WO2002100593A3 - Polishing pads with polymer filled fibrous web, and methods for fabricating and using same - Google Patents

Polishing pads with polymer filled fibrous web, and methods for fabricating and using same Download PDF

Info

Publication number
WO2002100593A3
WO2002100593A3 PCT/US2001/043208 US0143208W WO02100593A3 WO 2002100593 A3 WO2002100593 A3 WO 2002100593A3 US 0143208 W US0143208 W US 0143208W WO 02100593 A3 WO02100593 A3 WO 02100593A3
Authority
WO
WIPO (PCT)
Prior art keywords
fibers
fabricating
methods
same
fibrous web
Prior art date
Application number
PCT/US2001/043208
Other languages
French (fr)
Other versions
WO2002100593A2 (en
Inventor
Shyng-Tsong Chen
Kenneth P Rodbell
Oscar Kai Chi Hsu
Jean Vangsness
David S Gilbride
Scott Clayton Billings
Kenneth Davis
Original Assignee
Ibm
Shyng-Tsong Chen
Kenneth P Rodbell
Oscar Kai Chi Hsu
Jean Vangsness
David S Gilbride
Scott Clayton Billings
Kenneth Davis
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/715,184 external-priority patent/US6712681B1/en
Application filed by Ibm, Shyng-Tsong Chen, Kenneth P Rodbell, Oscar Kai Chi Hsu, Jean Vangsness, David S Gilbride, Scott Clayton Billings, Kenneth Davis filed Critical Ibm
Priority to AU2001297847A priority Critical patent/AU2001297847A1/en
Priority to JP2003503398A priority patent/JP2004528997A/en
Priority to EP01274075A priority patent/EP1341643A4/en
Priority to CA002441419A priority patent/CA2441419A1/en
Publication of WO2002100593A2 publication Critical patent/WO2002100593A2/en
Publication of WO2002100593A3 publication Critical patent/WO2002100593A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/008—Finishing manufactured abrasive sheets, e.g. cutting, deforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Nonwoven Fabrics (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The fibers define interstices, and the precursors fill these interstices substantially completely before completion of the reaction. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers. The fibers may be separate, or in the form of a woven or non-woven web.
PCT/US2001/043208 2000-11-20 2001-11-20 Polishing pads with polymer filled fibrous web, and methods for fabricating and using same WO2002100593A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU2001297847A AU2001297847A1 (en) 2000-11-20 2001-11-20 Polishing pads with polymer filled fibrous web, and methods for fabricating and using same
JP2003503398A JP2004528997A (en) 2000-11-20 2001-11-20 Abrasive pad having a polymer-filled fibrous web and methods of making and using the same
EP01274075A EP1341643A4 (en) 2000-11-20 2001-11-20 Polishing pads with polymer filled fibrous web, and methods for fabricating and using same
CA002441419A CA2441419A1 (en) 2000-11-20 2001-11-20 Polishing pads with polymer filled fibrous web, and methods for fabricating and using same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/715,184 2000-11-20
US09/715,184 US6712681B1 (en) 2000-06-23 2000-11-20 Polishing pads with polymer filled fibrous web, and methods for fabricating and using same

Publications (2)

Publication Number Publication Date
WO2002100593A2 WO2002100593A2 (en) 2002-12-19
WO2002100593A3 true WO2002100593A3 (en) 2003-06-05

Family

ID=24872997

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/043208 WO2002100593A2 (en) 2000-11-20 2001-11-20 Polishing pads with polymer filled fibrous web, and methods for fabricating and using same

Country Status (5)

Country Link
EP (1) EP1341643A4 (en)
JP (1) JP2004528997A (en)
AU (1) AU2001297847A1 (en)
CA (1) CA2441419A1 (en)
WO (1) WO2002100593A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
TWI409136B (en) * 2006-07-19 2013-09-21 Innopad Inc Chemical mechanical planarization pad having micro-grooves on the pad surface
JP5234916B2 (en) * 2007-01-30 2013-07-10 東レ株式会社 Laminated polishing pad
WO2009123659A1 (en) * 2008-04-01 2009-10-08 Innopad, Inc. Polishing pad with controlled void formation
KR101050274B1 (en) 2009-12-31 2011-07-19 한국생산기술연구원 Abrasive pad containing polishing pad and method for manufacturing same
JP2012101298A (en) * 2010-11-08 2012-05-31 Ritsumeikan Polishing pad
JP2015127094A (en) * 2015-03-04 2015-07-09 学校法人立命館 Polishing pad

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
US5197999A (en) * 1991-09-30 1993-03-30 National Semiconductor Corporation Polishing pad for planarization

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
US5197999A (en) * 1991-09-30 1993-03-30 National Semiconductor Corporation Polishing pad for planarization

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1341643A4 *

Also Published As

Publication number Publication date
JP2004528997A (en) 2004-09-24
EP1341643A4 (en) 2004-06-09
CA2441419A1 (en) 2002-12-19
EP1341643A2 (en) 2003-09-10
WO2002100593A2 (en) 2002-12-19
AU2001297847A1 (en) 2002-12-23

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