WO2003023830A3 - Spray member and method for using the same - Google Patents

Spray member and method for using the same Download PDF

Info

Publication number
WO2003023830A3
WO2003023830A3 PCT/US2002/024061 US0224061W WO03023830A3 WO 2003023830 A3 WO2003023830 A3 WO 2003023830A3 US 0224061 W US0224061 W US 0224061W WO 03023830 A3 WO03023830 A3 WO 03023830A3
Authority
WO
WIPO (PCT)
Prior art keywords
spray member
spray
flow
vessel
process fluid
Prior art date
Application number
PCT/US2002/024061
Other languages
French (fr)
Other versions
WO2003023830A2 (en
Inventor
Steve L Worm
Michael E Cole
Original Assignee
Micell Technologies Inc
Steve L Worm
Michael E Cole
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micell Technologies Inc, Steve L Worm, Michael E Cole filed Critical Micell Technologies Inc
Priority to AU2002362248A priority Critical patent/AU2002362248A1/en
Publication of WO2003023830A2 publication Critical patent/WO2003023830A2/en
Publication of WO2003023830A3 publication Critical patent/WO2003023830A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Nozzles (AREA)

Abstract

A process chamber assembly for use with a substrate and a flow of process fluid includes a vessel and a spray member. The vessel defines a chamber. The spray member includes at least one spray port formed therein adapted to distribute the flow of process fluid onto the substrate in the chamber. The spray member is operative to rotate about a rotational axis relative to the vessel responsive to a flow of the process fluid out of the spray member through the at least one spray port.
PCT/US2002/024061 2001-09-13 2002-07-30 Spray member and method for using the same WO2003023830A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002362248A AU2002362248A1 (en) 2001-09-13 2002-07-30 Spray member and method for using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/951,352 2001-09-13
US09/951,352 US6706641B2 (en) 2001-09-13 2001-09-13 Spray member and method for using the same

Publications (2)

Publication Number Publication Date
WO2003023830A2 WO2003023830A2 (en) 2003-03-20
WO2003023830A3 true WO2003023830A3 (en) 2003-08-28

Family

ID=25491590

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/024061 WO2003023830A2 (en) 2001-09-13 2002-07-30 Spray member and method for using the same

Country Status (4)

Country Link
US (2) US6706641B2 (en)
AU (1) AU2002362248A1 (en)
TW (1) TW579302B (en)
WO (1) WO2003023830A2 (en)

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JP4210045B2 (en) * 2001-06-25 2009-01-14 横河電機株式会社 Cleaning device
US20030139057A1 (en) * 2002-01-18 2003-07-24 Richard Novak Process and apparatus for removal of photoresist from semiconductor wafers
US6848458B1 (en) 2002-02-05 2005-02-01 Novellus Systems, Inc. Apparatus and methods for processing semiconductor substrates using supercritical fluids
US6913651B2 (en) * 2002-03-22 2005-07-05 Blue29, Llc Apparatus and method for electroless deposition of materials on semiconductor substrates
US6764552B1 (en) * 2002-04-18 2004-07-20 Novellus Systems, Inc. Supercritical solutions for cleaning photoresist and post-etch residue from low-k materials
JP4133209B2 (en) * 2002-10-22 2008-08-13 株式会社神戸製鋼所 High pressure processing equipment
US7041172B2 (en) * 2003-02-20 2006-05-09 Asml Holding N.V. Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems
JP2005033135A (en) * 2003-07-11 2005-02-03 Kobe Steel Ltd Cleaning device for microstructure
US20060074529A1 (en) * 2004-09-30 2006-04-06 Garcia James P Apparatus for dispensing precise volumes of fluid
JP4876215B2 (en) * 2005-01-21 2012-02-15 独立行政法人産業技術総合研究所 CMP polishing method, CMP polishing apparatus, and semiconductor device manufacturing method
US9241497B2 (en) * 2005-06-30 2016-01-26 The United States Of America, As Represented By The Secretary Of Agriculture Method and apparatus for treatment of food products
KR100757417B1 (en) * 2006-08-04 2007-09-11 삼성전자주식회사 Apparatus for cleaning wafer
US7819362B2 (en) * 2007-03-01 2010-10-26 Evergreen International Aviation, Inc. Enhanced aerial delivery system
JP2012524534A (en) * 2009-04-23 2012-10-18 バクターフィールド オーユー Vacuum injection production plant
US8225968B2 (en) 2009-05-12 2012-07-24 Illinois Tool Works Inc. Seal system for gear pumps
US9166139B2 (en) * 2009-05-14 2015-10-20 The Neothermal Energy Company Method for thermally cycling an object including a polarizable material
US20130136850A1 (en) * 2011-11-29 2013-05-30 Illinois Tool Works Inc. Method for depositing materials on a substrate
JP5926086B2 (en) * 2012-03-28 2016-05-25 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method
JP5889691B2 (en) 2012-03-28 2016-03-22 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method
US20170314825A1 (en) * 2016-04-29 2017-11-02 Emerson Climate Technologies, Inc. Co-fluid refrigeration system and method
US20180323063A1 (en) * 2017-05-03 2018-11-08 Applied Materials, Inc. Method and apparatus for using supercritical fluids in semiconductor applications
US10844484B2 (en) * 2017-09-22 2020-11-24 Asm Ip Holding B.V. Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
US11772134B2 (en) * 2017-09-29 2023-10-03 Taiwan Semiconductor Manufacturing Company, Ltd Sonic cleaning of brush
CN111515179B (en) * 2020-05-07 2021-10-26 福建智罗科技有限公司 Internal impurity cleaning and collecting structure for freeze dryer

Citations (2)

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US6059893A (en) * 1995-02-15 2000-05-09 Oki Electric Industry Co., Ltd. Method for cleaning a semiconductor wafer
US6103096A (en) * 1997-11-12 2000-08-15 International Business Machines Corporation Apparatus and method for the electrochemical etching of a wafer

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US3987963A (en) * 1975-06-27 1976-10-26 Partek Corporation Of Houston Fluid delivery system
US5201466A (en) * 1990-04-17 1993-04-13 Hynds James E Spray gun having a rotatable spray head
US5496901A (en) 1992-03-27 1996-03-05 University Of North Carolina Method of making fluoropolymers
US5514220A (en) 1992-12-09 1996-05-07 Wetmore; Paula M. Pressure pulse cleaning
US5626913A (en) * 1994-03-09 1997-05-06 Tokyo Electron Limited Resist processing method and apparatus
DE69523208T2 (en) 1994-04-08 2002-06-27 Texas Instruments Inc Process for cleaning semiconductor wafers using liquefied gases
US5482564A (en) 1994-06-21 1996-01-09 Texas Instruments Incorporated Method of unsticking components of micro-mechanical devices
US5522938A (en) 1994-08-08 1996-06-04 Texas Instruments Incorporated Particle removal in supercritical liquids using single frequency acoustic waves
DE19506404C1 (en) 1995-02-23 1996-03-14 Siemens Ag Separating and drying micro-mechanical elements without sticking
US5636795A (en) * 1995-05-11 1997-06-10 First Pioneer Industries Inc. Cyclonic spray nozzle
JPH08330266A (en) 1995-05-31 1996-12-13 Texas Instr Inc <Ti> Method of cleansing and processing surface of semiconductor device or the like
US5783082A (en) 1995-11-03 1998-07-21 University Of North Carolina Cleaning process using carbon dioxide as a solvent and employing molecularly engineered surfactants
US5868856A (en) 1996-07-25 1999-02-09 Texas Instruments Incorporated Method for removing inorganic contamination by chemical derivitization and extraction
US5868862A (en) 1996-08-01 1999-02-09 Texas Instruments Incorporated Method of removing inorganic contamination by chemical alteration and extraction in a supercritical fluid media
US5908510A (en) 1996-10-16 1999-06-01 International Business Machines Corporation Residue removal by supercritical fluids
JP3286539B2 (en) * 1996-10-30 2002-05-27 信越半導体株式会社 Cleaning device and cleaning method
US6149828A (en) 1997-05-05 2000-11-21 Micron Technology, Inc. Supercritical etching compositions and method of using same
US6500605B1 (en) 1997-05-27 2002-12-31 Tokyo Electron Limited Removal of photoresist and residue from substrate using supercritical carbon dioxide process
AU742586B2 (en) 1997-05-30 2002-01-10 Micell Technologies Surface treatment
US6001418A (en) 1997-12-16 1999-12-14 The University Of North Carolina At Chapel Hill Spin coating method and apparatus for liquid carbon dioxide systems
US5865901A (en) * 1997-12-29 1999-02-02 Siemens Aktiengesellschaft Wafer surface cleaning apparatus and method
US6067728A (en) 1998-02-13 2000-05-30 G.T. Equipment Technologies, Inc. Supercritical phase wafer drying/cleaning system
US6092739A (en) * 1998-07-14 2000-07-25 Moen Incorporated Spray head with moving nozzle
US6242165B1 (en) 1998-08-28 2001-06-05 Micron Technology, Inc. Supercritical compositions for removal of organic material and methods of using same
US6277753B1 (en) 1998-09-28 2001-08-21 Supercritical Systems Inc. Removal of CMP residue from semiconductors using supercritical carbon dioxide process
AU4902201A (en) 1999-11-02 2001-07-03 Tokyo Electron Limited Method and apparatus for supercritical processing of a workpiece

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6059893A (en) * 1995-02-15 2000-05-09 Oki Electric Industry Co., Ltd. Method for cleaning a semiconductor wafer
US6103096A (en) * 1997-11-12 2000-08-15 International Business Machines Corporation Apparatus and method for the electrochemical etching of a wafer

Also Published As

Publication number Publication date
US6730612B2 (en) 2004-05-04
WO2003023830A2 (en) 2003-03-20
TW579302B (en) 2004-03-11
AU2002362248A1 (en) 2003-03-24
US20030049939A1 (en) 2003-03-13
US20030201000A1 (en) 2003-10-30
US6706641B2 (en) 2004-03-16

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