WO2002067322A3 - Dispositif semi-conducteur possedant des contacts de signaux et des contacts de courants eleves - Google Patents

Dispositif semi-conducteur possedant des contacts de signaux et des contacts de courants eleves Download PDF

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Publication number
WO2002067322A3
WO2002067322A3 PCT/US2002/003557 US0203557W WO02067322A3 WO 2002067322 A3 WO2002067322 A3 WO 2002067322A3 US 0203557 W US0203557 W US 0203557W WO 02067322 A3 WO02067322 A3 WO 02067322A3
Authority
WO
WIPO (PCT)
Prior art keywords
casing
contacts
semiconductor device
semiconductor die
contact pad
Prior art date
Application number
PCT/US2002/003557
Other languages
English (en)
Other versions
WO2002067322A2 (fr
Inventor
Anthony Andric
Ruel Hill
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Priority to JP2002566547A priority Critical patent/JP4698928B2/ja
Priority to KR1020037010631A priority patent/KR100819192B1/ko
Priority to AU2002240290A priority patent/AU2002240290A1/en
Priority to EP02706185A priority patent/EP1368861B1/fr
Publication of WO2002067322A2 publication Critical patent/WO2002067322A2/fr
Publication of WO2002067322A3 publication Critical patent/WO2002067322A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Connecting Device With Holders (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

L'invention concerne un dispositif semi-conducteur (400) comprenant un boîtier (110), une matrice semi-conductrice (150) supportée dans le boîtier (110), au moins une plage de contact (420), et plusieurs contacts externes (120). Le boîtier (110) comporte une ouverture (410) exposant au moins une partie (430) de la matrice semi-conductrice (150). La plage de contact (420) est disposée sur la partie exposée (430) de la matrice semi-conductrice (150). Les contacts externes (120) dépassent du boîtier (110) et sont reliés à la matrice semi-conductrice (150). La plage de contact (420) possède une capacité de transport de courant plus élevée que chacun des contacts externes (120). Un assemblage de circuit comprend une carte de circuit imprimé (300), un dispositif semi-conducteur (100, 400), et une prise (200). Le dispositif semi-conducteur (100, 400) comprend un boîtier (110), une matrice semi-conductrice (150) supportée dans le boîtier (110), au moins une plage de contact (130, 420) disposée sur le boîtier (110) ou sur la matrice semi-conductrice (150), et plusieurs contacts externes (120) dépassant du boîtier (110) et qui sont reliés à la matrice semi-conductrice (150). La plage de contact (130, 420) possède une capacité de transport de courant plus élevée que chacun des contacts externes (120). La prise (200) est couplée à la carte de circuit imprimé (300) et conçue pour recevoir le dispositif semi-conducteur (100, 400). La prise (200) comprend une première série de contacts (250) conçus pour servir d'interface à des contacts externes (120) du dispositif semi-conducteur (100, 400), au moins un contact de base (285) conçu pour servir d'interface à la plage de contact (130, 420), une portion de base (220) comportant une série d'ouvertures (240), et une portion supérieure (210) engagée de façon coulissante à la portion de base (220). La première série de contacts (250) est reliée à la carte de circuit imprimé (300) et disposée à l'intérieure de la première série d'ouvertures (240). La portion supérieure (210) comprend une seconde série d'ouvertures (230) qui correspond à la première série d'ouvertures (240) de la portion de base (220).
PCT/US2002/003557 2001-02-20 2002-02-06 Dispositif semi-conducteur possedant des contacts de signaux et des contacts de courants eleves WO2002067322A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002566547A JP4698928B2 (ja) 2001-02-20 2002-02-06 Ｚｉｆソケット対応半導体デバイス及びｚｉｆソケットを用いた回路アセンブリ
KR1020037010631A KR100819192B1 (ko) 2001-02-20 2002-02-06 신호 접촉들 및 고전류 전원 접촉들을 갖는 반도체 디바이스
AU2002240290A AU2002240290A1 (en) 2001-02-20 2002-02-06 Semiconductor device having signal contacts and high current power contacts
EP02706185A EP1368861B1 (fr) 2001-02-20 2002-02-06 Dispositif semi-conducteur possedant des contacts de signaux et des contacts de courants eleves

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/789,141 2001-02-20
US09/789,141 US6551114B2 (en) 2001-02-20 2001-02-20 Semiconductor device having signal contacts and high current power contacts

Publications (2)

Publication Number Publication Date
WO2002067322A2 WO2002067322A2 (fr) 2002-08-29
WO2002067322A3 true WO2002067322A3 (fr) 2002-12-19

Family

ID=25146704

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/003557 WO2002067322A2 (fr) 2001-02-20 2002-02-06 Dispositif semi-conducteur possedant des contacts de signaux et des contacts de courants eleves

Country Status (8)

Country Link
US (1) US6551114B2 (fr)
EP (1) EP1368861B1 (fr)
JP (1) JP4698928B2 (fr)
KR (1) KR100819192B1 (fr)
CN (1) CN1251358C (fr)
AU (1) AU2002240290A1 (fr)
TW (1) TW546810B (fr)
WO (1) WO2002067322A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL358677A1 (en) 2000-03-14 2004-08-09 James Hardie Research Pty Limited Fiber cement building materials with low density additives
CN1243615C (zh) 2001-03-02 2006-03-01 詹姆士·哈代国际金融公司 涂洒装置
US6964584B2 (en) * 2001-12-21 2005-11-15 Intel Corporation Low impedance, high-power socket and method of using
US6752635B1 (en) * 2003-03-31 2004-06-22 Intel Corporation Comb-shaped land grid array (LGA) socket contact for improved power delivery
US8209927B2 (en) 2007-12-20 2012-07-03 James Hardie Technology Limited Structural fiber cement building materials
US9583125B1 (en) 2009-12-16 2017-02-28 Magnecomp Corporation Low resistance interface metal for disk drive suspension component grounding
US8079849B2 (en) * 2010-05-11 2011-12-20 Tyco Electronics Corporation Socket connector assembly with compressive contacts

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5483099A (en) * 1994-08-31 1996-01-09 Intel Corporation Standardized power and ground design for pin grid array packages
US5721673A (en) * 1995-10-05 1998-02-24 Micron Electronics, Inc. Socket for retaining multiple electronic packages

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330163A (en) * 1979-12-05 1982-05-18 E. I. Du Pont De Nemours And Company Zero insertion force connector for LSI circuit package
US5258648A (en) * 1991-06-27 1993-11-02 Motorola, Inc. Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
JP3302720B2 (ja) * 1992-06-09 2002-07-15 ミネソタ マイニング アンド マニュファクチャリング カンパニー Ｉｃソケット
US5489218A (en) * 1994-03-24 1996-02-06 Hon Hai Precision Industry Co., Ltd. ZIF PGA socket and contact therein
US5528083A (en) * 1994-10-04 1996-06-18 Sun Microsystems, Inc. Thin film chip capacitor for electrical noise reduction in integrated circuits
US5703402A (en) * 1995-11-13 1997-12-30 Acc Microelectronics Corporation Output mapping of die pad bonds in a ball grid array
US6084777A (en) * 1997-04-23 2000-07-04 Texas Instruments Incorporated Ball grid array package
US6020637A (en) * 1997-05-07 2000-02-01 Signetics Kp Co., Ltd. Ball grid array semiconductor package
US6160705A (en) * 1997-05-09 2000-12-12 Texas Instruments Incorporated Ball grid array package and method using enhanced power and ground distribution circuitry
AU1536599A (en) * 1997-11-28 1999-06-16 Pcd, Inc. Manually operated top loading socket for ball grid arrays
US6140581A (en) * 1997-12-03 2000-10-31 Mitsubishi Electronics America, Inc. Grounded packaged semiconductor structure and manufacturing method therefor
US6064113A (en) * 1998-01-13 2000-05-16 Lsi Logic Corporation Semiconductor device package including a substrate having bonding fingers within an electrically conductive ring surrounding a die area and a combined power and ground plane to stabilize signal path impedances
US6075710A (en) * 1998-02-11 2000-06-13 Express Packaging Systems, Inc. Low-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chips
US6297550B1 (en) * 1998-04-01 2001-10-02 Lsi Logic Corporation Bondable anodized aluminum heatspreader for semiconductor packages
US5903050A (en) * 1998-04-30 1999-05-11 Lsi Logic Corporation Semiconductor package having capacitive extension spokes and method for making the same
TW421333U (en) * 1999-02-24 2001-02-01 Hung Rung Fang IC socket

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5483099A (en) * 1994-08-31 1996-01-09 Intel Corporation Standardized power and ground design for pin grid array packages
US5721673A (en) * 1995-10-05 1998-02-24 Micron Electronics, Inc. Socket for retaining multiple electronic packages

Also Published As

Publication number Publication date
EP1368861B1 (fr) 2011-09-28
KR100819192B1 (ko) 2008-04-04
US6551114B2 (en) 2003-04-22
JP2004523864A (ja) 2004-08-05
KR20040014457A (ko) 2004-02-14
JP4698928B2 (ja) 2011-06-08
CN1491464A (zh) 2004-04-21
WO2002067322A2 (fr) 2002-08-29
CN1251358C (zh) 2006-04-12
TW546810B (en) 2003-08-11
EP1368861A2 (fr) 2003-12-10
US20020115325A1 (en) 2002-08-22
AU2002240290A1 (en) 2002-09-04

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