WO2001091186A3 - Semiconductor multilayer system and a method for producing a semiconductor multilayer system with increased resistance to thermal processing - Google Patents
Semiconductor multilayer system and a method for producing a semiconductor multilayer system with increased resistance to thermal processing Download PDFInfo
- Publication number
- WO2001091186A3 WO2001091186A3 PCT/EP2001/005662 EP0105662W WO0191186A3 WO 2001091186 A3 WO2001091186 A3 WO 2001091186A3 EP 0105662 W EP0105662 W EP 0105662W WO 0191186 A3 WO0191186 A3 WO 0191186A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- multilayer system
- semiconductor multilayer
- boundary surface
- doping
- producing
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 239000002800 charge carrier Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/15—Structures with periodic or quasi periodic potential variation, e.g. multiple quantum wells, superlattices
- H01L29/151—Compositional structures
- H01L29/152—Compositional structures with quantum effects only in vertical direction, i.e. layered structures with quantum effects solely resulting from vertical potential variation
- H01L29/155—Comprising only semiconductor materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
Abstract
The invention relates to a semiconductor multilayer system (40) comprising an active region consisting of at least two layers of different semiconductors, which have a band-offset on one boundary surface. Doping materials are present, or are to be introduced predominantly on one doping side (46) of the boundary surface (48) and on the opposing side of the boundary surface, a potential well (50) with quantized energy levels for charge carriers, is provided or is formed. Said multilayer system is characterized in that either at least one hetero-junction is provided on the doping side (46), in a region lying between the doping materials and the boundary surface (48), or several hetero-junctions are present on the doping side. The invention also relates to a corresponding production method.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10025833A DE10025833A1 (en) | 2000-05-25 | 2000-05-25 | Semiconductor layer system and method for producing a semiconductor layer system with increased resistance to thermal processing |
DE10025833.6 | 2000-05-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001091186A2 WO2001091186A2 (en) | 2001-11-29 |
WO2001091186A3 true WO2001091186A3 (en) | 2002-05-23 |
Family
ID=7643478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2001/005662 WO2001091186A2 (en) | 2000-05-25 | 2001-05-17 | Semiconductor multilayer system and a method for producing a semiconductor multilayer system with increased resistance to thermal processing |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE10025833A1 (en) |
WO (1) | WO2001091186A2 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4695857A (en) * | 1983-06-24 | 1987-09-22 | Nec Corporation | Superlattice semiconductor having high carrier density |
US4914488A (en) * | 1987-06-11 | 1990-04-03 | Hitachi, Ltd. | Compound semiconductor structure and process for making same |
EP0841704A1 (en) * | 1996-11-07 | 1998-05-13 | Paul-Drude-Institut für Festkörperelektronik | Semiconductor transistor device and method of manufacturing the same |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5767539A (en) * | 1996-04-05 | 1998-06-16 | Nec Corporation | Heterojunction field effect transistor having a InAlAs Schottky barrier layer formed upon an n-InP donor layer |
US5798540A (en) * | 1997-04-29 | 1998-08-25 | The United States Of America As Represented By The Secretary Of The Navy | Electronic devices with InAlAsSb/AlSb barrier |
US5844261A (en) * | 1997-06-03 | 1998-12-01 | Lucent Technologies Inc. | InAlGaP devices |
US5811844A (en) * | 1997-07-03 | 1998-09-22 | Lucent Technologies Inc. | Low noise, high power pseudomorphic HEMT |
US6350993B1 (en) * | 1999-03-12 | 2002-02-26 | International Business Machines Corporation | High speed composite p-channel Si/SiGe heterostructure for field effect devices |
-
2000
- 2000-05-25 DE DE10025833A patent/DE10025833A1/en not_active Withdrawn
-
2001
- 2001-05-17 WO PCT/EP2001/005662 patent/WO2001091186A2/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4695857A (en) * | 1983-06-24 | 1987-09-22 | Nec Corporation | Superlattice semiconductor having high carrier density |
US4914488A (en) * | 1987-06-11 | 1990-04-03 | Hitachi, Ltd. | Compound semiconductor structure and process for making same |
EP0841704A1 (en) * | 1996-11-07 | 1998-05-13 | Paul-Drude-Institut für Festkörperelektronik | Semiconductor transistor device and method of manufacturing the same |
Non-Patent Citations (2)
Title |
---|
BROCKERHOFF W ET AL: "D.C.- AND R.F.-CHARACTERISATION OF CONVENTIONAL AND SUPERLATTICE HETEROSTRUCTURE FIELD-EFFECT TRANSISTORS AT LOW TEMPERATURES", SOLID STATE ELECTRONICS, ELSEVIER SCIENCE PUBLISHERS, BARKING, GB, vol. 33, no. 11, 1 November 1990 (1990-11-01), pages 1393 - 1400, XP000161632, ISSN: 0038-1101 * |
ESHLAGHI S ET AL: "GA+ ION BEAM INDUCED COMPOSITIONAL INTERMIXING IN MBE GROWN A1XGA1-XAS/GAAS QUANTUM WELLS: OPTIMIZATION OF THE STRUCTURAL PARAMETERS FOR LOW DOSE APPLICATIONS", COMPOUND SEMICONDUCTORS 1999. PROCEEDINGS OF THE 26TH INTERNATIONAL SYMPOSIUM ON COMPOUND SEMICONDUCTORS. BERLIN, AUG. 22 - 26, 1999, INSTITUTE OF PHYSICS CONFERENCE SERIES, LONDON: IOP, GB, vol. NR. 166, 22 August 1999 (1999-08-22), pages 111 - 114, XP000921502, ISBN: 0-7503-0704-8 * |
Also Published As
Publication number | Publication date |
---|---|
DE10025833A1 (en) | 2001-11-29 |
WO2001091186A2 (en) | 2001-11-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0772247A4 (en) | Semiconductor light-emitting device and production method thereof | |
WO2004059808A3 (en) | Methods of forming semiconductor devices including mesa structures and multiple passivation layers and related devices | |
WO2002017387A3 (en) | Conductive material patterning methods | |
EP1187203A3 (en) | A semiconductor device and method of manufacturing the same | |
WO2001082336A3 (en) | Laminate comprising barrier layers on a substrate | |
EP1109226A3 (en) | Semiconductor device and its manufacturing method capable of reducing low frequency noise | |
EP0854516A3 (en) | Partially pinned photodiode for solid state image sensors | |
EP1115153A3 (en) | Semiconductor substrate and process for its production | |
WO2006076143A3 (en) | Semiconductor die package including universal footprint and method for manufacturing the same | |
EP1286439A3 (en) | Semiconductor optical device and method of manufacturing the same | |
EP0926709A3 (en) | Method of manufacturing an SOI structure | |
WO2002089178A3 (en) | Embedded metal nanocrystals | |
EP1184913A4 (en) | Nitride semiconductor device and its manufacturino method | |
WO2007081546A3 (en) | Clipless and wireless semiconductor die package and method for making the same | |
EP1109219A3 (en) | Semiconductor device having a wiring layer | |
EP1143526A3 (en) | Field effect transistor and method of manufacturing the same | |
WO2002071560A3 (en) | Separating of optical integrated modules and structures formed thereby | |
EP1148543A3 (en) | Semiconductor device and process of manufacturing the same | |
EP1160851A3 (en) | Method for fabricating a multilayer semiconductor device | |
WO2005065089A3 (en) | Method of manufacturing a semiconductor component, and semiconductor component formed thereby | |
GB2379802A (en) | A method for forming a product sensor and a product sensor | |
EP0627771A4 (en) | Distorted superlattice semiconductor photodetecting element with side-contact structure. | |
WO1999048143A3 (en) | Method of manufacturing semiconductor devices with 'chip size package' | |
WO2006114746A3 (en) | Bipolar transistor and method of fabricating the same | |
WO2004041712A3 (en) | Method of making a nanoscale electronic device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): JP KR US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
AK | Designated states |
Kind code of ref document: A3 Designated state(s): JP KR US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR |
|
122 | Ep: pct application non-entry in european phase | ||
NENP | Non-entry into the national phase |
Ref country code: JP |