WO2002059629A2 - Device, current measurer and motor vehicle - Google Patents

Device, current measurer and motor vehicle Download PDF

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Publication number
WO2002059629A2
WO2002059629A2 PCT/DE2002/000232 DE0200232W WO02059629A2 WO 2002059629 A2 WO2002059629 A2 WO 2002059629A2 DE 0200232 W DE0200232 W DE 0200232W WO 02059629 A2 WO02059629 A2 WO 02059629A2
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WIPO (PCT)
Prior art keywords
conductor
sensor means
sensor
motor vehicle
current
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PCT/DE2002/000232
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German (de)
French (fr)
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WO2002059629A3 (en
Inventor
Stephan Ernst
Ning Qu
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Robert Bosch Gmbh
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Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Priority to EP02701222A priority Critical patent/EP1358491A2/en
Publication of WO2002059629A2 publication Critical patent/WO2002059629A2/en
Publication of WO2002059629A3 publication Critical patent/WO2002059629A3/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
    • G01R15/207—Constructional details independent of the type of device used

Definitions

  • the device according to the invention, the current meter according to the invention and the motor vehicle according to the invention with the features of the independent claims have the advantage that the measurement of currents via magnetic fields or the measurement of magnetic fields by simplifying assembly processes and independent of frequency-dependent effects, such as the skin -Effect that is realizable. Furthermore, assembly techniques can be used according to the invention, which ensure independence from magnetic interference fields from the environment, without using expensive additional components such as magnetic field concentrators.
  • the conductor has a cylindrical shape at least in the area of the sensor means. This further reduces the frequency dependency because there is no formation of frequency-dependent magnetic fields around the conductor.
  • the senor means is applied to a flexible substrate. This makes it possible to have high accuracy and reproducibility to ensure the distance of the sensor means from the current-carrying conductor.
  • the sensor means decides the conductor along a circumference. This makes it possible for the sensor to represent a closed magnetic circuit. As a result, interference fields no longer have a significant influence on the measurement result. This eliminates the need for more complex measures such as magnetic field concentrators or shielding measures, which results in cost advantages and space or size advantages.
  • FIG. 1 shows a conductor according to the invention with a sensor means in a first embodiment
  • FIG. 2 shows a conductor according to the invention with a sensor means in a second embodiment.
  • the conductor 1 shows a conductor 1 with a sensor means 5.
  • the conductor 1 has a cylindrical shape at least in the area of the sensor means 5.
  • the sensor means 5 is provided as a current or magnetic field sensor chip.
  • the sensor means 5 is designed as a flexible sensor chip, such as a Hall plate, a lateral magnetotransistor as a very thinly ground wafer or chip, or the like.
  • the sensor means 5 is applied to the cylindrical conductor 1.
  • the assembly can for example by gluing or soldering or the like respectively.
  • the solder thickness or the adhesive thickness acts in particular as a spacer of the sensor means 5 from the conductor 1.
  • FIG. 2 shows a second embodiment of the conductor 1 according to the invention and the sensor means 5.
  • the conductor 1 in turn has a cylindrical shape.
  • a flexible substrate 10 is applied to the conductor surface.
  • a magnetoresistive layer is also applied to the flexible substrate 10 as sensor means 5.
  • AMR or GMR layers which have an "anisotropy magneto resistance” or “Giant magnetic resistance” or similar layers come into consideration as magnetoresistive layers 5 or as sensor means 5.
  • Layers, which are applied to a flexible substrate 10, can at the same time be realized with a corresponding design of the substrate 10, a sensor 5 or sensor means 5 which surrounds the entire conductor 1.
  • Sensor means 5 thus represents a closed magnetic circuit. As a result, interference fields can no longer have any significant influence on the measurement result of sensor means 5.
  • suitable conductor geometries such as, for example, a cylindrical conductor geometry, ensures independence from frequency-dependent effects, such as the skin effect, without the need for a demanding assembly of the sensor means.
  • a frequency independence of the measuring method is thereby achieved with simple means. Due to the small space requirement of a device for measuring the electrical current strength provided in this way, an easy and simple adaptation of the sensor or the sensor means to predetermined geometries is also possible. This allows a minimal installation space for the sensor means.
  • the invention provides for an evaluation circuit 6 to be provided on the flexible substrate 10.
  • Evaluation circuit 6 is also provided according to the embodiment according to FIG. 1, but is not shown there for the sake of simplicity. In particular, it is provided according to the invention to provide such an evaluation circuit 6 or such an ASIC on the flexible chip, which also holds the sensor means 5 u.
  • the sensor means 5 is provided according to the invention as a chip on the cylindrical conductor 1.
  • sensor means 5 is sawn onto a thinned wafer whose thickness is so small that the chip can be bent, for example significantly smaller than 150 ⁇ m, depending on the chip size.
  • Either solder or adhesive is applied to the cylindrical conductor 1 or on the back of the sensor means 5 and the chip 5 is then applied to the conductor 1, in order to avoid misalignment of the chip 5, one is applied to the conductor 1 before the joining operation
  • Adjustment aid for example in the form of an embossing, applied using a mechanical mask or the application of solder resist.
  • the conductor, together with the joined chip and the solder or the adhesive is, for example, thermally heated to close the connection. consolidate.
  • a magnetoresistive sensor layer is provided as sensor means 5.
  • the magnetoresistive sensor layer 5 is applied to a flexible substrate 10 and encloses the entire cylindrical conductor, so that a closed magnetic circuit is present.
  • the flexible substrate 10 can be brought into the appropriate shape before final assembly, to which the magnetoresistive layer 5 is then applied, for example by sputtering.
  • it can be provided according to the invention to apply the magnetoresistive layer on the flexible substrate 10, the substrate 10 initially being provided in a planar manner and subsequently bringing the substrate 10 together with the magnetoresistive layer 5 into the desired shape. In this case, the connection of the two end pieces must take place in a suitable form, so that a closed magnetic circuit is created.
  • the design of the magnetoresistive layer 5 can take any suitable shape in the geometric form.
  • the flexible substrate 10 is pushed onto the conductor 1, for example, and fixed thereon, for example positioned on the conductor 1 by gluing or by some other method.
  • the magnetic field-sensitive layer 5 can be applied directly to the conductor or, if appropriate, to its insulation.
  • the measurement signal is evaluated according to the invention, for example by a second flexible ASIC or a flexible evaluation circuit, which either - directly on the conductor or on the flexible Substrate 10 or the insulation of the conductor is mounted. It is also conceivable that the ASIC or the evaluation circuit in stacking technique, for example, to "the sensor chip 5 is applied, or vice versa.
  • a motor vehicle according to the invention with a device according to the invention or a current sensor according to the invention therefore has the advantages of the smaller installation size of a current sensor or a device for measuring the electrical current strength.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)

Abstract

The invention relates to a device, a current measurer and a motor vehicle. The device is used to measure the intensity of an electric current flowing through a conductor (1), a sensing means (5) being provided therein. The sensing means (5) is embodied in a mechanically flexible manner. Said sensing means (5) is incurved against the surface of the conductor (1) corresponding thereto.

Description

Vorrichtung, Strommesser und KraftfahrzeugDevice, ammeter and motor vehicle
Stand der TechnikState of the art
Die Messung von Strömen über Magnetfeldsensoren und Magnetfelder im Kraftfahrzeug, insbesondere in einer Umgebung, in der hohe elektromagnetische Störfelder auftreten, wie z.B. innerhalb elektrischer Antriebe, Motoren und Generatoren, stellt besondere Herausforderungen an die Anordnung von magnetischen Sensorelementen dar. Als weitere Herausforderung ist die Beherrschung derThe measurement of currents via magnetic field sensors and magnetic fields in the motor vehicle, in particular in an environment in which high electromagnetic interference fields occur, e.g. within electrical drives, motors and generators, poses special challenges to the arrangement of magnetic sensor elements. Another challenge is mastering the
Frequenzabhängigkeit der Magnetfelder zu nennen, insbesondere der Skin-Effekt, der eine weitere konstruktive Einschränkung der Sensoranordnung bedeutet und einen bedeutenden Aufwand in Bezug auf die Positionierung der Sensorelemente erfordert.To name frequency dependence of the magnetic fields, in particular the skin effect, which means a further design limitation of the sensor arrangement and requires a significant effort in relation to the positioning of the sensor elements.
Bisher bekannt ist hinsichtlich der Messung von Stromstärken die Benutzung von Magnetfeldkonzentratoren, z.B. Ringkernen, um den Einfluß der magnetischen Stör- bzw. Streufelder zu eliminieren. Nachteil dieser Technik ist ein erhöhter Aufwand für die Konstruktion sowie ein erhöhter Materialaufwand, was zu Platzproblemen und relativ hohen Kosten führt. Weiterhin kann eine Beschränkung des Frequenzbereichs z.B. für die Strommessung resultieren, da die magnetischen Materialien oberhalb charakteristischer Frequenzen ein Sättigungsverhalten aufweisen. Außerdem muß die Hysterese dieser Materialien in der Auswertung der Signale berücksichtigt werden, um den dadurch verursachten Fehler zu kompensieren. Dies erfordert eine umfangreichere Signalauswertung. Ein weiteres Problem ist die mechanische Halterung der Sensormittel bzw. Sensoren derart, dass der Abstand zum z.B. stromführenden Leiter möglichst exakt eingehalten wird. Dies erfordert beispielsweise Vorrichtungen zur Mikropräzisionsmontage und Ähnliches.So far it has been known to use magnetic field concentrators, for example toroidal cores, to measure the strength of currents in order to eliminate the influence of magnetic interference or stray fields. The disadvantage of this technique is an increased outlay for the construction and an increased outlay on materials, which leads to space problems and relatively high costs. Furthermore, a limitation of the frequency range can result, for example, for the current measurement, since the magnetic materials are more characteristic above Frequencies have a saturation behavior. In addition, the hysteresis of these materials must be taken into account in the evaluation of the signals in order to compensate for the error caused thereby. This requires a more extensive signal evaluation. Another problem is the mechanical mounting of the sensor means or sensors in such a way that the distance from the current-carrying conductor, for example, is maintained as precisely as possible. This requires, for example, devices for micro-precision assembly and the like.
Vorteile der ErfindungAdvantages of the invention
Die erfindungsgemäße Vorrichtung, der erfindungsgemäße Strommesser und das erfindungsgemäße Kraftfahrzeug mit den Merkmalen der nebengeordneten Ansprüche haben demgegenüber den Vorteil, dass die Messung von Strömen über Magnetfelder bzw. die Messung von Magnetfeldern durch die Vereinfachung von Montageverfahren und unabhängig von frequenzabhängigen Effekten, wie beispielsweise dem Skin-Effekt, realsierbar ist. Weiterhin können erfindungsgemäß Montagetechniken eingesetzt werden, die eine Unabhängigkeit von magnetischen Störfeldern aus der Umgebung gewährleisten, ohne teuere zusätzliche Komponenten wie Magnetfeldkonzentratoren zu verwenden.The device according to the invention, the current meter according to the invention and the motor vehicle according to the invention with the features of the independent claims have the advantage that the measurement of currents via magnetic fields or the measurement of magnetic fields by simplifying assembly processes and independent of frequency-dependent effects, such as the skin -Effect that is realizable. Furthermore, assembly techniques can be used according to the invention, which ensure independence from magnetic interference fields from the environment, without using expensive additional components such as magnetic field concentrators.
Weiterhin ist es von Vorteil, dass der Leiter zumindest im Bereich des Sensormittels eine zylindrische Form aufweist. Dadurch wird weiterhin die Frequenzabhängigkeit verringert, weil es nicht zur Ausbildung von frequenzabhängigen Magnetfeldern um den Leiter herum kommt.It is also advantageous that the conductor has a cylindrical shape at least in the area of the sensor means. This further reduces the frequency dependency because there is no formation of frequency-dependent magnetic fields around the conductor.
Weiterhin ist von Vorteil, dass das Sensormittel auf ein flexibles Substrat aufgebracht ist. Dadurch ist es möglich, eine hohe Genauigkeit und Reproduzierbarkeit hinsichtlich des Abstands des Sensormittels vom stromdurchflossenen Leiter zu gewährleisten.It is also advantageous that the sensor means is applied to a flexible substrate. This makes it possible to have high accuracy and reproducibility to ensure the distance of the sensor means from the current-carrying conductor.
Weiterhin ist von Vorteil, dass das Sensormittel den Leiter entlang eines U fangs entschließt. Dadurch ist es möglich, dass der Sensor einen geschlossenen magnetischen Kreis darstellt. Hierdurch haben Störfelder keinen wesentlichen Einfluß mehr auf das Meßergebnis. Es können damit aufwendigere 'Maßnahmen wie beispielsweise Magnetfeldkonzentratoren oder Abschirmmaßnahmen entfallen, was Kostenvorteile und Platzvorteile bzw. Größenvorteile mit sich, bringt.It is also advantageous that the sensor means decides the conductor along a circumference. This makes it possible for the sensor to represent a closed magnetic circuit. As a result, interference fields no longer have a significant influence on the measurement result. This eliminates the need for more complex measures such as magnetic field concentrators or shielding measures, which results in cost advantages and space or size advantages.
Zeichnungdrawing
Ausführungsbeispiele der Erfindung sind in der Zeichnung dargestellt und in der nachfolgenden Beschreibung näher erläutert. Es zeigenEmbodiments of the invention are shown in the drawing and explained in more detail in the following description. Show it
Figur 1 ein erfindungsgemäßer Leiter mit einem Sensormittel in einer ersten Ausführungsform und1 shows a conductor according to the invention with a sensor means in a first embodiment and
Figur 2 ein erfindungsgemäßer Leiter mit .einem Sensormittel in einer zweiten Ausführungsform.2 shows a conductor according to the invention with a sensor means in a second embodiment.
Beschreibung der AusführungsbeispieleDescription of the embodiments
In Figur 1 ist ein Leiter 1 mit einem Sensormittel 5 dargestellt. Der Leiter 1 hat zumindest im Bereich des Sensormittels 5 eine zylindrische Form. Das Sensormittel 5 ist als Strom- bzw. Magnetfeldsensor-Chip vorgesehen. Das Sensormittel 5 ist als flexibler Sensorchip, wie beispielsweise ein Hall-Plättchen, ein lateraler Magnetotransistor ausgeführt als ein sehr dünn geschliffener Wafer bzw. Chip, oder Ähnliches .Das Sensormittel 5 ist auf den zylindrischen Leiter 1 aufgebracht. Die Montage kann beispielsweise durch Kleben oder Löten oder ähnliches erfolgen. Die Lotdicke bzw. die Klebstoffdicke fungiert dabei insbesondere als Abstandshalter des Sensormittels 5 von dem Leiter 1.1 shows a conductor 1 with a sensor means 5. The conductor 1 has a cylindrical shape at least in the area of the sensor means 5. The sensor means 5 is provided as a current or magnetic field sensor chip. The sensor means 5 is designed as a flexible sensor chip, such as a Hall plate, a lateral magnetotransistor as a very thinly ground wafer or chip, or the like. The sensor means 5 is applied to the cylindrical conductor 1. The assembly can for example by gluing or soldering or the like respectively. The solder thickness or the adhesive thickness acts in particular as a spacer of the sensor means 5 from the conductor 1.
In Figur 2 ist eine zweite Ausführungsform- des erfindungsgemäßen Leiters 1 und des Sensormittels 5 dargestellt. Der Leiter 1 hat wiederum zylindrische Gestalt. Auf die Leiteroberfläche ist ein flexibles Substrat 10 aufgebracht. Auf das flexible Substrat 10 ist weiterhin eine magnetoresistive Schicht als Sensormittel 5 aufgebracht. Hierbei kommen als magnetoresistive Schichten 5 bzw. als Sensormittel 5 insbesondere AMR- oder GMR-Schichten (die eine "Anisotropie magneto resistance" bzw. eine "Giant magnetic resistance" aufweisen) oder ähnliche Schichten in Frage. Bei der Verwendung solcher magnetoresistiverFIG. 2 shows a second embodiment of the conductor 1 according to the invention and the sensor means 5. The conductor 1 in turn has a cylindrical shape. A flexible substrate 10 is applied to the conductor surface. A magnetoresistive layer is also applied to the flexible substrate 10 as sensor means 5. In particular, AMR or GMR layers (which have an "anisotropy magneto resistance" or "Giant magnetic resistance") or similar layers come into consideration as magnetoresistive layers 5 or as sensor means 5. When using such magnetoresistive
Schichten, die auf ein flexibles Substrat 10 aufgebracht werden, kann bei entsprechender Auslegung des Substrats 10 zugleich ein Sensor 5 bzw. Sensormittel 5 realisiert werden, der bzw. die den gesamten Leiter 1 umschließt. Damit stellt das Sensormittel 5 einen geschlossenen magnetischen Kreis dar. Dadurch können Störfelder keinen wesentlichen Einfluß mehr auf das Meßergebnis des Sensormittels 5 haben.Layers, which are applied to a flexible substrate 10, can at the same time be realized with a corresponding design of the substrate 10, a sensor 5 or sensor means 5 which surrounds the entire conductor 1. Sensor means 5 thus represents a closed magnetic circuit. As a result, interference fields can no longer have any significant influence on the measurement result of sensor means 5.
Ein weiterer Lösungsansatz ist das direkte Aufbringen des Sensormittels 5 auf den stromführenden Leiter 1 bzw. auf die den Leiter 1 umgebende Isolation, die in der Zeichnung nicht näher- dargestellt ist.Another solution is the direct application of the sensor means 5 to the current-carrying conductor 1 or to the insulation surrounding the conductor 1, which is not shown in the drawing.
Durch die Wahl von geeigneten Leitergeometrien, wie z.B. eine zylindrische Leitergeometrie, ist eine Unabhängigkeit von frequenzabhängigen Effekten, wie beispielsweise dem Skin-Effekt gegeben, .ohne dass dazu eine anspruchsvolle Montage der Sensormittεl benötigt würde. Dadurch wird -eine Frequenzunabhängigkeit des Meßverfahrens mit einfachen Mitteln erreicht. Durch den geringen Platzbedarf einer solchermaßen vorgesehenen Vorrichtung zur Messung der elektrischen Stromstärke ist weiterhin eine leichte und einfache Anpassung des Sensors bzw. der Sensormittel an vorgegebene Geometrien möglich. Hierdurch ist ein minimaler Bauraum des Sensormittels möglich.The choice of suitable conductor geometries, such as, for example, a cylindrical conductor geometry, ensures independence from frequency-dependent effects, such as the skin effect, without the need for a demanding assembly of the sensor means. A frequency independence of the measuring method is thereby achieved with simple means. Due to the small space requirement of a device for measuring the electrical current strength provided in this way, an easy and simple adaptation of the sensor or the sensor means to predetermined geometries is also possible. This allows a minimal installation space for the sensor means.
Weiterhin ist erfindungsgemäß vorgesehen, auf dem flexiblen Substrat 10 eine Auswerteschaltung 6 vorzusehen. DieFurthermore, the invention provides for an evaluation circuit 6 to be provided on the flexible substrate 10. The
Auswerteschaltung 6 ist auch nach der Ausführungsform gemäß der Figur 1 vorgesehen, dort jedoch der Einfachheit halber nicht dargestellt. Es ist insbesondere erfindungsgemäß vorgesehen, eine solche Auswerteschaltung 6 bzw. einen solchen ASIC auf dem flexiblen Chip, der auch die Ξensormittel 5 u fasst, vorzusehen.Evaluation circuit 6 is also provided according to the embodiment according to FIG. 1, but is not shown there for the sake of simplicity. In particular, it is provided according to the invention to provide such an evaluation circuit 6 or such an ASIC on the flexible chip, which also holds the sensor means 5 u.
In der ersten Ausführungsform gemäß der Figur 1 ist erfindungsgemäß das Sensormittel 5 als Chip auf dem zylindrischen Leiter 1 vorgesehen. Der Chip 5. bzw. dieIn the first embodiment according to FIG. 1, the sensor means 5 is provided according to the invention as a chip on the cylindrical conductor 1. The chip 5th or the
Sensormittel 5 ist erfindungsgemäß auf einen gedünnten Wafer gesägt, dessen Dicke so niedrig ist, dass der Chip gebogen werden kann, beispielsweise deutlich kleiner als 150 um, abhängig von der Chipgröße. Auf dem zylindrischen Leiter 1 bzw. auf der Rückseite des Sensormittels 5 wird entweder Lot oder Klebstoff aufgetragen und der Chip 5 wird im Anschluß daran auf den Leiter 1 aufgebracht, um eine Dejustage desChips 5 zu vermeiden, wird auf den Leiter 1 vor dem Fügevσrgang eine Justagehilfe, z.B. in Form einer Prägung, mit Hilfe einer mechanischen Maske oder der Aufbringung von Lötstoplack aufgebracht. Der Leiter wird zusammen mit dem gefügten Chip und dem Lot bzw. dem Klebstoff z.B. thermisch ausgeheizt, um die Verbindung zu. festigen. Es können erfindungsgemäß insbesondere auch mehrere Sensorchips montiert werden. Erfindungsgemäß ist insbesondere eine symmetrische Anordnung mehrerer solcher Sensorchips 5 vorgesehen.According to the invention, sensor means 5 is sawn onto a thinned wafer whose thickness is so small that the chip can be bent, for example significantly smaller than 150 μm, depending on the chip size. Either solder or adhesive is applied to the cylindrical conductor 1 or on the back of the sensor means 5 and the chip 5 is then applied to the conductor 1, in order to avoid misalignment of the chip 5, one is applied to the conductor 1 before the joining operation Adjustment aid, for example in the form of an embossing, applied using a mechanical mask or the application of solder resist. The conductor, together with the joined chip and the solder or the adhesive, is, for example, thermally heated to close the connection. consolidate. According to the invention, it is also possible in particular to mount a plurality of sensor chips. According to the invention, in particular A symmetrical arrangement of several such sensor chips 5 is provided.
Bei der zweiten Ausführungsform gemäß der Figur 2 ist eine magnetoresistive Sensorschicht als Sensormittel 5 vorgesehen. Die magnetoresistive Sensorschicht 5 ist auf ein flexibles Substrat 10 aufgebracht und umschließt den gesamten zylindrischen Leiter, so dass ein geschlossener Magnetkreis vorliegt. Das flexible Substrat 10 kann vor der Endmontage in die entsprechende Form gebracht werden, worauf dann die magnetoresistive Schicht 5 beispielsweise durch Sputtern, aufgebracht wird. Ebenso kann es erfindungsgemäß vorgesehen sein, die magnetoresistive Schicht auf dem flexiblen Substrat 10 aufzubringen, wobei das Substrat 10 zunächst noch planar vorgesehen ist und im Anschluß daran das Substrat 10 mitsamt der magnetoresistiven Schicht 5 in die gewünschte Form zu bringen. In diesem Fall muß die Verbindung der beiden Endstücke in geeigneter Form erfolgen, so dass ein geschlossener Magnetkreis entsteht.In the second embodiment according to FIG. 2, a magnetoresistive sensor layer is provided as sensor means 5. The magnetoresistive sensor layer 5 is applied to a flexible substrate 10 and encloses the entire cylindrical conductor, so that a closed magnetic circuit is present. The flexible substrate 10 can be brought into the appropriate shape before final assembly, to which the magnetoresistive layer 5 is then applied, for example by sputtering. Likewise, it can be provided according to the invention to apply the magnetoresistive layer on the flexible substrate 10, the substrate 10 initially being provided in a planar manner and subsequently bringing the substrate 10 together with the magnetoresistive layer 5 into the desired shape. In this case, the connection of the two end pieces must take place in a suitable form, so that a closed magnetic circuit is created.
Die Ausführung der magnetoresistiven Schicht 5 kann in der geometrischen Form jede beliebige geeignete Gestalt annehmen. Das flexible Substrat 10 wird auf den Leiter 1 beispielsweise geschoben und darauf fixiert, beispielsweise durch Kleben oder durch andere Art auf dem Leiter 1 positioniert.The design of the magnetoresistive layer 5 can take any suitable shape in the geometric form. The flexible substrate 10 is pushed onto the conductor 1, for example, and fixed thereon, for example positioned on the conductor 1 by gluing or by some other method.
Ebenso kann die magnetfeldempfindliche Schicht 5 direkt auf den Leiter aufgebracht werden bzw. gegebenenfalls auf dessen Isolation.Likewise, the magnetic field-sensitive layer 5 can be applied directly to the conductor or, if appropriate, to its insulation.
Die Auswertung des Meßsignals erfolgt erfindungsgemäß in beiden Ausführungsformen beispielsweise durch einen zweiten flexiblen ASIC bzw. eine flexible Auswerteschaltung, die entweder - direkt auf den Leiter oder auf das flexible Substrat 10 bzw. die Isolation des Leiters montiert wird. Ebenso ist es denkbar, dass der ASIC bzw. die Auswerteschaltung in Stapeltechnik z.B. auf" den Sensorchip 5 aufgebracht wird oder umgekehrt.In both embodiments, the measurement signal is evaluated according to the invention, for example by a second flexible ASIC or a flexible evaluation circuit, which either - directly on the conductor or on the flexible Substrate 10 or the insulation of the conductor is mounted. It is also conceivable that the ASIC or the evaluation circuit in stacking technique, for example, to "the sensor chip 5 is applied, or vice versa.
Die Messung von Strömen über deren Magnetfeldeffekt ist insbesondere im Automobilbereich notwendig und kritisch, weil hier mit besonders starken Störfeldern zu rechnen ist. Ein erfindungsgemäßes Kraftfahrzeug mit einer erfindungsgemäßen Vorrichtung bzw. einem erfindungsgemäßen Stromsensor, hat daher die Vorteile der geringeren Einbaugröße eines Stromsensors bzw. einer Vorrichtung zur Messung der elektrischen Stromstärke. The measurement of currents via their magnetic field effect is necessary and critical, especially in the automotive sector, because particularly strong interference fields can be expected here. A motor vehicle according to the invention with a device according to the invention or a current sensor according to the invention therefore has the advantages of the smaller installation size of a current sensor or a device for measuring the electrical current strength.

Claims

Ansprüche Expectations
1. Vorrichtung zur Messung der elektrischen Stromstärke eines stromdurchflossenen Leiters (1) mit einem Sensormittel (5) , wobei das Sensormittel (5) mechanisch biegsam vorgesehen ist, wobei das Sensormittel an der Oberfläche des Leiters (1) , entsprechend der Oberfläche des Leiters (1) gebogen, befestigt ist.1. Device for measuring the electrical current intensity of a current-carrying conductor (1) with a sensor means (5), the sensor means (5) being mechanically flexible, the sensor means on the surface of the conductor (1), corresponding to the surface of the conductor ( 1) bent, fastened.
2. Vorrichtung zur Messung der elektrischen Stromstärke eines stromdurchflossenen Leiters (1) mit einem Sensormittel (5) , wobei das Sensormittel (5) als Schicht an einem Teilbereich der Oberfläche des Leiters (1) angebracht ist .2. Device for measuring the electrical current intensity of a current-carrying conductor (1) with a sensor means (5), the sensor means (5) being applied as a layer to a partial area of the surface of the conductor (1).
3. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der Leiter. (1) zumindest im. Bereich des Sensormittels eine zylindrische Form aufweist .3. Device according to one of the preceding claims, characterized in that the conductor. (1) at least in. Area of the sensor means has a cylindrical shape.
4. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Sensormittel (5) auf ein flexibles Substrat aufgebracht ist.4. Device according to one of the preceding claims, characterized in that the sensor means (5) is applied to a flexible substrate.
5. Vorrichtung nach einem der Ansprüche 2 bis 4, dadurch gekennzeichnet, dass das Sensormittel (5) als magnetoresistive Schicht vorgesehen ist.5. Device according to one of claims 2 to 4, characterized in that the sensor means (5) is provided as a magnetoresistive layer.
6. Vorrichtung nach Anspruch 5, dadurch gekennzeichnet, dass das Sensormittel (5) den Leiter (1) entlang eines Umfangs umschließt. 6. The device according to claim 5, characterized in that the sensor means (5) encloses the conductor (1) along a circumference.
7. Strommesser mit einer Vorrichtung nach einem der vorhergehenden Ansprüche .7. ammeter with a device according to any one of the preceding claims.
8. Kra tfahrzeug mit einer Vorrichtung oder einem Strommesser nach einem der vorhergehenden Ansprüche. 8. Kra tfahrzeug with a device or an ammeter according to one of the preceding claims.
PCT/DE2002/000232 2001-01-26 2002-01-24 Device, current measurer and motor vehicle WO2002059629A2 (en)

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DE102004062474A1 (en) 2004-03-23 2005-10-13 Siemens Ag Device for potential-free current measurement
DE102013222466A1 (en) 2013-11-06 2015-05-07 Robert Bosch Gmbh Arrangement for measuring a short-circuit current

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GB2088568A (en) * 1980-11-14 1982-06-09 Central Electr Generat Board A transducer for an alternating current measuring device
US4542338A (en) * 1982-03-12 1985-09-17 Thomson-Csf Optical fibre interferometric electric current measuring device
DE3517095A1 (en) * 1984-05-31 1986-01-09 VEB Meßtechnik Mellenbach Betrieb des Kombinates VEB Elektro-Apparate-Werke Berlin-Treptow "Friedrich Ebert", DDR 6428 Mellenbach-Glasbach Arrangement in the form of a magnetoresistive transducer for measuring line currents
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SCOVILLE J T ET AL: "A LOW-COST MULTIPLE HALL PROBE CURRENT TRANSDUCER" REVIEW OF SCIENTIFIC INSTRUMENTS, AMERICAN INSTITUTE OF PHYSICS. NEW YORK, US, Bd. 62, Nr. 3, 1. März 1991 (1991-03-01), Seiten 755-760, XP000224321 ISSN: 0034-6748 *

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