WO2002003405A1 - Ceramic multilayer capacitor array - Google Patents
Ceramic multilayer capacitor array Download PDFInfo
- Publication number
- WO2002003405A1 WO2002003405A1 PCT/NL2001/000510 NL0100510W WO0203405A1 WO 2002003405 A1 WO2002003405 A1 WO 2002003405A1 NL 0100510 W NL0100510 W NL 0100510W WO 0203405 A1 WO0203405 A1 WO 0203405A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrodes
- capacitor array
- pattern
- package
- plates
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
- H01G4/385—Single unit multiple capacitors, e.g. dual capacitor in one coil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT01950108T ATE307382T1 (en) | 2000-07-06 | 2001-07-05 | CERAMIC MULTI-LAYER CAPACITOR NETWORK |
US10/312,949 US6934145B2 (en) | 2000-07-06 | 2001-07-05 | Ceramic multilayer capacitor array |
AU2001271139A AU2001271139A1 (en) | 2000-07-06 | 2001-07-05 | Ceramic multilayer capacitor array |
JP2002507392A JP2004502315A (en) | 2000-07-06 | 2001-07-05 | Ceramic multilayer capacitor array |
EP01950108A EP1297543B1 (en) | 2000-07-06 | 2001-07-05 | Ceramic multilayer capacitor array |
DE60114200T DE60114200T2 (en) | 2000-07-06 | 2001-07-05 | CERAMIC MULTILAYER CONDENSER NETWORK |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00202406 | 2000-07-06 | ||
EP00202406.5 | 2000-07-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002003405A1 true WO2002003405A1 (en) | 2002-01-10 |
Family
ID=8171763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/NL2001/000510 WO2002003405A1 (en) | 2000-07-06 | 2001-07-05 | Ceramic multilayer capacitor array |
Country Status (7)
Country | Link |
---|---|
US (1) | US6934145B2 (en) |
EP (1) | EP1297543B1 (en) |
JP (1) | JP2004502315A (en) |
AT (1) | ATE307382T1 (en) |
AU (1) | AU2001271139A1 (en) |
DE (1) | DE60114200T2 (en) |
WO (1) | WO2002003405A1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1579507A1 (en) * | 2002-12-31 | 2005-09-28 | Intel Corporation | Multilayer capacitor with multiple plates per layer |
GB2389708B (en) * | 2002-04-15 | 2006-04-12 | Avx Corp | Component formation via plating technology |
US7152291B2 (en) | 2002-04-15 | 2006-12-26 | Avx Corporation | Method for forming plated terminations |
US7177137B2 (en) | 2002-04-15 | 2007-02-13 | Avx Corporation | Plated terminations |
US7463474B2 (en) | 2002-04-15 | 2008-12-09 | Avx Corporation | System and method of plating ball grid array and isolation features for electronic components |
Families Citing this family (36)
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---|---|---|---|---|
US6829134B2 (en) * | 2002-07-09 | 2004-12-07 | Murata Manufacturing Co., Ltd. | Laminated ceramic electronic component and method for manufacturing the same |
JP4415744B2 (en) * | 2003-12-11 | 2010-02-17 | パナソニック株式会社 | Electronic components |
US7633752B2 (en) * | 2004-03-29 | 2009-12-15 | Intel Corporation | Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel |
KR100663941B1 (en) * | 2005-03-30 | 2007-01-02 | 삼성전기주식회사 | Array type Multi-layer Ceramic Capacitor and Production Method Thereof |
KR100616687B1 (en) * | 2005-06-17 | 2006-08-28 | 삼성전기주식회사 | Multilayer chip capacitor |
JP4276649B2 (en) * | 2005-09-27 | 2009-06-10 | Tdk株式会社 | Feedthrough multilayer capacitor array and mounting structure of feedthrough multilayer capacitor array |
US7145429B1 (en) * | 2006-01-26 | 2006-12-05 | Tdk Corporation | Multilayer capacitor |
JP2007317786A (en) * | 2006-05-24 | 2007-12-06 | Tdk Corp | Multilayer capacitor |
JP4293560B2 (en) * | 2006-07-12 | 2009-07-08 | Tdk株式会社 | Multilayer capacitor array |
US7667949B2 (en) * | 2006-08-05 | 2010-02-23 | John Maxwell | Capacitor having improved surface breakdown voltage performance and method for marking same |
JP4283834B2 (en) * | 2006-09-06 | 2009-06-24 | Tdk株式会社 | Multilayer capacitor |
JP4896642B2 (en) * | 2006-09-12 | 2012-03-14 | Tdk株式会社 | Multilayer capacitors and electronic devices |
JP4378371B2 (en) * | 2006-09-29 | 2009-12-02 | Tdk株式会社 | Multilayer capacitor |
JP4400612B2 (en) * | 2006-10-31 | 2010-01-20 | Tdk株式会社 | Multilayer capacitor and method for manufacturing multilayer capacitor |
JP4626605B2 (en) * | 2006-11-07 | 2011-02-09 | 株式会社村田製作所 | Multilayer capacitor |
US7388738B1 (en) * | 2007-03-28 | 2008-06-17 | Tdk Corporation | Multilayer capacitor |
JP4650475B2 (en) * | 2007-10-18 | 2011-03-16 | 株式会社村田製作所 | Multilayer ceramic capacitor array |
JP4645637B2 (en) * | 2007-11-15 | 2011-03-09 | Tdk株式会社 | Multilayer capacitor |
JP4513855B2 (en) * | 2007-11-26 | 2010-07-28 | Tdk株式会社 | Multilayer capacitor |
JP4502006B2 (en) * | 2007-12-28 | 2010-07-14 | Tdk株式会社 | Feedthrough multilayer capacitor array |
JP4548492B2 (en) * | 2008-02-13 | 2010-09-22 | Tdk株式会社 | Multilayer capacitor array |
JP5217692B2 (en) * | 2008-07-02 | 2013-06-19 | 株式会社村田製作所 | Multilayer ceramic electronic components |
US9441295B2 (en) * | 2010-05-14 | 2016-09-13 | Solarcity Corporation | Multi-channel gas-delivery system |
KR101141369B1 (en) * | 2010-12-13 | 2012-05-03 | 삼성전기주식회사 | A multi-layerd ceramic condenser and fabricating method using thereof |
USD680119S1 (en) * | 2011-11-15 | 2013-04-16 | Connectblue Ab | Module |
USD668658S1 (en) * | 2011-11-15 | 2012-10-09 | Connectblue Ab | Module |
USD692896S1 (en) * | 2011-11-15 | 2013-11-05 | Connectblue Ab | Module |
USD680545S1 (en) * | 2011-11-15 | 2013-04-23 | Connectblue Ab | Module |
USD689053S1 (en) * | 2011-11-15 | 2013-09-03 | Connectblue Ab | Module |
USD668659S1 (en) * | 2011-11-15 | 2012-10-09 | Connectblue Ab | Module |
US20160359080A1 (en) | 2015-06-07 | 2016-12-08 | Solarcity Corporation | System, method and apparatus for chemical vapor deposition |
US9748434B1 (en) | 2016-05-24 | 2017-08-29 | Tesla, Inc. | Systems, method and apparatus for curing conductive paste |
US9954136B2 (en) | 2016-08-03 | 2018-04-24 | Tesla, Inc. | Cassette optimized for an inline annealing system |
US10115856B2 (en) | 2016-10-31 | 2018-10-30 | Tesla, Inc. | System and method for curing conductive paste using induction heating |
JP2018093164A (en) * | 2016-12-02 | 2018-06-14 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Multilayer ceramic electronic component and board having the same |
US11626249B2 (en) * | 2019-12-03 | 2023-04-11 | Taiyo Yuden Co., Ltd. | Ceramic electronic device and manufacturing method of the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2545596A1 (en) * | 1975-10-11 | 1977-04-14 | Draloric Electronic | Capacitive network with dielectric layer - has staggered electrodes on stacked dielectric layers forming layered capacitor |
US4313157A (en) * | 1978-09-26 | 1982-01-26 | Draloric Electronic Gmbh | Capacitive network |
US5880925A (en) * | 1997-06-27 | 1999-03-09 | Avx Corporation | Surface mount multilayer capacitor |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5583738A (en) * | 1993-03-29 | 1996-12-10 | Murata Manufacturing Co., Ltd. | Capacitor array |
-
2001
- 2001-07-05 US US10/312,949 patent/US6934145B2/en not_active Expired - Fee Related
- 2001-07-05 JP JP2002507392A patent/JP2004502315A/en active Pending
- 2001-07-05 WO PCT/NL2001/000510 patent/WO2002003405A1/en active IP Right Grant
- 2001-07-05 EP EP01950108A patent/EP1297543B1/en not_active Expired - Lifetime
- 2001-07-05 AU AU2001271139A patent/AU2001271139A1/en not_active Abandoned
- 2001-07-05 DE DE60114200T patent/DE60114200T2/en not_active Expired - Lifetime
- 2001-07-05 AT AT01950108T patent/ATE307382T1/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2545596A1 (en) * | 1975-10-11 | 1977-04-14 | Draloric Electronic | Capacitive network with dielectric layer - has staggered electrodes on stacked dielectric layers forming layered capacitor |
US4313157A (en) * | 1978-09-26 | 1982-01-26 | Draloric Electronic Gmbh | Capacitive network |
US5880925A (en) * | 1997-06-27 | 1999-03-09 | Avx Corporation | Surface mount multilayer capacitor |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7177137B2 (en) | 2002-04-15 | 2007-02-13 | Avx Corporation | Plated terminations |
GB2389708B (en) * | 2002-04-15 | 2006-04-12 | Avx Corp | Component formation via plating technology |
US7067172B2 (en) | 2002-04-15 | 2006-06-27 | Avx Corporation | Component formation via plating technology |
US7152291B2 (en) | 2002-04-15 | 2006-12-26 | Avx Corporation | Method for forming plated terminations |
US7154374B2 (en) | 2002-04-15 | 2006-12-26 | Avx Corporation | Plated terminations |
US7161794B2 (en) | 2002-04-15 | 2007-01-09 | Avx Corporation | Component formation via plating technology |
US7344981B2 (en) | 2002-04-15 | 2008-03-18 | Avx Corporation | Plated terminations |
US7463474B2 (en) | 2002-04-15 | 2008-12-09 | Avx Corporation | System and method of plating ball grid array and isolation features for electronic components |
US9666366B2 (en) | 2002-04-15 | 2017-05-30 | Avx Corporation | Method of making multi-layer electronic components with plated terminations |
US10020116B2 (en) | 2002-04-15 | 2018-07-10 | Avx Corporation | Plated terminations |
US10366835B2 (en) | 2002-04-15 | 2019-07-30 | Avx Corporation | Plated terminations |
US11195659B2 (en) | 2002-04-15 | 2021-12-07 | Avx Corporation | Plated terminations |
EP1579507A1 (en) * | 2002-12-31 | 2005-09-28 | Intel Corporation | Multilayer capacitor with multiple plates per layer |
Also Published As
Publication number | Publication date |
---|---|
DE60114200T2 (en) | 2006-07-13 |
AU2001271139A1 (en) | 2002-01-14 |
EP1297543A1 (en) | 2003-04-02 |
DE60114200D1 (en) | 2006-03-02 |
US20040027735A1 (en) | 2004-02-12 |
ATE307382T1 (en) | 2005-11-15 |
US6934145B2 (en) | 2005-08-23 |
JP2004502315A (en) | 2004-01-22 |
EP1297543B1 (en) | 2005-10-19 |
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