WO2001078482A1 - Assembly device comprising a unit for measuring the insertion force - Google Patents

Assembly device comprising a unit for measuring the insertion force Download PDF

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Publication number
WO2001078482A1
WO2001078482A1 PCT/DE2001/001302 DE0101302W WO0178482A1 WO 2001078482 A1 WO2001078482 A1 WO 2001078482A1 DE 0101302 W DE0101302 W DE 0101302W WO 0178482 A1 WO0178482 A1 WO 0178482A1
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WO
WIPO (PCT)
Prior art keywords
arm
support arm
placement device
travel
support
Prior art date
Application number
PCT/DE2001/001302
Other languages
German (de)
French (fr)
Inventor
Stefan Friesenhan
Original Assignee
Siemens Production And Logistics Systems Ag
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Publication date
Application filed by Siemens Production And Logistics Systems Ag filed Critical Siemens Production And Logistics Systems Ag
Publication of WO2001078482A1 publication Critical patent/WO2001078482A1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/0061—Force sensors associated with industrial machines or actuators
    • G01L5/0076—Force sensors associated with manufacturing machines
    • G01L5/009—Force sensors associated with material gripping devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B25J13/085—Force or torque sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays

Definitions

  • Placement device with a device for measuring the placement force
  • the invention relates to an assembly device for mounting an electrical component on a printed circuit board with a travel arm that can be moved in a mounting direction and a carrier element that is suitable for receiving and delivering the component.
  • Assembly devices of the type mentioned at the outset are used for assembling printed circuit boards with electrical components, which can also be surface-mountable components (SMD components), for example.
  • the carrier element is fastened to the travel arm and can be moved by means of an x-y positioning device between a component supply and the position on the circuit board to be populated. Since the printed circuit boards are usually equipped with components and components of very different heights, the carrier element is moved to the desired mounting position at a relatively large distance of a few centimeters above the printed circuit board and then lowered onto the printed circuit board in the z direction. As a result, the component is placed on the circuit board.
  • the forces acting during the settling process particularly in the case of highly sensitive components such as integrated circuits, must be controlled very precisely within narrow tolerances. For example, for some sensitive components, setting forces of 0.5 N with a tolerance of 10% are required. In order to be able to control the contact forces, an exact measurement of the contact forces is necessary.
  • EP 0476 912 A discloses an assembly device which has a suitable carrier element for receiving and delivering components, which can be moved in the direction of the printed circuit board.
  • the pressing force with which the carrier element presses on the respective component on the printed circuit board is determined on the basis of the deformation of two strain gauges which are attached to spoke-like arms of a base part of the mounting device.
  • a placement device is known from US Pat. No. 5,422,554 in which the vacuum gripper for the components is supported axially by a compression spring.
  • An actuator is attached to the opposite end of the compression spring, by means of which the pretensioning of the spring and thus the placement force can be set to different values.
  • an assembly device in which the travel arm is moved by a linear motor.
  • the drive current of the linear motor is measured continuously.
  • the drive current for the linear motor increases due to the mechanical resistance, which allows conclusions to be drawn about the touchdown force.
  • This method of measuring the placement force has the disadvantage that a relatively large mass is moved onto the printed circuit board with the displacement arm, the linear motor and the carrier element, as a result of which the measurement of the placement force is delayed with the inertia determined by the mass.
  • the non-smooth bearing mechanical friction which also falsifies the measurement result.
  • the aim of the present invention is therefore to provide a placement device which allows the placement force of the component on the circuit board to be measured very easily and very precisely.
  • the invention specifies a placement device for placing an electrical component on a printed circuit board, which has a travel arm that can be moved in the mounting direction and a carrier element that is suitable for receiving and delivering the component.
  • a projecting, flexible support arm is arranged on the travel arm, the free end of which is non-positively connected to the support element.
  • the placement device according to the invention has a sensor which is suitable for measuring the bending of the support arm.
  • the non-positive connection between the support arm and the support element on the one hand ensures that the movement of the travel arm is transmitted directly to the support element. It is also achieved in that the placement force of the carrier element acts directly and directly on the carrier arm on the circuit board. The contact force can thus be measured via the bending of the support arm.
  • the placement device has the advantage that only the relatively low mass of the carrier element is decisive as the inert mass for the time constant effective to build up the placement force. Furthermore, the placement device according to the invention has the advantage that the placement force is measured using means that are very simple to construct.
  • the support arm projecting from the travel arm can be realized as a support arm integrated in one piece into the travel arm. This is done, for example, by milling a correspondingly shaped metallic workpiece.
  • the support arm projecting from the travel arm can also be designed as a separate component which is detachably connected to the travel arm. Such a releasable connection can be realized, for example, by screwing or riveting.
  • an assembly device is particularly advantageous in which the carrier element comprises a suction pipette for suctioning the component.
  • the placement device is suitable for removing components from a flat carrier, in the recesses of which the components are arranged (so-called trays).
  • the suction pipette can also be used to remove taped components.
  • the suction pipette is particularly advantageously connected to a rotary motor, which enables the suction pipette to be rotated in order to turn the component into its desired angular position.
  • a placement device in which the sensor is arranged on the support arm is particularly advantageous. Since the touchdown force is measured via the bending of the support arm, this is the most direct and precise way to measure the touchdown force.
  • a strain gauge is particularly suitable as a sensor, which is particularly suitable for measuring bends. Such a strain gauge can be a metal strain gauge or a semiconductor strain gauge (based on the piezoresistive effect). The strain gauges are connected to other resistors with the measuring bridges common in measuring technology. To protect the strain gauge from dirt and vibrations, it is particularly advantageous to protect the strain gauge arranged on the support arm with a silicone rubber potting compound.
  • Carrier arm designed in this way is particularly simple and inexpensive to implement by machine.
  • the figure shows a placement device according to the invention in side view.
  • the figure shows a placement device that can be moved in two coordinate directions X-Y for mounting an electrical component 1 on a printed circuit board 2 with a travel arm 3 that can be moved in the mounting direction L perpendicular to the x-y plane and that is firmly connected to a carrier element 4.
  • the connection between the travel arm 3 and the support element 4 is made by the support arm 5, which is screwed to the support element 4 and the travel arm 3, respectively.
  • the support arm 5 is arranged parallel to the circuit board 2.
  • the moving arm 3 can be fastened, for example, to the sliding carriage of a linear motor which moves the moving arm 3 perpendicular to the printed circuit board 2 in the mounting direction L.
  • the carrier element 4 comprises a suction pipette 7, by means of which the component 1 can be picked up and released.
  • the suction pipette 7 can be connected, for example, to a rotary motor which serves to rotate the suction pipette 7 with the component 1 in its correct angular position.
  • the support arm 5 has an elongated hole 10 which divides the support arm 5 into two bending plates 8, which are rigidly connected to one another at their ends on the travel arm side and at their ends on the support element side by connecting elements 9.
  • a parallel spring is realized, which has the effect that the carrier element 4 can only be moved perpendicular to the printed circuit board 2 or parallel to the travel arm 3.
  • This increases the selectivity of the sensor 6 for measuring the placement force F in the direction perpendicular to the conductor plate.
  • the sensor 6 for measuring the bend of the support arm 5 is applied to the top of the support arm 5 and can be particularly advantageously designed as a strain gauge.
  • the invention is not limited to the exemplary embodiments shown, but is defined in its most general form by claim 1.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The invention relates to an assembly device for inserting an electric component (1) into a printed circuit board (2). Said device comprises a traversing arm (3) which can be displaced in a vertical insertion direction (L), a support element (4) suitable for picking and placing the component (1), an elastic support arm (5), whose free end is connected to the support element (4) using a non-positive fit and which protrudes from the traversing arm (3) and a sensor (6) for measuring the flexure of the support arm (5). The measurement of the insertion force with the help of the flexural support arm (5) is advantageous in that said insertion force (F) can be rapidly determined in a highly accurate manner.

Description

Beschreibungdescription
Bestückvorrichtung mit einer Einrichtung zum Messen der Auf- setzkraftPlacement device with a device for measuring the placement force
Die Erfindung betrifft eine Bestückvorrichtung zum Aufsetzen eines elektrischen Bauelementes auf eine Leiterplatte mit einem in einer Aufsetzrichtung verfahrbaren Verfahrarm und einem zur Aufnahme und Abgabe des Bauelementes geeigneten Trä- gerelement.The invention relates to an assembly device for mounting an electrical component on a printed circuit board with a travel arm that can be moved in a mounting direction and a carrier element that is suitable for receiving and delivering the component.
Bestückvorrichtungen der eingangs genannten Art werden verwendet zur Bestückung von Leiterplatten mit elektrischen Bauelementen, die beispielsweise auch oberflächenmontierbare Bauelemente (SMD-Bauelemente) sein können. Das Trägerelement ist an dem Verfahrarm befestigt und kann mittels einer x-y- Positioniereinrichtung zwischen einem Bauelementevorrat und der zu bestückenden Position auf der Leiterplatte verfahren werden. Da die Leiterplatten üblicherweise mit Bauelementen und Bauteilen sehr unterschiedlicher Höhe bestückt sind, wird das Trägerelement in einem relativ großen Abstand von einigen Zentimetern über der Leiterplatte auf die gewünschte Bestückposition gefahren und dann auf die Leiterplatte senkrcht zu dieser in der z-Richtung abgesenkt. Dadurch wird das Bauele- ment auf der Leiterplatte abgesetzt. Die bei dem Absetzvorgang wirkenden Kräfte müssen, insbesondere bei hochempfindlichen Bauelementen wie integrierten Schaltungen, sehr genau innerhalb enger Toleranzen kontrolliert werden. Für einige empfindliche Bauelemente werden beispielsweise Absetzkräfte von 0,5 N mit einer Toleranz von 10 % gefordert. Um die Auf- setzkräfte kontrollieren zu können, ist eine genaue Messung der Aufsetzkräfte notwendig.Assembly devices of the type mentioned at the outset are used for assembling printed circuit boards with electrical components, which can also be surface-mountable components (SMD components), for example. The carrier element is fastened to the travel arm and can be moved by means of an x-y positioning device between a component supply and the position on the circuit board to be populated. Since the printed circuit boards are usually equipped with components and components of very different heights, the carrier element is moved to the desired mounting position at a relatively large distance of a few centimeters above the printed circuit board and then lowered onto the printed circuit board in the z direction. As a result, the component is placed on the circuit board. The forces acting during the settling process, particularly in the case of highly sensitive components such as integrated circuits, must be controlled very precisely within narrow tolerances. For example, for some sensitive components, setting forces of 0.5 N with a tolerance of 10% are required. In order to be able to control the contact forces, an exact measurement of the contact forces is necessary.
Aus US 4,657,470 ist eine Bestückvorrichtung bekannt, bei der im Trägerelement eine Druckfeder integriert ist, die beim Aufsetzen des Bauelements auf der Leiterplatte zusammengedrückt wird. Über den Federweg kann so .die Aufsetzkraft indi- rekt bestimmt werden. Diese Methode der Messung der Aufsetz- kraft hat den Nachteil, daß eine relativ aufwendige Konstruktion zur Messung des Federwegs notwendig ist und daß die Druckfeder in dem Trägerelement auch bei Bewegungen parallel zur Leiterplatte zusammendrückbar ist, wodurch die Kraftkomponente senkrecht auf die Leiterplatte, die die entscheidende Meßgröße ist, durch lateral zur Leiterplatte verlaufende Kraftkomponenten verfälscht wird.From US 4,657,470 a placement device is known in which a compression spring is integrated in the carrier element and is compressed when the component is placed on the circuit board. The contact force can thus be be determined directly. This method of measuring the contact force has the disadvantage that a relatively complex construction is necessary to measure the spring travel and that the compression spring in the carrier element can be compressed even when moving parallel to the circuit board, so that the force component perpendicular to the circuit board, which is the decisive factor Measured variable is falsified by force components running laterally to the circuit board.
Ferner ist durch die EP 0476 912 A eine Bestückvorrichtung bekannt, die zur Aufnahme und Abgabe von Bauelementen ein geeignetes Trägerelement aufweist, das in der Richtung der Leiterplatte verfahrbar ist. Die Andruckkraft , mit der das Trägerelement auf das jeweilige Bauelement auf der Leiterplatte drückt, wird anhand der Verformung zweier Dehnungsmeßstreifen ermittelt, die an speichenartigen Armen eines Basisteils der Bestückvorrichtung angebracht sind.Furthermore, EP 0476 912 A discloses an assembly device which has a suitable carrier element for receiving and delivering components, which can be moved in the direction of the printed circuit board. The pressing force with which the carrier element presses on the respective component on the printed circuit board is determined on the basis of the deformation of two strain gauges which are attached to spoke-like arms of a base part of the mounting device.
Ferner ist durch die US 5 422 554 eine Bestückvorrichtung be- kannt, bei der der Vakuumgreifer für die Bauelemente axial durch eine Druckfeder abgestützt ist. Auf der gegenüberliegenden Stirnseite der Druckfeder ist ein Aktuator angesetzt, durch den die Vorspannung der Feder und damit die Aufsetz- kraft auf unterschiedliche Werte einstellbar ist.Furthermore, a placement device is known from US Pat. No. 5,422,554 in which the vacuum gripper for the components is supported axially by a compression spring. An actuator is attached to the opposite end of the compression spring, by means of which the pretensioning of the spring and thus the placement force can be set to different values.
Ferner ist eine Bestückvorrichtung bekannt, bei der der Verfahrarm von einem Linearmotor bewegt wird. Der Antriebsstrom des Linearmotors wird kontinuierlich gemessen. In dem Moment, in dem das Bauelement auf der Leiterplatte aufsetzt, steigt der Antriebsstrom für den Linearmotor aufgrund des mechanischen Widerstands an, wodurch auf die Aufsetzkraft geschlossen werden kann. Diese Methode der Messung der Aufsetzkraft hat den Nachteil, daß mit dem Verfahrarm, dem Linearmotor und dem Trägerelement eine relativ große Masse auf die Leiter- platte bewegt wird, wodurch die Messung der Aufsetzkraft mit der durch die Masse bestimmten Trägheit verzögert wird. Darüber hinaus entsteht im Verfahrarm bzw. im Linearmotor durch die nicht reibungslose Lagerung mechanische Reibung, die das Meßergebnis zusätzlich verfälscht.Furthermore, an assembly device is known in which the travel arm is moved by a linear motor. The drive current of the linear motor is measured continuously. The moment the component touches the circuit board, the drive current for the linear motor increases due to the mechanical resistance, which allows conclusions to be drawn about the touchdown force. This method of measuring the placement force has the disadvantage that a relatively large mass is moved onto the printed circuit board with the displacement arm, the linear motor and the carrier element, as a result of which the measurement of the placement force is delayed with the inertia determined by the mass. In addition, in the travel arm or in the linear motor the non-smooth bearing mechanical friction, which also falsifies the measurement result.
Ziel der vorliegenden Erfindung ist es daher, eine Bestück- Vorrichtung anzugeben, die eine sehr einfach durchzuführende und sehr genaue Messung der Aufsetzkraft des Bauelementes auf der Leiterplatte erlaubt.The aim of the present invention is therefore to provide a placement device which allows the placement force of the component on the circuit board to be measured very easily and very precisely.
Dieses Ziel wird erfindungsgemäß durch eine Bestückvorrich- tung nach Anspruch 1 erreicht. Vorteilhafte Ausgestaltungen der Erfindung sind den weiteren Ansprüchen zu entnehmen.This object is achieved according to the invention by means of a placement device according to claim 1. Advantageous embodiments of the invention can be found in the further claims.
Die Erfindung gibt eine Bestückvorrichtung zum Aufsetzen eines elektrischen Bauelementes auf eine Leiterplatte an, die einen in der Aufsetzrichtung verfahrbaren Verfahrarm und ein zur Aufnahme und Abgabe des Bauelementes geeignetes Trägerelement aufweist. Am Verfahrarm ist darüber hinaus ein vorspringender, biegeelastischer Trägerarm angeordnet, dessen freies Ende mit dem Trägerelement kraftschlüssig verbunden ist. Ferner weist die erfindungsgemäße Bestückvorrichtung einen Sensor auf, der zur Messung der Biegung des Trägerarms geeignet ist.The invention specifies a placement device for placing an electrical component on a printed circuit board, which has a travel arm that can be moved in the mounting direction and a carrier element that is suitable for receiving and delivering the component. In addition, a projecting, flexible support arm is arranged on the travel arm, the free end of which is non-positively connected to the support element. Furthermore, the placement device according to the invention has a sensor which is suitable for measuring the bending of the support arm.
Durch die kraftschlüssige Verbindung zwischen dem Trägerarm und dem Trägerelement wird einerseits erreicht, daß die Bewegung des Verfahrarms direkt auf das Trägerelement übertragen wird. Ferner wird dadurch erreicht, daß die Aufsetzkraft des Trägerelements auf der Leiterplatte direkt und unmittelbar auf den Trägerarm wirkt. Somit kann die Aufsetzkraft über die Biegung des Trägerarms gemessen werden. Die erfindungsgemäßeThe non-positive connection between the support arm and the support element on the one hand ensures that the movement of the travel arm is transmitted directly to the support element. It is also achieved in that the placement force of the carrier element acts directly and directly on the carrier arm on the circuit board. The contact force can thus be measured via the bending of the support arm. The invention
Bestückvorrichtung hat den Vorteil, daß als träge Masse für die zum Aufbau der Aufsetzkraft wirksame Zeitkonstante nur noch die relativ geringe Masse des Trägerelements ausschlaggebend ist. Ferner hat die erfindungsgemäße Bestückvorrich- tung den Vorteil, daß die Messung der Aufsetzkraft mit konstruktiv sehr einfach zu realisierenden Mitteln erfolgt. Der aus dem Verfahrarm vorspringende Trägerarm kann als einstückig in den Verfahrarm integrierter Trägerarm realisiert sein. Dies geschieht beispielsweise durch Fräsen eines entsprechend geformten metallischen Werkstücks. Der aus dem Verfahrarm vorspringende Trägerarm kann in einer anderen Ausführungsform der Erfindung auch als separates Bauelement ausgeführt sein, das mit dem Verfahrarm lösbar verbunden ist. Eine solche lösbare Verbindung kann beispielsweise durch Schrauben oder Vernieten realisiert sein.The placement device has the advantage that only the relatively low mass of the carrier element is decisive as the inert mass for the time constant effective to build up the placement force. Furthermore, the placement device according to the invention has the advantage that the placement force is measured using means that are very simple to construct. The support arm projecting from the travel arm can be realized as a support arm integrated in one piece into the travel arm. This is done, for example, by milling a correspondingly shaped metallic workpiece. In another embodiment of the invention, the support arm projecting from the travel arm can also be designed as a separate component which is detachably connected to the travel arm. Such a releasable connection can be realized, for example, by screwing or riveting.
Es ist darüber hinaus eine Bestückvorrichtung besonders vorteilhaft, bei der das Trägerelement eine Saugpipette zum Ansaugen des Bauelements umfaßt. Mit Hilfe dieser erfindungsgemäßen Saugpipette ist die Bestückvorrichtung zur Entnahme von Bauelementen aus einem flächenhaften Träger, in dessen Vertiefungen die Bauelemente angeordnet sind (sogenannte Trays) geeignet . Ferner kann die Saugpipette auch zur Entnahme von gegurteten Bauelementen verwendet werden. Die Saugpipette ist besonders vorteilhaft an einem Drehmotor verbunden, der die Verdrehung der Saugpipette ermöglicht, um das Bauelement in seine gewünschte Winkellage zu verdrehen.In addition, an assembly device is particularly advantageous in which the carrier element comprises a suction pipette for suctioning the component. With the aid of this suction pipette according to the invention, the placement device is suitable for removing components from a flat carrier, in the recesses of which the components are arranged (so-called trays). Furthermore, the suction pipette can also be used to remove taped components. The suction pipette is particularly advantageously connected to a rotary motor, which enables the suction pipette to be rotated in order to turn the component into its desired angular position.
Ferner ist eine Bestückvorrichtung besonders vorteilhaft, bei der der Sensor am Trägerarm angeordnet ist. Da die Aufsetz- kraft über die Biegung des Trägerarms gemessen wird, ist dies der direkteste und genaueste Weg, die Aufsetzkraft zu messen. Als Sensor kommt dabei im besonderen ein Dehnungsmeßstreifen in Betracht, der für die Messung von Biegungen besonders geeignet ist. Ein solcher Dehnungsmeßstreifen kann ein Metall- dehnungsmeßstreifen oder auch ein Halbleiterdehnungsmeßstreifen (basierend auf dem piezoresistiven Effekt) sein. Die Dehnungsmeßstreifen werden dabei mit den in der Meßtechnik üblichen Meßbrücken mit weiteren Widerständen verschaltet. Zum Schutz des Dehnungsmeßstreifens vor Schmutz und Vibrationen ist es besonders vorteilhaft, den auf dem Trägerarm angeordneten Dehnungsmeßstreifen mit einem Verguß aus Silikongummi zu schützen. L UJ _xj NJ H MFurthermore, a placement device in which the sensor is arranged on the support arm is particularly advantageous. Since the touchdown force is measured via the bending of the support arm, this is the most direct and precise way to measure the touchdown force. A strain gauge is particularly suitable as a sensor, which is particularly suitable for measuring bends. Such a strain gauge can be a metal strain gauge or a semiconductor strain gauge (based on the piezoresistive effect). The strain gauges are connected to other resistors with the measuring bridges common in measuring technology. To protect the strain gauge from dirt and vibrations, it is particularly advantageous to protect the strain gauge arranged on the support arm with a silicone rubber potting compound. L UJ _xj NJ HM
( l O Ul O LΠ O LΠ(l O Ul O LΠ O LΠ
Figure imgf000007_0001
Figure imgf000007_0001
so ausgeführter Trägerarm ist besonders einfach und kostengünstig maschinell zu realisieren.Carrier arm designed in this way is particularly simple and inexpensive to implement by machine.
Im Folgenden wird die Erfindung anhand eines Ausführungsbei- spiels und den dazugehörigen Figuren näher erläutert.The invention is explained in more detail below on the basis of an exemplary embodiment and the associated figures.
Die Figur zeigt eine erfindungsgemäße Bestückvorrichtung in Seitenansicht .The figure shows a placement device according to the invention in side view.
Die Figur zeigt eine in zwei Koordinatenrichtungen X-Y verfahrbare Bestückvorrichtung zum Aufsetzen eines elektrischen Bauelementes 1 auf einer Leiterplatte 2 mit einem in Aufsetzrichtung L senkrecht zur x-y-Ebene verfahrbaren Verfahrarm 3, der mit einem Trägerelement 4 fest verbunden ist. Die Verbin- düng zwischen dem Verfahrarm 3 und dem Trägerelement 4 erfolgt durch den Trägerarm 5, der jeweils mit dem Trägerelement 4 und dem Verfahrarm 3 verschraubt ist. Der Trägerarm 5 ist parallel zur Leiterplatte 2 angeordnet. Der Verfahrarm 3 kann beispielsweise am Gleitschlitten eines Linearmotors be- festigt sein, der den Verfahrarm 3 senkrecht zur Leiterplatte 2 in der Aufsetzrichtung L bewegt.The figure shows a placement device that can be moved in two coordinate directions X-Y for mounting an electrical component 1 on a printed circuit board 2 with a travel arm 3 that can be moved in the mounting direction L perpendicular to the x-y plane and that is firmly connected to a carrier element 4. The connection between the travel arm 3 and the support element 4 is made by the support arm 5, which is screwed to the support element 4 and the travel arm 3, respectively. The support arm 5 is arranged parallel to the circuit board 2. The moving arm 3 can be fastened, for example, to the sliding carriage of a linear motor which moves the moving arm 3 perpendicular to the printed circuit board 2 in the mounting direction L.
Das Trägerelement 4 umfaßt eine Saugpipette 7, mit deren Hilfe das Bauelement 1 aufgenommen und abgegeben werden kann. Die Saugpipette 7 kann beispielsweise mit einem Drehmotor verbunden sein, der dazu dient, die Saugpipette 7 mit dem Bauelemente 1 in dessen richtige Winkellage zu verdrehen.The carrier element 4 comprises a suction pipette 7, by means of which the component 1 can be picked up and released. The suction pipette 7 can be connected, for example, to a rotary motor which serves to rotate the suction pipette 7 with the component 1 in its correct angular position.
Der Trägerarm 5 weist ein Langloch 10 auf, das den Trägerarm 5 in zwei Biegeplatten 8 unterteilt, die an ihren verfahrarm- seitigen Enden und an ihren trägerelementseitigen Enden durch Verbindungselemente 9 starr miteinander verbunden sind. Dadurch wird eine Parallelfeder realisiert, die bewirkt, daß das Trägerelement 4 nur senkrecht zur Leiterplatte 2 bezie- hungsweise parallel zum Verfahrarm 3 bewegt werden kann. Dadurch erhöht sich die Selektivität des Sensors 6 zur Messung der Aufsetzkraft F in der Richtung senkrecht auf die Leiter- platte. Der Sensor 6 zur Messung der Biegung des Trägerarms 5 ist auf der Oberseite des Trägerarms 5 aufgebracht und kann besonders vorteilhaft als Dehnungsmeßstreifen ausgeführt sein.The support arm 5 has an elongated hole 10 which divides the support arm 5 into two bending plates 8, which are rigidly connected to one another at their ends on the travel arm side and at their ends on the support element side by connecting elements 9. As a result, a parallel spring is realized, which has the effect that the carrier element 4 can only be moved perpendicular to the printed circuit board 2 or parallel to the travel arm 3. This increases the selectivity of the sensor 6 for measuring the placement force F in the direction perpendicular to the conductor plate. The sensor 6 for measuring the bend of the support arm 5 is applied to the top of the support arm 5 and can be particularly advantageously designed as a strain gauge.
Die Erfindung beschränkt sich nicht auf die beispielhaft gezeigten Ausführungsformen, sondern wird in ihrer allgemeinsten Form durch Anspruch 1 definiert . The invention is not limited to the exemplary embodiments shown, but is defined in its most general form by claim 1.
BezugszeichenlisteLIST OF REFERENCE NUMBERS
1 Bauelement1 component
2 Leiterplatte 3 Verfahrarm2 PCB 3 travel arm
4 Trägerelement4 support element
5 Trägerarm5 support arm
6 Sensor6 sensor
7 Saugpipette 8 Biegeplatte7 Suction pipette 8 bending plate
9 Verbindungselement9 connecting element
10 Langloch10 slot
L AufsetzrichtungL direction of touchdown
F Aufsetzkraft F touchdown force

Claims

Patentansprüche claims
1. Bestückvorrichtung zum Aufsetzen eines elektrischen Bauelementes (1) auf eine Leiterplatte (2) mit - einem in einer Aufsetzrichtung (L) verfahrbaren Verfahrarm (3),1. placement device for placing an electrical component (1) on a printed circuit board (2) with - a moving arm (3) which can be moved in a placing direction (L),
- einem zur Aufnahme und Abgabe des Bauelementes (1) geeigneten Trägerelement (4) ,a carrier element (4) suitable for receiving and delivering the component (1),
- einem aus dem Verfahrarm (3) vorspringenden, biegeelasti- sehen Trägerarm (5) , dessen freies Ende mit dem Trägerelement- A protruding from the travel arm (3), flexurally elastic support arm (5), the free end with the support element
(4) kraftschlüssig verbunden ist und(4) is non-positively connected and
- einem Sensor (6) zur Messung der Biegung des Trägerarms- A sensor (6) for measuring the bending of the support arm
(5) .(5).
2. Bestückvorrichtung nach Anspruch 1, bei der der Trägerarm (5) einstückig in den Verfahrarm (3) integriert ist.2. Placement device according to claim 1, wherein the support arm (5) is integrated in one piece in the displacement arm (3).
3. Bestückvorrichtung nach Anspruch 1, bei der der Trägerarm (5) mit dem Verfahrarm (3) lösbar verbunden ist. 3. placement device according to claim 1, wherein the support arm (5) with the displacement arm (3) is detachably connected.
4. Bestückvorrichtung nach Anspruch 1 bis 3, bei der das Trägerelement (4) eine Saugpipette (7) zum Ansaugen des Bauelementes (1) umfaßt. 4. placement device according to claim 1 to 3, wherein the carrier element (4) comprises a suction pipette (7) for sucking the component (1).
5. Bestückvorrichtung nach Anspruch 1 bis 4, bei der der Sensor (6) am Trägerarm (5) angeordnet ist. 5. placement device according to claim 1 to 4, wherein the sensor (6) on the support arm (5) is arranged.
6. Bestückvorrichtung nach Anspruch 1 bis 5, bei der der Sensor (6) ein Dehnungsmeßstreifen ist.6. placement device according to claim 1 to 5, wherein the sensor (6) is a strain gauge.
7. Bestückvorrichtung nach Anspruch 1 bis 6, bei der der Trägerarm (5) im unverbogenen Zustand senkrecht auf dem Verfahrarm (3) steht und bei der die Biegesteifigkeit des Trägerarms (5) in der Richtung parallel zum Verfahrarm höchstens ein Zehntel von der Biegesteifigkeit in den dazu senkrechten Richtungen beträgt .7. placement device according to claim 1 to 6, in which the support arm (5) in the non-bent state is perpendicular to the travel arm (3) and in which the bending stiffness of the support arm (5) in the direction parallel to the travel arm at most one tenth of the bending stiffness in the directions perpendicular to it.
8. Bestückvorrichtung nach Anspruch 7, bei der der Trägerarm (5) im unverbogenen Zustand zwei paral- lele, sich senkrecht zum Verfahrarm (3) erstreckende Biegeplatten (8) aufweist, die an ihren verfahrarmseitigen Enden und an ihren tragerelementseitigen Enden mit je einem Verbindungselement (9) verbunden sind. 8. Placement device according to claim 7, in which the support arm (5) in the non-bent state has two parallel, perpendicular to the travel arm (3) extending bending plates (8) at their ends on the travel arm side and are connected at their ends on the support element side to a connecting element (9).
9. Bestückvorrichtung nach Anspruch 8, bei der der Trägerarm (5) aus einem Quader gebildet ist, der ein sich in Aufsetzrichtung (L) des Trägerarms (5) erstrek- kendes Langloch (10) aufweist. 9. Placement device according to claim 8, in which the support arm (5) is formed from a cuboid which has an elongated hole (10) extending in the mounting direction (L) of the support arm (5).
PCT/DE2001/001302 2000-04-05 2001-04-04 Assembly device comprising a unit for measuring the insertion force WO2001078482A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10016998.8 2000-04-05
DE10016998A DE10016998C1 (en) 2000-04-05 2000-04-05 Electrical components equipping device with appliance for measuring placement force of components on to circuit board

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WO2020027273A1 (en) * 2018-08-01 2020-02-06 Thk株式会社 Load detector for actuator

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