WO2001063304A3 - Method and apparatus for isolated thermal fault finding in electronic components - Google Patents

Method and apparatus for isolated thermal fault finding in electronic components Download PDF

Info

Publication number
WO2001063304A3
WO2001063304A3 PCT/GB2001/000774 GB0100774W WO0163304A3 WO 2001063304 A3 WO2001063304 A3 WO 2001063304A3 GB 0100774 W GB0100774 W GB 0100774W WO 0163304 A3 WO0163304 A3 WO 0163304A3
Authority
WO
WIPO (PCT)
Prior art keywords
component
fault finding
thermal fault
isolated thermal
electronic components
Prior art date
Application number
PCT/GB2001/000774
Other languages
French (fr)
Other versions
WO2001063304A2 (en
Inventor
Leo Martin Gibbs
Original Assignee
Leo Martin Gibbs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leo Martin Gibbs filed Critical Leo Martin Gibbs
Priority to AU33950/01A priority Critical patent/AU3395001A/en
Publication of WO2001063304A2 publication Critical patent/WO2001063304A2/en
Publication of WO2001063304A3 publication Critical patent/WO2001063304A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/265—Contactless testing
    • G01R31/2656—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation

Abstract

An apparatus for isolated thermal fault finding in an electronic component comprises; an infra-red (IR) radiation source; means for focussing the IR radiation source into an area on the upper exposed surface of the component under test; a thermal sensor for sensing the heat radiated from the component under test. The apparatus is useful in performing the inventive method for isolated thermal fault finding in an electronic component which comprises; i) focussing a beam of infra-red radiation onto a small area at about the centre of the electronic component; ii) monitoring the temperature of the component of step i) ; and iii) maintaining the temperature of the component of step i) at a predetermined maximum level dictated by the function and/or environmental in which the component is to be used.
PCT/GB2001/000774 2000-02-23 2001-02-23 Method and apparatus for isolated thermal fault finding in electronic components WO2001063304A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU33950/01A AU3395001A (en) 2000-02-23 2001-02-23 Method and apparatus for isolated thermal fault finding in electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0004214.3 2000-02-23
GB0004214A GB0004214D0 (en) 2000-02-23 2000-02-23 Method and apparatus for isolated thermal fault finding in electronic components

Publications (2)

Publication Number Publication Date
WO2001063304A2 WO2001063304A2 (en) 2001-08-30
WO2001063304A3 true WO2001063304A3 (en) 2002-01-03

Family

ID=9886208

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2001/000774 WO2001063304A2 (en) 2000-02-23 2001-02-23 Method and apparatus for isolated thermal fault finding in electronic components

Country Status (3)

Country Link
AU (1) AU3395001A (en)
GB (1) GB0004214D0 (en)
WO (1) WO2001063304A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010053766B4 (en) * 2010-12-08 2019-05-23 Acculogic Corporation Apparatus for thermal testing of printed circuit boards

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3803413A (en) * 1972-05-01 1974-04-09 Vanzetti Infrared Computer Sys Infrared non-contact system for inspection of infrared emitting components in a device
US4392189A (en) * 1980-12-03 1983-07-05 Gte Products Corporation Front loading projection unit with threaded resilient retention member
US4481418A (en) * 1982-09-30 1984-11-06 Vanzetti Systems, Inc. Fiber optic scanning system for laser/thermal inspection
GB2154405A (en) * 1984-01-10 1985-09-04 Thorn Emi Domestic Appliances Heating apparatus
EP0468874A2 (en) * 1990-07-25 1992-01-29 Sumitomo Electric Industries, Ltd. Lamp annealing process for semiconductor wafer and apparatus for execution of such process
EP0615279A1 (en) * 1993-03-08 1994-09-14 Koninklijke Philips Electronics N.V. Electric lamp
US5885274A (en) * 1997-06-24 1999-03-23 New Star Lasers, Inc. Filament lamp for dermatological treatment
US5984522A (en) * 1995-12-18 1999-11-16 Nec Corporation Apparatus for inspecting bump junction of flip chips and method of inspecting the same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3803413A (en) * 1972-05-01 1974-04-09 Vanzetti Infrared Computer Sys Infrared non-contact system for inspection of infrared emitting components in a device
US4392189A (en) * 1980-12-03 1983-07-05 Gte Products Corporation Front loading projection unit with threaded resilient retention member
US4481418A (en) * 1982-09-30 1984-11-06 Vanzetti Systems, Inc. Fiber optic scanning system for laser/thermal inspection
GB2154405A (en) * 1984-01-10 1985-09-04 Thorn Emi Domestic Appliances Heating apparatus
EP0468874A2 (en) * 1990-07-25 1992-01-29 Sumitomo Electric Industries, Ltd. Lamp annealing process for semiconductor wafer and apparatus for execution of such process
EP0615279A1 (en) * 1993-03-08 1994-09-14 Koninklijke Philips Electronics N.V. Electric lamp
US5984522A (en) * 1995-12-18 1999-11-16 Nec Corporation Apparatus for inspecting bump junction of flip chips and method of inspecting the same
US5885274A (en) * 1997-06-24 1999-03-23 New Star Lasers, Inc. Filament lamp for dermatological treatment

Also Published As

Publication number Publication date
AU3395001A (en) 2001-09-03
WO2001063304A2 (en) 2001-08-30
GB0004214D0 (en) 2000-04-12

Similar Documents

Publication Publication Date Title
WO2003075321A3 (en) An apparatus and method for measuring a property of a layer in a multilayered structure
CA2114806A1 (en) Method and Apparatus for Measuring Temperature Using Infrared Techniques
KR101007724B1 (en) Laser weld monitor
PT958128E (en) WELDING OF HEAT PLASTICS THROUGH RADIATION
CA2471334A1 (en) Methods for determining the depth of defects
JPS6110750A (en) Reflowing soldering method and device
CA2223195A1 (en) Light source system and method for hand-held temperature measuring unit
EP1014036A3 (en) Device and procedure to examine an object
EP0269026A3 (en) Sensor-controlled levelling device
ATE524285T1 (en) DEVICE AND METHOD FOR SCRATCHING SUPPORTS MADE OF BRITTLE MATERIAL AND AUTOMATIC ANALYSIS LINE
CZ245693A3 (en) Process and apparatus for identifying matters of materials
CZ251498A3 (en) Method of determining mean radiation of a fuel layer
WO2001073819A3 (en) Infrared inspection for determining residual films on semiconductor devices
WO2004099742A3 (en) Optical exploration device and vehicle comprising said device
WO2001063304A3 (en) Method and apparatus for isolated thermal fault finding in electronic components
WO2002033387A3 (en) Method and apparatus for nondestructive determination of polymer hydrolytic stability
FR2621692B1 (en) METHOD AND APPARATUS FOR DETECTING CHANGES IN SURFACE CONDITION AND FOR CONTROLLING THE SAME
EP0791818A3 (en) Method and device for photothermal testing a workpiece
SG129256A1 (en) Lithographic apparatus and device manufacturing method
WO2004001764A3 (en) Method and device for recording optical near field interaction signals
WO1999010731A8 (en) Microwave enhanced infrared thermography
ATE337546T1 (en) METHOD FOR DETECTING AN ANALYTE
JP3259695B2 (en) Laser processing apparatus and laser processing method
EP0605055A2 (en) Pyrometer including an emissivity meter
EP0961310A3 (en) Apparatus for processing silicon devices with improved temperature control

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
AK Designated states

Kind code of ref document: A3

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 69 (1) EPC (EPO FORM 1205A DATED 21-01-2003

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP