WO2002011186A2

WO2002011186A2 - Change kit-insert or socket-insert for ic packages

Info

Publication number: WO2002011186A2
Application number: PCT/US2001/020678
Authority: WO
Inventors: Dean Tran
Original assignee: Advanced Micro Devices, Inc.
Priority date: 2000-07-27
Filing date: 2001-06-27
Publication date: 2002-02-07
Also published as: AU2001271599A1; WO2002011186A3

Abstract

A change kit (100) for retaining integrated circuit packages (120) in an assembly process or test process of the packages (120). The change kit (100) comprises a substrate (102) having openings (104), and inserts (110) configured to be inserted into the respective openings (104). The inserts (110) are inserted into the respective openings (104) for changing a configuration and/or size of the respective openings (104) in accordance with a configuration and size of integrated circuit packages (120) to be retained by the change kit (100) so that the packages (120) are accommodated in the respective openings (104). This enables the change kit (100) to retain integrated circuit packages (120) of varying configurations and/or sizes.

Description

INSERTS FOR MAKING CHANGE KIT OR SOCKET

UNIVERSAL TO IC PACKAGES OF VARYING

CONFIGURATION AND SIZES

TECHNICAL FIELD The present invention relates to equipment such as a change kit or socket for retaining integrated circuit (IC) packages in respective openings of the equipment to handle the IC packages in their assembly process or test process. More particularly, the invention relates to the equipment which is so configured that inserts are inserted into the respective openings to change their configuration and/or size in accordance with a configuration and size of IC packages to be retained by the equipment in the assembly process or test process.

BACKGROUND ART

IC package designs have proliferated over the years into a wide variety of configurations, such as shapes, number of I/O pins, lead arrangements and geometry, in response to circuit and system-level demands.

This results in production of various families of IC packages; for example, SOP (Small Outline Package), QFP

(Quad Flat Package), PLCC (Plastic Leadless Chip Carrier), BGA (Ball Grid Array), and CSP (Chip-Scale Package). In the same family, there are also different IC packages in package size. For instance, as BGA packages with 6 X 8 populated pins, there are various package sizes, such as 6 X 8 mm, 6 X 9 mm, and 8 X 9 mm.

Since configurations and/or sizes vary from IC package to IC package, special care for IC packages is required when they are handled in their assembly process or test process. More specifically, IC packages require development of specialized custom equipment and tooling, such as change kits, sockets, test handlers and electrical component board assembly, which are configured in accordance with a configuration and size of

IC packages to be handled in the assembly process or test process.

A change kit mentioned above is so customized that it can retain IC packages of a certain configuration and size for retaining those IC packages in the assembly process or test process. For example, when 100-pin QFP packages are to be tested, a change kit which is exclusive to the 100-pin QFP packages is prepared to retain the QFP packages and provide them to a test handler.

Figs. 1 to 3 are a perspective view, plan view and cross sectional view respectively showing an example of change kits as explained above. Assuming that this change kit 10 is exclusive to 100-pin BGA packages 18, the change kit 10 shown in Figs. 1 to 3 comprises a substrate 12, which has a plurality of openings 14 for accommodating the BGA packages 18. Provided in the respective openings 14 is a rib 16 which supports a housing of the respective BGA packages 18 to accurately keep them in the respective openings 14 as shown in Fig. 1. For the purpose of accurately keeping them in the respective, openings 14, the openings 14 and rib 16 have to be configured in accordance with a configuration and size of the BGA packages 18. On the other hand, when IC packages to be handled in the assembly process or test process are changed from the BGA packages 18 to 40-lead PLCC packages, the change kit 10 will be replaced by another change kit peculiar to those PLCC packages because the change kit 10 is exclusive to the BGA packages 18. As explained above, replacing a change kit to another helps handle IC packages of varying configurations and sizes in the assembly process or test process, however, designing and fabricating change kits normally needs to take 6 to 8 weeks to finish. This requires that various change kits should be prepared before they become necessary to be used. On the other hand, change kits are also significantly expensive because they are made of aluminum/nickel plating or other suitable conductive material. Consequently, it may be difficult to possess various change kits from an economical standpoint, resulting in delaying replacement of change kits in response to change of IC packages to be handled. In this way, there have been inconsistent problems on change kits. Another piece of equipment mentioned above is a socket for testing IC packages. The socket is a device that retains one or more IC packages to be tested, in which a temporary, non-destructive electrical connection is formed between an IC package and a testing apparatus. The socket typically has one or more openings each configured to accommodate an IC package, and connectors or a connector sheet for coupling the test apparatus and pins of the IC package accommodated in the respective openings. This socket is also fabricated in accordance with a specific configuration and size of an IC package to be tested. When the configuration and/or size of an IC package to be tested is changed, the socket, therefore, will have to be changed to another, in a manner similar to change kits mentioned above.

DISCLOSURE OF THE INVENTION

According to the present invention, various objects and advantages which become apparent in this specification are attained by a change kit for retaining integrated circuit packages in an assembly process or test process of the packages, comprising a substrate having openings, and inserts configured to be inserted into the respective openings. The inserts are inserted into the respective openings for changing a configuration and/or size of the respective openings in accordance with a configuration and size of integrated circuit packages to be retained by the change kit so that the packages are accommodated in the respective openings. In accordance with a described embodiment of the invention, the openings are each configured to be large enough to be shared at least between integrated circuit packages intended to be retained by the change kit. Preferably, all the openings are the same in configuration and size.

Furthermore, each of the inserts is configured to accommodate an integrated circuit package of a predetermined configuration and size. The inserts to be inserted into the respective openings are thus selected or changed depending on a configuration and size of integrated circuit packages to be retained by the change kit. Preferably, the inserts each have an opening with supporting structure configured in accordance with the predetermined configuration and size of the package. In addition, each of the inserts is so configured that at least pins of the package accommodated in the opening are exposed to exterior.

In accordance with an alternative embodiment of the invention, the openings of the substrate are each configured to accommodate an integrated circuit package of a predetermined configuration and size without using any insert. On the other hand, the inserts are inserted into the respective openings when a configuration and size of integrated circuit packages to be retained by the change kit are different from the predetermined configuration and/or size. Preferably, the change kit further comprises a fastening mechanism for removably fastening the inserts to the respective openings. More particularly, the fastening mechanism comprises portions provided to the respective inserts, areas provided around the respective openings, and fasteners for fastening the portions to the respective areas when the inserts are inserted into the respective openings. In another aspect of the invention, a socket for testing integrated circuit packages comprises a socket body having one or more openings, and one or more inserts configured to be inserted into the respective openings. The inserts are inserted into the respective openings for changing a configuration and/or size of the respective openings in accordance with a configuration and size of integrated circuit packages to be tested so that the packages are accommodated in the respective openings. In accordance with a described embodiment, the openings are each configured to be large enough to be shared at least between integrated circuit packages intended to be tested. Preferably, all the openings are the same in configuration and size.

Furthermore, each of the inserts is configured to accommodate an integrated circuit package of a predetermined configuration and size. The inserts to be inserted into the respective openings are thus selected or changed depending on a configuration and size of integrated circuit packages to be tested.

In accordance with an alternative embodiment, the openings of the socket body are each configured to accommodate an integrated circuit package of a predetermined configuration and size without using any insert. On the other hand, the inserts are inserted into the respective openings when a configuration and size of integrated circuit packages to be tested are different from the predetermined configuration and/or size. In accordance with a described embodiment, the socket further comprises a fastening mechanism for removably fastening the inserts to the respective openings. Preferably, the fastening mechanism comprises portions provided to tire respective inserts, areas provided around the respective openings, and fasteners for fastening the portions to the respective areas when the inserts are inserted into the respective openings.

As mentioned above, objects, advantages and novel features of the invention will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following or may be learned by practice of the invention. The objects and advantages of the invention may be realized and attained by means of the instrumentalities and combinations particularly pointed out in the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view, partly in cross section, showing an example of change kits currently used.

Figure 2 is a plan view of the change kit shown in Fig. 1.

Figure 3 is a cross sectional view of the change kit shown in Figs. 1 and 2, which is taken on line A- A of Fig. 2. Figure 4 is a perspective view, partly in cross section, showing a change kit of an embodiment according to the invention.

Figure 5 is a plan view showing the change kit of Fig. 4.

Figure 6 is a cross sectional view of the change kit, which is taken on line B-B of Fig. 5. Figure 7A is a plan view showing an example of inserts for a BGA package. Figure 7B is a cross sectional view of the insert, which is taken on line C-C of Fig. 7A. Figure 7C is a perspective view of the insert of Figs. 7 A and 7B. Figure 7D is a perspective view showing a BGA package to be accommodated in the insert of Figs. 7A to 7C. Fig. 7E is a cross sectional view showing circumstances where the BGA package of 7D is accommodated by the insert of Figs. 7 A to 7C.

Figure 8A is a plan view showing an example of inserts for a PLCC package. Figure 8B is a cross sectional view of the insert, which is taken on line D-D of Fig. 8A. Figure 8C is a cross sectional view of the insert, which is taken on line E-E of Fig. 8A. Figure 8D is a perspective view of the insert of Figs. 8A to 8C. Figure 8E is a perspective view showing a PLCC package to be accommodated in the insert of Figs. 8A to 8D. Fig. 8F is a cross sectional view showing circumstances where the PLCC package of 8E is accommodated by the insert of Figs. 8A to 8D.

Figure 9A is a plan view showing an example of inserts for a QFP package. Figure 9B is a cross sectional view of the insert, which is taken on line F-F of Fig. 9 A. Figure 9C is a perspective view of the insert of Figs. 9 A and 9B. Figure 9D is a perspective view showing a QFP package to be accommodated in the insert of Figs. 9 A to 9C. Fig. 9E is a cross sectional view showing circumstances where the QFP package of 9D is accommodated by the insert of Figs. 9A to 9C.

Figure 10 is a perspective view, partly in cross section, showing a change kit of the alternative embodiment according to the invention.

Figure 11 is a perspective view, partly in cross section, showing the change kit with inserts of the alternative embodiment according to the invention.

Figure 12 is a plan view showing the change kit of Figs. 10 and 11.

Figure 13 is a cross sectional view of the change kit, which is taken on line G-G of Fig. 12.

Figure 14A is a plan view showing an example of inserts to be inserted into respective openings of the change kit shown in Figs. 10 to 13. Figure 14B is a cross sectional view of the insert, which is taken on line H-H ofFig. 14A. Figure 14C is a perspective view of the change kit of Figs. 14A and 14B.

Figure 15 is a perspective view showing a socket of the another embodiment according to the invention.

Figure 16 is a cross sectional view of the socket of Fig. 15, which is taken on line I-I of Fig. 15.

Figure 17A is a plan view showing an example of inserts to be inserted into the opening of the socket of Figs. 15 and 16. Figure 17B is a cross sectional view of the insert of Fig. 17A, which is taken on line J-J of Fig. 17A.

Figure 18A is a plan view showing another example of inserts to be inserted into the opening of the socket of Figs. 15 and 16. Figure 18B is a cross sectional view of the insert of 18A, which is taken on line K-K of Fig. 18 A. Figure 18C is a cross sectional view of the insert of Fig. 18 A, which is taken on line L-L of Fig. 18A.

Figure 19 is a cross sectional view showing the socket of Figs. 15 and 16, which is retaining a BGA package such as that shown in Fig. 7D.

Figure 20 is a cross sectional view showing the socket of Figs. 15 and 16, which is retaining a PLCC package such as that shown in Fig. 8E. Figure 21 is a plan view showing a FBGA package with 10 X 10 populated pins. Figure 22 is a plan view showing a socket for the FBGA package of Fig. 21.

Figure 23 is a partial sectional view showing the socket of Fig. 22.

Figure 24 is a plan view showing a FBGA package with 6 X 10 populated pins.

Figure 25 is a plan view showing the socket of Fig. 21 with an insert for the FBGA package of Fig

24.

Figure 26 is a plan view showing a FBGA package with 6 8 populated pins.

Figure 27 is a plan view showing the socket of Fig. 21 with an insert for the FBGA package of Fig.

26.

MODES FORCARRYINGOUT THEINVENTION An embodiment of the present invention will be described in detail with reference to the accompanying drawings. Fig. 4 is a perspective view, partly in cross section, showing a change kit of one embodiment according to the invention. The change kit 100 comprises a substrate or base kit 102 having openings 104, and inserts 110 configured to be inserted into the respective openings 104. Insertion of the inserts 110 into the respective openings 104 may change a configuration and/or size of the respective openings 104 in accordance with a configuration and size of IC packages 120 to be retained by the change kit 100. Changing the configuration and/or size of the respective openings 104 by the inserts 110 may enable the change kit 100 to retain any IC packages of varying configurations and sizes. In other words, the inserts 110 eliminate the need for replacement of the whole change kit 100.

Figs. 5 and 6 are a plan view and cross sectional view respectively illustrating the base kit 102. In addition to the openings 104, the base kit 102 has concave portions 106 provided around the respective openings 104. Those concave portions, which will be described below, are used for fastening the inserts 110 when they are inserted into the respective openings 104.

This base kit 102 may be made of the same material as the substrate 12 shown in Figs. 1 to 3.

The openings 104 are formed such that each of them may receive any IC packages of varying configurations and sizes together with the insert 110. In other words, each of the openings 104 has a configuration and size that are large enough to be shared at least between IC packages intended to be retained by the change kit 100. This allows the change kit 100 to retain IC packages of varying configurations and sizes by means of the inserts 110, because each of the openings 104 may accommodate any one of various IC packages with the insert 110. In addition, all the openings 104 may preferably be the same in configuration and size. This makes it easy for venders of change kits to fabricate inserts because the venders do not need to care about the external shape and size of the inserts.

It should be noted that although the base kit 102 as shown in Figs. 5 and 6 has only six openings 104, this does not intend to limit the number of the openings 104 of the base kit 102, allowing it to have more than six openings 104, if necessary. In addition, the configuration of the openings 104 shown in Figs. 5 and 6 are a few examples, so that the openings 104 may be designed arbitrarily, provided that each of the openings 104 is configured to be shared at least between IC packages intended to be retained by the change kit 100.

As an alternative embodiment, the base kit 102 may be prepared as any package family, such as SOP, PLCC, BGA or CSP. In this case, each base kit 102 has openings 104 configured in accordance with a common shape of a package family. For example, the base kit 102 has square-shaped openings 104 for the BGA package 120 shown in Fig. 7D, while the base kit 102 has quadralateral-shaped openings 104 for the PLCC package 140 shown in Fig. 8E. Of course, the shape of the openings 104 of the base kit 102 may not need to correspond to the shape of IC packages to be retained in the change kit 100. The following is an explanation of the inserts 110 to be inserted into the respective openings 104. As described above, each opening 104 is configured to be shared between IC packages of varying configurations and sizes, while each of the inserts 110 is configured to accommodate only one of the IC packages that share the opening 104. That is, the inserts 110 are exclusive to an IC package of a particular configuration and size, resembling to the change kit 10 shown in Figs. 1 to 3. Those inserts 110 may be made of any appropriate static dissipative material, such as Torlon, Geotek

II, etc.

Figs. 7A to 7C illustrate one example of inserts for a BGA package shown in Fig. 7D. The insert shown in Figs. 7A to 7C is the same insert as those shown in Fig. 4. The BGA package shown in Fig. 7D is also the same package as those shown in Fig. 4. The insert 110 includes an opening 112 for accommodating the BGA package 120, and a rib 114, provided in the opening 112, for supporting the BGA package 120 to properly accommodate it in the opening 112. The opening 112 and rib 114 are so configured to fit the configuration and size of the BGA package 120, as shown in Fig. 7E. Fig. 7E illustrates circumstances where the BGA package 120 is accommodated by the insert 110. As shown in Fig. 7E, the BGA package 120 fits the opening 114, in which the edge of the BGA package 120 are properly supported by the rib 114.

The insert 110 also has fastened portions 116 which are used to be fastened to the respective concave portions 106 provided around the respective openings 104 of the base kit 102. An explanation as to the fastened portions 116 will be made below.

It should be noted that the shape of the opening 112 and rib 114 is not limited to that shown in Fig. 7. Therefore, any shape may be adapted to the opening 112 and rib 114, provided that the BGA package 120 is properly accommodated. Further, the insert 110 is preferably so configured that at least pins (solder balls) of the BGA package 120 (or any other IC packages to be retained by the change kit 100) are exposed to exterior when the BGA package 120 is completely accommodated in the opening 112. Fig. 7E shows that the bottom part of the BGA package 120, to which the pins are attached, is exposed through the opening 112 to exterior. Such structure makes it possible to couple those pins and test proves of an IC test apparatus (not shown), even though the BGA package 120 is retained by the change kit 100 through the insert 110. If the insert 110 is so configured that the bottom part of the BGA package 120 is covered, holes in registration with an arrangement of the pins may be formed to the insert 110 so that the pins are made available for testing through the insert 110, if necessary. Figs. 8A to 8D illustrate another example of inserts for a PLCC package as shown in Fig. 8E. The insert 130 includes an opening 132 for accommodating the PLCC package 140, and a pedestal 134, provided in the opening 132 for supporting the PLCC package 140 to properly accommodate it in the opening 132. The opening 132 and pedestal 134 are configured to fit the configuration and size of the PLCC package 140, as shown in Fig. 8F. As shown in Fig. 8F, the PLCC package 140 fits the opening 132, in which the bottom of the PLCC package 140 are properly supported by the pedestal 134. The shape of the opening 132 and pedestal 134 are not limited to that shown in Fig. 8, so that any shape may be adapted to the opening 132 and pedestal 134, providing that the PLCC package 140 is properly accommodated there. Similar to the insert 110 for the BGA package 120, the insert 130 is preferably so configured that at least pins (leads) of the PLCC package 140 are exposed to exterior through the opening 132 for the testing, when the PLCC package 140 is completely accommodated in the opening 132 and placed on the pedestal 134.

Figs. 9A to 9C show another example of inserts for a QFP package as shown in Fig. 9D. The insert 150 includes an opening 152 for accommodating the QFP package 160, and a pedestal 154, provided in the opening 152 for supporting the QFP package 160 to properly accommodate it in the opening 152. The opening 152 and pedestal 154 are so configured to fit the configuration and size of the QFP package 160, as shown in Fig. 9E. Especially, the pedestal 154 are provided to the opening 152 in such a way that the pedestal 154 supports only the housing of the QFP package 160 without making contact with the leads of the QFP package 160. As a result of the pedestal 154 which has a structure peculiar to the QFP package 160, the QFP package 160 fits the opening 152, in which the bottom of the QFP package 160 are properly supported by the pedestal 154, as shown in Fig. 9E.

It should be noted that the shape of the opening 152 and pedestal 154 are not limited to that shown in Fig. 9. Any shape may, therefore, be adapted to the opening 152 and pedestal 154, provided that the QFP package 160 is properly accommodated there. Similar to the insert 110 for the BGA package 120, the insert 150 is preferably so configured that at least pins (leads) of the QFP package 160 are exposed to the exterior for testing when the QFP package 160 is completely accommodated in the opening 152 and placed on the pedestal 154.

Referring to Fig. 4 again, assume that the change kit 100 needs to be prepared for retaining BGA packages 120 because BGA packages 120 are to be tested. Since IC packages to be tested are BGA packages 120, the inserts 110 are selected as inserts to be inserted into the respective openings 104 of the base kit 102. In this example, the inserts 110 are inserted into the respective openings 104, and then the fastened portions 116 of each insert 110 are fastened to the respective concave portions 106 by means of screws 118. Although the screws 118 are used to fix the inserts 110 to the base kit 102 in this example, any fasteners such as a bolts and nuts, pins, and others may be used. Instead of using such fasteners, the inserts may be configured to be snapped into the respective openings 104, for instance. Then, the change kit 100, in which the inserts 110 are inserted into the respective openings 104, may be used to retain the BGA packages 120 for handling them in the test process.

Assume that the PLCC packages 140 are to be tested, following the testing of the BGA packages 120. After the testing of the BGA packages 120 are completed, the inserts 110 for the BGA packages 120 in the respective openings 104 will be replaced with the inserts 130 for the PLCC packages 140. This enables the change kit 100 to retain the PLCC packages 140 to be tested.

If the QFP packages 160 are necessary to be tested, the inserts 150 shown in Fig. 9 will be inserted into the respective openings 104 of the base kit 102 instead of the inserts previously inserted there, in the same manner as already explained above. As described above, just changing inserts to others makes it possible for the change kit 100 to retain IC packages of desired configuration and size, and to eliminate the need for replacement of the whole change kit.

In this embodiment, it also may be possible to use a combination of different inserts, such as the inserts 110, 130 and 160, for retaining different IC packages at the same time in the single change kit 100, if required.

Figs. 10 and 11 are perspective views, partly in cross section, illustrating a change kit of an alternative embodiment according to the invention. In the drawings, the same elements as those already explained above are given a common reference numeral to omit their explanations for the purpose of brevity. As shown in Fig. 10, the change kit 200 is different from the change kit 100 in that the change kit 200 comprises a base kit 202 which is configured to retain IC packages 208 of a predetermined configuration and size without using any inserts. In contrast, when a configuration and size of IC packages to be retained in the change kit 200 are different from the predetermined configuration and size, inserts will need to be inserted into respective openings 204 to retain such IC packages, as shown in Fig. 11. Figs. 12 and 13 are a plan view and cross sectional view respectively showing the base kit 202 of this embodiment. As a precondition for this base kit 202, the openings 204 provided to the base kit 202 are each configured to accommodate a BGA package similar to that shown in Fig. 7D. Therefore, the IC packages 208 shown in Fig. 10 are BGA packages. The respective openings 204 have a rib 206, the same as the rib 114 of the insert 110, for properly supporting the BGA package 208 in the respective openings 204. Of course, the structure of the openings 204 of the base kit 202 are not limited to that shown in Figs.

10 to 13. For example, providing the base kit 202 with openings resembling to that of the insert 130 shown in Figs. 8 A to 8D enables the base kit 202 to retain PLCC packages 140 of Fig. 8E without any inserts.

Figs. 14A to 14C show one example of inserts to be inserted into the respective openings 204 when a configuration and size of packages to be retained in the change kit 200 is different from the BGA package 208. The insert shown in Figs. 14A to 14C is the same insert as those of shown in Fig. 11, which is exclusive to the BGA package 120 of Fig. 7D. This insert 210 has almost the same structure as the insert 110 of Fig. 7, except that the insert 210 has, as its external shape, a taper portion 212 and groove 214, giving the inserts 210 a complete match to the respective openings 204 of the base kit 102, which have the rib 206 for supporting the BGA package 208. By adding the taper portion 212 and groove 214 to any inserts in this manner, such inserts become available in the change kit 200.

It should be noted that it might be possible for inserts to be inserted into the respective openings 204 without the taper portion 212 and groove 214, if the size of the inserts are small enough to fit into the respective openings 204.

Figs. 15 to 21 show another embodiment of the present invention, which relates to sockets for testing IC packages. This embodiment adapts a concept of the above described insert to sockets, in which an insert is inserted into an opening of sockets in order to retain any one of IC packages of varying configurations and sizes.

As shown in Figs. 15 and 16, the socket 250 includes an opening 252, into which an IC package to be tested is placed. The socket 250 of this embodiment has just one opening 252, but this example does not intend to limit the number of openings provided in the socket 250. Therefore, the socket 250 may include more than one opening.

The opening 252 in this embodiment is configured to accommodate an IC package of a predetermined configuration and size without any inserts, similar to the change kit 200 shown in Figs. 10 and 11. However, inserts may be necessarily inserted into the opening 254 when a configuration and/or size of IC packages to be tested is different from the predetermined configuration and size. Of course, like the change kit

100 shown in Figs. 4 to 9, use of inserts may be mandatory to retain an IC package in the socket 250.

The socket 250 also includes concave portions 254 provided around the opening 252, to which an insert (not shown) is fastened when the insert is inserted into the opening 252. This will be explained below with reference to the Figs. 19 and 20.

The socket 250 is generally used to establish an electrical connection between an IC package to be tested and a test apparatus (not shown). To establish such connection, any of various contacts which couples pins (leads or balls) of IC packages to be tested and the test apparatus is used in sockets. In this embodiment, the socket 250 includes an elastomer contact 256, which comprises an electrically insulating elastomer sheet and a plurality of fine wires embedded uniformly in the sheet. The fine wires electrically couple pins of an IC package and a test apparatus. Since an elastomer contact 256 has been well known, the detailed explanation is omitted for brevity.

If more than one opening is provided in the socket 250, all the openings are preferably configured to have the same configuration and size, allowing inserts to have the same external shape and also making it easy for inserts to be fabricated. In addition, the opening 252 is preferably large enough to be shared between IC packages of varying configurations and sizes, which are, at least, intended to be tested. The socket 250 is generally made of an electrically insulating material.

Figs. 17A to 17B illustrate one example of inserts to be inserted into the opening 252 of the socket 250. The insert 260 shown in Figs. 17A and 17B are configured to accommodate a BGA package such as that shown in Fig. 7D. The insert 260 includes an opening 262 for accommodating only the BGA package 120 to place it on the elastomer contact 256. The insert 260 also has fastening portions 264 that are fastened to the respective concave portions 254 of the socket 250 by means of fasteners such as bolts and nuts, screws and pins.

Figs. 18A to 18C show another example of inserts. The insert 270 shown in Figs. 18A to 18C is configured to accommodate a PLCC package such as that shown in Fig. 8E. The insert 270 includes an opening 272 for accommodating only the PLCC package 140 of a predetermined configuration and size to place it on the elastomer contact 256.

Fig. 19 shows circumstances where the insert 260 is inserted into the opening 252 and a BGA package 120 to be tested is accommodated in the opening 262 of the insert 260. As shown in Fig. 19, the fastening portions 264 of the insert 260 are fastened to the respective concave portions 254 provided around the opening 252 of the socket 250 by screws 266.

If a configuration and/or size of IC packages to be tested is changed from those of the BGA packages 120 to others, the insert 260 will be replaced by another insert. For example, if IC packages to be tested are changed from the BGA packages 120 to the PLCC packages 140, the insert 260 will be replaced by the insert 270 for the PLCC packages 140. Fig. 20 shows circumstances where the insert 270 is inserted into the opening 252, and then the PLCC package 140 to be tested is accommodated in the opening 272 of the insert 270.

As apparent from the Figs. 19 and 20, an insert is prepared and inserted into the opening 252 of the socket 250 in conformity with a configuration and size of an IC package to be tested so as to accommodate a desired IC package in the socket 250. This allows the socket 250 to retain IC packages of varying configurations and/or sizes, which are, at least, intended to be tested.

Figs. 21 to 27 illustrate an alternative embodiment of a socket for testing IC packages. The socket, shown in Figs. 22 and 23, is for a FBGA (Fine-pitch Ball Grid Array) package 300 with 10 X 10 populated pins, shown in Fig. 21. Like the socket 250 of Figs. 15 to 20, the socket 310 includes an opening 312, into which the FBGA package 300 to be tested are placed. The socket 310 is also provided with a plurality of holes 314, each of which includes a contactor to couple each solder ball 302 of the FBGA package 300 and a test apparatus (not shown). In this example, there are a hundred contactors 316 provided in the socket 310, which are disposed in registration with the solder balls 302 of the FBGA package 300 that has a hundred solder balls 302. As shown in Fig. 23, placing the FBGA package 300 in the opening 312 causes its solder balls 302 to contact the respective contactors 316, establishing an electrical connection between the FBGA package 300 and a test apparatus.

Fig. 24 is a plan view showing a FBGA package with 6 X 10 populated pins. This FBGA package 320 is different from the FBGA package 300 in the number of pins (solder balls), but assume that the FBGA package 320 is the same as the FBGA package 300 in pitch of the pins. Since the pitch of the pins of the FBGA package 320 are the same as that of the FBGA package 300, pins of the FBGA package 320 fit to the contactors 316 of the socket 310. As shown in Fig. 25, when an insert 330 for FBGA package 320, therefore, is inserted into the opening 312 of the socket 310, the socket 310 becomes available for the testing of the FBGA package 320. In this case, the contactors 316 (holes 314) shown within a dotted line in Fig. 25 are to be used for the testing of the FBGA package 320. Other contactors not to be used for the testing may be covered, if necessary.

Fig. 26 is a plan view showing a FBGA package with 6 X 8 populated pins. This FBGA package 340 is different from the FBGA package 300 in the number of pins (solder balls), but assume that the FBGA package 340 is the same as the FBGA package 300 in pitch of the pins. As shown in Fig. 27, when an insert 350 for the FBGA package 340 is inserted into the opening 312 of the socket 310, the socket 310 can be used as a socket for the FBGA package with 6 X 8 populated pins, similar to the case of the FBGA package 320 shown in Figs. 24 and 25. The contactors 316 (holes 314) of the socket 310 to be used for the testing are shown in a dotted line in Fig. 27.

According to the present invention, even though a configuration and/or size of an IC package to be retained in a change kit or socket is changed, a whole change kit or socket is not necessary to be changed to another.

For change kits, since only inserts are customized to IC packages to be retained by change kits, the time necessary for designing and fabricating inserts may become shorter than that for the whole change kit, reducing from 6-8 weeks to 2-3 weeks, for example. In addition, replacement of inserts may reduce the necessary cost of designing and fabricating change kits by about 60%, for example. In this disclosure, there is shown and described only the embodiment of the invention, but, as aforementioned, it is to be understood that the invention is capable of use in various other combinations and environments and is capable of changes or modifications within the scope of the inventive concept as expressed herein.

Claims

WHAT IS CLAIMED IS:

1. A change kit (100) for retaining integrated circuit packages in an assembly process or test process of the packages, comprising: a substrate (102) having openings (104); and inserts (110) configured to be inserted into the respective openings (104) for changing a configuration and/or size of the respective openings (104) in accordance with a configuration and size of integrated circuit packages (120) to be retained by the change kit (100) so that the packages (120) are accommodated in the respective openings (104).

2. A change kit (100) according to claim 1, wherein the openings (104) are each configured to be large enough to be shared at least between integrated circuit packages (120) intended to be retained by the change kit (100).

3. A change kit (100) according to claim 1, wherein each of the inserts (110) is configured to accommodate an integrated circuit package (120) of a predetermined configuration and size, and wherein the inserts (110) to be inserted into the respective openings (104) are selected or changed depending on a configuration and size of integrated circuit packages (120) to be retained by the change kit (100).

4. A change kit (100) according to claim 4, wherein the inserts (110) each have an opening (104) with supporting structure configured in accordance with the predetermined configuration and size of the package (120).

5. A change kit (100) according to claim 5, wherein each of the inserts (104) is so configured that at least pins of the package (120) accommodated in the opening are exposed to exterior.

6. A change kit (200) according to claim 1, wherein the openings (204) of the substrate (202) are each configured to accommodate an integrated circuit package (120) of a predetermined configuration and size without using any insert (110), and wherein the inserts are (110) inserted into the respective openings (104) when a configuration and size of integrated circuit packages (120) to be retained by the change kit (100) are different from the predetermined configuration and/or size.

7. A change kit (100) according to claim 1, further comprising a fastening mechanism for removably fastening the inserts (110) to the respective openings (104).

8. A change kit according to claim 9, wherein the fastening mechanism comprises: portions (116) provided to the respective inserts (110); areas (106) provided around the respective openings (104); and fasteners for fastening the portions to the respective areas when the inserts (110) are inserted into the respective openings (104).

9. A socket (250) for testing integrated circuit packages (120), comprising: a socket body (250) having one or more openings (252); and one or more inserts (260) configured to be inserted into the respective openings (252) for changing a configuration and/or size of the respective openings (252) in accordance with a configuration and size of integrated circuit packages (120) to be tested so that the packages are accommodated in the respective openings (252).

10. A socket (250) according to claim 11, wherein all the openings (252) are the same in configuration and size.

11. A socket (250) according to claim 10, wherein each of the inserts (260) is configured to accommodate an integrated circuit package (120) of a predetermined configuration and size, and wherein the inserts (260) to be inserted into the respective openings (252) are selected or changed depending on a configuration and size of integrated circuit packages (120) to be tested.

12. A socket (250) according to claim 10, wherein the openings (252) of the socket body (250) are each configured to accommodate an integrated circuit package (120) of a predetermined configuration and size without using any insert, and wherein the inserts (260) are inserted into the respective openings (252) when a configuration and size of integrated circuit packages (120) to be tested are different from the predetermined configuration and/or size.

13. A socket (250) according to claim 10, further comprising a fastening mechanism (264) for removably fastening the inserts (260) to the respective openings (252).

14. A socket according to claim 15, wherein the fastening mechanism comprises: portions (264) provided to the respective inserts (260); areas (254) provided around the respective openings (252); and fasteners (266) for fastening the portions (264) to the respective areas (254) when the inserts (260) are inserted into the respective openings (252).