WO2002015237B1 - Changing local compressibility of a wafer support member - Google Patents

Changing local compressibility of a wafer support member

Info

Publication number
WO2002015237B1
WO2002015237B1 PCT/US2001/024904 US0124904W WO0215237B1 WO 2002015237 B1 WO2002015237 B1 WO 2002015237B1 US 0124904 W US0124904 W US 0124904W WO 0215237 B1 WO0215237 B1 WO 0215237B1
Authority
WO
WIPO (PCT)
Prior art keywords
support member
wafer
wafer support
sealant material
pores
Prior art date
Application number
PCT/US2001/024904
Other languages
French (fr)
Other versions
WO2002015237A2 (en
WO2002015237A3 (en
Inventor
Diane B Scott
Original Assignee
Rodel Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rodel Inc filed Critical Rodel Inc
Publication of WO2002015237A2 publication Critical patent/WO2002015237A2/en
Publication of WO2002015237A3 publication Critical patent/WO2002015237A3/en
Publication of WO2002015237B1 publication Critical patent/WO2002015237B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Abstract

A wafer support member (1), and a method of changing local compressibility of a wafer support member (1) to provide a seal, includes, dispensing a curable sealant material (9) onto a resiliently compressible wager support member (1), the support member having pores (6) for directing either fluid borne pressure or fluid borne vaccuum between the wafer support member (1) and a backside of a wager to be supported, wicking the sealant material (9) into pores (6) of the wager support member (1), curing the sealant material (9) to provide a film closing each of the pores (6) that are intercepted by the sealant material (9), to change local compressibility of the edge margin (5) of the wafer support member (1), and provide a seal.

Claims

AMENDED CLAIMS[received by the International Bureau on 2 April 2002 (02.04.02); original claims 1 -8 amended; original claims 9 and 10 cancelled (2 pages)]
1. A wafer support member comprises, a substantially planar platen surface to face a wafer during polishing of the wafer, the wafer support member having finely divided pores substantially distributing either fluid borne pressure or fluid borne vacuum evenly throughout the wafer support member and evenly across an area of a backside surface of the wafer, the pores directing the fluid axially of the pores and in a direction orthogonally normal to a wafer during polishing to support a substantial area of the wafer, and a perimeter seal along an edge margin of the wafer support member, and further characterised by; one or more than one localized seal on the planar platen surface provided by the sealant material that forms a film bridging across the pores that are intercepted by each localized seal, and each localized seal being arranged to compensate for localized differences in height of a wafer front surface to be polished.
2. The wafer support member as recited in claim 1 wherein, each localized seal is oriented to follow valleys in the topography of the wafer front surface.
3. The wafer support member as recited in claim 1 wherein, each localized seal is oriented to follow peaks in the topography of the wafer front surface.
4. The wafer support member as recited in claim 1, and further comprising: the sealant material having been printed onto the planar platen surface.
10
5. A method of changing local compressibility of a wafer support member to provide seals, comprising the steps of: dispensing a curable sealant material onto a resiliently compressible wafer support member to provide localized seals covering pores through the support member for directing either fluid borne pressure or fluid borne vacuum between the wafer support member and a backside of a wafer to be supported by the wafer support member, wicking the sealant material into pores of the wafer support member, and curing the sealant material to provide a film closing each of the pores along the localized seals that are intercepted by the sealant material, to change local compressibility of the wafer support member.
6. The method as recited in claim 5 wherein, each localized seal is oriented to follow valleys in the topography of the wafer front surface.
7. The method as recited in claim 5 wherein, each localized seal is oriented to follow peaks in the topography of the wafer front surface.
8. The method as recited in claim 5, wherein the step of dispensing a curable sealant material further comprising the step of: printing the curable sealant material.
PCT/US2001/024904 2000-08-11 2001-08-08 Changing local compressibility of a wafer support member WO2002015237A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22431900P 2000-08-11 2000-08-11
US60/224,319 2000-08-11

Publications (3)

Publication Number Publication Date
WO2002015237A2 WO2002015237A2 (en) 2002-02-21
WO2002015237A3 WO2002015237A3 (en) 2002-04-11
WO2002015237B1 true WO2002015237B1 (en) 2002-06-27

Family

ID=22840138

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/024904 WO2002015237A2 (en) 2000-08-11 2001-08-08 Changing local compressibility of a wafer support member

Country Status (3)

Country Link
US (1) US20020022082A1 (en)
TW (1) TW506038B (en)
WO (1) WO2002015237A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7055229B2 (en) * 2003-12-31 2006-06-06 Intel Corporation Support system for semiconductor wafers and methods thereof
CN104076619A (en) * 2014-07-03 2014-10-01 无锡宏纳科技有限公司 Contact type photoetching machine sucking disc
CN109887877B (en) * 2019-01-02 2021-09-14 长江存储科技有限责任公司 Wafer fixing table and wafer bonding equipment
CN113471135B (en) * 2021-07-06 2022-07-29 华海清科股份有限公司 Wafer clamping device and wafer cleaning device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3072962B2 (en) * 1995-11-30 2000-08-07 ロデール・ニッタ株式会社 Workpiece holder for polishing and method of manufacturing the same

Also Published As

Publication number Publication date
US20020022082A1 (en) 2002-02-21
WO2002015237A2 (en) 2002-02-21
TW506038B (en) 2002-10-11
WO2002015237A3 (en) 2002-04-11

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