WO2002019397A2 - Keyed wafer lift system - Google Patents
Keyed wafer lift system Download PDFInfo
- Publication number
- WO2002019397A2 WO2002019397A2 PCT/US2001/027094 US0127094W WO0219397A2 WO 2002019397 A2 WO2002019397 A2 WO 2002019397A2 US 0127094 W US0127094 W US 0127094W WO 0219397 A2 WO0219397 A2 WO 0219397A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- lift
- hoop
- key
- shaft
- substrate
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Definitions
- the present invention generally relates to substrate processing. More particularly, the present invention relates to a wafer lift system for positioning a substrate in relation to a substrate support member in a processing chamber.
- the wafer lift system is typically utilized to receive a substrate from a robot blade and position the substrate onto the substrate support member.
- the wafer lift system is also utilized to lift the substrate off of the substrate support member and facilitate substrate transfers into and out of the processing chamber.
- the wafer lift system typically comprises a lift hoop, a lift hoop clamp, a sleeve attached to the lift hoop clamp, an actuator shaft that is inserted into the lift hoop sleeve, and a set screw which is inserted transverse to the lift hoop sleeve to secure the actuator shaft in the lift hoop sleeve.
- a plurality of lift pins extending through the substrate support member are moved by the lift hoop to facilitate substrate transfers onto and off of the substrate support member.
- the typical wafer lift system having a sleeve/shaft configuration has provided adequate support for substrates sizes of 200mm or smaller. However, as semiconductor substrate size increases to 300mm, the typical wafer lift system has not provided adequate support of substrates during substrate transfers. Particularly, vibration of the lift hoop during movements may cause breakage of the lift pins and or generate contaminants in the processing chamber. Also, vibration transferred to the wafer may also cause damage to devices formed thereon. Vibration of the lift hoop during movements are magnified by differences in thermal expansion of the lift hoop sleeve and the actuator shaft due to temperature increases during processing.
- the present invention generally provides a wafer lift system that provides rigid support of a substrate during substrate transfers and substantially reduces vibration of the wafer lift system during movements.
- the wafer lift system provides rigid support for all operating temperatures during processing. Also, the wafer lift system eliminates or substantially reduces outgas contamination into the processing chamber.
- One aspect of the invention provides an apparatus for positioning a substrate relative to a substrate support member comprising a lift hoop having a hoop key, the lift hoop disposed in moveable engagement with the substrate, and a lift shaft having a shaft key disposed in an interlocked arrangement with the hoop key.
- the hoop key comprises two or more wedges extending from a surface of the lift hoop
- the shaft key comprises two or more mating wedges extending from a distal end of the lift shaft.
- Figure 1 is an exploded perspective view of one embodiment of a wafer lift system according to the invention.
- Figure 2 is a cross sectional view of one embodiment of a wafer lift system and a substrate support member.
- Figure 3 is a cross sectional view of one embodiment of a hoop key and a shaft key disposed in an interlocked configuration.
- FIG. 1 is an exploded perspective view of one embodiment of a wafer lift system according to the invention.
- the wafer lift system 100 generally comprises a lift hoop 110 having a hoop key 112 and a lift shaft 120 having a shaft key 122 disposed in an interlocked arrangement with the hoop key 112.
- the lift hoop 110 may be shaped as a continuous flat ring having an inward protrusion 114 at the location of the hoop key 112.
- the lift hoop 110 may be shaped (e.g., C-shape, U-shape) to accommodate other components in the processing chamber.
- the hoop key 112 comprises two or more wedges 116 extending from a surface of the lift hoop 112, and the shaft key 122 comprises two or more mating wedges 124 extending from a distal end of the lift shaft 120.
- a fastener 128, such as a threaded bolt, may extend centrally (e.g., axially) through a hole 130 on the hoop key 112 and a cavity 132 in the shaft key 122.
- the fastener 128 releasably secures the lift hoop 110 to the lift shaft 120.
- Each wedge 116 of the hoop key 112 may further include a tapered flange 118 extending radially outward from each wedge 116.
- the tapered flange 118 may provide additional support of the hoop key on the lift hoop 110 and additional rigidity between the hoop key 112 and the shaft key 122.
- the lift hoop 110 and the hoop key 112 may be machined from a monolithic piece of material, such as stainless steel. Other materials, such as aluminum and ceramics, may also be used to form the lift hoop 110 and the lift shaft 120. In one embodiment, same materials are used for the lift hoop 110 and the lift shaft 120 to minimize mechanical expansion/contraction differences between the hoop key 112 and the shaft key 122 caused by changes in temperature during processing. Alternatively, the hoop key 112 and the lift hoop 110 may be machined from separate pieces of material, and the hoop key 112 may be attached to the lift hoop 110 by adhesive bonding, welding, and/or mechanical fasteners.
- Figure 2 is a cross sectional view of one embodiment of a wafer lift system and a substrate support member.
- the wafer lift system 100 and the substrate support member 200 may be disposed at a bottom portion of the processing chamber.
- the processing chamber may be an etch chamber, a physical vapor deposition chamber, a chemical vapor deposition chamber, or any other chamber that utilizes a substrate support member which requires a wafer lift system to facilitate positioning a substrate onto or lifting a substrate off of the substrate support member.
- the substrate support member 200 which is also commonly referred to as a heater or a pedestal, may comprise a vacuum chuck, an electrostatic chuck, or other substrate holders.
- a temperature controller such as resistive heating coils or thermal fluid channels, may be disposed inside or adjacent the substrate supporting surface 202 of the substrate support member 200.
- the substrate support member 200 includes a pedestal shaft 204 which extends downwardly through a base plate 250 of the chamber.
- a flange portion 205 of the pedestal shaft 204 is connected to a pedestal actuator 206 which moves the substrate support member 200 between various positions, including a processing position (e.g., high position) and a substrate transfer position (e.g., low position). As shown in Figure 2, the substrate support member 200 is in a substrate transfer position.
- the pedestal actuator 206 is disposed outside of the processing chamber.
- a bellows 208 may be disposed around portions of the pedestal shaft 204 extending through the chamber bottom to reduce contaminant particles in the processing chamber and to facilitate chamber operation at sub-atmospheric pressure levels.
- the bellows 208 is sealingly attached to the flange portion 205 of the pedestal shaft 204 and to a seal plate 252 disposed around the pedestal shaft 204.
- the seal plate 252 may be sealingly attached to the base plate 250 of the bottom of the chamber by mechanical fasteners, such as bolts or screws.
- An O-ring 254 may be disposed between the seal plate 252 and the base plate 250.
- the wafer lift system 100 is disposed below the substrate support member 200.
- the lift hoop 110 is disposed around the pedestal shaft 204.
- the lift shaft 120 may extend through the bottom of the chamber bottom, and a lift actuator 220 may be connected to a flange portion 224 of the lift shaft 120 to move the lift hoop 110 to various positions.
- the lift actuator 220 may be disposed outside of the processing chamber, and another bellows 222 may be disposed around portions of the lift shaft 120 that is extending through the base plate 250 to reduce contaminant particles in the processing chamber and to facilitate chamber operation at sub-atmospheric pressure levels.
- the bellows 222 is sealingly attached to the flange portion 224 of the lift shaft 120 and to another seal plate 226 disposed around the lift shaft 120.
- the seal plate 226 may be sealingly attached to the base plate 250 of the bottom of the chamber by mechanical fasteners, such as bolts or screws.
- Another O-ring 228 may be disposed between the seal plate 226 and the base plate
- the lift hoop 110 is moved to a substrate transfer position to lift a substrate off of the substrate supporting surface or to lift a substrate off of a robot blade.
- a plurality of lift pins 214 are movably disposed through lift pin guides 216 in the substrate support member 200.
- the lift pins 214 may be made from stainless steel, aluminum, ceramics, or other suitable materials.
- Ceramic buttons 240 may be disposed on the top surface of the lift hoop 110 at locations that engages the lift pins 214.
- the top ends of the lift pins 214 engages the bottom surface of a substrate as the lift pins 214 are pushed up by the lift hoop 110.
- the lift pins 214 may be attached or secured to the lift hoop 110, for example, by welding, adhesive bonding, and or mechanical fasteners.
- Figure 3 is a cross sectional top view (taken along the lines indicated by 3-3 in Figure 2) of one embodiment of a hoop key and a shaft key disposed in an interlocked configuration.
- the hoop key 112 comprises two wedges 116 disposed in opposite quadrants, and each wedge 116 includes a tapered flange 118.
- the shaft key 122 comprises two wedges 126 disposed in opposite quadrants.
- the distal end of the lift shaft 120 may be machined to provide the two wedges 126.
- the hoop key 112 and the shaft key 122 may have tolerances (i.e., distances between the wedges) as small as about 2 mils at room temperature when disposed in an interlocked configuration. During processing, the temperature may increase and cause thermal expansion of the wedges, resulting in an even tighter fit and increased rigidity of the splined connection between the hoop key 112 and the shaft key 122.
- the lift pins 214 are moved upwardly to a substrate transfer position as shown in Figure 2, and the substrate 230 is lifted above the substrate supporting surface 202 a sufficient distance to facilitate a robot blade (not shown) to be positioned between the substrate 230 and the substrate supporting surface 202.
- the lift hoop 110 and the lift pins 214 may be lowered to place the substrate 230 onto the robot blade, and the robot blade may retract with the substrate out of the chamber and transfer the substrate to another chamber.
- a robot blade is extended into the chamber to position the substrate 230 above the substrate support member 200 while the wafer lift system 100 is retracted to a lower position.
- the lift actuator 220 then moves the lift hoop 110 upwardly to engage and move the lift pins 214.
- the lift pins 214 are moved upwardly to lift the substrate 230 off of the robot blade, and the robot blade is the retracted out of the chamber.
- the lift actuator 220 then retracts the lift hoop 110 and lift pins 214 to position the substrate onto the substrate support member 200.
- the wafer lift system according to the invention substantially improves the rigidity of the connection between the lift hoop and the lift shaft and substantially reduces vibration of the lift hoop as the lift hoop is moved by the lift actuator. Also, the wafer lift system substantially reduces vibration transferred to the lift pins and the substrate, resulting in decreased likelihood of contaminant generation, breakage of the lift pins, and/or damages to devices formed on the substrate. Furthermore, the wafer lift system substantially reduces the number of parts required for the system and eliminates outgassing problems of the typical sleeve/shaft lift configuration.
Abstract
An apparatus for positioning a substrate relative to a substrate support member is provided. The apparatus comprises a lift hoop having a hoop key, the lift hoop disposed in moveable engagement with the substrate; and a lift shaft having a shaft key disposed in an interlocked arrangement with the hoop key. In one embodiment, the hoop key comprises two or more wedges extending from a surface of the lift hoop, and the shaft key comprises two or more mating wedges extending from a distal end of the lift shaft.
Description
KEYED WAFER LIFT SYSTEM
Field of the Invention
The present invention generally relates to substrate processing. More particularly, the present invention relates to a wafer lift system for positioning a substrate in relation to a substrate support member in a processing chamber.
Background of the Related Art
Semiconductor substrates are typically placed on a substrate support member disposed inside a processing chamber for various processes required to fabricate integrated circuits. The wafer lift system is typically utilized to receive a substrate from a robot blade and position the substrate onto the substrate support member. The wafer lift system is also utilized to lift the substrate off of the substrate support member and facilitate substrate transfers into and out of the processing chamber. The wafer lift system typically comprises a lift hoop, a lift hoop clamp, a sleeve attached to the lift hoop clamp, an actuator shaft that is inserted into the lift hoop sleeve, and a set screw which is inserted transverse to the lift hoop sleeve to secure the actuator shaft in the lift hoop sleeve. A plurality of lift pins extending through the substrate support member are moved by the lift hoop to facilitate substrate transfers onto and off of the substrate support member. The typical wafer lift system having a sleeve/shaft configuration has provided adequate support for substrates sizes of 200mm or smaller. However, as semiconductor substrate size increases to 300mm, the typical wafer lift system has not provided adequate support of substrates during substrate transfers. Particularly, vibration of the lift hoop during movements may cause breakage of the lift pins and or generate contaminants in the processing chamber. Also, vibration transferred to the wafer may also cause damage to devices formed thereon. Vibration of the lift hoop during movements are magnified by differences in thermal expansion of the lift hoop sleeve and the actuator shaft due to temperature increases during processing. Furthermore, gases trapped within the lift hoop sleeve may cause outgassing contamination into the processing chamber during processing.
Therefore, there remains a need for a wafer lift system that provides rigid support of a substrate during substrate transfers and substantially reduces vibration of the wafer lift system during movements. It would be desirable for the wafer lift system to provide rigid support for all operating temperatures during processing. It would be further desirable for the wafer lift system to eliminate or substantially reduce outgas contamination into the processing chamber.
SUMMARY OF THE INVENTION
The present invention generally provides a wafer lift system that provides rigid support of a substrate during substrate transfers and substantially reduces vibration of the wafer lift system during movements. The wafer lift system provides rigid support for all operating temperatures during processing. Also, the wafer lift system eliminates or substantially reduces outgas contamination into the processing chamber.
One aspect of the invention provides an apparatus for positioning a substrate relative to a substrate support member comprising a lift hoop having a hoop key, the lift hoop disposed in moveable engagement with the substrate, and a lift shaft having a shaft key disposed in an interlocked arrangement with the hoop key. In one embodiment, the hoop key comprises two or more wedges extending from a surface of the lift hoop, and the shaft key comprises two or more mating wedges extending from a distal end of the lift shaft.
BRIEF DESCRIPTION OF THE DRAWINGS
So that the manner in which the above recited features, advantages and objects of the present invention are attained and can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to the embodiments thereof which are illustrated in the appended drawings.
It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
Figure 1 is an exploded perspective view of one embodiment of a wafer lift system
according to the invention.
Figure 2 is a cross sectional view of one embodiment of a wafer lift system and a substrate support member.
Figure 3 is a cross sectional view of one embodiment of a hoop key and a shaft key disposed in an interlocked configuration.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Figure 1 is an exploded perspective view of one embodiment of a wafer lift system according to the invention. The wafer lift system 100 generally comprises a lift hoop 110 having a hoop key 112 and a lift shaft 120 having a shaft key 122 disposed in an interlocked arrangement with the hoop key 112. The lift hoop 110 may be shaped as a continuous flat ring having an inward protrusion 114 at the location of the hoop key 112. Alternatively, the lift hoop 110 may be shaped (e.g., C-shape, U-shape) to accommodate other components in the processing chamber.
In one embodiment, the hoop key 112 comprises two or more wedges 116 extending from a surface of the lift hoop 112, and the shaft key 122 comprises two or more mating wedges 124 extending from a distal end of the lift shaft 120. A fastener 128, such as a threaded bolt, may extend centrally (e.g., axially) through a hole 130 on the hoop key 112 and a cavity 132 in the shaft key 122. The fastener 128 releasably secures the lift hoop 110 to the lift shaft 120. Each wedge 116 of the hoop key 112 may further include a tapered flange 118 extending radially outward from each wedge 116. The tapered flange 118 may provide additional support of the hoop key on the lift hoop 110 and additional rigidity between the hoop key 112 and the shaft key 122.
The lift hoop 110 and the hoop key 112 may be machined from a monolithic piece of material, such as stainless steel. Other materials, such as aluminum and ceramics, may also be used to form the lift hoop 110 and the lift shaft 120. In one embodiment, same materials are used for the lift hoop 110 and the lift shaft 120 to minimize mechanical expansion/contraction differences between the hoop key 112 and the shaft key 122 caused by changes in temperature during processing. Alternatively, the hoop key 112 and the lift hoop 110 may be machined from separate pieces of material, and the hoop key 112 may be attached to the lift hoop 110 by adhesive bonding, welding, and/or mechanical
fasteners.
Figure 2 is a cross sectional view of one embodiment of a wafer lift system and a substrate support member. The wafer lift system 100 and the substrate support member 200 may be disposed at a bottom portion of the processing chamber. The processing chamber may be an etch chamber, a physical vapor deposition chamber, a chemical vapor deposition chamber, or any other chamber that utilizes a substrate support member which requires a wafer lift system to facilitate positioning a substrate onto or lifting a substrate off of the substrate support member.
The substrate support member 200, which is also commonly referred to as a heater or a pedestal, may comprise a vacuum chuck, an electrostatic chuck, or other substrate holders. A temperature controller, such as resistive heating coils or thermal fluid channels, may be disposed inside or adjacent the substrate supporting surface 202 of the substrate support member 200. The substrate support member 200 includes a pedestal shaft 204 which extends downwardly through a base plate 250 of the chamber. A flange portion 205 of the pedestal shaft 204 is connected to a pedestal actuator 206 which moves the substrate support member 200 between various positions, including a processing position (e.g., high position) and a substrate transfer position (e.g., low position). As shown in Figure 2, the substrate support member 200 is in a substrate transfer position. The pedestal actuator 206 is disposed outside of the processing chamber. A bellows 208 may be disposed around portions of the pedestal shaft 204 extending through the chamber bottom to reduce contaminant particles in the processing chamber and to facilitate chamber operation at sub-atmospheric pressure levels. The bellows 208 is sealingly attached to the flange portion 205 of the pedestal shaft 204 and to a seal plate 252 disposed around the pedestal shaft 204. The seal plate 252 may be sealingly attached to the base plate 250 of the bottom of the chamber by mechanical fasteners, such as bolts or screws. An O-ring 254 may be disposed between the seal plate 252 and the base plate 250.
The wafer lift system 100 is disposed below the substrate support member 200. The lift hoop 110 is disposed around the pedestal shaft 204. The lift shaft 120 may extend through the bottom of the chamber bottom, and a lift actuator 220 may be connected to a flange portion 224 of the lift shaft 120 to move the lift hoop 110 to various positions. The lift actuator 220 may be disposed outside of the processing chamber, and another bellows
222 may be disposed around portions of the lift shaft 120 that is extending through the base plate 250 to reduce contaminant particles in the processing chamber and to facilitate chamber operation at sub-atmospheric pressure levels. The bellows 222 is sealingly attached to the flange portion 224 of the lift shaft 120 and to another seal plate 226 disposed around the lift shaft 120. The seal plate 226 may be sealingly attached to the base plate 250 of the bottom of the chamber by mechanical fasteners, such as bolts or screws. Another O-ring 228 may be disposed between the seal plate 226 and the base plate 250.
As shown in Figure 2, the lift hoop 110 is moved to a substrate transfer position to lift a substrate off of the substrate supporting surface or to lift a substrate off of a robot blade. In one embodiment, a plurality of lift pins 214 are movably disposed through lift pin guides 216 in the substrate support member 200. The lift pins 214 may be made from stainless steel, aluminum, ceramics, or other suitable materials. As the lift actuator moves the lift hoop closer toward the substrate support member 200, the top surface of the lift hoop 110 engages the bottom ends of the lift pins 214 and controls the vertical movement of the lift pins 214. Ceramic buttons 240 may be disposed on the top surface of the lift hoop 110 at locations that engages the lift pins 214. The top ends of the lift pins 214 engages the bottom surface of a substrate as the lift pins 214 are pushed up by the lift hoop 110. Alternatively, the lift pins 214 may be attached or secured to the lift hoop 110, for example, by welding, adhesive bonding, and or mechanical fasteners.
Figure 3 is a cross sectional top view (taken along the lines indicated by 3-3 in Figure 2) of one embodiment of a hoop key and a shaft key disposed in an interlocked configuration. Referring to Figures 1, 2 and 3, the hoop key 112 comprises two wedges 116 disposed in opposite quadrants, and each wedge 116 includes a tapered flange 118. The shaft key 122 comprises two wedges 126 disposed in opposite quadrants. The distal end of the lift shaft 120 may be machined to provide the two wedges 126. As shown in Figure 3, the hoop key 112 and the shaft key 122 may have tolerances (i.e., distances between the wedges) as small as about 2 mils at room temperature when disposed in an interlocked configuration. During processing, the temperature may increase and cause thermal expansion of the wedges, resulting in an even tighter fit and increased rigidity of the splined connection between the hoop key 112 and the shaft key 122.
Referring back to Figure 2, to transfer a substrate out of the chamber, the lift pins
214 are moved upwardly to a substrate transfer position as shown in Figure 2, and the substrate 230 is lifted above the substrate supporting surface 202 a sufficient distance to facilitate a robot blade (not shown) to be positioned between the substrate 230 and the substrate supporting surface 202. The lift hoop 110 and the lift pins 214 may be lowered to place the substrate 230 onto the robot blade, and the robot blade may retract with the substrate out of the chamber and transfer the substrate to another chamber.
To transfer a substrate 230 onto the substrate support member 200, a robot blade is extended into the chamber to position the substrate 230 above the substrate support member 200 while the wafer lift system 100 is retracted to a lower position. The lift actuator 220 then moves the lift hoop 110 upwardly to engage and move the lift pins 214. The lift pins 214 are moved upwardly to lift the substrate 230 off of the robot blade, and the robot blade is the retracted out of the chamber. The lift actuator 220 then retracts the lift hoop 110 and lift pins 214 to position the substrate onto the substrate support member 200.
The wafer lift system according to the invention substantially improves the rigidity of the connection between the lift hoop and the lift shaft and substantially reduces vibration of the lift hoop as the lift hoop is moved by the lift actuator. Also, the wafer lift system substantially reduces vibration transferred to the lift pins and the substrate, resulting in decreased likelihood of contaminant generation, breakage of the lift pins, and/or damages to devices formed on the substrate. Furthermore, the wafer lift system substantially reduces the number of parts required for the system and eliminates outgassing problems of the typical sleeve/shaft lift configuration.
While the foregoing is directed to the preferred embodiment of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims
1. An apparatus for positioning a substrate relative to a substrate support member, comprising: a lift hoop having a hoop key, the lift hoop disposed in moveable engagement with substrate; and a lift shaft having a shaft key disposed in an interlocked arrangement with the hoop key.
2. The apparatus of claim 1, further comprising: a lift actuator connected to the lift shaft.
3. The apparatus of claim 1, further comprising: a plurality of lift pins disposed through the substrate support in positions engageable with the lift hoop.
4. The apparatus of claim 1, further comprising: a plurality of lift pins disposed on the lift hoop and extending through the substrate support.
5. The apparatus of claim 1, wherein the hoop key comprises two or more wedges extending from a surface of the lift hoop, and wherein the shaft key comprises two or more mating wedges extending from a distal end of the lift shaft.
6. The apparatus of claim 5, wherein the hoop key further comprises a tapered flange extending radially outward from each wedge.
7. The apparatus of claim 1, further comprising: a fastener extending through a hole on the lift hoop and a cavity in the lift shaft, the fastener releasably securing the lift hoop to the lift shaft.
8. The apparatus of claim 7, wherein the fastener comprises a threaded bolt, and wherein the cavity in the lift shaft includes a threaded portion.
9. The apparatus of claim 7, wherein the hole on the lift hoop is located centrally through the hoop key, and wherein the cavity in the lift shaft is located centrally through the shaft key.
10. The apparatus of claim 1, wherein the lift hoop and the hoop key are machined from a monolithic piece of material.
11. The apparatus of claim 1 , wherein the hoop key is attached to the lift hoop through one or more methods selected from the group consisting of adhesive bonding, welding, and mechanical fastening.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US65272700A | 2000-08-31 | 2000-08-31 | |
| US09/652,727 | 2000-08-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2002019397A2 true WO2002019397A2 (en) | 2002-03-07 |
| WO2002019397A3 WO2002019397A3 (en) | 2003-01-30 |
Family
ID=24617915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2001/027094 WO2002019397A2 (en) | 2000-08-31 | 2001-08-30 | Keyed wafer lift system |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW506039B (en) |
| WO (1) | WO2002019397A2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090025636A1 (en) * | 2007-07-27 | 2009-01-29 | Applied Materials, Inc. | High profile minimum contact process kit for hdp-cvd application |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6001234A (en) * | 1997-09-30 | 1999-12-14 | Semitool, Inc. | Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot |
| EP1005063A2 (en) * | 1998-11-25 | 2000-05-31 | Applied Materials, Inc. | Shadow ring and guide for supporting the shadow ring in a chamber |
| US6213478B1 (en) * | 1999-03-11 | 2001-04-10 | Moore Epitaxial, Inc. | Holding mechanism for a susceptor in a substrate processing reactor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06124520A (en) * | 1992-10-08 | 1994-05-06 | Hitachi Electron Eng Co Ltd | Adapter of spindle mechanism |
-
2001
- 2001-08-29 TW TW90121384A patent/TW506039B/en active
- 2001-08-30 WO PCT/US2001/027094 patent/WO2002019397A2/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6001234A (en) * | 1997-09-30 | 1999-12-14 | Semitool, Inc. | Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot |
| EP1005063A2 (en) * | 1998-11-25 | 2000-05-31 | Applied Materials, Inc. | Shadow ring and guide for supporting the shadow ring in a chamber |
| US6213478B1 (en) * | 1999-03-11 | 2001-04-10 | Moore Epitaxial, Inc. | Holding mechanism for a susceptor in a substrate processing reactor |
Non-Patent Citations (1)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 018, no. 417 (P-1781), 4 August 1994 (1994-08-04) & JP 06 124520 A (HITACHI ELECTRON ENG CO LTD), 6 May 1994 (1994-05-06) * |
Also Published As
| Publication number | Publication date |
|---|---|
| TW506039B (en) | 2002-10-11 |
| WO2002019397A3 (en) | 2003-01-30 |
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