WO2001075772A3 - Method for manufacturing of rfid inlet - Google Patents

Method for manufacturing of rfid inlet Download PDF

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Publication number
WO2001075772A3
WO2001075772A3 PCT/SG2001/000054 SG0100054W WO0175772A3 WO 2001075772 A3 WO2001075772 A3 WO 2001075772A3 SG 0100054 W SG0100054 W SG 0100054W WO 0175772 A3 WO0175772 A3 WO 0175772A3
Authority
WO
WIPO (PCT)
Prior art keywords
inlet
manufacturing
rfid inlet
pads
adhesive
Prior art date
Application number
PCT/SG2001/000054
Other languages
French (fr)
Other versions
WO2001075772A2 (en
Inventor
Tiang Siong Lian
Geok Leong Tan
Original Assignee
Smartag S Pte Ltd
Tiang Siong Lian
Geok Leong Tan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP00810291A external-priority patent/EP1143378A1/en
Application filed by Smartag S Pte Ltd, Tiang Siong Lian, Geok Leong Tan filed Critical Smartag S Pte Ltd
Publication of WO2001075772A2 publication Critical patent/WO2001075772A2/en
Publication of WO2001075772A3 publication Critical patent/WO2001075772A3/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

A contact-less inlet and a method for the manufacture of such an inlet in mass volume production is described in this invention. The method involves steps of dispensing adhesive paste on the pads of the antenna coil, aligning the bumps on the chip with the corresponding pads, curing of the adhesive and henceforth making the inlet connected electrically. The invention can therefore be applied through large-scale production as the method described has cost and speed advantages.
PCT/SG2001/000054 2000-04-04 2001-04-03 Method for manufacturing of rfid inlet WO2001075772A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP00810291.5 2000-04-04
EP00810291A EP1143378A1 (en) 2000-04-04 2000-04-04 Method for manufacturing of RFID inlet
US62193000A 2000-07-24 2000-07-24
US09/621,930 2000-07-24

Publications (2)

Publication Number Publication Date
WO2001075772A2 WO2001075772A2 (en) 2001-10-11
WO2001075772A3 true WO2001075772A3 (en) 2002-03-28

Family

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PCT/SG2001/000054 WO2001075772A2 (en) 2000-04-04 2001-04-03 Method for manufacturing of rfid inlet

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7755484B2 (en) 2004-02-12 2010-07-13 Avery Dennison Corporation RFID tag and method of manufacturing the same
JP4290620B2 (en) 2004-08-31 2009-07-08 富士通株式会社 RFID tag, RFID tag antenna, RFID tag antenna sheet, and RFID tag manufacturing method
US7605056B2 (en) 2005-05-31 2009-10-20 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device including separation by physical force
FR2922342B1 (en) * 2007-10-11 2010-07-30 Ask Sa REINFORCED RADIOFREQUENCY IDENTIFICATION DEVICE SUPPORT AND METHOD OF MANUFACTURING THE SAME
US9590296B2 (en) 2015-05-28 2017-03-07 Nxp B. V. Antenna structure and method for assembling an RFID device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4317184C1 (en) * 1993-05-22 1994-07-07 Melzer Maschinenbau Gmbh Smart card mfr. e.g. for credit, debit esp. telephone card
EP0745956A2 (en) * 1995-05-31 1996-12-04 HERBST, Richard Method of making plastic objects and semi-finished product to be used in the method
US5705852A (en) * 1995-04-13 1998-01-06 Sony Chemicals Corp. Non-contact IC card and process for its production
WO1998013804A1 (en) * 1996-09-26 1998-04-02 Sensormatic Electronics Corporation A data communication and electronic article surveillance tag
US5779839A (en) * 1992-06-17 1998-07-14 Micron Communications, Inc. Method of manufacturing an enclosed transceiver

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5779839A (en) * 1992-06-17 1998-07-14 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
DE4317184C1 (en) * 1993-05-22 1994-07-07 Melzer Maschinenbau Gmbh Smart card mfr. e.g. for credit, debit esp. telephone card
US5705852A (en) * 1995-04-13 1998-01-06 Sony Chemicals Corp. Non-contact IC card and process for its production
EP0745956A2 (en) * 1995-05-31 1996-12-04 HERBST, Richard Method of making plastic objects and semi-finished product to be used in the method
WO1998013804A1 (en) * 1996-09-26 1998-04-02 Sensormatic Electronics Corporation A data communication and electronic article surveillance tag

Also Published As

Publication number Publication date
WO2001075772A2 (en) 2001-10-11

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