WO2002013265A3 - Heat sink assembly with evenly distributed compression force - Google Patents

Heat sink assembly with evenly distributed compression force Download PDF

Info

Publication number
WO2002013265A3
WO2002013265A3 PCT/IB2001/001585 IB0101585W WO0213265A3 WO 2002013265 A3 WO2002013265 A3 WO 2002013265A3 IB 0101585 W IB0101585 W IB 0101585W WO 0213265 A3 WO0213265 A3 WO 0213265A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
heat
heat generating
sink assembly
generating device
Prior art date
Application number
PCT/IB2001/001585
Other languages
French (fr)
Other versions
WO2002013265A2 (en
Inventor
Chong-Sheng Wang
Peter D Tata
Original Assignee
Tyco Electronics Logistics Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Logistics Ag filed Critical Tyco Electronics Logistics Ag
Priority to AU2001282392A priority Critical patent/AU2001282392A1/en
Publication of WO2002013265A2 publication Critical patent/WO2002013265A2/en
Publication of WO2002013265A3 publication Critical patent/WO2002013265A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat sink assembly (10) for removing heat from an electronic device (12) is disclosed. A socket (14) is mounted to a printed circuit board (16) that has a top surface and a bottom surface and holes (18) formed therethrough. A heat generating device (12) is installed in the socket (14). Alignment pins (22) of a backing plate (20) are installed through the holes (18) in the circuit board (16). A clasp plate (26), having slits, grasps the alignment pins (22). The clasp plate (26) further includes a female threaded bore (30) which is positioned over the heat generating device (12). A heat sink member (32), with heat dissipating members (36) and a male threaded shank (34) with a bottom contact surface is threaded into the female threaded bore (30) so that the bottom contact surface of the threaded shank (34) is maintained in flush thermal and tensioned communication with the heat generating surface of the heat generating device (12).
PCT/IB2001/001585 2000-08-04 2001-07-18 Heat sink assembly with evenly distributed compression force WO2002013265A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001282392A AU2001282392A1 (en) 2000-08-04 2001-07-18 Heat sink assembly with evenly distributed compression force

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63254200A 2000-08-04 2000-08-04
US09/632,542 2000-08-04

Publications (2)

Publication Number Publication Date
WO2002013265A2 WO2002013265A2 (en) 2002-02-14
WO2002013265A3 true WO2002013265A3 (en) 2003-10-30

Family

ID=24535921

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2001/001585 WO2002013265A2 (en) 2000-08-04 2001-07-18 Heat sink assembly with evenly distributed compression force

Country Status (3)

Country Link
AU (1) AU2001282392A1 (en)
TW (1) TW516360B (en)
WO (1) WO2002013265A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6741470B2 (en) * 2001-06-01 2004-05-25 Intel Corporation Reusable thermal solution attachment mechanism and methods of using same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5662163A (en) * 1995-11-29 1997-09-02 Silicon Graphics, Inc. Readily removable heat sink assembly
US5730620A (en) * 1995-09-08 1998-03-24 International Business Machines Corporation Method and apparatus for locating electrical circuit members
US5738531A (en) * 1996-09-09 1998-04-14 International Business Machines Corporation Self-alligning low profile socket for connecting ball grid array devices through a dendritic interposer
US5766022A (en) * 1996-05-21 1998-06-16 International Business Machines Corporation Electrical assembly
US5919050A (en) * 1997-04-14 1999-07-06 International Business Machines Corporation Method and apparatus for separable interconnecting electronic components
US5945736A (en) * 1998-09-28 1999-08-31 Chip Coolers, Inc. Heat sink assembly with snap-in cover plate having multiple pressure capability
US6014315A (en) * 1998-09-08 2000-01-11 Chip Coolers, Inc. Heat sink assembly with multiple pressure capability

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5730620A (en) * 1995-09-08 1998-03-24 International Business Machines Corporation Method and apparatus for locating electrical circuit members
US5662163A (en) * 1995-11-29 1997-09-02 Silicon Graphics, Inc. Readily removable heat sink assembly
US5766022A (en) * 1996-05-21 1998-06-16 International Business Machines Corporation Electrical assembly
US5738531A (en) * 1996-09-09 1998-04-14 International Business Machines Corporation Self-alligning low profile socket for connecting ball grid array devices through a dendritic interposer
US5919050A (en) * 1997-04-14 1999-07-06 International Business Machines Corporation Method and apparatus for separable interconnecting electronic components
US6014315A (en) * 1998-09-08 2000-01-11 Chip Coolers, Inc. Heat sink assembly with multiple pressure capability
US5945736A (en) * 1998-09-28 1999-08-31 Chip Coolers, Inc. Heat sink assembly with snap-in cover plate having multiple pressure capability

Also Published As

Publication number Publication date
TW516360B (en) 2003-01-01
AU2001282392A1 (en) 2002-02-18
WO2002013265A2 (en) 2002-02-14

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