODULES
US8144464B2 (en) 2010-04-29 2012-03-27 Brocade Communication Systems, Inc. Side-exhaust cooling system with extensible duct for rack mounted equipment
US9609786B2 (en) * 2011-04-01 2017-03-28 Academia Sinica Cooling system for an electronic rack
TWM412341U (en) * 2011-04-01 2011-09-21 Academia Sinica Cooling system for electronic instrument cabinet
US9049803B2 (en) * 2011-09-22 2015-06-02 Panduit Corp. Thermal management infrastructure for IT equipment in a cabinet
US8817473B2 (en) * 2011-09-26 2014-08-26 Mellanox Technologies Ltd. Liquid cooling system for modular electronic systems
CN103019347A (en) * 2013-01-19 2013-04-03 重庆大学 Radiator of laptop
JP2015012282A (en) * 2013-07-02 2015-01-19 富士通株式会社 Electronic apparatus
US10182517B2 (en) * 2013-11-20 2019-01-15 Nec Corporation Electronic apparatus enclosure device and electronic apparatus cooling system
WO2016027299A1 (en) * 2014-08-18 2016-02-25 株式会社Ｍｕｒａｋｕｍｏ System, information processing device and rack
US9832912B2 (en) * 2015-05-07 2017-11-28 Dhk Storage, Llc Computer server heat regulation utilizing integrated precision air flow
JP6611203B2 (en) 2017-10-20 2019-11-27 Ｎｅｃプラットフォームズ株式会社 Module, server
US10813246B2 (en) * 2017-10-23 2020-10-20 Asia Vital Components (China) Co., Ltd. Chassis heat dissipation structure
US10921070B2 (en) * 2018-12-14 2021-02-16 Quanta Computer Inc. Connector assembly for liquid cooling
US11921552B2 (en) * 2022-02-28 2024-03-05 Quanta Computer Inc. High efficiency jet flow generator for storage cooling

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EP0580412A1 (en) * 1992-07-21 1994-01-26 British Aerospace Public Limited Company Cooling of electronic components

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US4994937A (en) * 1989-12-22 1991-02-19 Lockheed Corporation Hydraulic thermal clamp for electronic modules
EP0580412A1 (en) * 1992-07-21 1994-01-26 British Aerospace Public Limited Company Cooling of electronic components

Also Published As

Publication number Publication date
US6693797B2 (en) 2004-02-17
EP1461682A2 (en) 2004-09-29
WO2003058413A2 (en) 2003-07-17
CN1308787C (en) 2007-04-04
US20030128517A1 (en) 2003-07-10
AU2003226434A8 (en) 2003-07-24
AU2003226434A1 (en) 2003-07-24
CN1613043A (en) 2005-05-04

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