WO2003015166A3 - Sheet for sealing electric wiring - Google Patents

Sheet for sealing electric wiring Download PDF

Info

Publication number
WO2003015166A3
WO2003015166A3 PCT/US2002/024789 US0224789W WO03015166A3 WO 2003015166 A3 WO2003015166 A3 WO 2003015166A3 US 0224789 W US0224789 W US 0224789W WO 03015166 A3 WO03015166 A3 WO 03015166A3
Authority
WO
WIPO (PCT)
Prior art keywords
sheet
electric wiring
sealing electric
thickness
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2002/024789
Other languages
French (fr)
Other versions
WO2003015166A2 (en
Inventor
Kohichiro Kawate
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to MXPA04000893A priority Critical patent/MXPA04000893A/en
Priority to CA002453338A priority patent/CA2453338A1/en
Priority to EP02761237A priority patent/EP1415343A2/en
Priority to BR0211509-3A priority patent/BR0211509A/en
Priority to US10/484,117 priority patent/US20040185237A1/en
Publication of WO2003015166A2 publication Critical patent/WO2003015166A2/en
Publication of WO2003015166A3 publication Critical patent/WO2003015166A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40Leadframes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Laminated Bodies (AREA)
  • Insulating Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

A sheet for sealing bus-bar comprising a thermoplastic resin layer having a thickness of not less than 300 μm, and a thermocurable resin layer having a thickness of not more than 100 μm placed on one surface thereof.
PCT/US2002/024789 2001-08-07 2002-08-06 Sheet for sealing electric wiring Ceased WO2003015166A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
MXPA04000893A MXPA04000893A (en) 2001-08-07 2002-08-06 Sheet for sealing electric wiring.
CA002453338A CA2453338A1 (en) 2001-08-07 2002-08-06 Sheet for sealing electric wiring
EP02761237A EP1415343A2 (en) 2001-08-07 2002-08-06 Sheet for sealing electric wiring
BR0211509-3A BR0211509A (en) 2001-08-07 2002-08-06 Sheet and process for preparing a sheet for sealing at least one tie bar, process for sealing a tie bar, and electrical circuit
US10/484,117 US20040185237A1 (en) 2001-08-07 2002-08-06 Sheet for sealing electrical wiring

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001239204A JP2003059363A (en) 2001-08-07 2001-08-07 Sheet for sealing electrical wiring
JP2001-239204 2001-08-07

Publications (2)

Publication Number Publication Date
WO2003015166A2 WO2003015166A2 (en) 2003-02-20
WO2003015166A3 true WO2003015166A3 (en) 2003-10-16

Family

ID=19069988

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/024789 Ceased WO2003015166A2 (en) 2001-08-07 2002-08-06 Sheet for sealing electric wiring

Country Status (7)

Country Link
EP (1) EP1415343A2 (en)
JP (1) JP2003059363A (en)
CN (1) CN1327518C (en)
BR (1) BR0211509A (en)
CA (1) CA2453338A1 (en)
MX (1) MXPA04000893A (en)
WO (1) WO2003015166A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2428537A1 (en) * 2010-09-13 2012-03-14 Sika Technology AG Waterproofing membrane

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB902567A (en) * 1958-02-06 1962-08-01 Reyrolle A & Co Ltd Improvements relating to elongated electrical conductors embedded in cast resin solid insulation
JPH05315473A (en) * 1992-05-06 1993-11-26 Nitto Denko Corp Semiconductor device
JP2000049275A (en) * 1998-07-28 2000-02-18 Hitachi Ltd Lead frame, semiconductor device using the same, and method of manufacturing the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2458701Y (en) * 2001-01-02 2001-11-07 山东省金曼克电气集团股份有限公司 Low-voltage closed conductor outlet device for large and medium-sized air immersed transformer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB902567A (en) * 1958-02-06 1962-08-01 Reyrolle A & Co Ltd Improvements relating to elongated electrical conductors embedded in cast resin solid insulation
JPH05315473A (en) * 1992-05-06 1993-11-26 Nitto Denko Corp Semiconductor device
JP2000049275A (en) * 1998-07-28 2000-02-18 Hitachi Ltd Lead frame, semiconductor device using the same, and method of manufacturing the same

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 018, no. 120 (E - 1516) 25 February 1994 (1994-02-25) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 05 14 September 2000 (2000-09-14) *

Also Published As

Publication number Publication date
CN1327518C (en) 2007-07-18
MXPA04000893A (en) 2004-06-03
EP1415343A2 (en) 2004-05-06
BR0211509A (en) 2004-09-14
WO2003015166A2 (en) 2003-02-20
CN1572022A (en) 2005-01-26
JP2003059363A (en) 2003-02-28
CA2453338A1 (en) 2003-02-20

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