WO2003019652A3 - Verfahren zum befestigen eines elektrischen elements sowie baueinheit mit danach befestigtem elektrischen element - Google Patents

Verfahren zum befestigen eines elektrischen elements sowie baueinheit mit danach befestigtem elektrischen element Download PDF

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Publication number
WO2003019652A3
WO2003019652A3 PCT/DE2002/003036 DE0203036W WO03019652A3 WO 2003019652 A3 WO2003019652 A3 WO 2003019652A3 DE 0203036 W DE0203036 W DE 0203036W WO 03019652 A3 WO03019652 A3 WO 03019652A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrical element
fixing
module
insert
support body
Prior art date
Application number
PCT/DE2002/003036
Other languages
English (en)
French (fr)
Other versions
WO2003019652A2 (de
Inventor
Holger Haussmann
Original Assignee
Bosch Gmbh Robert
Holger Haussmann
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert, Holger Haussmann filed Critical Bosch Gmbh Robert
Priority to EP02760120A priority Critical patent/EP1421616A2/de
Priority to JP2003523002A priority patent/JP2005500699A/ja
Priority to US10/487,315 priority patent/US20040187308A1/en
Publication of WO2003019652A2 publication Critical patent/WO2003019652A2/de
Publication of WO2003019652A3 publication Critical patent/WO2003019652A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Synchronous Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

Es wird ein Verfahren zum Befestigen eines elektrischen Elements, insbesondere einer Diode (20), mit einem Einsatz insbesondere Diodensockel (26), in einem Tragkörper (23) vorgeschlagen, wobei der Einsatz, insbesondere der Diodensockel (26), in eine Öffnung (35) des Tragkörpers (23) eingesetzt wird. Das Verfahren ist dadurch gekennzeichnet, dass in einem weiteren Schritt um den Einsatz herum Material des Tragkörpers (23) zum Einsatz hin verdrängt wird, um eine feste Verbindung zwischen dem elektrischen Element und dem Tragkörper (23) zu erhalten.
PCT/DE2002/003036 2001-08-24 2002-08-17 Verfahren zum befestigen eines elektrischen elements sowie baueinheit mit danach befestigtem elektrischen element WO2003019652A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP02760120A EP1421616A2 (de) 2001-08-24 2002-08-17 Verfahren zum befestigen eines elektrischen elements sowie baueinheit mit danach befestigtem elektrischen element
JP2003523002A JP2005500699A (ja) 2001-08-24 2002-08-17 電気的な素子を固定するための方法ならびに該方法により固定された電気的な素子を備えた構成ユニット
US10/487,315 US20040187308A1 (en) 2001-08-24 2002-08-17 Method for fixing an electrical element and a module with an electrical element fixed thus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10141603A DE10141603A1 (de) 2001-08-24 2001-08-24 Verfahren zum Befestigen eines elektrischen Elements sowie Baueinheit mit danach befestigtem elektrischen Element
DE10141603.2 2001-08-24

Publications (2)

Publication Number Publication Date
WO2003019652A2 WO2003019652A2 (de) 2003-03-06
WO2003019652A3 true WO2003019652A3 (de) 2003-08-14

Family

ID=7696536

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/003036 WO2003019652A2 (de) 2001-08-24 2002-08-17 Verfahren zum befestigen eines elektrischen elements sowie baueinheit mit danach befestigtem elektrischen element

Country Status (5)

Country Link
US (1) US20040187308A1 (de)
EP (1) EP1421616A2 (de)
JP (1) JP2005500699A (de)
DE (1) DE10141603A1 (de)
WO (1) WO2003019652A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006019315B4 (de) * 2006-04-26 2015-04-16 Robert Bosch Gmbh Gleichrichter für eine Elektromaschine

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1098103B (de) * 1959-01-14 1961-01-26 Standard Elektrik Lorenz Ag Verfahren zum Einbau eines elektrischen Halbleiterelementes in ein Gehaeuse
DE2912189A1 (de) * 1978-03-30 1979-10-04 Sev Marchal Halbleiter-leistungsdiode
EP0650188A2 (de) * 1993-10-06 1995-04-26 R-Theta Inc. Methode und Apparat zur Herstellung von Kühlkörpern hoher Rippendichte
US5542176A (en) * 1992-09-21 1996-08-06 Hideaki Serizawa Radiation plate and method of producing the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3293500A (en) * 1964-05-15 1966-12-20 Rca Corp Printed circuit board with semiconductor mounted therein
FR2512275A3 (fr) * 1981-08-29 1983-03-04 Bosch Gmbh Robert Dispositif redresseur de courant avec plaquette a diode a semi-conducteur
US5678970A (en) * 1996-05-02 1997-10-21 Hahn Systems Self-coining fastener
US6637102B2 (en) * 2000-07-19 2003-10-28 Ngk Insulators, Ltd. Process for producing an industrial member having throughholes of high aspect ratio

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1098103B (de) * 1959-01-14 1961-01-26 Standard Elektrik Lorenz Ag Verfahren zum Einbau eines elektrischen Halbleiterelementes in ein Gehaeuse
DE2912189A1 (de) * 1978-03-30 1979-10-04 Sev Marchal Halbleiter-leistungsdiode
US5542176A (en) * 1992-09-21 1996-08-06 Hideaki Serizawa Radiation plate and method of producing the same
EP0650188A2 (de) * 1993-10-06 1995-04-26 R-Theta Inc. Methode und Apparat zur Herstellung von Kühlkörpern hoher Rippendichte

Also Published As

Publication number Publication date
JP2005500699A (ja) 2005-01-06
WO2003019652A2 (de) 2003-03-06
US20040187308A1 (en) 2004-09-30
EP1421616A2 (de) 2004-05-26
DE10141603A1 (de) 2003-03-06

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