WO2001080370A1 - Semiconductor process carrier and bridge clip assembly - Google Patents
Semiconductor process carrier and bridge clip assembly Download PDFInfo
- Publication number
- WO2001080370A1 WO2001080370A1 PCT/US2000/017174 US0017174W WO0180370A1 WO 2001080370 A1 WO2001080370 A1 WO 2001080370A1 US 0017174 W US0017174 W US 0017174W WO 0180370 A1 WO0180370 A1 WO 0180370A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- leg
- coupon
- bridge clip
- web portion
- aperture
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
Definitions
- the present invention relates to semiconductor process carriers, and more particularly,
- semiconductor process carriers including bridge clips for biasing the semiconductor coupon against the process carrier during processing.
- manipulators handle the bare wafers up to the dicing stage when the wafer is scribed and broken
- an AUERTM Boat As an "AUERTM Boat.” Conventionally, an AUERTM Boat comprises a flat plate roughly 5
- coupon aperture biases the coupon against the opposite wall to hold the coupon in the aperture
- the compressive force is supplied by a bridge clip that
- the present invention comprises a semiconductor process carrier and a bridge clip that is
- the bridge clip comprises a horizontal sheet metal
- the legs comprise a pair of tangs extending laterally outward from the
- manipulator compresses the legs of the bridge clip together sufficiently to permit the tangs of
- a bridge clip made in accordance with the present invention is capable of exerting a substantially greater pressure than a conventional longitudinally engaging bridge clip.
- FIG. 1 is a top plan view of a prior art semiconductor process carrier bridge clip
- FIG. 2 is a side view of the bridge clip of FIG. 1
- FIG. 3 is an end view of the prior art bridge clip of FIG. 1;
- FIG. 4 is a top plan view of a semiconductor process carrier incorporating features of
- FIG. 5 is a partially exploded perspective view of a bridge clip incorporating features of the present invention
- FIG. 6 is an end view of the bridge clip of FIG. 5.
- semiconductor die against a process carrier comprises a substantially horizontal web section
- leg 14 and 16 are substantially mirror images of each other. Accordingly, leg
- Leg 14 comprises a generally planar member having
- tabs 18 and 20 extending laterally outward (i.e. in a direction having a component normal to
- bridge clip 10 is installed in process carrier 30 by
- Manipulator arms 50 and 52 compress legs 14 and 16 toward each
- a leaf spring 58 engages the top of the semiconductor coupon 60 (shown
- process carrier 30 immediately outward (relative to coupon aperture 62) of distal walls 54 and
- bridge clip 10 upward. As web section 12 of bridge clip 10 bows upward, it will pull lower end 38 of leg 14 and corresponding lower end 38A of leg 16 inward toward each other.
- a bridge clip 110 made in accordance with the present
- invention comprises a substantially horizontal web section 112 the ends of which are formed
- legs 114 and 116 which extend generally downward from the respective ends 118, 120 of
- leg 116 is substantially a mirror image of 114. Accordingly, leg 116 will
- Leg 114 comprises a generally planar member having a
- leg 114 is functionally "T" shaped in plan
- the lateral edges 128 and 130 are defined as the lateral edges
- leg 114 is formed into tangs 134 and 136 that also extend laterally outward
- leg 114 has an upright portion composed of that portion of leg 114 extending
- leg 124 and 126 and aperture 122 are apertures such as tabs 124 and 126 and aperture 122. What is of importance is that leg
- leg 114 plane of leg 114 and, therefore, against the maximum area moment of leg 114.
- tabs 124 and 126 extend laterally
- a leaf spring 142 engages a pair of slots
- Web section 112 may optionally include stiffening flanges 150
- process carrier 230 comprises a plurality of
- a bias spring 264 projects beyond a lateral wall 266 into coupon aperture 262
- a pair of bridge clip apertures 232 and 234 are
- Each of bridge clip apertures 232 and 234 comprises a functionally "T" shaped aperture
- transverse is defined as a dimension normal to a longitudinal axis 94 passing through both of apertures 232 and 234.
- bridge clip 110 is engaged by robot manipulator arms similar to arms 50 and 52 of FIG. 2 such that legs 114 and 116 are compressed together sufficiently to allow tangs 134 and 136 of leg 114 to pass through large opening 274 and for tangs 134A and 136A of leg 116 to simultaneously pass through large opening 274A of aperture 234.
- Tabs 124 and 126 which extend past tangs 134 and 136, prevent bridge clip 110 from being over-inserted into bridge clip apertures 232 and 234 in conventional fashion.
- the robot manipulator arm releases bridge clip 110 such that legs 114 and 116 spring outward against distal walls 254 and 256 of bridge clip apertures 232 and 234.
- upper surfaces 138 and 140 of leg 114 engage the lower surface 280 of process carrier 230 laterally outward of bridge clip aperture 232 proximal distal wall 254, and corresponding upper surfaces 138A and 140A (not shown) of leg 116 engage lower surface 280 laterally outward of bridge clip aperture 234 proximal distal wall 256.
- a bridge clip made in accordance with the foregoing is capable of exerting a substantially greater pressure than a conventional bridge clip without the necessity of being constructed of a higher gauge material (which would overstress a robot manipulator arm attempting to compress the legs together).
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connection Of Plates (AREA)
Abstract
A semiconductor process carrier (230) and a bridge clip (110) that is capable of retaining a coupon (60) comprises a horizontal sheet metal web portion (112) the ends of which are formed into legs (114, 116) having a generally 'T' shaped plan extending downward from the ends of the web portion. The legs engage a corresponding pair of 'T' shaped apertures (232, 234) adjacent opposite walls of a coupon aperture (262) in the process carrier. The tangs (134, 136) of the legs engage the underside of the process carrier laterally outward of the narrow section of the 'T'-shaped aperture. Because the legs engage the lateral underside of the process carrier any bowing of the bridge clip will not cause the tangs to lose engagement with the underside of the process carrier.
Description
SEMICONDUCTOR PROCESS CARRIER AND BRIDGE CLIP ASSEMBLY
BACKGROUND OF THE INVENTION
The present invention relates to semiconductor process carriers, and more particularly,
to semiconductor process carriers including bridge clips for biasing the semiconductor coupon against the process carrier during processing.
The manufacturer of semiconductor memory chips, microprocessors, and other
semiconductor components is a highly automated process. During assembly, robotic
manipulators handle the bare wafers up to the dicing stage when the wafer is scribed and broken
into individual die. Once the individual die has been separated from the wafer, it is common to
handle the die, lead frame, heat sink, and other components that make up the completed
packaged semiconductor product in batches using a semiconductor process carrier, also known
as an "AUER™ Boat." Conventionally, an AUER™ Boat comprises a flat plate roughly 5
inches wide by 12 inches long, having a number of precision apertures formed therein sized to
match precisely the appropriate semiconductor coupon. A spring located along one edge of the
coupon aperture biases the coupon against the opposite wall to hold the coupon in the aperture
and to eliminate the coupon-to-aperture tolerance as one source of positioning error during the
processing. In many cases, it is also necessary to provide a compressive force between the
coupon and the AUER™ Boat, for example when curing the epoxy bond between a
semiconductor die and a ceramic chip carrier or when curing a bond between a semiconductor
die and its heat sink. Conventionally, the compressive force is supplied by a bridge clip that
spans the coupon aperture and supports a bias spring that compresses the coupon components
together. Conventional bridge clips are formed of sheet metal and snap in place into rectangular
apertures adjacent the coupon aperture in the AUER™ Boat. As semiconductor process
techniques are demanding higher processing temperatures and higher contact pressure, however,
the mechanical limits of the snap-in style bridge clips are being exceeded. Accordingly, what is
needed is a bridge clip that is compatible with existing semiconductor pick-and-place
manipulators that is capable of withstanding the higher operating temperatures and higher
contact forces being demanded by the semiconductor industry.
SUMMARY OF THE INVENTION
The present invention comprises a semiconductor process carrier and a bridge clip that is
capable of being inserted and removed from the process carrier with conventional robotic
manipulators. In a preferred embodiment, the bridge clip comprises a horizontal sheet metal
web portion the ends of which are formed into legs extending generally downward from the
ends of the web portion. The legs comprise a pair of tangs extending laterally outward from the
lateral edges of the legs such that the legs assume the shape of a "T". The process carrier
comprises a conventional coupon aperture with a pair of "T" cross-section bridge clip apertures
adjacent opposite side walls of the coupon aperture. In operation, a conventional robotic
manipulator compresses the legs of the bridge clip together sufficiently to permit the tangs of
the bridge clip legs to pass through the widest portion of the "T"-shaped apertures in the process
carrier. Once the bridge clip is in place, the robotic manipulator releases the bridge clip to allow
the legs to spring outward into the narrow portion of the "T"-shaped apertures in the process
carrier. The tangs of the legs engage the underside of the process carrier laterally outward of the
narrow section of the "T"-shaped aperture. Because the legs engage the lateral underside of the
process carrier rather than only engaging the process carrier longitudinally outward of the bridge
clip slots, any bowing of the bridge clip will not cause the tangs to lose engagement with the
underside of the process carrier. Accordingly, a bridge clip made in accordance with the present
invention is capable of exerting a substantially greater pressure than a conventional longitudinally engaging bridge clip.
BRIEF DESCRIPTION OF THE DRAWING The present invention will be better understood from a reading of the following detailed description, taken in conjunction with the accompanying drawing figures in which like references designate like elements and, in which:
FIG. 1 is a top plan view of a prior art semiconductor process carrier bridge clip; FIG. 2 is a side view of the bridge clip of FIG. 1; FIG. 3 is an end view of the prior art bridge clip of FIG. 1;
FIG. 4 is a top plan view of a semiconductor process carrier incorporating features of
the present invention;
FIG. 5 is a partially exploded perspective view of a bridge clip incorporating features of the present invention; and FIG. 6 is an end view of the bridge clip of FIG. 5.
DETAILED DESCRIPTION
The drawing figures are intended to illustrate the general manner of construction and are not necessarily to scale, i the description and in the claims, the terms left, right, front and back, and the like are used for descriptive purposes. However, it is understood that the embodiment of the invention described herein is capable of operation in other orientations than is shown and the terms so used are only for the purpose of describing relative positions and are interchangeable under appropriate circumstances.
With reference to FIGs. 1-3, a conventional prior art bridge clip 10 for biasing a
semiconductor die against a process carrier comprises a substantially horizontal web section
12 the ends of which are formed into legs 14 and 16 which extend downward from web
section 12. Legs 14 and 16 are substantially mirror images of each other. Accordingly, leg
16 will not be discussed in detail herein. Leg 14 comprises a generally planar member having
tabs 18 and 20 extending laterally outward (i.e. in a direction having a component normal to
the longitudinal axis 22 of web 12) from the lateral edges 24 and 26 of leg 14. Tabs 18 and 20 are sized to prevent leg 14 from being inserted too far into the corresponding bridge clip
apertures 32 and 34 of semiconductor process carrier 30. The lower end 38 of leg 14 is
sheared and deformed to create tangs 42 and 44 which extend longitudinally outward (i.e. in a
direction having a component parallel to longitudinal axis 22 of web section 12). Tangs 42
and 44 do not extend laterally outward from lateral edges 24 and 26.
As shown more clearly in FIG. 2, bridge clip 10 is installed in process carrier 30 by
means of robotic manipulator arms 50 and 52 which engage apertures 46 (shown) and 48 (not
shown) in legs 14 and 16. Manipulator arms 50 and 52 compress legs 14 and 16 toward each
other so that tangs 42, 44 of leg 14 (and corresponding tangs 42A and 44A of leg 16) clear
distal walls 54 and 56 as bridge clip 10 is inserted into bridge clip apertures 32 and 34 of
process carrier 30. A leaf spring 58 engages the top of the semiconductor coupon 60 (shown
in phantom lines) to bias the components of semiconductor coupon 60 into the coupon
aperture 62 of process carrier 30. Tangs 42, 44, 42A and 44A engage the lower surface 64 of
process carrier 30 immediately outward (relative to coupon aperture 62) of distal walls 54 and
56 of bridge clip apertures 32 and 34. As can be ascertained from the foregoing, the normal
compressive force exerted on bridge clip 10 by semiconductor coupon 60 will tend to bow
bridge clip 10 upward. As web section 12 of bridge clip 10 bows upward, it will pull lower
end 38 of leg 14 and corresponding lower end 38A of leg 16 inward toward each other.
Sufficient bowing of web section 12 of bridge clip 10 will draw legs 14 and 16 inward a
sufficient distance to permit bridge clip 10 to separate from process carrier 30 relieving the
downward force on coupon 60, thereby resulting in a failed bonding operation and possibly
scrapping of the part.
With reference to FIGs. 4-6, a bridge clip 110 made in accordance with the present
invention comprises a substantially horizontal web section 112 the ends of which are formed
into legs 114 and 116 which extend generally downward from the respective ends 118, 120 of
web section 112. Leg 116 is substantially a mirror image of 114. Accordingly, leg 116 will
not be discussed in detail herein. Leg 114 comprises a generally planar member having a
conventional aperture 122 for gripping by a robotic manipulator arm. Leg 114 further
comprises a pair of tabs 124, 126 that extend laterally outward (i.e. having a component
normal to longitudinal axis 90 of web section 112 and longitudinal axis 92 of leg 114) from
lateral edges 128 and 130, respectively such that leg 114 is functionally "T" shaped in plan
view. (As used herein, the lateral edges 128 and 130 are defined as the lateral edges
immediately upward from upper surface 138 and 140 of tangs 134 and 136 respectively). The
lower end 132 of leg 114 is formed into tangs 134 and 136 that also extend laterally outward
from a lateral sides 128 and 130, respectively. By functionally "T" shaped, what is meant
herein is that leg 114 has an upright portion composed of that portion of leg 114 extending
from web 112 to lower end 132 and a crosspiece formed by tangs 134 and 136 irrespective of
the aspect ratio of the upright portion to the crosspiece and also irrespective of other features
and apertures such as tabs 124 and 126 and aperture 122. What is of importance is that leg
114 be capable of being hooked into an aperture that is larger than the distance from lateral
wall 128 to lateral wall 130 but smaller than the maximum span of tangs 134 and 136, such
that any bending moment tending to rotate tangs 134 and 136 downward will be reacted in the
plane of leg 114 and, therefore, against the maximum area moment of leg 114.
For reasons that will become apparent hereinafter, tabs 124 and 126 extend laterally
outward a greater distance than tangs 134 and 136. A leaf spring 142 engages a pair of slots
144 and 146 formed in web section 112, which retain leaf spring 142 as bridge clip 110 is
manipulated into position. Web section 112 may optionally include stiffening flanges 150
and 152 to increase the section modulus of web section 112. An optional stiffening bridge
(not shown) which comprises a second sheet metal web may be welded, bonded, or otherwise
attached to web section 112 (either along the underside or the top side) to increase the
effective cross section of web section 112 and thereby provide additional stiffiiess to web
section 112 without increasing the stiffness of (and consequently the force required to bend)
legs 114 and 116.
With particular reference to FIGs. 4 and 5, process carrier 230 comprises a plurality of
coupon apertures 262 which are sized according to the particular semiconductor being
processed to provide a close tolerance fit to the semiconductor coupon (not shown) being
processed. A bias spring 264 projects beyond a lateral wall 266 into coupon aperture 262
such that when a coupon is placed in coupon aperture 262 bias spring 264 urges the coupon
against opposite wall 268 of aperture 262. A pair of bridge clip apertures 232 and 234 are
formed in process carrier 230 adjacent opposite sides 270 and 272 of coupon aperture 262.
Each of bridge clip apertures 232 and 234 comprises a functionally "T" shaped aperture
having a larger opening 274 and 274A respectively and a smaller opening 276 and 276A
respectively, smaller openings 276 and 276A each having a smaller transverse dimension than
the transverse dimension of larger openings 274 and 274A. As used herein with respect to the
bridge clip apertures, transverse is defined as a dimension normal to a longitudinal axis 94 passing through both of apertures 232 and 234.
In use, bridge clip 110 is engaged by robot manipulator arms similar to arms 50 and 52 of FIG. 2 such that legs 114 and 116 are compressed together sufficiently to allow tangs 134 and 136 of leg 114 to pass through large opening 274 and for tangs 134A and 136A of leg 116 to simultaneously pass through large opening 274A of aperture 234. Tabs 124 and 126, which extend past tangs 134 and 136, prevent bridge clip 110 from being over-inserted into bridge clip apertures 232 and 234 in conventional fashion. Once bridge clip 110 is in position, the robot manipulator arm releases bridge clip 110 such that legs 114 and 116 spring outward against distal walls 254 and 256 of bridge clip apertures 232 and 234. Simultaneously, under the urging of leaf spring 142, upper surfaces 138 and 140 of leg 114 engage the lower surface 280 of process carrier 230 laterally outward of bridge clip aperture 232 proximal distal wall 254, and corresponding upper surfaces 138A and 140A (not shown) of leg 116 engage lower surface 280 laterally outward of bridge clip aperture 234 proximal distal wall 256. As can be determined from the foregoing, since tangs 134, 136, 134A and 136A engage lower surface 280 of process carrier 230 laterally outward of bridge clip apertures 232 and 234, rather than only longitudinally outward, any bowing of bridge clip 110 will not cause tangs 134, 136, 134A and 136A to lose engagement with underside 280 of process carrier 230. Accordingly, a bridge clip made in accordance with the foregoing is capable of exerting a substantially greater pressure than a conventional bridge clip without the necessity of being constructed of a higher gauge material (which would overstress a robot manipulator arm attempting to compress the legs together).
Although certain preferred embodiments and methods have been disclosed herein, it will be apparent from the foregoing disclosure to those skilled in the art that variations and
modifications of such embodiments and methods may be made without departing from the
spirit and scope of the invention. For example, in lieu of a single "T" slot and "T"-shaped
leg, a pair of "L"-shaped slots with corresponding "L"-shaped legs or a "T" slot with "L"-
shaped legs would still engage the lower side of the process carrier laterally outward from the
slot such that bowing of the bridge clip would not tend to disengage the bridge clip from the
process carrier. Accordingly, it is intended that the invention shall be limited only to the
extent required by the appended claims and the rules and principles of applicable law.
Claims
1. A bridge clip for biasing a semiconductor die against a process carrier comprising: a sheet metal member comprising a substantially horizontal web portion having an
upper surface, a lower surface, a first end and a second end, said sheet metal member
further comprising;
a first leg extending generally downward from said first end of said web portion,
said first leg having a longitudinal axis extending downward from said first end of said
web portion; and
a second leg extending generally downward from said second end of said web
portion, said second leg having a longitudinal axis extending downward from said second
end of said web portion,
said first leg comprising a generally planar member having a first lateral edge and a second lateral edge opposite said first lateral edge, said first leg further comprising a fixed
end integral with said first end of said web portion and a free end distal of said fixed end,
the free end of said first leg having a first plurality of tangs extending laterally outward one
each respectively from said first and second lateral edges, said first plurality of tangs
adapted to engage a lower surface of said process carrier, and
said second leg comprising a generally planar member having a third lateral edge
and a fourth lateral edge opposite said third lateral edge, said second leg further
comprising a fixed end integral with said second end of said web portion and a free end
distal of said fixed end, the free end of said second leg having a second plurality of tangs
extending laterally outward one each respectively from said third and fourth lateral edges,
said second plurality of tangs adapted to engage a lower surface of said process carrier.
2. The bridge clip of claim 1, wherein:
each of said first plurality of tangs extends in a plane substantially common
to a plane of said first leg.
3. The bridge clip of claim 2, wherein
each of said second plurality of tangs extends in a plane substantially common to a
plane of said second leg.
4. The bridge clip of claim 1, further comprising:
a resilient member operatively attached to the lower surface of said web portion for
providing a controlled bias between the semiconductor die and the process carrier.
5. The bridge clip of claim 4, wherein:
said resilient member comprises a leaf spring disposed on the lower surface of said
web portion and engaging a pair of slots formed in said web portion.
6. The bridge clip of claim 2, wherein:
said resilient member comprises a coil spring attached to said lower surface of said
web portion.
7. The bridge clip of claim 1, wherein: said web portion further comprises a first and second lateral edge, said first lateral
edge further comprising a flange extending at an angle outward from said first lateral edge,
said second lateral edge also further comprising a flange extending at an angle outward
from said second lateral edge.
8. A semiconductor process carrier assembly comprising:
a generally planar member having at least one coupon aperture formed therein, said
coupon aperture having lateral edges sized and shaped to hold a semiconductor coupon
during processing;
a bias spring attached to said planar member proximal said coupon aperture, said
bias spring having a portion extending into said coupon aperture for biasing said coupon
against a distal lateral edge of said coupon aperture;
first and second bridge clip apertures formed in said planar member proximal said coupon aperture on opposite sides of said coupon aperture along a common axis, said first
and second bridge clip apertures each comprising an opening having a first dimension and
a second dimension perpendicular to said common axis, said first dimension being larger
than said second dimension.
9. the semiconductor process carrier assembly of claim 8, wherein:
said first and second bridge clip apertures each comprise a "T" shaped opening
oriented along said common axis.
10. The semiconductor process carrier assembly of claim 8, wherein:
said first and second bridge clip apertures each comprise a trapezoidal shaped opening.
11. The semiconductor process carrier assembly of claim 8, further comprising
a bridge clip, said bridge clip comprising:
an integrally formed sheet metal member comprising a substantially horizontal web
portion having an upper surface, a lower surface, a first end and a second end, said sheet
metal member further comprising;
a first leg extending generally downward from said first end of said web portion,
said first leg having a longitudinal axis extending downward from said first end of said
web portion; and
a second leg extending generally downward from said second end of said web
portion, said second leg having a longitudinal axis extending downward from said second
end of said web portion,
said first leg comprising a generally planar member having a first lateral edge and a
second lateral edge opposite said first lateral edge, said first leg further comprising a fixed
end integral with said first end of said web portion and a free end distal of said fixed end,
the free end of said first leg having a first plurality of tangs extending laterally outward one
each respectively from said first and second lateral edges, said first plurality of tangs
adapted to engage a lower surface of said process carrier through said bridge clip aperture,
and
said second leg comprising a generally planar member having a third lateral edge
and a fourth lateral edge opposite said third lateral edge, said second leg further
comprising a fixed end integral with said second end of said web portion and a free end
distal of said fixed end, the free end of said second leg having a second plurality of tangs
extending laterally outward one each respectively from said third and fourth lateral edges, said second plurality of tangs adapted to engage a lower surface of said process carrier
through said bridge clip aperture.
12. A bridge clip for biasing a semiconductor die against a process carrier comprising:
a sheet metal member comprising a substantially horizontal web portion having an
upper surface, a lower surface, a first end and a second end, said sheet metal member
further comprising;
a first leg extending generally downward from said first end of said web portion,
said first leg comprising a generally planar member having a "T" shaped plan having an
upright portion terminating at one end in a base and terminating at the other end in a
crosspiece, said first leg fixed to said web at the base of said "T" shaped plan ;
a second leg extending generally downward from said second end of said web
portion, said second leg also comprising a generally planar member having a "T" shaped
plan having an upright portion terminating at one end in a base and terminating at the other
end in a crosspiece, said second leg fixed to said web at the base of said "T" shaped plan;
and
a resilient member operatively attached to the lower surface of said web portion for
providing a controlled bias between the semiconductor die and the process carrier.
13. The bridge clip of claim 12, wherein:
each of said first and second legs comprises a second crosspiece formed in each of
said legs disposed between said first crosspiece and said base thereof.
14. The bridge clip of claim 12, further comprising: a carrier comprising a generally planar member having at least one coupon aperture
formed therein, said coupon aperture having lateral edges sized and shaped to hold a
semiconductor coupon during processing;
a bias spring attached to said planar member proximal said coupon aperture, said
bias spring having a portion extending into said coupon aperture for biasing said coupon
against a distal lateral edge of said coupon aperture;
first and second bridge clip apertures formed in said planar member proximal said
coupon aperture on opposite sides of said coupon aperture along a common axis, said first
and second bridge clip apertures each comprising a "T" shaped opening having a first
dimension and a second dimension perpendicular to said common axis, said first
dimension being larger than said second dimension.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2000257581A AU2000257581A1 (en) | 2000-04-13 | 2000-06-21 | Semiconductor process carrier and bridge clip assembly |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US54843800A | 2000-04-13 | 2000-04-13 | |
| US09/548,438 | 2000-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2001080370A1 true WO2001080370A1 (en) | 2001-10-25 |
Family
ID=24188842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2000/017174 WO2001080370A1 (en) | 2000-04-13 | 2000-06-21 | Semiconductor process carrier and bridge clip assembly |
Country Status (2)
| Country | Link |
|---|---|
| AU (1) | AU2000257581A1 (en) |
| WO (1) | WO2001080370A1 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2673334A (en) * | 1951-10-03 | 1954-03-23 | Gen Motors Corp | Retainer spring |
| US3356840A (en) * | 1967-01-30 | 1967-12-05 | David A Cohen | Electric light fixture mounting |
| US5779488A (en) * | 1996-12-20 | 1998-07-14 | Intel Corporation | Socket for mounting an electrical component to a board |
-
2000
- 2000-06-21 WO PCT/US2000/017174 patent/WO2001080370A1/en active Application Filing
- 2000-06-21 AU AU2000257581A patent/AU2000257581A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2673334A (en) * | 1951-10-03 | 1954-03-23 | Gen Motors Corp | Retainer spring |
| US3356840A (en) * | 1967-01-30 | 1967-12-05 | David A Cohen | Electric light fixture mounting |
| US5779488A (en) * | 1996-12-20 | 1998-07-14 | Intel Corporation | Socket for mounting an electrical component to a board |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2000257581A1 (en) | 2001-10-30 |
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